WO2008108178A1 - マイクロチップの製造方法 - Google Patents
マイクロチップの製造方法 Download PDFInfo
- Publication number
- WO2008108178A1 WO2008108178A1 PCT/JP2008/052948 JP2008052948W WO2008108178A1 WO 2008108178 A1 WO2008108178 A1 WO 2008108178A1 JP 2008052948 W JP2008052948 W JP 2008052948W WO 2008108178 A1 WO2008108178 A1 WO 2008108178A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- microchip
- channel
- substrates
- manufacturing
- films
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/08—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor using a stream of discrete samples flowing along a tube system, e.g. flow injection analysis
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/345—Progressively making the joint, e.g. starting from the middle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00055—Grooves
- B81C1/00071—Channels
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N37/00—Details not covered by any other group of this subclass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
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- B01J2219/00277—Apparatus
- B01J2219/00497—Features relating to the solid phase supports
- B01J2219/00511—Walls of reactor vessels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
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- B01J2219/00277—Apparatus
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- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
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- B01J2219/00583—Features relative to the processes being carried out
- B01J2219/00596—Solid-phase processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B01J2219/00603—Making arrays on substantially continuous surfaces
- B01J2219/00605—Making arrays on substantially continuous surfaces the compounds being directly bound or immobilised to solid supports
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B01J2219/00583—Features relative to the processes being carried out
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- B01J2219/00614—Delimitation of the attachment areas
- B01J2219/00621—Delimitation of the attachment areas by physical means, e.g. trenches, raised areas
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B01J2219/00632—Introduction of reactive groups to the surface
- B01J2219/00637—Introduction of reactive groups to the surface by coating it with another layer
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- B01L2200/06—Fluid handling related problems
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C2793/00—Shaping techniques involving a cutting or machining operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
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- B29C66/7232—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer
- B29C66/72324—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer consisting of inorganic materials not provided for in B29C66/72321 - B29C66/72322
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- B29C66/81266—Optical properties, e.g. transparency, reflectivity
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C66/80—General aspects of machine operations or constructions and parts thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
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- B29C66/91411—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Toxicology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Dispersion Chemistry (AREA)
- Optics & Photonics (AREA)
- Hematology (AREA)
- Clinical Laboratory Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electromagnetism (AREA)
- Biochemistry (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Micromachines (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Automatic Analysis And Handling Materials Therefor (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/528,989 US7901527B2 (en) | 2007-03-02 | 2008-02-21 | Microchip manufacturing method |
JP2009502511A JP5229215B2 (ja) | 2007-03-02 | 2008-02-21 | マイクロチップの製造方法 |
EP08711737A EP2116853A4 (en) | 2007-03-02 | 2008-02-21 | MICROCHIP MANUFACTURING METHOD |
CN2008800064519A CN101622542B (zh) | 2007-03-02 | 2008-02-21 | 微芯片的制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-052511 | 2007-03-02 | ||
JP2007052511 | 2007-03-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008108178A1 true WO2008108178A1 (ja) | 2008-09-12 |
Family
ID=39738075
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2008/052948 WO2008108178A1 (ja) | 2007-03-02 | 2008-02-21 | マイクロチップの製造方法 |
Country Status (6)
Country | Link |
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US (1) | US7901527B2 (ja) |
