WO2008069182A1 - オキシメチレン系重合体を含む樹脂材料の接着方法および構造体 - Google Patents

オキシメチレン系重合体を含む樹脂材料の接着方法および構造体 Download PDF

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Publication number
WO2008069182A1
WO2008069182A1 PCT/JP2007/073343 JP2007073343W WO2008069182A1 WO 2008069182 A1 WO2008069182 A1 WO 2008069182A1 JP 2007073343 W JP2007073343 W JP 2007073343W WO 2008069182 A1 WO2008069182 A1 WO 2008069182A1
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WIPO (PCT)
Prior art keywords
resin material
melting point
oxymethylene polymer
polymer
oxymethylene
Prior art date
Application number
PCT/JP2007/073343
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English (en)
French (fr)
Inventor
Akira Okamura
Satoshi Nagai
Original Assignee
Mitsubishi Gas Chemical Company, Inc.
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Publication date
Application filed by Mitsubishi Gas Chemical Company, Inc. filed Critical Mitsubishi Gas Chemical Company, Inc.
Priority to JP2008548280A priority Critical patent/JPWO2008069182A1/ja
Priority to EP07832963.8A priority patent/EP2090630B1/en
Priority to US12/517,418 priority patent/US8617345B2/en
Priority to CN2007800440616A priority patent/CN101627098B/zh
Publication of WO2008069182A1 publication Critical patent/WO2008069182A1/ja

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    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0005Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
    • B29K2105/0044Stabilisers, e.g. against oxydation, light or heat
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/12Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of short lengths, e.g. chopped filaments, staple fibres or bristles
    • B29K2105/126Whiskers, i.e. reinforcement in the form of monocrystals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/16Fillers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2309/00Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
    • B29K2309/08Glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2309/00Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
    • B29K2309/10Mica
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0037Other properties
    • B29K2995/0041Crystalline
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31855Of addition polymer from unsaturated monomers

Definitions

  • the present invention relates to a resin material bonding method using an oxymethylene polymer having a specific melting point and a structure obtained by the bonding method in order to bond resin materials containing an oxymethylene polymer.
  • An oxymethylene polymer is an aliphatic ether type or a polymer mainly composed of an aliphatic ether, and is considered to be a material having a low environmental impact, which is derived from methanol power, which is a raw material independent of petroleum. . It is an excellent material that is currently widely used as engineering plastics with high mechanical properties such as rigidity.
  • an oxymethylene polymer is a resin having high crystallinity, and when bonding between an injection molded product, an extrusion molded product, and a stretched material containing the polymer, a heat history at a high temperature or a long time is required for bonding. After that, the heat shrinkage is larger than expected, and further, the melting on the material side cannot be ignored, and there is a problem that it is impossible to manufacture a structure that maintains the shape accurately.
  • Patent Document 1 Japanese Patent Laid-Open No. 1132638
  • Patent Document 2 JP-A-8-60125
  • Patent Document 3 International Publication 2002-077049
  • the present invention improves the adhesion between resin materials containing an oxymethylene-based polymer and can suppress the thermal shrinkage and thermal deformation of the structure, and the adhesion method. It aims at providing the structure obtained.
  • the inventors of the present invention have compared the melting point of the oxymethylene polymer contained in one resin material when the resin materials containing the oxymethylene polymer are bonded to each other.
  • the present inventors have conceived the present invention in which a heat treatment is carried out using a resin material containing an oxymethylene polymer having a specific melting point difference as (1) the other material or (2) an adhesive layer.
  • a resin material containing an oxymethylene polymer having a specific melting point difference as (1) the other material or (2) an adhesive layer.
  • the present invention is a resin material bonding method for bonding a resin material (X) containing an oxymethylene polymer (A) and a resin material (Y), the resin material (Y) Is a low melting point oximethylene polymer (B) having a melting point of 5 to 50 ° C. lower than that of the oximethylene polymer (A), or the resin material (Y) is the resin material (X). Or another kind of resin The low melting point between the resin material (Y) and the resin material (X).
  • this invention is a structure obtained by the said adhesion
  • a method for bonding a resin material capable of improving the adhesion between resin materials containing an oxymethylene polymer and suppressing thermal shrinkage and thermal deformation of the structure and A structure obtained by the bonding method can be provided.
