WO2008136228A1 - 基板温度制御装置用ステージ - Google Patents

基板温度制御装置用ステージ Download PDF

Info

Publication number
WO2008136228A1
WO2008136228A1 PCT/JP2008/056092 JP2008056092W WO2008136228A1 WO 2008136228 A1 WO2008136228 A1 WO 2008136228A1 JP 2008056092 W JP2008056092 W JP 2008056092W WO 2008136228 A1 WO2008136228 A1 WO 2008136228A1
Authority
WO
WIPO (PCT)
Prior art keywords
stage
plate
control unit
temperature control
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/056092
Other languages
English (en)
French (fr)
Inventor
Kenichi Bandoh
Katsuo Saio
Kazuhiko Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Komatsu Ltd
Original Assignee
Komatsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Ltd filed Critical Komatsu Ltd
Priority to CN2008800217938A priority Critical patent/CN101689481B/zh
Priority to KR1020097021109A priority patent/KR101450022B1/ko
Priority to US12/596,755 priority patent/US8399811B2/en
Publication of WO2008136228A1 publication Critical patent/WO2008136228A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

　プレートの材料としてセラミック以外の材料を用いながら、プレートの熱変形を防止することにより、ローコストで応答性の良い基板温度制御装置用ステージ。この基板温度制御装置用ステージは、基板の温度を制御する基板温度制御装置において基板を載置するために用いられるステージであって、基板と対向する第１の面、及び、該第１の面と反対側の第２の面を有するプレートと、プレートの第２の面に接着された面状のヒータとを具備し、プレートの第１の面に、第１の厚さで表面処理が施され、プレートの第２の面の所定の領域に、第１の厚さよりも薄い第２の厚さで表面処理が施され、又は、表面処理が施されていないことを特徴とする。
PCT/JP2008/056092 2007-04-26 2008-03-28 基板温度制御装置用ステージ Ceased WO2008136228A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800217938A CN101689481B (zh) 2007-04-26 2008-03-28 基板温度控制装置用工作台
KR1020097021109A KR101450022B1 (ko) 2007-04-26 2008-03-28 기판 온도 제어 장치용 스테이지
US12/596,755 US8399811B2 (en) 2007-04-26 2008-03-28 Stage for substrate temperature control apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007116606A JP5294570B2 (ja) 2007-04-26 2007-04-26 基板温度制御装置用ステージ
JP2007-116606 2007-04-26

Publications (1)

Publication Number Publication Date
WO2008136228A1 true WO2008136228A1 (ja) 2008-11-13

Family

ID=39943346

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056092 Ceased WO2008136228A1 (ja) 2007-04-26 2008-03-28 基板温度制御装置用ステージ

Country Status (6)

Country Link
US (1) US8399811B2 (ja)
JP (1) JP5294570B2 (ja)
KR (1) KR101450022B1 (ja)
CN (1) CN101689481B (ja)
TW (1) TWI469246B (ja)
WO (1) WO2008136228A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100065A (ja) * 2009-11-09 2011-05-19 Shin-Etsu Chemical Co Ltd ペリクル膜の製造方法および装置
JP2011158814A (ja) * 2010-02-03 2011-08-18 Shin-Etsu Chemical Co Ltd ペリクル膜の製造方法および装置
JP5684023B2 (ja) * 2011-03-28 2015-03-11 株式会社小松製作所 加熱装置
JP5694824B2 (ja) * 2011-03-28 2015-04-01 株式会社小松製作所 加熱装置
US9465049B2 (en) * 2012-04-13 2016-10-11 James B. Colvin Apparatus and method for electronic sample preparation
US9461355B2 (en) 2013-03-29 2016-10-04 Intel Corporation Method apparatus and material for radio frequency passives and antennas
JP6390214B2 (ja) * 2014-07-01 2018-09-19 セイコーエプソン株式会社 液体吐出装置
KR102360248B1 (ko) * 2016-05-10 2022-02-07 램 리써치 코포레이션 상이한 히터 트레이스 재료를 사용한 적층된 히터

