WO2008111484A1 - 凸版反転印刷用導電性インキ - Google Patents

凸版反転印刷用導電性インキ Download PDF

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Publication number
WO2008111484A1
WO2008111484A1 PCT/JP2008/054051 JP2008054051W WO2008111484A1 WO 2008111484 A1 WO2008111484 A1 WO 2008111484A1 JP 2008054051 W JP2008054051 W JP 2008054051W WO 2008111484 A1 WO2008111484 A1 WO 2008111484A1
Authority
WO
WIPO (PCT)
Prior art keywords
solvent
conductive ink
measured
ingredient
surface energy
Prior art date
Application number
PCT/JP2008/054051
Other languages
English (en)
French (fr)
Inventor
Masayoshi Kotake
Yasuhiro Sente
Hiroshi Isozumi
Original Assignee
Dic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dic Corporation filed Critical Dic Corporation
Priority to KR20097018771A priority Critical patent/KR101184674B1/ko
Priority to CN2008800077453A priority patent/CN101632136B/zh
Priority to JP2009504008A priority patent/JP4375499B2/ja
Priority to US12/450,153 priority patent/US8241528B2/en
Priority to EP08721471.4A priority patent/EP2139007B1/en
Publication of WO2008111484A1 publication Critical patent/WO2008111484A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Printing Methods (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

　凸版反転印刷法による微細な導電性パターンを基板上に形成するための導電性インキを提供する。特に、転写不良が無く安定的に形成することができ、かつ低温焼成で優れた導電性を付与できる導電性インキである。体積平均粒径（Ｍｖ）が１０～７００ｎｍの導電性粒子、離型剤、表面エネルギー調整剤、溶剤成分を必須成分とし、前記溶剤成分が２５°Cでの表面エネルギーが２７ｍＮ／ｍ以上の溶剤（高表面エネルギー溶剤）と、大気圧下での沸点１００°C以下の揮発性の溶剤（低沸点溶剤）との混合物であり、２５°Cにおけるインキの表面エネルギーが１０～２１ｍＮ／ｍである実質的にバインダー成分を含まない導電性インキである。
PCT/JP2008/054051 2007-03-15 2008-03-06 凸版反転印刷用導電性インキ WO2008111484A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR20097018771A KR101184674B1 (ko) 2007-03-15 2008-03-06 볼록판 반전 인쇄용 도전성 잉크
CN2008800077453A CN101632136B (zh) 2007-03-15 2008-03-06 凸版反转印刷用导电性油墨
JP2009504008A JP4375499B2 (ja) 2007-03-15 2008-03-06 凸版反転印刷用導電性インキ
US12/450,153 US8241528B2 (en) 2007-03-15 2008-03-06 Conductive ink for letterpress reverse printing
EP08721471.4A EP2139007B1 (en) 2007-03-15 2008-03-06 Conductive ink for letterpress reverse printing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-067277 2007-03-15
JP2007067277 2007-03-15

Publications (1)

Publication Number Publication Date
WO2008111484A1 true WO2008111484A1 (ja) 2008-09-18

Family

ID=39759426

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054051 WO2008111484A1 (ja) 2007-03-15 2008-03-06 凸版反転印刷用導電性インキ

Country Status (7)

Country Link
US (1) US8241528B2 (ja)
EP (1) EP2139007B1 (ja)
JP (1) JP4375499B2 (ja)
KR (1) KR101184674B1 (ja)
CN (1) CN101632136B (ja)
TW (1) TWI343405B (ja)
WO (1) WO2008111484A1 (ja)

Cited By (15)

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JP2010116525A (ja) * 2008-11-14 2010-05-27 Dic Corp エッチングレジスト用インクおよびそれを用いたレジストパターンの形成方法
JP2010264599A (ja) * 2009-05-12 2010-11-25 Dic Corp パターン形成方法
CN102217076A (zh) * 2009-04-27 2011-10-12 Dic株式会社 有机半导体元件遮光膜形成用油墨组合物、遮光膜形成方法以及具有遮光膜的有机晶体管元件
JP4894957B2 (ja) * 2009-03-31 2012-03-14 Ｄｉｃ株式会社 有機半導体インキ組成物及びこれを用いた有機半導体パターン形成方法
CN102666747A (zh) * 2009-08-26 2012-09-12 Lg化学株式会社 导电金属油墨组合物和形成导电图形的方法
CN102892847A (zh) * 2010-05-10 2013-01-23 Lg化学株式会社 导电金属油墨组合物和用于形成导电图形的方法
JP2013503234A (ja) * 2009-08-28 2013-01-31 エルジー・ケム・リミテッド 導電性金属インク組成物および導電性パターンの形成方法
WO2014017323A1 (ja) * 2012-07-26 2014-01-30 Dic株式会社 反転印刷用導電性インキ及び薄膜トランジスタの製造方法及び該製造法方法で形成された薄膜トランジスタ
JP2014507532A (ja) * 2011-02-08 2014-03-27 エルジー・ケム・リミテッド 印刷用インク組成物、これを用いた印刷方法
JP2014507510A (ja) * 2011-02-25 2014-03-27 ハンワ ケミカル コーポレイション オフセットまたはリバースオフセット印刷用の導電性インク組成物
WO2015012264A1 (ja) * 2013-07-23 2015-01-29 旭化成株式会社 銅及び／又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜
US8961835B2 (en) 2009-08-26 2015-02-24 Lg Chem, Ltd. Conductive metal ink composition and method for forming a conductive pattern
WO2016084312A1 (ja) * 2014-11-25 2016-06-02 バンドー化学株式会社 導電性インク
CN106457868A (zh) * 2014-06-05 2017-02-22 大日本印刷株式会社 印刷版、印刷版的制造方法、功能性元件的制造方法及印刷装置
JP2017160319A (ja) * 2016-03-09 2017-09-14 株式会社アルバック 凸版反転印刷用導電性金属インク

