WO2008117384A1 - 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法 - Google Patents

電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法 Download PDF

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Publication number
WO2008117384A1
WO2008117384A1 PCT/JP2007/056079 JP2007056079W WO2008117384A1 WO 2008117384 A1 WO2008117384 A1 WO 2008117384A1 JP 2007056079 W JP2007056079 W JP 2007056079W WO 2008117384 A1 WO2008117384 A1 WO 2008117384A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
base
circuit chip
electronic
conductor pattern
Prior art date
Application number
PCT/JP2007/056079
Other languages
English (en)
French (fr)
Inventor
Hiroshi Kobayashi
Kenji Kobae
Shuichi Takeuchi
Hidehiko Kira
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/056079 priority Critical patent/WO2008117384A1/ja
Priority to EP07739520A priority patent/EP2131312A4/en
Priority to JP2009506100A priority patent/JP4883175B2/ja
Priority to CN2007800522387A priority patent/CN101636750B/zh
Publication of WO2008117384A1 publication Critical patent/WO2008117384A1/ja
Priority to US12/559,202 priority patent/US7789316B2/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/027—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Textile Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

　本発明は、回路チップへの曲げ応力が低減され、かつ、導体パターンの断線も回避された電子装置等を提供することを目的とし、ベース１１と、ベース上に配線された導体パターン１２と、導体パターン１２に電気的に接続された回路チップ１３と、ベース１１上に回路チップ１３を囲んで配置された、環状の外形を有し、所定の基材１６ａ中にベース１１の厚み方向に延びる複数の支柱１６ｂが分散してなる内部構造を有する補強体１６と、補強体１６の内側を埋めて回路チップ１３上部を覆い、回路チップ１３をベース１１上で封止した封止体１５ａとを備えた。
PCT/JP2007/056079 2007-03-23 2007-03-23 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法 WO2008117384A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/JP2007/056079 WO2008117384A1 (ja) 2007-03-23 2007-03-23 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法
EP07739520A EP2131312A4 (en) 2007-03-23 2007-03-23 ELECTRONIC ARRANGEMENT, ELECTRONIC EQUIPMENT, INCLUDING AN ELECTRONIC ARRANGEMENT, ARTICLE TO WHICH AN ELECTRONIC ARRANGEMENT IS PLACED, AND METHOD FOR PRODUCING AN ELECTRONIC ARRANGEMENT
JP2009506100A JP4883175B2 (ja) 2007-03-23 2007-03-23 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法
CN2007800522387A CN101636750B (zh) 2007-03-23 2007-03-23 电子装置、安装有电子装置的电子设备、安装有电子装置的物品、电子装置的制造方法
US12/559,202 US7789316B2 (en) 2007-03-23 2009-09-14 Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/056079 WO2008117384A1 (ja) 2007-03-23 2007-03-23 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/559,202 Continuation US7789316B2 (en) 2007-03-23 2009-09-14 Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device

Publications (1)

Publication Number Publication Date
WO2008117384A1 true WO2008117384A1 (ja) 2008-10-02

Family

ID=39788128

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/056079 WO2008117384A1 (ja) 2007-03-23 2007-03-23 電子装置、電子装置が実装された電子機器、電子装置が装着された物品、および電子装置の製造方法

Country Status (5)

Country Link
US (1) US7789316B2 (ja)
EP (1) EP2131312A4 (ja)
JP (1) JP4883175B2 (ja)
CN (1) CN101636750B (ja)
WO (1) WO2008117384A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101663750B (zh) * 2007-03-23 2011-06-29 富士通株式会社 Rfid标签及其制造方法
CN102469693A (zh) * 2010-11-12 2012-05-23 速码波科技股份有限公司 覆晶封装结构及其可携式通信装置与芯片封胶的工艺方法
JP5637004B2 (ja) * 2011-02-23 2014-12-10 株式会社村田製作所 半導体集積回路モジュール、無線通信モジュール及び無線通信デバイス
FI126349B (en) * 2012-12-31 2016-10-14 Suunto Oy Electronic device case
DE102013102003A1 (de) * 2013-02-28 2014-08-28 Bundesdruckerei Gmbh Chipkarte mit integrierten aktiven Komponenten
JP6679244B2 (ja) * 2015-08-27 2020-04-15 富士通株式会社 Ｒｆｉｄタグ
CN111630594B (zh) 2017-12-01 2023-08-01 日本电信电话株式会社 基音增强装置、其方法以及记录介质
JP2019192137A (ja) * 2018-04-27 2019-10-31 富士通株式会社 Ｒｆｉｄタグ
JP2021048195A (ja) 2019-09-17 2021-03-25 キオクシア株式会社 半導体装置及び半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02255391A (ja) * 1989-03-30 1990-10-16 Toshiba Corp 携帯可能電子機器
JPH09118087A (ja) * 1995-05-31 1997-05-06 Richard Herbst スマートカードを形成する方法と装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS554917A (en) 1978-06-26 1980-01-14 Hitachi Ltd Resin-enclosed semi-conductor device
JPS6018934A (ja) 1983-07-13 1985-01-31 Hitachi Micro Comput Eng Ltd 半導体装置
JPS6186886A (ja) 1984-10-04 1986-05-02 Toshiba Corp Ｉｃカ−ド
DE3924439A1 (de) * 1989-07-24 1991-04-18 Edgar Schneider Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente
JP3914620B2 (ja) * 1997-10-16 2007-05-16 シチズン時計株式会社 Ｉｃカード
JP3451373B2 (ja) 1999-11-24 2003-09-29 オムロン株式会社 電磁波読み取り可能なデータキャリアの製造方法
JP4753339B2 (ja) 2001-09-28 2011-08-24 Ｎｅｃトーキン株式会社 非接触通信媒体
US6627990B1 (en) * 2003-02-06 2003-09-30 St. Assembly Test Service Ltd. Thermally enhanced stacked die package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02255391A (ja) * 1989-03-30 1990-10-16 Toshiba Corp 携帯可能電子機器
JPH09118087A (ja) * 1995-05-31 1997-05-06 Richard Herbst スマートカードを形成する方法と装置

Also Published As

Publication number Publication date
EP2131312A1 (en) 2009-12-09
JPWO2008117384A1 (ja) 2010-07-08
JP4883175B2 (ja) 2012-02-22
US7789316B2 (en) 2010-09-07
CN101636750A (zh) 2010-01-27
EP2131312A4 (en) 2011-08-24
CN101636750B (zh) 2012-08-08
US20100001081A1 (en) 2010-01-07

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