WO2008093516A1 - カメラモジュールの製造方法及びカメラモジュール - Google Patents

カメラモジュールの製造方法及びカメラモジュール Download PDF

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Publication number
WO2008093516A1
WO2008093516A1 PCT/JP2008/050124 JP2008050124W WO2008093516A1 WO 2008093516 A1 WO2008093516 A1 WO 2008093516A1 JP 2008050124 W JP2008050124 W JP 2008050124W WO 2008093516 A1 WO2008093516 A1 WO 2008093516A1
Authority
WO
WIPO (PCT)
Prior art keywords
camera module
manufacturing
function
light shielding
diaphragm
Prior art date
Application number
PCT/JP2008/050124
Other languages
English (en)
French (fr)
Inventor
Yuiti Fujii
Takemi Miyazaki
Shigeru Hosoe
Original Assignee
Konica Minolta Opto, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto, Inc. filed Critical Konica Minolta Opto, Inc.
Priority to JP2008556034A priority Critical patent/JP4863026B2/ja
Priority to US12/524,694 priority patent/US8313971B2/en
Priority to EP08702995A priority patent/EP2120451B1/en
Publication of WO2008093516A1 publication Critical patent/WO2008093516A1/ja

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0075—Arrays characterized by non-optical structures, e.g. having integrated holding or alignment means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14632—Wafer-level processed structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H01L31/02164—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers, cold shields for infrared detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
    • G02B3/0068—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between arranged in a single integral body or plate, e.g. laminates or hybrid structures with other optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/003—Light absorbing elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

　製造工程を複雑化させることなく、カメラモジュールの性能を向上できるカメラモジュールの製造方法及びカメラモジュールを提供する。各レンズ本体１１の側面とレンズ支持体１２の側面に遮光層を形成することで、別途、絞りや遮光部材等を用いることなく、入射光束の透過面積を規制する絞り機能や迷光の侵入を抑制する機能を持たせることができる。
PCT/JP2008/050124 2007-01-30 2008-01-09 カメラモジュールの製造方法及びカメラモジュール WO2008093516A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008556034A JP4863026B2 (ja) 2007-01-30 2008-01-09 カメラモジュールの製造方法及びカメラモジュール
US12/524,694 US8313971B2 (en) 2007-01-30 2008-01-09 Camera module manufacturing method and camera module
EP08702995A EP2120451B1 (en) 2007-01-30 2008-01-09 Camera module manufacturing method and camera module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-019369 2007-01-30
JP2007019369 2007-01-30

Publications (1)

Publication Number Publication Date
WO2008093516A1 true WO2008093516A1 (ja) 2008-08-07

Family

ID=39673830

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050124 WO2008093516A1 (ja) 2007-01-30 2008-01-09 カメラモジュールの製造方法及びカメラモジュール

Country Status (5)

Country Link
US (1) US8313971B2 (ja)
EP (1) EP2120451B1 (ja)
JP (1) JP4863026B2 (ja)
CN (1) CN101601274A (ja)
WO (1) WO2008093516A1 (ja)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2251717A1 (en) 2009-05-14 2010-11-17 Fujinon Corporation Wafer level lens array and manufacturing method therefor
JP2011027853A (ja) * 2009-07-22 2011-02-10 Toshiba Corp カメラモジュールの製造方法
JP2011085625A (ja) * 2009-10-13 2011-04-28 Toppan Printing Co Ltd カメラモジュール及びその製造方法
JP2011107695A (ja) * 2009-10-19 2011-06-02 Fujifilm Corp ウエハレベルレンズ用チタンブラック分散物、それを含有する感光性樹脂組成物、及び、ウエハレベルレンズ
JP2011123369A (ja) * 2009-12-11 2011-06-23 Fujifilm Corp ウエハレベルレンズ用黒色硬化性組成物、ウエハレベルレンズ、及びカメラモジュール
JP2011153965A (ja) * 2010-01-28 2011-08-11 Ricoh Co Ltd 測距装置、測距用モジュール及びこれを用いた撮像装置及び測距用モジュールの製作方法
JP2011170334A (ja) * 2010-01-20 2011-09-01 Fujifilm Corp ウエハレベルレンズ用黒色硬化性組成物、及びウエハレベルレンズ
JP2011202023A (ja) * 2010-03-25 2011-10-13 Fujifilm Corp ウエハレベルレンズ用黒色硬化性組成物、ウエハレベルレンズ、およびカメラモジュール
JP2011209640A (ja) * 2010-03-30 2011-10-20 Fujifilm Corp ウエハレベルレンズ用チタンブラック分散物、それを含有する感光性樹脂組成物、及び、ウエハレベルレンズ
CN102472837A (zh) * 2009-08-13 2012-05-23 富士胶片株式会社 晶片级透镜、晶片级透镜的制备方法和成像单元
JP2012107167A (ja) * 2010-03-30 2012-06-07 Fujifilm Corp ウエハレベルレンズ用チタンブラック分散物、それを含有する感光性樹脂組成物、ウエハレベルレンズ、及び、固体撮像素子
US8759741B2 (en) 2009-10-19 2014-06-24 Fujifilm Corporation Titanium black dispersion, photosensitive resin composition, wafer level lens, light blocking film, method for producing the light blocking film, and solid-state image pickup element
US8828629B2 (en) 2010-03-25 2014-09-09 Fujifilm Corporation Black curable composition, light-shielding color filter for a solid-state imaging device and method of producing the same, solid-state imaging device, wafer level lens, and camera module
WO2019171460A1 (ja) * 2018-03-06 2019-09-12 オリンパス株式会社 内視鏡用撮像装置、内視鏡、および内視鏡用撮像装置の製造方法

