WO2008108157A1 - 粘着テープ - Google Patents

粘着テープ Download PDF

Info

Publication number
WO2008108157A1
WO2008108157A1 PCT/JP2008/052642 JP2008052642W WO2008108157A1 WO 2008108157 A1 WO2008108157 A1 WO 2008108157A1 JP 2008052642 W JP2008052642 W JP 2008052642W WO 2008108157 A1 WO2008108157 A1 WO 2008108157A1
Authority
WO
WIPO (PCT)
Prior art keywords
pressure
sensitive adhesive
adhesive tape
clay mineral
lamellar clay
Prior art date
Application number
PCT/JP2008/052642
Other languages
English (en)
French (fr)
Inventor
Yuki Sugo
Yoshio Terada
Takashi Oda
Hiroyuki Kondou
Original Assignee
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Priority to US12/529,237 priority Critical patent/US20100092714A1/en
Publication of WO2008108157A1 publication Critical patent/WO2008108157A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1462—Polymer derived from material having at least one acrylic or alkacrylic group or the nitrile or amide derivative thereof [e.g., acrylamide, acrylate ester, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

　被着体に対して十分な粘着力を有し、耐熱性に優れ、特に、引き剥がす際に被着体に粘着剤残りを生じることなく簡単に剥離する事が可能な、粘着テープを提供する。 　本発明の粘着テープは、親油性の層状粘土鉱物を含む粘着剤層を基材シート上に有し、該層状粘土鉱物が剥離分散しており、該層状粘土鉱物の層間距離が５０Å以上である。
PCT/JP2008/052642 2007-03-06 2008-02-18 粘着テープ WO2008108157A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/529,237 US20100092714A1 (en) 2007-03-06 2008-02-18 Pressure-Sensitive Adhesive Tape

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-054992 2007-03-06
JP2007054992A JP2008214518A (ja) 2007-03-06 2007-03-06 粘着テープ

Publications (1)

Publication Number Publication Date
WO2008108157A1 true WO2008108157A1 (ja) 2008-09-12

Family

ID=39738054

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052642 WO2008108157A1 (ja) 2007-03-06 2008-02-18 粘着テープ

Country Status (4)

Country Link
US (1) US20100092714A1 (ja)
JP (1) JP2008214518A (ja)
TW (1) TW200842179A (ja)
WO (1) WO2008108157A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102216075A (zh) * 2008-11-27 2011-10-12 三井-杜邦聚合化学株式会社 电子部件用保护膜、其制造方法及用途
JP2011111367A (ja) * 2009-11-27 2011-06-09 Sekisui Chem Co Ltd 薄片化黒鉛分散液の製造方法、薄片化黒鉛分散液及び薄膜の製造方法
KR101478429B1 (ko) * 2012-03-12 2014-12-31 주식회사 엘지화학 점착 필름
JP6451034B2 (ja) * 2015-03-31 2019-01-16 フジコピアン株式会社 自己貼着性フィルム

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002167557A (ja) * 2000-12-01 2002-06-11 Sekisui Chem Co Ltd 粘着剤用組成物、粘着剤及び粘着シート
JP2002294209A (ja) * 2001-03-30 2002-10-09 Sekisui Chem Co Ltd 粘着剤組成物及びその製造方法、並びに粘着テープ
JP2004014930A (ja) * 2002-06-10 2004-01-15 Nitto Denko Corp 半導体装置の製造方法及びこれに用いる耐熱性粘着テープ
JP2004530012A (ja) * 2001-04-04 2004-09-30 スリーエム イノベイティブ プロパティズ カンパニー 親有機性クレー板状粒子を含むホットメルト加工性感圧接着剤、製造方法、及びそれによって製造された物品
JP2005344008A (ja) * 2004-06-03 2005-12-15 Nitto Denko Corp 剥離可能な感圧性接着シート
JP2006188645A (ja) * 2004-12-10 2006-07-20 National Institute Of Advanced Industrial & Technology 粘着粘土膜及びその使用方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2070136T3 (es) * 1988-04-07 1995-06-01 Kanegafuchi Chemical Ind Material adhesivo sensible a la presion.
JP3040705B2 (ja) * 1995-12-20 2000-05-15 株式会社麗光 光拡散シート用樹脂微粒子および光拡散シート
US6884833B2 (en) * 2001-06-29 2005-04-26 3M Innovative Properties Company Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
JP4213887B2 (ja) * 2001-10-26 2009-01-21 日東電工株式会社 透明性粘着剤組成物とその粘着シート
JP2003181967A (ja) * 2001-12-14 2003-07-03 Nitto Denko Corp 剥離ライナーおよび剥離ライナー付感圧性接着シート
JP4146685B2 (ja) * 2002-08-15 2008-09-10 日東電工株式会社 透明性粘着剤組成物とその粘着シート
JPWO2004027085A1 (ja) * 2002-09-05 2006-01-19 日東電工株式会社 固体表面の微生物試験用粘着シートおよびキット
US6958860B2 (en) * 2002-10-07 2005-10-25 Eastman Kodak Company Voided polymer film containing layered particulates
KR100668921B1 (ko) * 2003-03-25 2007-01-12 세키스이가세이힝코교가부시키가이샤 실리카 피복 중합체 입자, 이의 제조 방법 및 이의 용도
JP4718146B2 (ja) * 2004-09-01 2011-07-06 株式会社Ｓｈｉｎｄｏ 多孔質シート用エマルション型シリコーン粘着剤組成物および再剥離性粘着シート

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002167557A (ja) * 2000-12-01 2002-06-11 Sekisui Chem Co Ltd 粘着剤用組成物、粘着剤及び粘着シート
JP2002294209A (ja) * 2001-03-30 2002-10-09 Sekisui Chem Co Ltd 粘着剤組成物及びその製造方法、並びに粘着テープ
JP2004530012A (ja) * 2001-04-04 2004-09-30 スリーエム イノベイティブ プロパティズ カンパニー 親有機性クレー板状粒子を含むホットメルト加工性感圧接着剤、製造方法、及びそれによって製造された物品
JP2004014930A (ja) * 2002-06-10 2004-01-15 Nitto Denko Corp 半導体装置の製造方法及びこれに用いる耐熱性粘着テープ
JP2005344008A (ja) * 2004-06-03 2005-12-15 Nitto Denko Corp 剥離可能な感圧性接着シート
JP2006188645A (ja) * 2004-12-10 2006-07-20 National Institute Of Advanced Industrial & Technology 粘着粘土膜及びその使用方法

Also Published As

Publication number Publication date
TW200842179A (en) 2008-11-01
TWI363083B (ja) 2012-05-01
JP2008214518A (ja) 2008-09-18
US20100092714A1 (en) 2010-04-15

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