WO2008128612A1 - Procédé de formation de trous débouchants dans des éléments en verre - Google Patents

Procédé de formation de trous débouchants dans des éléments en verre Download PDF

Info

Publication number
WO2008128612A1
WO2008128612A1 PCT/EP2008/002329 EP2008002329W WO2008128612A1 WO 2008128612 A1 WO2008128612 A1 WO 2008128612A1 EP 2008002329 W EP2008002329 W EP 2008002329W WO 2008128612 A1 WO2008128612 A1 WO 2008128612A1
Authority
WO
WIPO (PCT)
Prior art keywords
heating zone
component
glass
temperature
heating
Prior art date
Application number
PCT/EP2008/002329
Other languages
German (de)
English (en)
Inventor
Carsten BÜSCHING
Original Assignee
Lzh Laserzentrum Hannover E.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lzh Laserzentrum Hannover E.V. filed Critical Lzh Laserzentrum Hannover E.V.
Publication of WO2008128612A1 publication Critical patent/WO2008128612A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses

Definitions

  • the invention relates to a method of the type mentioned in the preamble of claim 1 for forming through-holes in glass components.
  • JP 2000-128556 A and the related EPODOC and WPI abstracts disclose a method of the type in question for forming through holes in glass components, in which the component is heated in a spot-shaped heating zone to a heating temperature at which the glass begins to liquefy, in which the heating zone is subsequently cooled, such that forms a thermally induced stress crack along the contour of the heating zone and in which for heating the component in the Heating zone is used by at least one laser generated laser radiation.
  • GB 2 139 615 A discloses a method of forming holes in glass.
  • EP 1 547 485 A1 discloses a method for free-form cutting of knitted substrates made of brittle-fractured material.
  • the invention has for its object to provide a method referred to in the preamble of claim 1, which allows the formation of fürgangslöchern in components made of glass in a simple and fast way and in which the walls of the through holes have a high surface quality.
  • the invention provides for the component to be heated by introduction of heat in a spatially sharply delimited stain-shaped heating zone, for example using laser radiation, the heating taking place so rapidly that compressive stresses are avoided or kept small, the working temperature being selected in this way is that the glass begins to liquefy at the processing temperature. Upon reaching the processing temperature, the glass can expand and dodge perpendicular to the surface of the component. After being heated to the processing temperature, the component is cooled, resulting in tensile stresses which are radially aligned with the center of the heating and result in a thermally induced stress crack, through which a conically limited volume of material is formed to form the through-hole. Hole is separated separated from the component.
  • laser radiation having a wavelength between 400 nm and 5,000 nm is used. It has been found that laser radiation in this wavelength range, in particular in the subarea below 2,900 nm and in particular at about 1,000 nm, is suitable for use in the method according to the invention.
  • the invention also provides that the temperature of the component in the heating zone during the machining process is measured and that the power of the laser is controlled or regulated in dependence on the measured temperature. Depending on the measured temperature, the process of forming a through hole in its time course can be adjusted, in particular, it can be ensured that adjusts temporally and spatially a desired voltage profile in the component to be machined.
  • the teachings of the present invention enable the formation of through holes in high surface quality glass components that conform to the surface quality of polished glass surfaces. Post-processing of the walls of the through-holes is thus inventively avoided. This saves additional work steps and time and therefore costs.
  • a further advantage of the method according to the invention is that when it is used in the glass microcracks do not or only to a negligible extent arise, which in known methods when using the component expand and damage or destruction of the component already during processing or in the can lead to later use.
