WO2008129590A1 - 半導体用接着フィルム及びこれを用いた半導体装置 - Google Patents

半導体用接着フィルム及びこれを用いた半導体装置 Download PDF

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Publication number
WO2008129590A1
WO2008129590A1 PCT/JP2007/000379 JP2007000379W WO2008129590A1 WO 2008129590 A1 WO2008129590 A1 WO 2008129590A1 JP 2007000379 W JP2007000379 W JP 2007000379W WO 2008129590 A1 WO2008129590 A1 WO 2008129590A1
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WIPO (PCT)
Prior art keywords
adhesive film
semiconductor
semiconductor device
same
device made
Prior art date
Application number
PCT/JP2007/000379
Other languages
English (en)
French (fr)
Inventor
Hiroyuki Yasuda
Masato Yoshida
Original Assignee
Sumitomo Bakelite Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co., Ltd. filed Critical Sumitomo Bakelite Co., Ltd.
Priority to US11/886,463 priority Critical patent/US20090230568A1/en
Priority to KR1020097022227A priority patent/KR101125762B1/ko
Priority to CN2007800525332A priority patent/CN101641773B/zh
Priority to PCT/JP2007/000379 priority patent/WO2008129590A1/ja
Priority to EP07737036A priority patent/EP2136393A4/en
Publication of WO2008129590A1 publication Critical patent/WO2008129590A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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    • C09J7/00—Adhesives in the form of films or foils
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
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  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Adhesive Tapes (AREA)

Abstract

（Ａ）熱可塑性樹脂、（Ｂ）エポキシ樹脂、及び、（Ｃ）硬化剤を含む半導体用接着フィルムであって、前記半導体用接着フィルムの室温から１０℃／分の昇温速度で昇温したときの５０℃以上１８０℃以下の範囲における最低溶融粘度が０．１Ｐａ・ｓ以上５００Ｐａ・ｓ以下であり、かつ、揮発分が５．０％以下であることを特徴とする半導体用接着フィルムにより、半導体素子と半導体素子搭載用支持部材をより間隙なく、ボイド発生を抑制しつつ接着することができ、信頼性の高い半導体装置を提供可能にする。
PCT/JP2007/000379 2007-04-10 2007-04-10 半導体用接着フィルム及びこれを用いた半導体装置 WO2008129590A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US11/886,463 US20090230568A1 (en) 2007-04-10 2007-04-10 Adhesive Film for Semiconductor and Semiconductor Device Therewith
KR1020097022227A KR101125762B1 (ko) 2007-04-10 2007-04-10 반도체용 접착필름 및 이를 이용한 반도체 장치
CN2007800525332A CN101641773B (zh) 2007-04-10 2007-04-10 用于半导体的粘合膜和使用该粘合膜的半导体器件
PCT/JP2007/000379 WO2008129590A1 (ja) 2007-04-10 2007-04-10 半導体用接着フィルム及びこれを用いた半導体装置
EP07737036A EP2136393A4 (en) 2007-04-10 2007-04-10 HAFTFILM FOR SEMICONDUCTORS AND SEMI-FINISHED SEMICONDUCTOR ARRANGEMENT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/000379 WO2008129590A1 (ja) 2007-04-10 2007-04-10 半導体用接着フィルム及びこれを用いた半導体装置

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WO2008129590A1 true WO2008129590A1 (ja) 2008-10-30