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006093495A (ja) * 2004-09-27 2006-04-06 Fuji Photo Film Co Ltd 基板の加熱装置及び方法
JP2006140367A (ja) * 2004-11-15 2006-06-01 Sumitomo Electric Ind Ltd 半導体製造装置用加熱体およびこれを搭載した加熱装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3049539B2 (ja) 1995-11-08 2000-06-05 日本電熱株式会社 加熱装置
TW439094B (en) 1998-02-16 2001-06-07 Komatsu Co Ltd Apparatus for controlling temperature of substrate
JP2001126851A (ja) * 1999-10-26 2001-05-11 Keihin Sokki Kk 半導体ウエハーにおけるヒータ装置およびその製造方法
JP3123354U (ja) * 2006-04-28 2006-07-20 京浜測器株式会社 半導体ウエハーにおけるヒーター装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006093495A (ja) * 2004-09-27 2006-04-06 Fuji Photo Film Co Ltd 基板の加熱装置及び方法
JP2006140367A (ja) * 2004-11-15 2006-06-01 Sumitomo Electric Ind Ltd 半導体製造装置用加熱体およびこれを搭載した加熱装置

Also Published As

Publication number Publication date
US20100133256A1 (en) 2010-06-03
JP5294570B2 (ja) 2013-09-18
TWI469246B (zh) 2015-01-11
KR101450022B1 (ko) 2014-10-13
CN101689481A (zh) 2010-03-31
TW200901361A (en) 2009-01-01
JP2008277382A (ja) 2008-11-13
CN101689481B (zh) 2012-06-27
US8399811B2 (en) 2013-03-19
KR20100015461A (ko) 2010-02-12

Similar Documents

Publication Publication Date Title
WO2008136228A1 (ja) 基板温度制御装置用ステージ
WO2009124098A3 (en) A solar panel back sheet with improved heat dissipation
WO2010132422A3 (en) Structured-core laminate panels and methods of forming the same
WO2011112447A3 (en) Heat activated optically clear adhesive for bonding display panels
WO2007127111A3 (en) High temperature anodic bonding apparatus
USD672968S1 (en) Film sheet for use in antiballistic articles
WO2009031450A1 (ja) 基板熱処理装置及び基板の熱処理方法
WO2007030309A3 (en) Flexible graphite flooring heat spreader
TW200745357A (en) Evaporation source
TW200704741A (en) Double sided adhesive sheet and panel laminate
WO2009080931A8 (fr) Perfectionnements apportes a des elements capables de collecter de la lumiere
WO2009137757A3 (en) Controlling heat transfer in active material actuators using external elements
WO2008071983A3 (en) Electric water heater
WO2004059597A3 (fr) Interface tactile
NZ580373A (en) Thermal cylcer system with temperature control element and a controller to control a thermostate's temperature based on a sample in a sample chamber
WO2007073520A3 (en) Polymer interlayers comprising ethylene-vinyl acetate copolymer
EP1873307A3 (en) Aramid paper, method of manufacturing the same and aramid-polyester laminate
WO2011075683A3 (en) Cooking release sheet materials and release surfaces
WO2008060970A3 (en) Hydrogenation processes using functional surface catalyst composition
WO2008149039A3 (fr) Systeme de culture de cellules biologiques
CY1109294T1 (el) Διαταξη επιστρωσης δια την επιστρωση κατασκευαστικων τεμαχιων
TW200638173A (en) Temperature control method and temperature control device
WO2008005123A3 (en) Thermally conductive panel
WO2011020809A3 (de) Dekorelement für ein kältegerät
PL1640669T3 (pl) System ogrzewania pokojowego

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880021793.8

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08739210

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20097021109

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12596755

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08739210

Country of ref document: EP

Kind code of ref document: A1