  • a particular advantage of the method according to the invention is that cutting tools are not needed. When carrying out the method according to the invention, this does not result in dust or similar processing residues, so that cleaning of the component after forming a through-hole is not required according to the invention.
  • through holes of different diameters can be formed with one and the same device. If, for example, a laser whose beam spot defines the spot-shaped heating zone is used to heat the component, through holes of different diameter can be formed by enlarging or reducing the beam spot of the laser beam by means of appropriate beam shaping means.
  • the processing temperature is selected such that the glass is in the low-viscosity range at the processing temperature. In this way, the glass can expand when reaching the processing temperature and dodge perpendicular to the surface of the component, without causing too high viscosity of the softened glass undesirable effects.
  • the heating zone is cooled after heating by convection. If required or desirable in accordance with the respective requirements, however, the heating zone can also be cooled by means of a cooling device after the heating, as another advantageous development of the teaching according to the invention provides.
  • the temperature of the component in the heating zone at the surface of the component is measured, for example by means of a pyrometer.
  • An extremely advantageous development of the teaching of the invention provides that the temperature of the component is measured in the volume of the component. A detection of the temperature of the component in the heating zone in its volume allows an even better setting of a desired voltage profile in the component in time and space.
  • Fig. 1 is a highly schematic side view of an apparatus for performing a
  • FIG. 2 shows a photograph of a passage hole formed by means of the method according to the invention in the form of a passage bore.
  • a device 2 which is a laser 4, which generates in operation laser radiation 6 with a circular limited steel spot.
  • a solid-state laser having a wavelength of 1064 nm is used.
  • a circular through-hole having a diameter of about 7 mm is formed in a lime-soda glass sheet having a thickness of 4 mm.
  • the laser beam of the laser 4 is directed onto the glass sheet 8, the laser radiation from the glass of the glass sheet 8 in a defined by the beam spot of the laser beam, sharply delimited heating zone absorbed and the glass sheet 8 in the Er - Heating zone is heated.
  • the heating zone with a laser power of about 400 W for about 5.5 sec. heated to a tempering temperature which is greater than the transformation temperature of the glass, so that the glass in the heating zone in the low-viscosity
  • the glass sheet 8 is heated in the heating zone so fast to above the transformation temperature that the introduction of compressive stresses is avoided or kept low. After the transition of the glass in the heating zone in the low-viscosity region, the glass can expand and dodge perpendicular to the surface of the glass sheet 8.
  • the laser 4 is turned off, so that the glass sheet 8 cools in the heating zone 8.
  • Due to the stress crack a conically limited volume of material 10 is separated out of the glass sheet 8, wherein in the desired manner, a through hole is formed.
  • the temperature in the heating zone 8 is measured, for example by means of a pyrometer schematically indicated in FIG. 14, wherein the power of the laser is controlled as a function of the measured temperature is regulated. In this way it is possible to set a desired tension profile in the glass pane 8 in terms of time and space, which leads to the formation of a thermally induced stress crack in the desired manner.
  • the method according to the invention makes it possible in a simple manner to form through-holes in components made of glass.
  • the through hole may in this case be designed in the manner of a through hole, as is the case in the embodiment of FIG. It is according to the invention, however, also possible to move the laser beam and the component during processing relative to each other, so that the machining operation is designed in the manner of a Trepaniervorgangs.
  • 2 shows a through hole formed in a glass pane by means of the method according to the invention. It can be seen that the walls of the through hole have a high surface quality.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