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US8450821B2 (en) * 2009-03-26 2013-05-28 Micron Technology, Inc. Method and apparatus providing combined spacer and optical lens element
US8576574B2 (en) 2010-04-21 2013-11-05 Stmicroelectronics Pte Ltd. Electromagnetic interference shielding on semiconductor devices
JP4924777B2 (ja) * 2010-04-27 2012-04-25 コニカミノルタオプト株式会社 撮像用レンズ、ウエハレンズ、ウエハレンズ積層体、撮像用レンズの製造方法、撮像用レンズの中間物、撮像用レンズの中間物の製造方法
CN102236114B (zh) * 2010-04-28 2014-12-31 鸿富锦精密工业（深圳）有限公司 遮光元件、遮光元件的制造方法及镜头模组
KR20120016499A (ko) * 2010-08-16 2012-02-24 삼성전자주식회사 카메라 모듈
US8564896B2 (en) 2010-08-20 2013-10-22 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Compact imaging device
US8642119B2 (en) * 2010-09-22 2014-02-04 Stmicroelectronics Pte Ltd. Method and system for shielding semiconductor devices from light
WO2012069689A1 (en) * 2010-11-24 2012-05-31 Nokia Corporation Optically refracting surfaces
KR101208215B1 (ko) * 2011-01-14 2012-12-04 삼성전기주식회사 카메라 모듈 및 이의 제조방법
KR101910411B1 (ko) * 2011-06-07 2018-10-22 엘지이노텍 주식회사 촬상 렌즈 및 카메라 모듈
JP2013229675A (ja) * 2012-04-24 2013-11-07 Sony Corp 撮像ユニット及び撮像装置
KR101452078B1 (ko) * 2012-12-28 2014-10-16 삼성전기주식회사 쉴드캔 및 쉴드캔 제조용 지그
CN103744133A (zh) * 2014-01-17 2014-04-23 峻立科技股份有限公司 遮光阵列透镜及其制造方法
CN106031150A (zh) * 2014-02-24 2016-10-12 奥林巴斯株式会社 摄像装置和摄像装置的制造方法
CN104898190A (zh) * 2014-03-06 2015-09-09 玉晶光电股份有限公司 光学镜头及其阵列式镜片模块与制造方法
DE102016010040B4 (de) * 2016-08-22 2022-03-17 Schölly Fiberoptic GmbH Kameramodul und zugehöriges Herstellungsverfahren
CN106809797A (zh) * 2016-12-13 2017-06-09 中航（重庆）微电子有限公司 一种红外焦平面阵列的晶圆级封装结构
CN106911884A (zh) * 2017-04-12 2017-06-30 瑞声声学科技(深圳)有限公司 图像采集模组
TWI716689B (zh) * 2017-06-02 2021-01-21 大陸商寧波舜宇光電信息有限公司 光學鏡頭、光學元件和光學模組及其製造方法
DE102017011352B4 (de) 2017-12-07 2020-01-30 Friedrich Grimm Kameramoduleinheit für Digitalaufnahmen
EA033868B1 (ru) * 2018-10-08 2019-12-03 Общество с ограниченной ответственностью "ИРВЭЙ" Камера системы ночного видения
WO2022033920A1 (en) * 2020-08-14 2022-02-17 Ams International Ag Sensor module
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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2251717A1 (en) 2009-05-14 2010-11-17 Fujinon Corporation Wafer level lens array and manufacturing method therefor
