WO2008090654A1 - Substrat flexible à deux couches, procédé de fabrication du substrat flexible à deux couches, et tableau de connexion imprimé flexible fabriqué à partir du substrat flexible à deux couches - Google Patents
Substrat flexible à deux couches, procédé de fabrication du substrat flexible à deux couches, et tableau de connexion imprimé flexible fabriqué à partir du substrat flexible à deux couches Download PDFInfo
- Publication number
- WO2008090654A1 WO2008090654A1 PCT/JP2007/070830 JP2007070830W WO2008090654A1 WO 2008090654 A1 WO2008090654 A1 WO 2008090654A1 JP 2007070830 W JP2007070830 W JP 2007070830W WO 2008090654 A1 WO2008090654 A1 WO 2008090654A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- flexible substrate
- layer
- layer flexible
- substrate
- insulating film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020097015315A KR101088571B1 (ko) | 2007-01-24 | 2007-10-25 | 2층 플렉시블 기판과 그 제조 방법 및 이 2층 플렉시블 기판으로부터 얻어진 플렉시블 프린트 배선 기판 |
JP2008554964A JP4968266B2 (ja) | 2007-01-24 | 2007-10-25 | 2層フレキシブル基板とその製造方法及び該2層フレキシブル基板より得られたフレキシブルプリント配線基板 |
TW096147168A TWI422300B (zh) | 2007-01-24 | 2007-12-11 | A two-layer flexible substrate and a method for manufacturing the same, and a flexible printed wiring board obtained from the two-layer flexible substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007014358 | 2007-01-24 | ||
JP2007-014358 | 2007-05-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008090654A1 true WO2008090654A1 (fr) | 2008-07-31 |
Family
ID=39644232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/070830 WO2008090654A1 (fr) | 2007-01-24 | 2007-10-25 | Substrat flexible à deux couches, procédé de fabrication du substrat flexible à deux couches, et tableau de connexion imprimé flexible fabriqué à partir du substrat flexible à deux couches |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4968266B2 (fr) |
KR (1) | KR101088571B1 (fr) |
TW (1) | TWI422300B (fr) |
WO (1) | WO2008090654A1 (fr) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010253693A (ja) * | 2009-04-21 | 2010-11-11 | Sumitomo Metal Mining Co Ltd | 2層フレキシブル基板およびその製造方法 |
JP2011061113A (ja) * | 2009-09-14 | 2011-03-24 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
WO2012117850A1 (fr) | 2011-03-01 | 2012-09-07 | Jx日鉱日石金属株式会社 | Stratifié plaqué de cuivre à base d'un film de polymère à cristaux liquides et son procédé de fabrication |
JP2013229502A (ja) * | 2012-04-26 | 2013-11-07 | Sumitomo Metal Mining Co Ltd | プリント配線基板およびその製造方法 |
JP2013229504A (ja) * | 2012-04-26 | 2013-11-07 | Sumitomo Metal Mining Co Ltd | 金属化樹脂フィルムおよびその製造方法 |
JP2015082608A (ja) * | 2013-10-23 | 2015-04-27 | 住友金属鉱山株式会社 | 2層フレキシブル配線用基板およびその製造方法 |
JP2015081376A (ja) * | 2013-10-23 | 2015-04-27 | 住友金属鉱山株式会社 | 2層フレキシブル配線板およびその製造方法 |
JP2015108187A (ja) * | 2013-10-22 | 2015-06-11 | 住友金属鉱山株式会社 | 2層フレキシブル配線用基板及びそれを用いたフレキシブル配線板 |
JP2022100710A (ja) * | 2020-12-24 | 2022-07-06 | 住友金属鉱山株式会社 | 銅張積層板および銅張積層板の製造方法 |
US11895770B2 (en) | 2018-10-05 | 2024-02-06 | Panasonic Intellectual Property Management Co., Ltd. | Copper-clad laminate, wiring board, and copper foil provided with resin |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6083433B2 (ja) * | 2012-04-24 | 2017-02-22 | 住友金属鉱山株式会社 | 2層フレキシブル配線用基板及びフレキシブル配線板並びにそれらの製造方法 |
