TWI347312B - New compound, polymer compound, resist composition and method for forming resist pattern - Google Patents
New compound, polymer compound, resist composition and method for forming resist patternInfo
- Publication number
- TWI347312B TWI347312B TW094125306A TW94125306A TWI347312B TW I347312 B TWI347312 B TW I347312B TW 094125306 A TW094125306 A TW 094125306A TW 94125306 A TW94125306 A TW 94125306A TW I347312 B TWI347312 B TW I347312B
- Authority
- TW
- Taiwan
- Prior art keywords
- compound
- resist pattern
- polymer compound
- resist composition
- forming
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C233/00—Carboxylic acid amides
- C07C233/90—Carboxylic acid amides having nitrogen atoms of carboxamide groups further acylated
- C07C233/91—Carboxylic acid amides having nitrogen atoms of carboxamide groups further acylated with carbon atoms of the carboxamide groups bound to acyclic carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C335/00—Thioureas, i.e. compounds containing any of the groups, the nitrogen atoms not being part of nitro or nitroso groups
- C07C335/04—Derivatives of thiourea
- C07C335/24—Derivatives of thiourea containing any of the groups, X being a hetero atom, Y being any atom
- C07C335/26—Y being a hydrogen or a carbon atom, e.g. benzoylthioureas
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/52—Amides or imides
- C08F220/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2601/00—Systems containing only non-condensed rings
- C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
- C07C2601/14—The ring being saturated
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004224364 | 2004-07-30 | ||
JP2005184673A JP5008838B2 (en) | 2004-07-30 | 2005-06-24 | Polymer compound, resist composition, and resist pattern forming method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200611886A TW200611886A (en) | 2006-04-16 |
TWI347312B true TWI347312B (en) | 2011-08-21 |
Family
ID=35786169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094125306A TWI347312B (en) | 2004-07-30 | 2005-07-26 | New compound, polymer compound, resist composition and method for forming resist pattern |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5008838B2 (en) |
TW (1) | TWI347312B (en) |
WO (1) | WO2006011420A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4355011B2 (en) | 2006-11-07 | 2009-10-28 | 丸善石油化学株式会社 | Copolymer and composition for immersion lithography |
TWI462938B (en) * | 2008-05-21 | 2014-12-01 | Sumitomo Chemical Co | Polymer and chemically amplified resist composition comprising the same |
CN102301449A (en) * | 2009-01-29 | 2011-12-28 | 昭和电工株式会社 | Curable composition for transfer material and urea compound containing (meth)acryloyl group |
US9057948B2 (en) | 2011-10-17 | 2015-06-16 | Tokyo Ohka Kogyo Co., Ltd. | Resist composition for EUV or EB, and method of forming resist pattern |
JP5856441B2 (en) * | 2011-11-09 | 2016-02-09 | 東京応化工業株式会社 | Resist composition, resist pattern forming method, and polymer compound |
JP5764480B2 (en) | 2011-11-25 | 2015-08-19 | 東京応化工業株式会社 | Resist composition, resist pattern forming method, and polymer compound |
JP6018812B2 (en) * | 2012-06-19 | 2016-11-02 | 東京応化工業株式会社 | Resist composition, resist pattern formation method, compound, method for producing compound, polymer compound |
JP6097611B2 (en) * | 2013-03-25 | 2017-03-15 | 東京応化工業株式会社 | Resist composition and resist pattern forming method |
JP6097610B2 (en) | 2013-03-25 | 2017-03-15 | 東京応化工業株式会社 | Resist composition and resist pattern forming method |
JP6093614B2 (en) | 2013-03-25 | 2017-03-08 | 東京応化工業株式会社 | Resist composition and resist pattern forming method |
JP6343467B2 (en) * | 2013-03-27 | 2018-06-13 | 東京応化工業株式会社 | Resist composition and method for forming resist pattern |
JP6435109B2 (en) * | 2013-04-26 | 2018-12-05 | 東京応化工業株式会社 | Resist composition and resist pattern forming method |
US10324377B2 (en) * | 2015-06-15 | 2019-06-18 | Tokyo Ohka Kogyo Co., Ltd. | Resist composition and method of forming resist pattern |
JP6170990B2 (en) * | 2015-12-10 | 2017-07-26 | 東京応化工業株式会社 | Compound |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0140273B1 (en) * | 1983-11-01 | 1991-09-11 | Hoechst Celanese Corporation | Positive photoresist compositions having deep uv response, photosensitive elements and thermally stable photochemically imaged systems containing same |
JPH0639503B2 (en) * | 1985-05-28 | 1994-05-25 | 日本ペイント株式会社 | Fluorine-containing polymer and its manufacturing method |
JPH0753769B2 (en) * | 1986-04-22 | 1995-06-07 | 日本ペイント株式会社 | Water dispersible resin |
JP3592017B2 (en) * | 1996-12-18 | 2004-11-24 | キヤノン株式会社 | Organic compound, polymer thereof and organic electroluminescent device |
JP3980120B2 (en) * | 1997-05-19 | 2007-09-26 | 昭和電工株式会社 | Polymerizable malonic acid derivative and curable composition |
JP4069221B2 (en) * | 1998-03-13 | 2008-04-02 | 独立行政法人産業技術総合研究所 | Expression method of upper critical solution temperature |
EP1312627B1 (en) * | 2000-08-21 | 2009-10-07 | National Institute of Advanced Industrial Science and Technology | Polymers |
-
2005
- 2005-06-24 JP JP2005184673A patent/JP5008838B2/en active Active
- 2005-07-22 WO PCT/JP2005/013473 patent/WO2006011420A1/en active Application Filing
- 2005-07-26 TW TW094125306A patent/TWI347312B/en active
Also Published As
Publication number | Publication date |
---|---|
WO2006011420A1 (en) | 2006-02-02 |
JP2006063318A (en) | 2006-03-09 |
JP5008838B2 (en) | 2012-08-22 |
TW200611886A (en) | 2006-04-16 |
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