JP2011027853A (ja) * 2009-07-22 2011-02-10 Toshiba Corp カメラモジュールの製造方法
US8936371B2 (en) 2009-08-13 2015-01-20 Fujifilm Corporation Wafer level lens, production method of wafer level lens, and imaging unit
CN102472837A (zh) * 2009-08-13 2012-05-23 富士胶片株式会社 晶片级透镜、晶片级透镜的制备方法和成像单元
JP2011085625A (ja) * 2009-10-13 2011-04-28 Toppan Printing Co Ltd カメラモジュール及びその製造方法
US8759741B2 (en) 2009-10-19 2014-06-24 Fujifilm Corporation Titanium black dispersion, photosensitive resin composition, wafer level lens, light blocking film, method for producing the light blocking film, and solid-state image pickup element
JP2011107695A (ja) * 2009-10-19 2011-06-02 Fujifilm Corp ウエハレベルレンズ用チタンブラック分散物、それを含有する感光性樹脂組成物、及び、ウエハレベルレンズ
KR101552578B1 (ko) 2009-10-19 2015-09-11 후지필름 가부시키가이샤 티탄블랙 분산물, 감광성 수지 조성물, 웨이퍼 레벨 렌즈, 차광막과 그 제조방법, 및 고체 촬상 소자
JP2011123369A (ja) * 2009-12-11 2011-06-23 Fujifilm Corp ウエハレベルレンズ用黒色硬化性組成物、ウエハレベルレンズ、及びカメラモジュール
JP2011170334A (ja) * 2010-01-20 2011-09-01 Fujifilm Corp ウエハレベルレンズ用黒色硬化性組成物、及びウエハレベルレンズ
JP2011153965A (ja) * 2010-01-28 2011-08-11 Ricoh Co Ltd 測距装置、測距用モジュール及びこれを用いた撮像装置及び測距用モジュールの製作方法
US8828629B2 (en) 2010-03-25 2014-09-09 Fujifilm Corporation Black curable composition, light-shielding color filter for a solid-state imaging device and method of producing the same, solid-state imaging device, wafer level lens, and camera module
JP2011202023A (ja) * 2010-03-25 2011-10-13 Fujifilm Corp ウエハレベルレンズ用黒色硬化性組成物、ウエハレベルレンズ、およびカメラモジュール
KR101565360B1 (ko) 2010-03-25 2015-11-03 후지필름 가부시키가이샤 흑색 경화성 조성물, 고체 촬상 소자용 차광성 컬러필터 및 그 제조 방법, 고체 촬상 소자, 웨이퍼 레벨 렌즈, 및 카메라 모듈
JP2012107167A (ja) * 2010-03-30 2012-06-07 Fujifilm Corp ウエハレベルレンズ用チタンブラック分散物、それを含有する感光性樹脂組成物、ウエハレベルレンズ、及び、固体撮像素子
JP2011209640A (ja) * 2010-03-30 2011-10-20 Fujifilm Corp ウエハレベルレンズ用チタンブラック分散物、それを含有する感光性樹脂組成物、及び、ウエハレベルレンズ
WO2019171460A1 (ja) * 2018-03-06 2019-09-12 オリンパス株式会社 内視鏡用撮像装置、内視鏡、および内視鏡用撮像装置の製造方法

Also Published As

Publication number Publication date
US8313971B2 (en) 2012-11-20
EP2120451A4 (en) 2010-08-25
US20100118182A1 (en) 2010-05-13
EP2120451A1 (en) 2009-11-18
JP4863026B2 (ja) 2012-01-25
CN101601274A (zh) 2009-12-09
JPWO2008093516A1 (ja) 2010-05-20
EP2120451B1 (en) 2013-02-27

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