  • the resin material bonding method of the present invention is a method in which the resin material (X) containing the oxymethylene polymer ( ⁇ ) and the resin material ( ⁇ ) are bonded by heat treatment.
  • the various materials and heat treatment conditions are described below.
  • Examples of the oxymethylene polymer (i) include commercially available les, oxymethylene homopolymers and oxymethylene block copolymers. Among these, a copolymer of trioxane and 0.5 to 30.0 parts by mass of at least one comonomer containing a repeating unit represented by the following general formula (1) is preferable with respect to 100 parts by mass of the trioxane. .
  • the comonomer with respect to 100 parts by mass of trioxane is more preferably from 0.5 to 10.0 parts by mass.
  • R 2 independently represents a hydrogen atom, an alkyl group, an organic group having an alkyl group, a phenyl group, or an organic group having a phenyl group.
  • m represents an integer of;! ⁇ 6.
  • Examples of the alkyl group include an alkyl group having 1 to 8 carbon atoms.
  • Examples of the comonomer include cyclic formal and cyclic ether. Concrete 1, 3-dioxolan and derivatives thereof; 1,3-dioxepane and derivatives thereof; 1, 3,5-trioxepane and derivatives thereof; 1, 3,6-trioxocane and derivatives thereof; and monofunctional glycidyl Ether is preferred!
  • the oxymethylene polymer (A) in the resin material (X) is preferably 50 vol% or more, and the resin material (X) preferably has an oxymethylene polymer (A) force. ,.
  • the melting point of the low melting point oximethylene polymer (B) contained in the resin material (Y) is preferably 5 to 50 ° C. lower by 10 to 30 ° C. than the oxymethylene polymer (A).
  • the difference in melting point is smaller than this, the temperature for bonding is very close to the melting point of the oxymethylene polymer (A), so that the thermal shrinkage of the material containing the oxymethylene polymer (A) is increased. There is a risk of thermal deformation, melting, and loss of shape.
  • the difference in melting points is large, the heat resistance after bonding is inferior as described above, or sufficient adhesive strength cannot be obtained.
  • the low melting point oxymethylene polymer (B) is also the same as that represented by the general formula (1), but the trioxane and 100 parts by weight of the trioxane are used in an amount of 10.0 to 50 parts by weight. Preferably it is a copolymer with one or more comonomers.
  • (B) is preferably composed only of the polymer (B) which is preferably 50 vol% or more.
  • the resin material (Y) does not contain the low melting point oxymethylene polymer (B), that is, the low melting point oxymethylene polymer (B) contains the resin material (X) and the resin material (Y).
  • the low melting point oxymethylene polymer (B) contains the resin material (X) and the resin material (Y).
  • other materials may be used in combination as long as the polymer (B) is a main component.
  • the resin material (Y) in the case where the low melting point oxymethylene polymer (B) is used as an adhesive layer may be the same material as the resin material (X) or another kind of material.
  • examples of other types of materials include materials having different contents of the oxymethylene-based polymer (A), and materials having components other than the oxymethylene-based polymer (A).
  • the heat treatment conditions are preferably in the range of a temperature lower than the melting point of the oxymethylene polymer (A) and 20 ° C lower than the melting point of the low melting point oxymethylene polymer (B).
  • the temperature By setting the temperature to less than the above melting point, the thermal shrinkage of the material containing the oxymethylene polymer (A) can be suppressed, and it is possible to prevent the shape from being damaged due to thermal deformation or melting.
  • sufficient adhesion strength can be imparted by treating at a temperature 20 ° C. lower than the melting point of the low melting point oxymethylene polymer (B).
  • the material containing the oxymethylene-based polymer of the present invention mainly contains the above-mentioned oxymethylene-based polymer, but any known additives or additives within the range not impairing the original purpose of the present invention. It is possible to add a filler.
  • additives include crystal nucleating agents, antioxidants, plasticizers, anti-foaming agents, foaming agents, lubricants, mold release agents, antistatic agents, ultraviolet absorbers, light stabilizers, heat stabilizers, Examples include deodorants, flame retardants, sliding agents, fragrances, and antibacterial agents.