EP (1) | EP2116853A4 (ja) |
JP (1) | JP5229215B2 (ja) |
KR (1) | KR20090117758A (ja) |
CN (1) | CN101622542B (ja) |
WO (1) | WO2008108178A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2014087923A1 (ja) * | 2012-12-07 | 2014-06-12 | アルプス電気株式会社 | 接合部材及び接合部材の製造方法 |
JP2017030357A (ja) * | 2015-07-31 | 2017-02-09 | 東レ株式会社 | 熱可塑性樹脂フィルムの製造方法 |
WO2024062817A1 (ja) * | 2022-09-22 | 2024-03-28 | 国立大学法人東北大学 | マイクロ流路デバイス |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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EP2087981A4 (en) * | 2006-10-31 | 2013-01-02 | Konica Minolta Opto Inc | TEMPLATE AND MICRORACTOR |
US8863967B2 (en) * | 2009-01-06 | 2014-10-21 | Fujimori Kogyo Co., Ltd. | Pouring port, method for producing same and container for liquid provided with the pouring port |
CN102179831B (zh) * | 2011-04-06 | 2012-08-01 | 哈尔滨工业大学 | 一种微流控芯片的微沟道加工设备 |
JP5733392B2 (ja) * | 2011-05-23 | 2015-06-10 | ウシオ電機株式会社 | 成形体の表面処理方法および環状オレフィン系樹脂を含む材料からなる成形体 |
CN103640211A (zh) * | 2013-12-23 | 2014-03-19 | 中国石油大学(华东) | 一种柔性材料辅助聚合物微结构超声波键合封装方法 |
CN104925740B (zh) * | 2014-03-19 | 2017-06-16 | 中芯国际集成电路制造(上海)有限公司 | 一种利用激光退火改善热键合质量的方法 |
CN107349976A (zh) * | 2016-05-10 | 2017-11-17 | 李榕生 | 一种试样驱动用附加件可快捷移除的梅毒诊断用装置 |
JP2019093377A (ja) * | 2017-11-22 | 2019-06-20 | 株式会社エンプラス | 流体チップ、流体デバイスおよびそれらの製造方法 |
KR101976082B1 (ko) * | 2018-01-25 | 2019-05-07 | (주)인텍바이오 | 진단 칩의 제작 방법 |
JP7289718B2 (ja) * | 2019-05-13 | 2023-06-12 | 東京応化工業株式会社 | 流路デバイスの製造方法 |
Citations (4)
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JP2004202336A (ja) * | 2002-12-25 | 2004-07-22 | Fuji Electric Systems Co Ltd | マイクロチャンネルチップ |
JP2005103398A (ja) * | 2003-09-29 | 2005-04-21 | Casio Comput Co Ltd | 反応器及びその製造方法 |
JP2005114414A (ja) * | 2003-10-03 | 2005-04-28 | Univ Waseda | フローセル |
JP2006184010A (ja) * | 2004-12-24 | 2006-07-13 | Kobe Steel Ltd | マイクロ流体デバイス及びその製造方法、並びにこのマイクロ流体デバイスを備えた化学分析装置 |
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US6450895B1 (en) * | 2000-06-05 | 2002-09-17 | Denny J. Galluzzo, Jr. | Golf practice device with adjustable golf ball tee platform and adjustable leg stance platform |
JP2002139419A (ja) | 2000-10-31 | 2002-05-17 | Nippon Sheet Glass Co Ltd | 微小流路素子及びその製造方法 |
FR2846906B1 (fr) * | 2002-11-08 | 2005-08-05 | Commissariat Energie Atomique | Procede de realisation d'un composant comportant un micro-joint et composant realise par ce procede |
US20050023156A1 (en) * | 2003-07-30 | 2005-02-03 | Ramsey J. Michael | Nanostructured material transport devices and their fabrication by application of molecular coatings to nanoscale channels |
JP4367055B2 (ja) | 2003-08-29 | 2009-11-18 | 住友ベークライト株式会社 | マイクロチップ基板の接合方法およびマイクロチップ |
JP2005077239A (ja) | 2003-08-29 | 2005-03-24 | Sumitomo Bakelite Co Ltd | マイクロチップ基板の接合方法およびマイクロチップ |
JP2005077218A (ja) | 2003-08-29 | 2005-03-24 | Sumitomo Bakelite Co Ltd | マイクロチップ基板の接合方法及びマイクロチップ |
JP4021391B2 (ja) | 2003-09-09 | 2007-12-12 | 住友ベークライト株式会社 | マイクロチップ基板の接合方法及びマイクロチップ |
-
2008
- 2008-02-21 WO PCT/JP2008/052948 patent/WO2008108178A1/ja active Application Filing
- 2008-02-21 CN CN2008800064519A patent/CN101622542B/zh not_active Expired - Fee Related
- 2008-02-21 KR KR1020097017944A patent/KR20090117758A/ko not_active Application Discontinuation
- 2008-02-21 US US12/528,989 patent/US7901527B2/en active Active
- 2008-02-21 EP EP08711737A patent/EP2116853A4/en not_active Withdrawn
- 2008-02-21 JP JP2009502511A patent/JP5229215B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2004202336A (ja) * | 2002-12-25 | 2004-07-22 | Fuji Electric Systems Co Ltd | マイクロチャンネルチップ |
JP2005103398A (ja) * | 2003-09-29 | 2005-04-21 | Casio Comput Co Ltd | 反応器及びその製造方法 |
JP2005114414A (ja) * | 2003-10-03 | 2005-04-28 | Univ Waseda | フローセル |
JP2006184010A (ja) * | 2004-12-24 | 2006-07-13 | Kobe Steel Ltd | マイクロ流体デバイス及びその製造方法、並びにこのマイクロ流体デバイスを備えた化学分析装置 |
Non-Patent Citations (1)
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014087923A1 (ja) * | 2012-12-07 | 2014-06-12 | アルプス電気株式会社 | 接合部材及び接合部材の製造方法 |
JP2017030357A (ja) * | 2015-07-31 | 2017-02-09 | 東レ株式会社 | 熱可塑性樹脂フィルムの製造方法 |
WO2024062817A1 (ja) * | 2022-09-22 | 2024-03-28 | 国立大学法人東北大学 | マイクロ流路デバイス |
Also Published As
Publication number | Publication date |
---|---|
EP2116853A1 (en) | 2009-11-11 |
CN101622542B (zh) | 2013-06-12 |
EP2116853A4 (en) | 2012-08-01 |
JPWO2008108178A1 (ja) | 2010-06-10 |
US20100012255A1 (en) | 2010-01-21 |
US7901527B2 (en) | 2011-03-08 |
JP5229215B2 (ja) | 2013-07-03 |
KR20090117758A (ko) | 2009-11-12 |
CN101622542A (zh) | 2010-01-06 |
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