WO2008078631A1 - 回路基板上への半導体部品の搭載方法 - Google Patents

回路基板上への半導体部品の搭載方法 Download PDF

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Publication number
WO2008078631A1
WO2008078631A1 PCT/JP2007/074463 JP2007074463W WO2008078631A1 WO 2008078631 A1 WO2008078631 A1 WO 2008078631A1 JP 2007074463 W JP2007074463 W JP 2007074463W WO 2008078631 A1 WO2008078631 A1 WO 2008078631A1
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WIPO (PCT)
Prior art keywords
solder
circuit board
stud bumps
semiconductor component
stud
Prior art date
Application number
PCT/JP2007/074463
Other languages
English (en)
French (fr)
Inventor
Yukifumi Oyama
Kazushige Toriyama
Hidetoshi Nishiwaki
Yasumitsu Orii
Toshihiko Nishio
Original Assignee
International Business Machines Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corporation filed Critical International Business Machines Corporation
Priority to JP2008551057A priority Critical patent/JP5160450B2/ja
Priority to EP07850933A priority patent/EP2104136A4/en
Publication of WO2008078631A1 publication Critical patent/WO2008078631A1/ja

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    • H—ELECTRICITY
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    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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Abstract

【課題】 半導体部品のスタッド・バンプに均一な量のはんだを供給し、回路基板上の接合パッドとはんだ接合させる。【解決手段】 複数のスタッド・バンプ（１２）が設けられた半導体部品（１０）を準備するステップ、スタッド・バンプの各々に対応する固形はんだ（１４）が並べられたはんだ基板（１３）を準備するステップ、スタッド・バンプの各々に対応する接合パッド（２１）を有する回路基板（２０）を準備するステップ、スタッド・バンプの各々の先端部にはんだ基板上の対応する固形はんだを付着させるステップ、スタッド・バンプの先端部に付着した固形はんだをはんだ基板から分離するステップ、スタッド・バンプの各々の先端部に付着した固形はんだと対応する接合パッドとを接触させるステップ、対応する接合パッドに接触した固形はんだを溶融させてスタッド・バンプの各々と対応する接合パッドをはんだ接合させるステップとを含む方法が提供される。
PCT/JP2007/074463 2006-12-26 2007-12-19 回路基板上への半導体部品の搭載方法 WO2008078631A1 (ja)

Priority Applications (2)

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JP2008551057A JP5160450B2 (ja) 2006-12-26 2007-12-19 回路基板上への半導体部品の搭載方法
EP07850933A EP2104136A4 (en) 2006-12-26 2007-12-19 METHOD FOR MOUNTING A SEMICONDUCTOR COMPONENT ON A PCB

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JP2006-349957 2006-12-26
JP2006349957 2006-12-26

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WO2008078631A1 true WO2008078631A1 (ja) 2008-07-03

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US (1) US7674651B2 (ja)
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US7674651B2 (en) 2006-12-26 2010-03-09 International Business Machines Corporation Mounting method for semiconductor parts on circuit substrate
JP2011166066A (ja) * 2010-02-15 2011-08-25 Napura:Kk 電子デバイスの製造方法

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JP5150578B2 (ja) * 2008-08-08 2013-02-20 株式会社東芝 半導体装置及びその製造方法
US9142533B2 (en) 2010-05-20 2015-09-22 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate interconnections having different sizes
KR101156175B1 (ko) * 2010-06-16 2012-06-18 한국생산기술연구원 돌기 형상의 젖음층을 이용한 웨이퍼 솔더범프 형성방법, 이를 이용하여 생산된 솔더범프가 형성된 웨이퍼 및 이를 이용한 플립 칩 접합방법
TW201208007A (en) * 2010-08-02 2012-02-16 Advanced Semiconductor Eng Semiconductor package
KR101695353B1 (ko) * 2010-10-06 2017-01-11 삼성전자 주식회사 반도체 패키지 및 반도체 패키지 모듈
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US20130020698A1 (en) 2011-07-22 2013-01-24 Taiwan Semiconductor Manufacturing Company, Ltd. Pillar Design for Conductive Bump
US20130075907A1 (en) * 2011-09-23 2013-03-28 Broadcom Corporation Interconnection Between Integrated Circuit and Package
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US20080150135A1 (en) 2008-06-26
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JP5160450B2 (ja) 2013-03-13
JPWO2008078631A1 (ja) 2010-04-22
US7674651B2 (en) 2010-03-09
KR20090101441A (ko) 2009-09-28
KR101027179B1 (ko) 2011-04-05

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