  • the filler include glass fiber, talc, my strength, calcium carbonate, and potassium titanate whisker. It is also possible to add pigments and dyes to achieve the desired color. It is also possible to modify by adding various monomers, cutting agents, end treatment agents, other resins, wood flour, starch and the like.
  • the form of the resin material (X) and the resin material (Y) according to the present invention is not limited. I like it.
  • Other examples include, but are not limited to, blow molded products, films, sheets, fibers, multifilaments, monofilaments, ropes, nets, woven fabrics, knitted fabrics, nonwoven fabrics, filters, and materials obtained by secondary processing thereof. It is not something.
  • the oxymethylene polymer (B) is interposed between these materials and thermally bonded
  • examples of the interposed form include the low-melting oxymethylene polymer (B) in advance on the surface of the resin material (A). The ability to exist as a layer or as a domain.
  • the surface containing the oximethylene-based polymer (A) is simultaneously or sequentially applied to the surface in advance. It may be interposed, or may be interposed in the process from the primary processing of the material containing the oxymethylene polymer (A) to the formation of the structure.
  • the structure of the present invention can be obtained by the above-described method for bonding a resin material of the present invention.
  • This structure has good adhesion between resin materials containing an oxymethylene polymer, and heat shrinkage and thermal deformation are suppressed.
  • Such a structure may be used as it is, or may be further processed.
  • the structure once bonded can be bonded to a resin material containing another oxymethylene polymer (A) having a different shape to form a more advanced structure.
  • the layer structure in the case where the structure is a multi-layer fiber has two or more layers exposed on the fiber surface in the cross section of the same fiber, and the components constituting the layer are as follows. It consists of at least two components of the above resin materials (X) and (Y).
  • the exposure ratio on the surface is not particularly limited, but the exposure ratio of the resin material (Y) (particularly the oxymethylene polymer (B) component) that functions as an adhesive layer during secondary processing is low! Thus, the adhesive strength becomes better. Therefore, the resin material (Y) may be formed as a plurality of separate layers.
  • oxymethylene-based polymer (a)! Wupital F40 (hereinafter referred to as oxymethylene polymer (b) and! /) was used as the resin material (X) of the examples.
  • oxymethylene-based polymer (a)! Wupital F40 (hereinafter referred to as oxymethylene polymer (b) and! /) was melt-spun and processed into multifilaments having a draw ratio of 4 and a single fineness of 5 dtex.
  • oxymethylene polymer (c) and! /, U) having a melting point of 155 ° C was used as the resin material (Y) of the examples. I used it. This oxymethylene polymer (c) was melt-spun and processed into a multifilament of 5 dte X with a draw ratio of 1 and a single fineness.
  • the oxymethylene polymers (a) and (b) may become the resin material (or the oxymethylene polymer (c) may become the resin material (X).
  • the temperature was raised from 30 ° C. to 210 ° C. at a rate of 10 ° C./min, and the melting peak temperature was measured using a differential scanning calorimeter (DSC6200 manufactured by Seiko Instruments Inc.) to obtain the melting point.
  • DSC6200 differential scanning calorimeter manufactured by Seiko Instruments Inc.
  • Resin material (X) multifilament cut to 10 cm length is placed on an iron plate in a straight line, then resin material (Y) multifilament cut to 3 cm length is resin material (X) It was placed at the top so that it intersects with another iron plate. This was subjected to heat bonding treatment (heating treatment) under a heating and pressurizing condition for a predetermined time by a hydraulic hot press apparatus preheated to the temperature shown in Table 1 below.
  • the adhesion state between the resin material (X) and the resin material (Y) was visually confirmed to confirm whether each was melted or not melted. Further, the length of the resin material (X) after the treatment was measured, and the heat shrinkage ratio before and after the treatment was measured.
