WO2008081939A1 - レーザリフロー装置 - Google Patents

レーザリフロー装置 Download PDF

Info

Publication number
WO2008081939A1
WO2008081939A1 PCT/JP2007/075301 JP2007075301W WO2008081939A1 WO 2008081939 A1 WO2008081939 A1 WO 2008081939A1 JP 2007075301 W JP2007075301 W JP 2007075301W WO 2008081939 A1 WO2008081939 A1 WO 2008081939A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
laser light
irradiation
light
reflow device
Prior art date
Application number
PCT/JP2007/075301
Other languages
English (en)
French (fr)
Inventor
Yoshihisa Kakuda
Original Assignee
I-Pulse Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006354336A external-priority patent/JP2008166489A/ja
Priority claimed from JP2007007254A external-priority patent/JP2008177240A/ja
Priority claimed from JP2007116913A external-priority patent/JP2008277406A/ja
Application filed by I-Pulse Kabushiki Kaisha filed Critical I-Pulse Kabushiki Kaisha
Publication of WO2008081939A1 publication Critical patent/WO2008081939A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

　本体部Ｍに複数の端子部を設けた表面実装部品Ｅに対しレーザ光またはレーザビームを照射してプリント基板Ｐ上に実装するリフロー方式を採用しているレーザリフロー装置１である。照射ユニット２０にはレーザ光源からのレーザ光を発散させる光拡散レンズ２１が設けられ、光拡散レンズ２１は入射光の断面積D1に対する照射スポットの面積D2の比が１より大きくなるようにレーザ光を拡大し、本体部Ｍを通じて下面に照射熱を熱伝導させて半田ボールＳを溶融させる。ＢＧＡ等の表面実装部品を照射熱により損傷させることなく、半田付けができるようにする。
PCT/JP2007/075301 2006-12-28 2007-12-28 レーザリフロー装置 WO2008081939A1 (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2006-354336 2006-12-28
JP2006354336A JP2008166489A (ja) 2006-12-28 2006-12-28 レーザリフロー装置
JP2007-007254 2007-01-16
JP2007007254A JP2008177240A (ja) 2007-01-16 2007-01-16 レーザリフロー装置
JP2007116913A JP2008277406A (ja) 2007-04-26 2007-04-26 レーザリフロー装置
JP2007-116913 2007-04-26

Publications (1)

Publication Number Publication Date
WO2008081939A1 true WO2008081939A1 (ja) 2008-07-10

Family

ID=39588619

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/075301 WO2008081939A1 (ja) 2006-12-28 2007-12-28 レーザリフロー装置

Country Status (1)

Country Link
WO (1) WO2008081939A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017141146A (ja) * 2016-02-05 2017-08-17 一般財団法人ファインセラミックスセンター 焼結方法及び焼結物の製造方法
TWI616260B (zh) * 2016-12-09 2018-03-01 財團法人金屬工業研究發展中心 雷射加工裝置及雷射加工方法
TWI655049B (zh) * 2013-03-26 2019-04-01 日商戴西爾聚合物股份有限公司 金屬成形體之粗面化方法
US11027454B2 (en) 2016-02-05 2021-06-08 Japan Fine Ceramics Center Method for producing ceramic sintered body, and method and device for producing ceramic molded body
CN115055852A (zh) * 2022-06-14 2022-09-16 东莞市长讯精密技术有限公司 一种高强度屏蔽罩激光焊接设备及焊接方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5591847A (en) * 1978-12-29 1980-07-11 Ibm Device for packaging chip
JP2000277896A (ja) * 1999-03-23 2000-10-06 Matsushita Electric Ind Co Ltd 印刷配線基板およびフラットｉｃ部品の半田付け方法
JP2003101214A (ja) * 2001-09-21 2003-04-04 Matsushita Electric Ind Co Ltd 電子部品接合装置及び方法、並びに回路基板、並びに電子部品実装装置
JP2003204150A (ja) * 2002-01-07 2003-07-18 Taisei Kaken:Kk はんだ付けされた電子部品の取り外し方法及びその装置
JP2003297881A (ja) * 2002-04-03 2003-10-17 Ushio Inc ボールグリッドアレイの光処理方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5591847A (en) * 1978-12-29 1980-07-11 Ibm Device for packaging chip
JP2000277896A (ja) * 1999-03-23 2000-10-06 Matsushita Electric Ind Co Ltd 印刷配線基板およびフラットｉｃ部品の半田付け方法
JP2003101214A (ja) * 2001-09-21 2003-04-04 Matsushita Electric Ind Co Ltd 電子部品接合装置及び方法、並びに回路基板、並びに電子部品実装装置
JP2003204150A (ja) * 2002-01-07 2003-07-18 Taisei Kaken:Kk はんだ付けされた電子部品の取り外し方法及びその装置
JP2003297881A (ja) * 2002-04-03 2003-10-17 Ushio Inc ボールグリッドアレイの光処理方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI655049B (zh) * 2013-03-26 2019-04-01 日商戴西爾聚合物股份有限公司 金屬成形體之粗面化方法
US10322535B2 (en) 2013-03-26 2019-06-18 Daicel Polymer Ltd. Method of manufacturing composite molded body
US11267171B2 (en) 2013-03-26 2022-03-08 Daicel Polymer Ltd. Method of manufacturing composite molded body
JP2017141146A (ja) * 2016-02-05 2017-08-17 一般財団法人ファインセラミックスセンター 焼結方法及び焼結物の製造方法
US11027454B2 (en) 2016-02-05 2021-06-08 Japan Fine Ceramics Center Method for producing ceramic sintered body, and method and device for producing ceramic molded body
US11724415B2 (en) 2016-02-05 2023-08-15 Japan Fine Ceramics Center Method for producing ceramic sintered body, and method and device for producing ceramic molded body
TWI616260B (zh) * 2016-12-09 2018-03-01 財團法人金屬工業研究發展中心 雷射加工裝置及雷射加工方法
CN115055852A (zh) * 2022-06-14 2022-09-16 东莞市长讯精密技术有限公司 一种高强度屏蔽罩激光焊接设备及焊接方法
CN115055852B (zh) * 2022-06-14 2023-03-10 东莞市长讯精密技术有限公司 一种高强度屏蔽罩激光焊接设备及焊接方法

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