WO2008132901A1 - プラズマ処理装置 - Google Patents
プラズマ処理装置 Download PDFInfo
- Publication number
- WO2008132901A1 WO2008132901A1 PCT/JP2008/055280 JP2008055280W WO2008132901A1 WO 2008132901 A1 WO2008132901 A1 WO 2008132901A1 JP 2008055280 W JP2008055280 W JP 2008055280W WO 2008132901 A1 WO2008132901 A1 WO 2008132901A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- container
- bottom plate
- processing apparatus
- cover
- plasma processing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32825—Working under atmospheric pressure or higher
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
Abstract
【課題】プラズマ処理装置の組み立て作業を容易化する。 【解決手段】プラズマ処理装置の接地電極としての噴出孔11a付きの底板11と枠12と蓋13からなる容器10の内部に、固体誘電体からなる電界印加側誘電部材30収容し、容器内を底板側の放電空間10eと蓋側の電極収容部10aとに仕切り、収容部10aに電界印加電極30を収容する。容器10と誘電部材30との連結、底板11と枠12との連結、枠12と蓋13との連結を、基端部を蓋側に向け先端部を底板側に向けたネジ51~53にて行なう。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009511714A JP4647705B2 (ja) | 2007-04-19 | 2008-03-21 | プラズマ処理装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007110054 | 2007-04-19 | ||
JP2007-110054 | 2007-04-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008132901A1 true WO2008132901A1 (ja) | 2008-11-06 |
Family
ID=39925364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/055280 WO2008132901A1 (ja) | 2007-04-19 | 2008-03-21 | プラズマ処理装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4647705B2 (ja) |
TW (1) | TW200850079A (ja) |
WO (1) | WO2008132901A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015076328A (ja) * | 2013-10-10 | 2015-04-20 | 株式会社ケイテックリサーチ | プラズマ処理装置 |
WO2018104988A1 (ja) * | 2016-12-05 | 2018-06-14 | 東芝三菱電機産業システム株式会社 | 活性ガス生成装置 |
WO2019138456A1 (ja) * | 2018-01-10 | 2019-07-18 | 東芝三菱電機産業システム株式会社 | 活性ガス生成装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001087643A (ja) * | 1999-09-22 | 2001-04-03 | Pearl Kogyo Kk | プラズマ処理装置 |
JP2002180257A (ja) * | 2000-12-18 | 2002-06-26 | Fuji Electric Co Ltd | プラズマ処理装置と薄膜形成方法および表面処理方法 |
JP2003303816A (ja) * | 2002-03-29 | 2003-10-24 | Samsung Electronics Co Ltd | 半導体基板を加工するための電極組立体及びこれを有する加工装置 |
JP2004006211A (ja) * | 2001-09-27 | 2004-01-08 | Sekisui Chem Co Ltd | プラズマ処理装置 |
JP2004288452A (ja) * | 2003-03-20 | 2004-10-14 | Sekisui Chem Co Ltd | プラズマ処理装置 |
JP2004327394A (ja) * | 2003-04-28 | 2004-11-18 | Sekisui Chem Co Ltd | プラズマ処理装置 |
JP2005302681A (ja) * | 2003-05-14 | 2005-10-27 | Sekisui Chem Co Ltd | プラズマ処理装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996031997A1 (fr) * | 1995-04-07 | 1996-10-10 | Seiko Epson Corporation | Equipement de traitement de surface |
JP5021877B2 (ja) * | 2001-09-27 | 2012-09-12 | 積水化学工業株式会社 | 放電プラズマ処理装置 |
JP4401928B2 (ja) * | 2003-06-04 | 2010-01-20 | 積水化学工業株式会社 | プラズマ処理装置 |
-
2008
- 2008-03-21 JP JP2009511714A patent/JP4647705B2/ja not_active Expired - Fee Related
- 2008-03-21 WO PCT/JP2008/055280 patent/WO2008132901A1/ja active Application Filing
- 2008-03-28 TW TW97111562A patent/TW200850079A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001087643A (ja) * | 1999-09-22 | 2001-04-03 | Pearl Kogyo Kk | プラズマ処理装置 |
JP2002180257A (ja) * | 2000-12-18 | 2002-06-26 | Fuji Electric Co Ltd | プラズマ処理装置と薄膜形成方法および表面処理方法 |
JP2004006211A (ja) * | 2001-09-27 | 2004-01-08 | Sekisui Chem Co Ltd | プラズマ処理装置 |
JP2003303816A (ja) * | 2002-03-29 | 2003-10-24 | Samsung Electronics Co Ltd | 半導体基板を加工するための電極組立体及びこれを有する加工装置 |
JP2004288452A (ja) * | 2003-03-20 | 2004-10-14 | Sekisui Chem Co Ltd | プラズマ処理装置 |
JP2004327394A (ja) * | 2003-04-28 | 2004-11-18 | Sekisui Chem Co Ltd | プラズマ処理装置 |
JP2005302681A (ja) * | 2003-05-14 | 2005-10-27 | Sekisui Chem Co Ltd | プラズマ処理装置 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015076328A (ja) * | 2013-10-10 | 2015-04-20 | 株式会社ケイテックリサーチ | プラズマ処理装置 |
WO2018104988A1 (ja) * | 2016-12-05 | 2018-06-14 | 東芝三菱電機産業システム株式会社 | 活性ガス生成装置 |
JPWO2018104988A1 (ja) * | 2016-12-05 | 2019-03-28 | 東芝三菱電機産業システム株式会社 | 活性ガス生成装置 |
KR20190077488A (ko) * | 2016-12-05 | 2019-07-03 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | 활성 가스 생성 장치 |
KR102127084B1 (ko) | 2016-12-05 | 2020-06-25 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | 활성 가스 생성 장치 |
US10840065B2 (en) * | 2016-12-05 | 2020-11-17 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Active gas generation apparatus including a metal housing, first and second auxiliary members, and a housing contact |
WO2019138456A1 (ja) * | 2018-01-10 | 2019-07-18 | 東芝三菱電機産業システム株式会社 | 活性ガス生成装置 |
KR20200096607A (ko) * | 2018-01-10 | 2020-08-12 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | 활성 가스 생성 장치 |
JPWO2019138456A1 (ja) * | 2018-01-10 | 2020-10-01 | 東芝三菱電機産業システム株式会社 | 活性ガス生成装置 |
EP3740045A4 (en) * | 2018-01-10 | 2021-09-29 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | ACTIVE GAS GENERATING DEVICE |
KR102465845B1 (ko) | 2018-01-10 | 2022-11-11 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | 활성 가스 생성 장치 |
Also Published As
Publication number | Publication date |
---|---|
JP4647705B2 (ja) | 2011-03-09 |
TW200850079A (en) | 2008-12-16 |
JPWO2008132901A1 (ja) | 2010-07-22 |
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