  • Resin material (X) Resin material (Y) (A) and (B) and Li k 70, Li k ⁇

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

 オキシメチレン系重合体(A)を含む樹脂材料(X)と、樹脂材料(Y)とを接着する樹脂材料の接着方法であって、前記樹脂材料(Y)を、前記オキシメチレン系重合体(A)に対して融点が5~50°C低い低融点オキシメチレン系重合体(B)とし、あるいは、前記樹脂材料(Y)を、前記樹脂材料(X)もしくは他種の樹脂材料とし、当該樹脂材料(Y)と樹脂材料(X)との間に前記低融点オキシメチレン系重合体(B)を介在させて、加熱処理を施す樹脂材料の接着方法、および当該接着方法により得られる構造体である。

Description

明 細 書
ォキシメチレン系重合体を含む樹脂材料の接着方法および構造体 技術分野
[0001] 本発明は、ォキシメチレン系重合体を含む樹脂材料間を接着させるために、特定 の融点を有するォキシメチレン系重合体を用いる樹脂材料の接着方法および該接 着方法によって得られる構造体に関する。
背景技術
[0002] 近年、地球規模での環境問題に対して、産業廃棄物が環境を汚染することを防止 するために、焼却処理の際に必要な熱量や CO発生量の削減が注目されている。そ の結果、材料の回収、リサイクルについての関心が益々高まっている。
[0003] ォキシメチレン系重合体は、脂肪族エーテル型、もしくは脂肪族エーテルを主成分 としたポリマーであり、主として石油に依存しない原料であるメタノール力 誘導され、 環境負荷の低い材料と考えられている。剛性などの機械的特性も高ぐエンジニアリ ングプラスチックスとして現在、広く使用される優れた材料である。
[0004] ォキシメチレン系重合体を含む樹脂材料同士を接着させる方法としては、その表面 が化学的に不活性なため、超音波融着を行う方法や、ォキシメチレン重合体表面を 予め粗化したり、電子線やプラズマ処理で改質したりした上で、シァノアクリレート系 接着剤、エポキシ系接着剤を用いる方法が知られている。前者はその工程や設備が 複雑であるうえ、適用できる対象も一部の射出成形体に限られている。また、後者は 十分な接着効果が得られないだけでなぐリサイクル性の点で、ォキシメチレン系重 合体とは別の成分を使用することになるために好ましくないといった問題があった。そ のため、ォキシメチレン系重合体を含む樹脂材料同士を同種のォキシメチレン系重 合体の材料で接着する技術が望まれてレ、た。
[0005] ォキシメチレン系重合体同士の接着においては、同系の非晶性共重合体 (特許文 献 1参照)、低融点の共重合体 (特許文献 2参照)の適用が提案されている。前者に ついてはその接着強度が十分でない上に、非晶性共重合体の融点が低ぐ接着後 の耐熱性が劣り、実用性は不十分なものであった。一方、後者は、前者よりも接着強 度が大幅に改良され、接着成分の耐熱性が上がっているものの、接着後に従来のォ キシメチレン系重合体と同じ環境で使用するには未だ耐熱性に劣っている。
[0006] また、ォキシメチレン系重合体は、結晶性の高い樹脂であり、これを含む射出成形 品や押出成形品、延伸材料間の接着に際して、接着のために高温または長時間で の熱履歴を経ると熱収縮が予想以上に大きぐ更には材料側の溶融が無視できなく なり、形状を正確に維持した構造体が製造できないという問題がある。
[0007] 本発明者らは、既にコモノマー含有量の大きいォキシメチレン共重合体を開発して いる。これは、融点が従来のォキシメチレン重合体と比べて適度に低いが、接着剤と しての有効性にっレ、てはなんら言及されてレ、な!/、(特許文献 3参照)。
[0008] 特許文献 1:特開平 1 132638号公報
特許文献 2:特開平 8— 60125号公報
特許文献 3 :国際公開 2002— 077049号公報
発明の開示
発明が解決しょうとする課題
