WO2008090769A1 - 感光性樹脂組成物及びこれを用いたレジストパターンの形成方法 - Google Patents

感光性樹脂組成物及びこれを用いたレジストパターンの形成方法 Download PDF

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Publication number
WO2008090769A1
WO2008090769A1 PCT/JP2008/050235 JP2008050235W WO2008090769A1 WO 2008090769 A1 WO2008090769 A1 WO 2008090769A1 JP 2008050235 W JP2008050235 W JP 2008050235W WO 2008090769 A1 WO2008090769 A1 WO 2008090769A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
photosensitive resin
resist pattern
formation
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/050235
Other languages
English (en)
French (fr)
Inventor
Takahiro Senzaki
Koichi Misumi
Atsushi Yamanouchi
Koji Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to US12/448,913 priority Critical patent/US20100068648A1/en
Publication of WO2008090769A1 publication Critical patent/WO2008090769A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

　欠陥の発生を抑制でき、且つ良好な形状のレジストパターンを形成することができる感光性樹脂組成物、及びこれを用いたレジストパターンの形成方法を提供する。 　（ａ）多官能エポキシ樹脂、及び（ｂ）カチオン重合開始剤を含有してなる感光性樹脂組成物であって、感光性樹脂組成物中の炭酸プロピレン濃度が１０質量％以下であることを特徴とする感光性樹脂組成物によれば、欠陥の発生を抑制でき、且つ良好な形状のレジストパターンを形成できる。
PCT/JP2008/050235 2007-01-24 2008-01-11 感光性樹脂組成物及びこれを用いたレジストパターンの形成方法 Ceased WO2008090769A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/448,913 US20100068648A1 (en) 2007-01-24 2008-01-11 Photosensitive resin composition, and resist pattern formation method using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007013800A JP2008180879A (ja) 2007-01-24 2007-01-24 感光性樹脂組成物及びこれを用いたレジストパターンの形成方法
JP2007-013800 2007-01-24

Publications (1)

Publication Number Publication Date
WO2008090769A1 true WO2008090769A1 (ja) 2008-07-31

Family

ID=39644344

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050235 Ceased WO2008090769A1 (ja) 2007-01-24 2008-01-11 感光性樹脂組成物及びこれを用いたレジストパターンの形成方法

Country Status (3)

Country Link
US (1) US20100068648A1 (ja)
JP (1) JP2008180879A (ja)
WO (1) WO2008090769A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101033045B1 (ko) * 2009-12-30 2011-05-09 제일모직주식회사 반도체 조립용 접착필름 조성물 및 이를 이용한 접착필름
WO2013078409A2 (en) 2011-11-21 2013-05-30 Creatv Microtech, Inc. Polymer microfiltration devices, methods of manufacturing the same and the uses of the microfiltration devices
CA2798246C (en) 2010-05-03 2023-09-12 Creatv Microtech, Inc. Polymer microfilters and methods of manufacturing the same
TWI829181B (zh) * 2014-04-25 2024-01-11 日商力森諾科股份有限公司 感光性元件、積層體、永久抗蝕罩幕及其製造方法以及半導體封裝的製造方法
US9599893B2 (en) * 2014-09-25 2017-03-21 Canon Kabushiki Kaisha Production process for optically shaped product and production process for liquid discharge head
JP6635692B2 (ja) * 2014-09-25 2020-01-29 キヤノン株式会社 光造形物の製造方法及び液体吐出ヘッドの製造方法
JP7297442B2 (ja) * 2018-12-27 2023-06-26 キヤノン株式会社 微細構造体の製造方法及び液体吐出ヘッドの製造方法
KR20260047008A (ko) * 2024-09-30 2026-04-07 코오롱인더스트리 주식회사 감광성 수지 조성물, 이를 이용한 드라이 필름 포토레지스트 및 그 제조방법, 레지스트 패턴 및 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0934106A (ja) * 1995-07-20 1997-02-07 Toppan Printing Co Ltd 光重合性組成物及びその重合方法
JP2005055865A (ja) * 2003-07-24 2005-03-03 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物および該組成物を用いたパターン形成方法
JP2005084415A (ja) * 2003-09-09 2005-03-31 Jsr Corp 感光性絶縁樹脂組成物およびその硬化物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4882245A (en) * 1985-10-28 1989-11-21 International Business Machines Corporation Photoresist composition and printed circuit boards and packages made therewith
US6027858A (en) * 1997-06-06 2000-02-22 International Business Machines Corporation Process for tenting PTH's with PID dry film
US6203871B1 (en) * 1998-10-14 2001-03-20 Lexmark International, Inc. Encapsulant for leads in an aqueous environment
US6528218B1 (en) * 1998-12-15 2003-03-04 International Business Machines Corporation Method of fabricating circuitized structures
US6391523B1 (en) * 2000-09-15 2002-05-21 Microchem Corp. Fast drying thick film negative photoresist
CN1849560B (zh) * 2004-03-26 2011-12-07 东京応化工业株式会社 感光性树脂组合物及使用该组合物的图案形成方法
WO2005116038A1 (ja) * 2004-05-28 2005-12-08 San-Apro Limited 新規なオニウムおよび遷移金属錯体のフッ素化アルキルフルオロリン酸塩

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0934106A (ja) * 1995-07-20 1997-02-07 Toppan Printing Co Ltd 光重合性組成物及びその重合方法
JP2005055865A (ja) * 2003-07-24 2005-03-03 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物および該組成物を用いたパターン形成方法
JP2005084415A (ja) * 2003-09-09 2005-03-31 Jsr Corp 感光性絶縁樹脂組成物およびその硬化物

Also Published As

Publication number Publication date
JP2008180879A (ja) 2008-08-07
US20100068648A1 (en) 2010-03-18

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