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WO2009099707A1 (en) * 2008-02-05 2009-08-13 Crain, John, M. Printed electronics
TWI406704B (zh) * 2008-12-31 2013-09-01 Ind Tech Res Inst 奈米銀分散液與其噴印墨水
JP5569865B2 (ja) * 2010-07-09 2014-08-13 セイコーエプソン株式会社 インク組成物
EP2468827B1 (en) 2010-12-21 2014-03-12 Agfa-Gevaert A dispersion comprising metallic, metal oxide or metal precursor nanoparticles
JP5822368B2 (ja) * 2011-04-05 2015-11-24 エルジー・ケム・リミテッド 印刷組成物及びこれを利用した印刷方法
ES2485308T3 (es) 2011-12-21 2014-08-13 Agfa-Gevaert Dispersión que contiene nanopartículas metálicas, de óxido de metal o de precursor de metal, un dispersante polimérico y un aditivo de sinterización
EP2608218B1 (en) 2011-12-21 2014-07-30 Agfa-Gevaert A dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a thermally cleavable agent
CN103194116A (zh) * 2012-01-09 2013-07-10 深圳市纳宇材料技术有限公司 一种油墨、透明导电线路及透明导电线路的制备方法
EP2671927B1 (en) 2012-06-05 2021-06-02 Agfa-Gevaert Nv A metallic nanoparticle dispersion
CN104520971A (zh) * 2012-08-07 2015-04-15 株式会社Lg化学 印刷品及这种印刷品的制造方法
CN102827509B (zh) * 2012-10-08 2014-06-25 中国科学院宁波材料技术与工程研究所 一种纳米银导电墨水及其制备方法
TWI489342B (zh) * 2012-12-26 2015-06-21 Ind Tech Res Inst 凹版轉印組合物及凹版轉印製程
EP2781562B1 (en) 2013-03-20 2016-01-20 Agfa-Gevaert A method to prepare a metallic nanoparticle dispersion
WO2015000937A1 (en) 2013-07-04 2015-01-08 Agfa-Gevaert A metallic nanoparticle dispersion
WO2015000932A1 (en) 2013-07-04 2015-01-08 Agfa-Gevaert A method of preparing a conductive metallic layer or pattern
EP2821164A1 (en) 2013-07-04 2015-01-07 Agfa-Gevaert A metallic nanoparticle dispersion
KR20160051834A (ko) 2013-09-06 2016-05-11 솔베이 스페셜티 폴리머스 이태리 에스.피.에이. 전기 전도성 조립체
CN103474132B (zh) * 2013-09-16 2015-12-23 宁波东旭成新材料科技有限公司 一种用于触摸屏的导电膜及其制造方法
EP3037161B1 (en) 2014-12-22 2021-05-26 Agfa-Gevaert Nv A metallic nanoparticle dispersion
EP3099145B1 (en) 2015-05-27 2020-11-18 Agfa-Gevaert Method of preparing a silver layer or pattern comprising a step of applying a silver nanoparticle dispersion
EP3099146B1 (en) 2015-05-27 2020-11-04 Agfa-Gevaert Method of preparing a silver layer or pattern comprising a step of applying a silver nanoparticle dispersion
EP3287499B1 (en) 2016-08-26 2021-04-07 Agfa-Gevaert Nv A metallic nanoparticle dispersion
KR20200140359A (ko) 2018-05-08 2020-12-15 아그파-게바에르트 엔.브이. 전도성 잉크
EP4163343A1 (en) 2021-10-05 2023-04-12 Agfa-Gevaert Nv Conductive inks