TWI568865B (zh) * | 2013-10-23 | 2017-02-01 | Sumitomo Metal Mining Co | Layer 2 flexible wiring substrate and manufacturing method thereof, and two-layer flexible wiring board and manufacturing method thereof |
KR102461189B1 (ko) * | 2015-12-07 | 2022-10-28 | 에스케이넥실리스 주식회사 | 연성 동장 적층판 및 이를 이용한 인쇄회로 기판 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05259596A (ja) * | 1992-03-12 | 1993-10-08 | Toyo Metaraijingu Kk | フレキシブルプリント配線用基板 |
JP2001151916A (ja) * | 1999-11-30 | 2001-06-05 | Oji Paper Co Ltd | フレキシブルプリント配線用フィルム |
JP2004031370A (ja) * | 2002-06-07 | 2004-01-29 | Matsushita Electric Ind Co Ltd | フレキシブルプリント回路基板及びその製造方法 |
JP2006303206A (ja) * | 2005-04-21 | 2006-11-02 | Teijin Ltd | フレキシブルプリント回路用基板 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200704297A (en) * | 2005-04-08 | 2007-01-16 | 3M Innovative Properties Co | Flexible circuit substrate |
-
2007
- 2007-10-25 KR KR1020097015315A patent/KR101088571B1/ko active IP Right Grant
- 2007-10-25 WO PCT/JP2007/070830 patent/WO2008090654A1/fr active Application Filing
- 2007-10-25 JP JP2008554964A patent/JP4968266B2/ja active Active
- 2007-12-11 TW TW096147168A patent/TWI422300B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05259596A (ja) * | 1992-03-12 | 1993-10-08 | Toyo Metaraijingu Kk | フレキシブルプリント配線用基板 |
JP2001151916A (ja) * | 1999-11-30 | 2001-06-05 | Oji Paper Co Ltd | フレキシブルプリント配線用フィルム |
JP2004031370A (ja) * | 2002-06-07 | 2004-01-29 | Matsushita Electric Ind Co Ltd | フレキシブルプリント回路基板及びその製造方法 |
JP2006303206A (ja) * | 2005-04-21 | 2006-11-02 | Teijin Ltd | フレキシブルプリント回路用基板 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010253693A (ja) * | 2009-04-21 | 2010-11-11 | Sumitomo Metal Mining Co Ltd | 2層フレキシブル基板およびその製造方法 |
JP2011061113A (ja) * | 2009-09-14 | 2011-03-24 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
WO2012117850A1 (fr) | 2011-03-01 | 2012-09-07 | Jx日鉱日石金属株式会社 | Stratifié plaqué de cuivre à base d'un film de polymère à cristaux liquides et son procédé de fabrication |
JP2013229502A (ja) * | 2012-04-26 | 2013-11-07 | Sumitomo Metal Mining Co Ltd | プリント配線基板およびその製造方法 |
JP2013229504A (ja) * | 2012-04-26 | 2013-11-07 | Sumitomo Metal Mining Co Ltd | 金属化樹脂フィルムおよびその製造方法 |
JP2015108187A (ja) * | 2013-10-22 | 2015-06-11 | 住友金属鉱山株式会社 | 2層フレキシブル配線用基板及びそれを用いたフレキシブル配線板 |
JP2015081376A (ja) * | 2013-10-23 | 2015-04-27 | 住友金属鉱山株式会社 | 2層フレキシブル配線板およびその製造方法 |
JP2015082608A (ja) * | 2013-10-23 | 2015-04-27 | 住友金属鉱山株式会社 | 2層フレキシブル配線用基板およびその製造方法 |
US11895770B2 (en) | 2018-10-05 | 2024-02-06 | Panasonic Intellectual Property Management Co., Ltd. | Copper-clad laminate, wiring board, and copper foil provided with resin |
JP2022100710A (ja) * | 2020-12-24 | 2022-07-06 | 住友金属鉱山株式会社 | 銅張積層板および銅張積層板の製造方法 |
CN114745849A (zh) * | 2020-12-24 | 2022-07-12 | 住友金属矿山株式会社 | 覆铜层叠板和覆铜层叠板的制造方法 |
JP7151758B2 (ja) | 2020-12-24 | 2022-10-12 | 住友金属鉱山株式会社 | 銅張積層板および銅張積層板の製造方法 |
TWI818380B (zh) * | 2020-12-24 | 2023-10-11 | 日商住友金屬鑛山股份有限公司 | 覆銅積層板及覆銅積層板之製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI422300B (zh) | 2014-01-01 |
TW200838390A (en) | 2008-09-16 |
JP4968266B2 (ja) | 2012-07-04 |
KR101088571B1 (ko) | 2011-12-05 |
KR20090092342A (ko) | 2009-08-31 |
JPWO2008090654A1 (ja) | 2010-05-13 |
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