L'invention concerne un procédé de formation de trous débouchants dans des éléments en verre, l'élément étant chauffé au niveau d'une zone de chauffage en forme de tache à une température de chauffage à laquelle le verre commence à se liquéfier. Ladite zone de chauffage est ensuite refroidie de sorte qu'une fissure de contrainte thermiquement induite se forme le long des contours de la zone de chauffage. Pour chauffer l'élément dans la zone de chauffage, on utilise au moins un rayonnement laser produit par un laser. Selon l'invention, on utilise un rayonnement laser d'une longueur d'onde comprise entre 400 nm et 5 000 nm. En outre, la température de l'élément est mesurée dans la zone de chauffage pendant le processus de traitement et la puissance du laser est commandée ou réglée en fonction de la température mesurée.
PCT/EP2008/002329 2007-04-18 2008-03-25 Procédé de formation de trous débouchants dans des éléments en verre WO2008128612A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007018674.8 2007-04-18
DE200710018674 DE102007018674A1 (de) 2007-04-18 2007-04-18 Verfahren zum Bilden von Durchgangslöchern in Bauteilen aus Glas

Publications (1)

Publication Number Publication Date
WO2008128612A1 true WO2008128612A1 (fr) 2008-10-30

Family

ID=39537435

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/002329 WO2008128612A1 (fr) 2007-04-18 2008-03-25 Procédé de formation de trous débouchants dans des éléments en verre

Country Status (2)

Country Link
DE (1) DE102007018674A1 (fr)
WO (1) WO2008128612A1 (fr)

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9815144B2 (en) 2014-07-08 2017-11-14 Corning Incorporated Methods and apparatuses for laser processing materials
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9850159B2 (en) 2012-11-20 2017-12-26 Corning Incorporated High speed laser processing of transparent materials
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
US10144093B2 (en) 2013-12-17 2018-12-04 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10173916B2 (en) 2013-12-17 2019-01-08 Corning Incorporated Edge chamfering by mechanically processing laser cut glass
US10233112B2 (en) 2013-12-17 2019-03-19 Corning Incorporated Laser processing of slots and holes
US10252931B2 (en) 2015-01-12 2019-04-09 Corning Incorporated Laser cutting of thermally tempered substrates
US10280108B2 (en) 2013-03-21 2019-05-07 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser
US10335902B2 (en) 2014-07-14 2019-07-02 Corning Incorporated Method and system for arresting crack propagation
US10377658B2 (en) 2016-07-29 2019-08-13 Corning Incorporated Apparatuses and methods for laser processing
US10421683B2 (en) 2013-01-15 2019-09-24 Corning Laser Technologies GmbH Method and device for the laser-based machining of sheet-like substrates
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
US10525657B2 (en) 2015-03-27 2020-01-07 Corning Incorporated Gas permeable window and method of fabricating the same
US10526234B2 (en) 2014-07-14 2020-01-07 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US11062986B2 (en) 2017-05-25 2021-07-13 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11111170B2 (en) 2016-05-06 2021-09-07 Corning Incorporated Laser cutting and removal of contoured shapes from transparent substrates
US11114309B2 (en) 2016-06-01 2021-09-07 Corning Incorporated Articles and methods of forming vias in substrates
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US11648623B2 (en) 2014-07-14 2023-05-16 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
US11774233B2 (en) 2016-06-29 2023-10-03 Corning Incorporated Method and system for measuring geometric parameters of through holes
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9260337B2 (en) 2014-01-09 2016-02-16 Corning Incorporated Methods and apparatus for free-shape cutting of flexible thin glass
CN111716558A (zh) * 2020-06-30 2020-09-29 施利民 一种玻璃打孔装置

Citations (5)

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WO2002048059A1 (fr) * 2000-12-15 2002-06-20 Lzh Laserzentrum Hannover E.V. Procede pour decouper des composants constitues de verre, de ceramique, de vitroceramique ou d'un materiau analogue par realisation d'une fente thermique dans le composant le long d'une zone de decoupage
US20050150254A1 (en) * 2002-03-12 2005-07-14 Hideki Morita Method and device for processing fragile material
WO2006046525A1 (fr) * 2004-10-25 2006-05-04 Mitsuboshi Diamond Industrial Co., Ltd. Procede et dispositif pour former une fissure
US20060151450A1 (en) * 2003-01-06 2006-07-13 Ki-Yong You Glass-plate cutting machine
US20070039932A1 (en) * 2004-04-27 2007-02-22 Michael Haase Device for separative machining of components made from brittle material with stress-free component mounting

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GB2139615B (en) * 1983-05-13 1986-09-24 Glaverbel Forming holes in vitreous sheets
DE19830237C2 (de) * 1998-07-07 2001-10-04 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Schneiden eines Werkstückes aus sprödbrüchigem Werkstoff
JP2000128556A (ja) * 1998-10-30 2000-05-09 Futaba Corp ガラス基板の穴開方法及びガラス穴抜き装置
DE102004012402B3 (de) * 2004-03-13 2005-08-25 Schott Ag Verfahren zum Freiformschneiden von gewölbten Substraten aus sprödbrüchigem Material

Patent Citations (6)

