WO2008096587A1 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
WO2008096587A1
WO2008096587A1 PCT/JP2008/050686 JP2008050686W WO2008096587A1 WO 2008096587 A1 WO2008096587 A1 WO 2008096587A1 JP 2008050686 W JP2008050686 W JP 2008050686W WO 2008096587 A1 WO2008096587 A1 WO 2008096587A1
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WO
WIPO (PCT)
Prior art keywords
stress film
gate electrode
side wall
source
drain region
Prior art date
Application number
PCT/JP2008/050686
Other languages
English (en)
French (fr)
Inventor
Kenzo Manabe
Hidetatsu Nakamura
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to JP2008557050A priority Critical patent/JP5401991B2/ja
Publication of WO2008096587A1 publication Critical patent/WO2008096587A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238—Complementary field-effect transistors, e.g. CMOS
    • H01L21/823807—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H01L21/28035—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities
    • H01L21/28044—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer
    • H01L21/28052—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer the conductor comprising a silicide layer formed by the silicidation reaction of silicon with a metal layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238—Complementary field-effect transistors, e.g. CMOS
    • H01L21/823828—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
    • H01L21/823842—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes gate conductors with different gate conductor materials or different gate conductor implants, e.g. dual gate structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66545—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
    • H01L29/7845—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate the means being a conductive material, e.g. silicided S/D or Gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

　チャネル領域に大きな応力（歪み）が加わるようにゲート電極周辺の膜の応力と配置を最適化する。これによりＭＯＳＦＥＴのキャリア移動度を向上させる。 　（１）ゲート電極上のみに圧縮応力膜を有する、（２）ゲートサイドウォール、ソース／ドレイン領域上にのみ引張応力膜を有する、又は（３）ゲート電極上に圧縮応力膜と、ゲートサイドウォールとソース／ドレイン領域上に引張応力膜とを有する、のように構成されたｎチャネル型ＭＯＳＦＥＴ。（Ａ）ゲート電極上のみに引張応力膜を有する、（Ｂ）ゲートサイドウォール、ソース／ドレイン領域上にのみ圧縮応力膜を有する、又は（Ｃ）ゲート電極上に引張応力膜と、ゲートサイドウォール・ソース／ドレイン領域上に圧縮応力膜とを有する、のように構成されたｐチャネル型ＭＯＳＦＥＴ。
PCT/JP2008/050686 2007-02-07 2008-01-21 半導体装置 WO2008096587A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008557050A JP5401991B2 (ja) 2007-02-07 2008-01-21 半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007027882 2007-02-07
JP2007-027882 2007-02-07

Publications (1)

Publication Number Publication Date
WO2008096587A1 true WO2008096587A1 (ja) 2008-08-14

Family

ID=39681498

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050686 WO2008096587A1 (ja) 2007-02-07 2008-01-21 半導体装置

Country Status (2)

Country Link
JP (1) JP5401991B2 (ja)
WO (1) WO2008096587A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102446726A (zh) * 2010-10-13 2012-05-09 中芯国际集成电路制造(上海)有限公司 一种金属栅极的形成方法
CN102623405A (zh) * 2011-01-30 2012-08-01 中国科学院微电子研究所 一种形成半导体结构的方法
WO2012153201A1 (en) * 2011-05-09 2012-11-15 International Business Machines Corporation Preserving stress benefits of uv curing in replacement gate transistor fabrication
US10868177B2 (en) 2010-08-09 2020-12-15 Sony Corporation Semiconductor device and manufacturing method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08321612A (ja) * 1995-05-26 1996-12-03 Ricoh Co Ltd 半導体装置及びその製造方法
JP2002093921A (ja) * 2000-09-11 2002-03-29 Hitachi Ltd 半導体装置の製造方法
JP2005005633A (ja) * 2003-06-16 2005-01-06 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP2005311058A (ja) * 2004-04-21 2005-11-04 Rohm Co Ltd 半導体装置及びその製造方法
JP2006059980A (ja) * 2004-08-19 2006-03-02 Renesas Technology Corp 半導体装置及びその製造方法
JP2006121074A (ja) * 2004-10-20 2006-05-11 Samsung Electronics Co Ltd 半導体素子及びその製造方法
JP2006120718A (ja) * 2004-10-19 2006-05-11 Toshiba Corp 半導体装置およびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165335A (ja) * 2004-12-08 2006-06-22 Toshiba Corp 半導体装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08321612A (ja) * 1995-05-26 1996-12-03 Ricoh Co Ltd 半導体装置及びその製造方法
JP2002093921A (ja) * 2000-09-11 2002-03-29 Hitachi Ltd 半導体装置の製造方法
JP2005005633A (ja) * 2003-06-16 2005-01-06 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP2005311058A (ja) * 2004-04-21 2005-11-04 Rohm Co Ltd 半導体装置及びその製造方法
JP2006059980A (ja) * 2004-08-19 2006-03-02 Renesas Technology Corp 半導体装置及びその製造方法
JP2006120718A (ja) * 2004-10-19 2006-05-11 Toshiba Corp 半導体装置およびその製造方法
JP2006121074A (ja) * 2004-10-20 2006-05-11 Samsung Electronics Co Ltd 半導体素子及びその製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10868177B2 (en) 2010-08-09 2020-12-15 Sony Corporation Semiconductor device and manufacturing method thereof
CN102446726A (zh) * 2010-10-13 2012-05-09 中芯国际集成电路制造(上海)有限公司 一种金属栅极的形成方法
CN102623405A (zh) * 2011-01-30 2012-08-01 中国科学院微电子研究所 一种形成半导体结构的方法
WO2012153201A1 (en) * 2011-05-09 2012-11-15 International Business Machines Corporation Preserving stress benefits of uv curing in replacement gate transistor fabrication
US8421132B2 (en) 2011-05-09 2013-04-16 International Business Machines Corporation Post-planarization UV curing of stress inducing layers in replacement gate transistor fabrication
GB2503848A (en) * 2011-05-09 2014-01-08 Ibm Preserving stress benefits of UV curing in replacement gate transistor fabrication
CN103620748A (zh) * 2011-05-09 2014-03-05 国际商业机器公司 保留替代栅极晶体管制造中的uv固化的应力益处
GB2503848B (en) * 2011-05-09 2015-07-29 Ibm Preserving stress benefits of UV curing in replacement gate transistor fabrication

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JPWO2008096587A1 (ja) 2010-05-20
JP5401991B2 (ja) 2014-01-29

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