WO2008084673A1 - Dispositif semi-conducteur et procédé de fabrication du dispositif semi-conducteur - Google Patents

Dispositif semi-conducteur et procédé de fabrication du dispositif semi-conducteur Download PDF

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Publication number
WO2008084673A1
WO2008084673A1 PCT/JP2007/074846 JP2007074846W WO2008084673A1 WO 2008084673 A1 WO2008084673 A1 WO 2008084673A1 JP 2007074846 W JP2007074846 W JP 2007074846W WO 2008084673 A1 WO2008084673 A1 WO 2008084673A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
lead
semiconductor device
free solder
copper land
Prior art date
Application number
PCT/JP2007/074846
Other languages
English (en)
Japanese (ja)
Inventor
Hisao Ishikawa
Original Assignee
The Nippon Joint, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Nippon Joint, Ltd. filed Critical The Nippon Joint, Ltd.
Priority to JP2008553054A priority Critical patent/JPWO2008084673A1/ja
Publication of WO2008084673A1 publication Critical patent/WO2008084673A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne un dispositif semi-conducteur pouvant supprimer l'apparition de microvides sur une partie liée par brasage par suite d'un vieillissement causé par la chaleur, laquelle partie présente une meilleure résistance à la rupture par impact. Le dispositif semi-conducteur est produit par liaison par brasage des éléments de montage, tel que des boîtiers semi-conducteurs et des éléments électroniques sur une carte de circuits imprimés à l'aide d'une brasure exempte de plomb. Dans l'étape d'assemblage d'un composant électronique tel qu'un dispositif semi-conducteur, un élément de montage est lié par brasage à une carte de circuits imprimés à l'aide d'une brasure exempte de plomb. Dans ce cas, une carte de circuits imprimés est immergée dans un liquide contenant un acide organique, chauffé à une température allant de 60°C à 300°C pour ramener la couche d'oxyde présente sur la surface de plage de cuivre à une épaisseur égale ou inférieure à une épaisseur prédéterminée et pour pouvoir ainsi en effectuer le nettoyage et l'activation. En outre, l'acide organique présent sur la surface de plage de cuivre nettoyée et activée forme un film protecteur prévenant l'oxydation. Ladite carte de circuits imprimés est mise en contact avec un liquide de brasure exempt de plomb à l'état fondu contenant une concentration d'oxygène uniquement égale ou inférieure à une concentration prédéterminée ; la surface de plage de cuivre, l'interface de brasure et la couche de brasure exempte de plomb contenant une concentration d'oxygène uniquement égale ou inférieure à une concentration prédéterminée sont mises en contact étroit avec la surface supérieure de la surface de plage de cuivre, et un élément de montage est soudé par brasage à travers la couche de brasure exempte de plomb.
PCT/JP2007/074846 2007-01-09 2007-12-25 Dispositif semi-conducteur et procédé de fabrication du dispositif semi-conducteur WO2008084673A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008553054A JPWO2008084673A1 (ja) 2007-01-09 2007-12-25 半導体装置およびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007024813 2007-01-09
JP2007-024813 2007-01-09

Publications (1)

Publication Number Publication Date
WO2008084673A1 true WO2008084673A1 (fr) 2008-07-17

Family

ID=39608569

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074846 WO2008084673A1 (fr) 2007-01-09 2007-12-25 Dispositif semi-conducteur et procédé de fabrication du dispositif semi-conducteur

Country Status (2)

Country Link
JP (1) JPWO2008084673A1 (fr)
WO (1) WO2008084673A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010185826A (ja) * 2009-02-13 2010-08-26 Mega Chips Corp 衝撃検知装置
EP2302083A1 (fr) * 2008-06-23 2011-03-30 Nippon Joint Co., Ltd. Appareil de soudage de composant électronique et procédé de soudage de composant électronique
JP2015535199A (ja) * 2012-06-26 2015-12-10 深▲セン▼市▲クン▼▲チー▼▲シン▼▲華▼科技有限公司 一種の溶接方法
US9391034B2 (en) 2012-08-23 2016-07-12 International Business Machines Corporation Interfacial alloy layer for improving electromigration (EM) resistance in solder joints
CN116511752A (zh) * 2023-01-31 2023-08-01 度亘激光技术（苏州）有限公司 一种铜表面结构、制备方法及其焊接方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05129763A (ja) * 1991-10-31 1993-05-25 Toppan Printing Co Ltd ホツトエアーレベリングソルダーコーテイング装置
JP2003103360A (ja) * 2001-09-26 2003-04-08 Toshiba Corp 部材の接合方法
JP2004076030A (ja) * 2002-08-09 2004-03-11 Nippon Joint Kk 表面処理方法、洗浄保護用溶液および装置ユニット
JP2004306092A (ja) * 2003-04-08 2004-11-04 Tamura Kaken Co Ltd 回路基板はんだ付用フラックス及びソルダーペースト

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4152596B2 (ja) * 2001-02-09 2008-09-17 新日鉄マテリアルズ株式会社 ハンダ合金、ハンダボール及びハンダバンプを有する電子部材

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05129763A (ja) * 1991-10-31 1993-05-25 Toppan Printing Co Ltd ホツトエアーレベリングソルダーコーテイング装置
JP2003103360A (ja) * 2001-09-26 2003-04-08 Toshiba Corp 部材の接合方法
JP2004076030A (ja) * 2002-08-09 2004-03-11 Nippon Joint Kk 表面処理方法、洗浄保護用溶液および装置ユニット
JP2004306092A (ja) * 2003-04-08 2004-11-04 Tamura Kaken Co Ltd 回路基板はんだ付用フラックス及びソルダーペースト

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2302083A1 (fr) * 2008-06-23 2011-03-30 Nippon Joint Co., Ltd. Appareil de soudage de composant électronique et procédé de soudage de composant électronique
EP2302083A4 (fr) * 2008-06-23 2012-03-07 Nippon Joint Co Ltd Appareil de soudage de composant électronique et procédé de soudage de composant électronique
JP2010185826A (ja) * 2009-02-13 2010-08-26 Mega Chips Corp 衝撃検知装置
JP2015535199A (ja) * 2012-06-26 2015-12-10 深▲セン▼市▲クン▼▲チー▼▲シン▼▲華▼科技有限公司 一種の溶接方法
US9391034B2 (en) 2012-08-23 2016-07-12 International Business Machines Corporation Interfacial alloy layer for improving electromigration (EM) resistance in solder joints
US9698119B2 (en) 2012-08-23 2017-07-04 International Business Machines Corporation Interfacial alloy layer for improving electromigration (EM) resistance in solder joints
CN116511752A (zh) * 2023-01-31 2023-08-01 度亘激光技术（苏州）有限公司 一种铜表面结构、制备方法及其焊接方法
CN116511752B (zh) * 2023-01-31 2024-02-06 度亘核芯光电技术(苏州)有限公司 一种铜表面结构、制备方法及其焊接方法

Also Published As

Publication number Publication date
JPWO2008084673A1 (ja) 2010-04-30

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