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Publication number Priority date Publication date Assignee Title
WO2002048059A1 (fr) * 2000-12-15 2002-06-20 Lzh Laserzentrum Hannover E.V. Procede pour decouper des composants constitues de verre, de ceramique, de vitroceramique ou d'un materiau analogue par realisation d'une fente thermique dans le composant le long d'une zone de decoupage
US20050150254A1 (en) * 2002-03-12 2005-07-14 Hideki Morita Method and device for processing fragile material
US20060151450A1 (en) * 2003-01-06 2006-07-13 Ki-Yong You Glass-plate cutting machine
US20070039932A1 (en) * 2004-04-27 2007-02-22 Michael Haase Device for separative machining of components made from brittle material with stress-free component mounting
WO2006046525A1 (fr) * 2004-10-25 2006-05-04 Mitsuboshi Diamond Industrial Co., Ltd. Procede et dispositif pour former une fissure
EP1806202A1 (fr) * 2004-10-25 2007-07-11 Mitsuboshi Diamond Industrial Co., Ltd. Procede et dispositif pour former une fissure

Cited By (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9850159B2 (en) 2012-11-20 2017-12-26 Corning Incorporated High speed laser processing of transparent materials
US11028003B2 (en) 2013-01-15 2021-06-08 Corning Laser Technologies GmbH Method and device for laser-based machining of flat substrates
US11345625B2 (en) 2013-01-15 2022-05-31 Corning Laser Technologies GmbH Method and device for the laser-based machining of sheet-like substrates
US10421683B2 (en) 2013-01-15 2019-09-24 Corning Laser Technologies GmbH Method and device for the laser-based machining of sheet-like substrates
US10280108B2 (en) 2013-03-21 2019-05-07 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser
US11713271B2 (en) 2013-03-21 2023-08-01 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10392290B2 (en) 2013-12-17 2019-08-27 Corning Incorporated Processing 3D shaped transparent brittle substrate
US10173916B2 (en) 2013-12-17 2019-01-08 Corning Incorporated Edge chamfering by mechanically processing laser cut glass
US10179748B2 (en) 2013-12-17 2019-01-15 Corning Incorporated Laser processing of sapphire substrate and related applications
US10183885B2 (en) 2013-12-17 2019-01-22 Corning Incorporated Laser cut composite glass article and method of cutting
US10233112B2 (en) 2013-12-17 2019-03-19 Corning Incorporated Laser processing of slots and holes
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US11148225B2 (en) 2013-12-17 2021-10-19 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US10144093B2 (en) 2013-12-17 2018-12-04 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US10611668B2 (en) 2013-12-17 2020-04-07 Corning Incorporated Laser cut composite glass article and method of cutting
US10597321B2 (en) 2013-12-17 2020-03-24 Corning Incorporated Edge chamfering methods
US11697178B2 (en) 2014-07-08 2023-07-11 Corning Incorporated Methods and apparatuses for laser processing materials
US9815144B2 (en) 2014-07-08 2017-11-14 Corning Incorporated Methods and apparatuses for laser processing materials
US10526234B2 (en) 2014-07-14 2020-01-07 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
US11648623B2 (en) 2014-07-14 2023-05-16 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
US10335902B2 (en) 2014-07-14 2019-07-02 Corning Incorporated Method and system for arresting crack propagation
US11014845B2 (en) 2014-12-04 2021-05-25 Corning Incorporated Method of laser cutting glass using non-diffracting laser beams
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
US10252931B2 (en) 2015-01-12 2019-04-09 Corning Incorporated Laser cutting of thermally tempered substrates
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
US10525657B2 (en) 2015-03-27 2020-01-07 Corning Incorporated Gas permeable window and method of fabricating the same
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
US11111170B2 (en) 2016-05-06 2021-09-07 Corning Incorporated Laser cutting and removal of contoured shapes from transparent substrates
US11114309B2 (en) 2016-06-01 2021-09-07 Corning Incorporated Articles and methods of forming vias in substrates
US11774233B2 (en) 2016-06-29 2023-10-03 Corning Incorporated Method and system for measuring geometric parameters of through holes
US10377658B2 (en) 2016-07-29 2019-08-13 Corning Incorporated Apparatuses and methods for laser processing
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
US11130701B2 (en) 2016-09-30 2021-09-28 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11062986B2 (en) 2017-05-25 2021-07-13 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11972993B2 (en) 2017-05-25 2024-04-30 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness

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