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US (1) US20090230568A1 (ja)
EP (1) EP2136393A4 (ja)
KR (1) KR101125762B1 (ja)
CN (1) CN101641773B (ja)
WO (1) WO2008129590A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011103307A (ja) * 2011-01-19 2011-05-26 Sony Chemical & Information Device Corp 異方性導電フィルム
US20120114934A1 (en) * 2009-05-13 2012-05-10 Megumi Kodama Bonding sheet
JP2023505277A (ja) * 2019-12-05 2023-02-08 ドゥーサン コーポレイション 半導体パッケージ用アンダーフィルフィルム及びこれを用いた半導体パッケージの製造方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2274162A1 (en) * 2008-04-08 2011-01-19 The Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing
JP4939574B2 (ja) * 2008-08-28 2012-05-30 日東電工株式会社 熱硬化型ダイボンドフィルム
KR20110099106A (ko) * 2008-11-19 2011-09-06 덴끼 가가꾸 고교 가부시키가이샤 전자 부품의 제조 방법
EP2402985A4 (en) * 2009-02-27 2014-01-22 Sony Chem & Inf Device Corp METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
JP4816750B2 (ja) * 2009-03-13 2011-11-16 住友電気工業株式会社 プリント配線基板の接続方法
JP2012049388A (ja) * 2010-08-27 2012-03-08 Shin Etsu Chem Co Ltd 半導体ウエハ保護膜形成用シート
US9120293B2 (en) * 2011-03-31 2015-09-01 Seiku Chemical Co., Ltd. Preliminary-cured material, roughened preliminary-cured material, and laminated body
JP6193663B2 (ja) * 2013-07-26 2017-09-06 日東電工株式会社 ダイシングテープ付きダイボンドフィルム、及び、半導体装置の製造方法
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CN106715631B (zh) * 2015-07-10 2019-07-30 株式会社Lg化学 半导体用粘合剂组合物和切割管芯粘结膜
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EP3524462A1 (en) * 2018-02-13 2019-08-14 D. Swarovski KG Decorative composite body
TWI695453B (zh) * 2019-01-04 2020-06-01 台灣愛司帝科技股份有限公司 半導體晶片修補方法以及半導體晶片修補裝置
KR102528264B1 (ko) * 2020-04-24 2023-05-04 주식회사 엘지화학 경화제, 이를 포함하는 반도체 접착용 조성물, 반도체 접착용 필름 및 이를 이용한 반도체 패키지

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06264035A (ja) 1993-03-16 1994-09-20 Hitachi Chem Co Ltd 接着フィルム、その製造法及び接着法
JP2003096426A (ja) 2001-09-26 2003-04-03 Hitachi Chem Co Ltd 接着部材
JP2007059787A (ja) * 2005-08-26 2007-03-08 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001074962A1 (en) * 2000-03-31 2001-10-11 Hitachi Chemical Co., Ltd. Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device
JP4238124B2 (ja) * 2003-01-07 2009-03-11 積水化学工業株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体
US20040265540A1 (en) * 2003-06-24 2004-12-30 Gary Balakoff Masking film for textured surfaces
JP2005327789A (ja) * 2004-05-12 2005-11-24 Sharp Corp ダイシング・ダイボンド兼用粘接着シートおよびこれを用いた半導体装置の製造方法
JP3754700B1 (ja) * 2004-09-02 2006-03-15 住友ベークライト株式会社 半導体用接着フィルム及びこれを用いた半導体装置
US7560821B2 (en) * 2005-03-24 2009-07-14 Sumitomo Bakelite Company, Ltd Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same
US20070073008A1 (en) * 2005-09-28 2007-03-29 Cookson Singapore Pte, Ltd. Compositions effective to suppress void formation

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06264035A (ja) 1993-03-16 1994-09-20 Hitachi Chem Co Ltd 接着フィルム、その製造法及び接着法
JP2003096426A (ja) 2001-09-26 2003-04-03 Hitachi Chem Co Ltd 接着部材
JP2007059787A (ja) * 2005-08-26 2007-03-08 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2136393A4

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120114934A1 (en) * 2009-05-13 2012-05-10 Megumi Kodama Bonding sheet
JP2011103307A (ja) * 2011-01-19 2011-05-26 Sony Chemical & Information Device Corp 異方性導電フィルム
JP2023505277A (ja) * 2019-12-05 2023-02-08 ドゥーサン コーポレイション 半導体パッケージ用アンダーフィルフィルム及びこれを用いた半導体パッケージの製造方法
JP7373073B2 (ja) 2019-12-05 2023-11-01 ドゥーサン コーポレイション 半導体パッケージ用アンダーフィルフィルム及びこれを用いた半導体パッケージの製造方法

Also Published As

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CN101641773A (zh) 2010-02-03
KR20100009555A (ko) 2010-01-27
EP2136393A4 (en) 2012-10-24
US20090230568A1 (en) 2009-09-17
EP2136393A1 (en) 2009-12-23
KR101125762B1 (ko) 2012-03-20
CN101641773B (zh) 2011-08-17

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