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Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010116525A (ja) * 2008-11-14 2010-05-27 Dic Corp エッチングレジスト用インクおよびそれを用いたレジストパターンの形成方法
JP4894957B2 (ja) * 2009-03-31 2012-03-14 Ｄｉｃ株式会社 有機半導体インキ組成物及びこれを用いた有機半導体パターン形成方法
CN102217076A (zh) * 2009-04-27 2011-10-12 Dic株式会社 有机半导体元件遮光膜形成用油墨组合物、遮光膜形成方法以及具有遮光膜的有机晶体管元件
JP2010264599A (ja) * 2009-05-12 2010-11-25 Dic Corp パターン形成方法
US8691118B2 (en) 2009-08-26 2014-04-08 Lg Chem, Ltd. Conductive metal ink composition and method for forming a conductive pattern
CN102666747A (zh) * 2009-08-26 2012-09-12 Lg化学株式会社 导电金属油墨组合物和形成导电图形的方法
US8961835B2 (en) 2009-08-26 2015-02-24 Lg Chem, Ltd. Conductive metal ink composition and method for forming a conductive pattern
CN102666747B (zh) * 2009-08-26 2014-11-05 Lg化学株式会社 导电金属油墨组合物和形成导电图形的方法
US8883046B2 (en) 2009-08-28 2014-11-11 Lg Chem, Ltd. Conductive metal ink composition and method for forming a conductive pattern
JP2013503234A (ja) * 2009-08-28 2013-01-31 エルジー・ケム・リミテッド 導電性金属インク組成物および導電性パターンの形成方法
CN102892847B (zh) * 2010-05-10 2014-12-17 Lg化学株式会社 导电金属油墨组合物和用于形成导电图形的方法
CN102892847A (zh) * 2010-05-10 2013-01-23 Lg化学株式会社 导电金属油墨组合物和用于形成导电图形的方法
US9340684B2 (en) 2010-05-10 2016-05-17 Lg Chem, Ltd. Conductive metal ink composition, and method for forming a conductive pattern
JP2014507532A (ja) * 2011-02-08 2014-03-27 エルジー・ケム・リミテッド 印刷用インク組成物、これを用いた印刷方法
JP2016047925A (ja) * 2011-02-08 2016-04-07 エルジー・ケム・リミテッド 印刷方法
JP2014507510A (ja) * 2011-02-25 2014-03-27 ハンワ ケミカル コーポレイション オフセットまたはリバースオフセット印刷用の導電性インク組成物
WO2014017323A1 (ja) * 2012-07-26 2014-01-30 Dic株式会社 反転印刷用導電性インキ及び薄膜トランジスタの製造方法及び該製造法方法で形成された薄膜トランジスタ
JPWO2014017323A1 (ja) * 2012-07-26 2016-07-11 Dic株式会社 反転印刷用導電性インキ及び薄膜トランジスタの製造方法及び該製造法方法で形成された薄膜トランジスタ
WO2015012264A1 (ja) * 2013-07-23 2015-01-29 旭化成株式会社 銅及び／又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜
EP3026677A4 (en) * 2013-07-23 2016-07-27 Asahi Chemical Ind DISPERSION OF COPPER AND / OR COPPER OXIDE, AND CONDUCTIVE MEMBRANE FORMED THEREWITH
JPWO2015012264A1 (ja) * 2013-07-23 2017-03-02 旭化成株式会社 銅及び／又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜
JP2017143309A (ja) * 2013-07-23 2017-08-17 旭化成株式会社 銅及び／又は銅酸化物分散体、並びに該分散体を用いて形成された導電膜
US10424648B2 (en) 2013-07-23 2019-09-24 Asahi Kasei Kabushiki Kaisha Copper and/or copper oxide dispersion, and electroconductive film formed using dispersion
CN106457868A (zh) * 2014-06-05 2017-02-22 大日本印刷株式会社 印刷版、印刷版的制造方法、功能性元件的制造方法及印刷装置
WO2016084312A1 (ja) * 2014-11-25 2016-06-02 バンドー化学株式会社 導電性インク
JP6101403B2 (ja) * 2014-11-25 2017-03-22 バンドー化学株式会社 導電性インク
JPWO2016084312A1 (ja) * 2014-11-25 2017-04-27 バンドー化学株式会社 導電性インク
JP2017160319A (ja) * 2016-03-09 2017-09-14 株式会社アルバック 凸版反転印刷用導電性金属インク

Also Published As

Publication number Publication date
KR101184674B1 (ko) 2012-09-20
TWI343405B (en) 2011-06-11
KR20100014950A (ko) 2010-02-11
JP4375499B2 (ja) 2009-12-02
CN101632136A (zh) 2010-01-20
EP2139007A4 (en) 2011-03-23
CN101632136B (zh) 2012-01-11
EP2139007A1 (en) 2009-12-30
US20100148131A1 (en) 2010-06-17
JPWO2008111484A1 (ja) 2010-06-24
TW200848480A (en) 2008-12-16
US8241528B2 (en) 2012-08-14
EP2139007B1 (en) 2016-09-21

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