WO2008105397A1 - 粘着性と濡れ性を有するはんだ付け用回路基板 - Google Patents

粘着性と濡れ性を有するはんだ付け用回路基板 Download PDF

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Publication number
WO2008105397A1
WO2008105397A1 PCT/JP2008/053263 JP2008053263W WO2008105397A1 WO 2008105397 A1 WO2008105397 A1 WO 2008105397A1 JP 2008053263 W JP2008053263 W JP 2008053263W WO 2008105397 A1 WO2008105397 A1 WO 2008105397A1
Authority
WO
WIPO (PCT)
Prior art keywords
coating
corrosion
compound
resistant
property
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/053263
Other languages
English (en)
French (fr)
Inventor
Takeo Kuramoto
Kaichi Tsuruta
Takashi Hori
Takeo Saitou
Shinichi Nomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to JP2009501240A priority Critical patent/JP4899113B2/ja
Publication of WO2008105397A1 publication Critical patent/WO2008105397A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/365—Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0485—Tacky flux, e.g. for adhering components during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)

Abstract

　金属と錯体形成能を持つ防錆性有機化合物（例、イミダゾール又はベンゾイミダゾール誘導体）を利用して電子部品の基板の金属回路露出部（例、電極）上だけに粘着性を有する防錆性皮膜を形成する。この防錆性皮膜を次いで該防錆性有機化合物と反応性を持たないフラックス作用のある化合物（例、隣接炭素原子がハロゲンで置換されている有機ハロゲン化物）で処理して、皮膜中にこの化合物を取り込むことにより、防錆性皮膜は粘着性を保持しながらフラックス機能を示すようになる。この皮膜上にはんだ粉末を付着させるか、あるいははんだボールを搭載し、フラックスを塗布せずにリフロー加熱すると、はんだプリコート又ははんだバンプが形成される。
PCT/JP2008/053263 2007-02-26 2008-02-26 粘着性と濡れ性を有するはんだ付け用回路基板 Ceased WO2008105397A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009501240A JP4899113B2 (ja) 2007-02-26 2008-02-26 はんだ付け回路基板、その処理方法、およびはんだ層・バンプの形成方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007046319 2007-02-26
JP2007-046319 2007-02-26

Publications (1)

Publication Number Publication Date
WO2008105397A1 true WO2008105397A1 (ja) 2008-09-04

Family

ID=39721228

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053263 Ceased WO2008105397A1 (ja) 2007-02-26 2008-02-26 粘着性と濡れ性を有するはんだ付け用回路基板

Country Status (2)

Country Link
JP (2) JP4899113B2 (ja)
WO (1) WO2008105397A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010287838A (ja) * 2009-06-15 2010-12-24 Sumitomo Electric Ind Ltd 電極の接続構造、これに用いる導電性接着剤及び電子機器
JP2012248598A (ja) * 2011-05-26 2012-12-13 Fujitsu Ltd 半導体装置の製造方法
WO2013133409A1 (ja) * 2012-03-08 2013-09-12 住友電気工業株式会社 基板付き多心ケーブルの製造方法
US9226406B2 (en) 2009-06-15 2015-12-29 Sumitomo Electric Industries, Ltd. Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device
JP7037103B1 (ja) * 2021-10-06 2022-03-16 千住金属工業株式会社 フラックス及びソルダペースト

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5657761B1 (ja) * 2013-08-30 2015-01-21 株式会社タムラ製作所 半導体用基板の表面処理方法、半導体パッケージの製造方法、およびこれらの方法に用いる水溶性プリフラックス
JP6627522B2 (ja) 2016-01-15 2020-01-08 富士電機株式会社 半導体装置用部材及び半導体装置の製造方法、及び半導体装置用部材

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001267731A (ja) * 2000-01-13 2001-09-28 Hitachi Ltd バンプ付き電子部品の製造方法および電子部品の製造方法
JP2007044733A (ja) * 2005-08-10 2007-02-22 Miyazaki Prefecture はんだ付け用フラックス

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000200964A (ja) * 1998-12-28 2000-07-18 Nippon Mektron Ltd 可撓性回路基板の接続部構造及びその製造法
AU3667900A (en) * 1999-04-07 2000-10-23 Mv Research Limited Material inspection
JP2003069205A (ja) * 2001-08-28 2003-03-07 Showa Denko Kk プリント配線板用プリフラックス

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001267731A (ja) * 2000-01-13 2001-09-28 Hitachi Ltd バンプ付き電子部品の製造方法および電子部品の製造方法
JP2007044733A (ja) * 2005-08-10 2007-02-22 Miyazaki Prefecture はんだ付け用フラックス

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010287838A (ja) * 2009-06-15 2010-12-24 Sumitomo Electric Ind Ltd 電極の接続構造、これに用いる導電性接着剤及び電子機器
US8470438B2 (en) 2009-06-15 2013-06-25 Sumitomo Electric Industries, Ltd. Electrode-connecting structure, conductive adhesive used for the same, and electronic apparatus
US9226406B2 (en) 2009-06-15 2015-12-29 Sumitomo Electric Industries, Ltd. Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device
JP2012248598A (ja) * 2011-05-26 2012-12-13 Fujitsu Ltd 半導体装置の製造方法
WO2013133409A1 (ja) * 2012-03-08 2013-09-12 住友電気工業株式会社 基板付き多心ケーブルの製造方法
CN104160557A (zh) * 2012-03-08 2014-11-19 住友电气工业株式会社 带基板的多芯电缆的制造方法
JP7037103B1 (ja) * 2021-10-06 2022-03-16 千住金属工業株式会社 フラックス及びソルダペースト
WO2023058450A1 (ja) * 2021-10-06 2023-04-13 千住金属工業株式会社 フラックス及びソルダペースト
CN118055828A (zh) * 2021-10-06 2024-05-17 千住金属工业株式会社 助焊剂及焊膏
US12269806B2 (en) 2021-10-06 2025-04-08 Senju Metal Industry Co., Ltd. Flux and solder paste

Also Published As

Publication number Publication date
JP4899113B2 (ja) 2012-03-21
JPWO2008105397A1 (ja) 2010-06-03
JP2012114429A (ja) 2012-06-14

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