[0009] 本発明は、ォキシメチレン系重合体を含む樹脂材料同士の接着性を向上させ、構 造体の熱収縮や熱変形を抑制することが可能な樹脂材料の接着方法、および当該 接着方法により得られる構造体を提供することを目的とする。
課題を解決するための手段
[0010] 本発明者らは、前記課題を解決すべく鋭意検討した結果、ォキシメチレン系重合 体を含む樹脂材料同士を接着させるに際し、一方の樹脂材料に含まれるォキシメチ レン系重合体の融点に対し、特定の融点差をもったォキシメチレン系重合体を含む 樹脂材料を、(1)他方の材料として、または(2)接着層として用いて、加熱処理を行 なう本発明に想到した。そして、これにより、熱収縮や熱変形といった問題もなく材料 間の接着性を向上させることができることを見出した。
[0011] すなわち、本発明は、ォキシメチレン系重合体 (A)を含む樹脂材料 (X)と、樹脂材 料 (Y)とを接着する樹脂材料の接着方法であって、前記樹脂材料 (Y)を、前記ォキ シメチレン系重合体 (A)に対して融点が 5〜50°C低い低融点ォキシメチレン系重合 体 (B)とし、あるいは、前記樹脂材料 (Y)を、前記樹脂材料 (X)もしくは他種の樹脂 材料とし、当該樹脂材料 (Y)と樹脂材料 (X)との間に前記低融
重合体 (Β)を介在させて、加熱処理を施す樹脂材料の接着方法である。
また、本発明は、上記接着方法で得られる構造体である。
発明の効果
[0012] 本発明によれば、ォキシメチレン系重合体を含む樹脂材料同士の接着性を向上さ せ、構造体の熱収縮や熱変形を抑制することが可能な樹脂材料の接着方法、およ び当該接着方法により得られる構造体を提供することができる。
発明を実施するための最良の形態
[0013] [樹脂材料の接着方法]
本発明の樹脂材料の接着方法は、ォキシメチレン系重合体 (Α)を含む樹脂材料( X)と、樹脂材料 (Υ)とを加熱処理にて接着する方法である。以下、各種材料および 加熱処理の条件につ!/、て説明する。
[0014] (ォキシメチレン系重合体 (Α)を含む樹脂材料 (X) )
ォキシメチレン系重合体 (Α)としては、一般に市販されてレ、るォキシメチレンホモポ リマーゃォキシメチレンブロック共重合体などが挙げられる。なかでも、下記一般式( 1)で示される繰り返し単位を含み、かつ、トリオキサンと該トリオキサン 100質量部に 対し 0. 5-30. 0質量部の 1種以上のコモノマーとの共重合物が好ましい。トリオキサ ン 100質量部に対するコモノマーは、 0. 5—10. 0質量部であることがより好ましい。
[0015] [化 1]
Figure imgf000004_0001
[0016] 上記式(1)中、
Figure imgf000004_0002
R2はそれぞれ独立に、水素原子、アルキル基、アルキル基を有 する有機基、フエ二ル基、フエ二ル基を有する有機基を表す。 mは;!〜 6の整数を表 す。アルキル基としては、炭素数 1〜8のアルキル基が挙げられる。
[0017] 上記コモノマーとしては、環状ホルマールや環状エーテルなどが挙げられる。具体 的には、 1 , 3—ジォキソランおよびその誘導体; 1 , 3—ジォキセパンおよびその誘導 体; 1 , 3, 5—トリオキセパン及びその誘導体; 1 , 3, 6—トリオキソカンおよびその誘 導体;および単官能グリシジルエーテル;が好まし!/、。
[0018] 樹脂材料 (X)中のォキシメチレン系重合体 (A)は、 50vol%以上であることが好ま しく、樹脂材料 (X)がォキシメチレン系重合体 (A)力もなること力 り好ましレ、。
[0019] (樹脂材料 (Y) )
樹脂材料 (Y)に含まれる低融点ォキシメチレン系重合体 (B)の融点は、ォキシメチ レン系重合体 (A)に対して 5〜50°C低ぐ 10〜30°C低いことが好ましい。これより融 点差が小さい場合には、接着させるための温度がォキシメチレン系重合体 (A)の融 点に極めて近くなるため、ォキシメチレン系重合体 (A)を含む材料の熱収縮が大きく なるばかりでなぐ熱変形、更には溶融して形状を損なうおそれがある。逆に融点差 が大きい場合には前述のように接着後の耐熱性が劣ったり、十分な接着強度が得ら れなかったりする。
[0020] 低融点ォキシメチレン系重合体(B)としては、同じく前述の一般式(1)で示されるも のであるが、トリオキサンと該トリオキサン 100重量部に対し 10. 0-50. 0重量部の 1 種以上のコモノマーとの共重合物であることが好ましレ、。
[0021] 樹脂材料 (Y)が低融点ォキシメチレン系重合体 (B)を含有する場合、当該重合体
(B)は、 50vol%以上であることが好ましぐ当該重合体 (B)のみで構成されているこ とが好ましい。
また、樹脂材料 (Y)が低融点ォキシメチレン系重合体 (B)を含有しない場合、すな わち、低融点ォキシメチレン系重合体 (B)が樹脂材料 (X)と樹脂材料 (Y)とを接着 する接着層となる場合は、当該重合体 (B)を主成分とすれば、他の材料を併用して あよい。
なお、低融点ォキシメチレン系重合体 (B)を接着層とする場合の樹脂材料 (Y)は、 樹脂材料 (X)と同一の材質としてもよぐ他種の材質としてもよい。他種の材質として は、ォキシメチレン系重合物 (A)の含有量が異なる材質、またはォキシメチレン系重 合物 (A)以外の成分が異なる材質などが挙げられる。
[0022] (加熱処理条件) 加熱処理条件 (接着条件)は、ォキシメチレン系重合体 (A)の融点未満で、かつ、 低融点ォキシメチレン系重合体 (B)の融点より 20°C低い温度以上の範囲とすること が好ましい。上記融点未満とすることで、ォキシメチレン系重合体 (A)を含む材料の 熱収縮が抑えられ、熱変形、さらには溶融して形状が損なわれることを防ぐことができ る。また、低融点ォキシメチレン系重合体(B)の融点より 20°C低い温度以上で処理 することで、十分な接着強度を付与することができる。
[0023] なお、本発明のォキシメチレン系重合体を含む材料は、主として上記のォキシメチ レン系重合体を含有するものであるが、本発明の本来の目的を損なわない範囲内で 公知の添加剤や充填剤を添加することが可能である。
[0024] 添加剤としては、例えば結晶核剤、酸化防止剤、可塑剤、艷消し剤、発泡剤、潤滑 剤、離型剤、帯電防止剤、紫外線吸収剤、光安定剤、熱安定剤、消臭剤、難燃剤、 摺動剤、香料、抗菌剤等が挙げられる。また、充填剤としては、ガラス繊維、タルク、 マイ力、炭酸カルシウム、チタン酸カリウムウイスカ一等が挙げられる。さらに、顔料、 染料を加えて所望の色目に仕上げることも可能である。また、各種モノマー、カツプリ ング剤、末端処理剤、その他の樹脂、木粉、でんぷんなどを加えて変性することも可 能である。
[0025] さらに、本発明に係る樹脂材料 (X)および樹脂材料 (Y)の形態には限定はないが 、射出成形品、押出成形品、延伸成形、またはそれらを 2次加工した成形品が好まし い。その他に、ブロー成形品、フィルム、シート、繊維、マルチフィラメント、モノフィラメ ント、ロープ、網、織物、編物、不織布、フィルター、更にはそれらを 2次加工した材料 が例示されるが、それらに限定されるものではない。これらの材料間にォキシメチレン 系重合体 (B)を介在させ熱接着させる場合、介在の形態としては、例えば、樹脂材 料 (A)の表面に、予め前記低融点ォキシメチレン系重合体 (B)を層状、又はドメイン として存在させること力 S好ましレヽ。
また、連続 (層状、棒状、波打ち状)、もしくは不連続(ドメイン状、ドット状)を問わず 、ォキシメチレン系重合体 (A)を含む材料の 1次加工時に同時に、または逐次的に 表面へ予め介在させてもよいし、ォキシメチレン系重合体 (A)を含む材料の 1次加工 の以後、構造体を形成させるまでの間の工程で介在させてもよい。 [0026] [構造体]
本発明の構造体は、既述の本発明の樹脂材料の接着方法により得られる。この構 造体は、ォキシメチレン系重合体を含む樹脂材料同士の接着性が良好であり、熱収 縮や熱変形が抑制されてレ、る。
[0027] かかる構造体は、そのまま用いてもよいし、さらに加工を施してもしてもよい。例えば 、同じような接着作業をくり返して、もしくは同時に行なうことで、ォキシメチレン系重 合体 (A)を含む少なくとも 1種以上の樹脂材料が多層で構成される構造体とすること もできる。また、一度接着させた構造体を新たに形状の異なる別のォキシメチレン系 重合体 (A)を含む樹脂材料と接着させて更に高度な構造体を形成して!/、くことがで きる。
[0028] 例えば、構造体が多層繊維である場合の層構造としては、同一繊維中、その断面 に、何れも繊維表面に露出した 2つ以上の層を有し、その層を構成する成分が、少な くとも上記の樹脂材料 (X)および (Y)の 2成分からなる。表面への露出割合は、特に 限定されないが、融点が低ぐ 2次加工時に接着層として機能する樹脂材料 (Y) (特 に、ォキシメチレン系重合体 (B)成分)の露出割合が高!/、ほど接着強度は良好なも のとなる。そのため、樹脂材料 (Y)を各々分かれた複数層として形成させてもよい。
[0029] 以下に、実施例を挙げて本発明をさらに具体的に説明する力 本発明は以下に示 す具体例に制限されるものではない。
なお、実施例で使用した材料、融点の測定方法、および接着方法と判断基準とを 以下に示す。
[0030] (樹脂材料)
実施例の樹脂材料 (X)として、 172°Cおよび 168°Cの融点を有する三菱ェンジ二 ァリングプラスチック株式会社製のュピタール A40 (以下、ォキシメチレン系重合体( a)と!/、う)およびュピタール F40 (以下、ォキシメチレン系重合体(b)と!/、う)を使用し た。ォキシメチレン系重合体(a)および (b)のそれぞれを、溶融紡糸し、延伸倍率 4、 単繊度で 5dtexのマルチフィラメントに加工した。
[0031] 実施例の樹脂材料 (Y)として、 155°Cの融点を有する三菱エンジニアリングプラス チックス株式会社製ュピタール V40 (以下、ォキシメチレン系重合体 (c)と!/、う)を使 用した。このォキシメチレン系重合体 (c)溶融紡糸し、延伸倍率 1倍、単繊度で 5dte Xのマルチフィラメントに加工した。
なお、比較例の場合は、ォキシメチレン系重合体(a)および (b)が樹脂材料 ( と なったり、ォキシメチレン系重合体 (c)が樹脂材料 (X)となったりすることがある。
[0032] (融点の測定方法)
10°C/分の速度で、 30°Cから 210°Cまで昇温し、示差走査熱量計 (セイコーインス ツルメンッ (株)製 DSC6200)を用い、溶融ピーク温度を測定し、融点とした。
[0033] (接着方法及び判定基準)
樹脂材料 (X)のマルチフィラメントを 10cm長に切断したものを鉄板の上に直線状 に配置し、次に樹脂材料 (Y)のマルチフィラメントを 3cm長に切断したものを、樹脂 材料 (X)と交差するように上に配置し、更にもう 1つの鉄板で挟みこんだ。これを下記 表 1に記載の温度に予め加熱した油圧式ホットプレス装置によって、所定時間の加 熱、加圧条件下で熱接着処理 (加熱処理)を施した。
[0034] 処理後、樹脂材料 (X)と樹脂材料 (Y)との接着状態を目視で確認し、各々の溶融 、未溶融の確認を行った。また、樹脂材料 (X)の処理後の長さを測定し、処理前後で の熱収縮率を測定した。
[0035] [実施例;!〜 7]
既述の接着方法、および下記表 1に記載の条件で、樹脂材料 (X)と樹脂材料 (Y) とを接着した。評価結果も表 1に示した。
[0036] [比較例;!〜 12]
既述の接着方法、および下記表 1に記載の条件で、樹脂材料 (X)と樹脂材料 (Y) とを接着した。評価結果も表 1に示した。
[0037] [表 1] 【表 1】
樹脂材料 (X) 樹脂材料 (Y) (A)と (B)と リ k 7 十、リ k→| 2 + ., k- i -7 ^ ^«« ^ ^
( L"ォ メチレン 「ォ シメチしン の 羊 小ッ レスホットノレス 能 ホットフレ人後の
ヤノ レ ヤノ'ナ WHSfisS : ( ) 時間(分) 接せ^ ® net+iw v、/ 樹樹 ,脂Πί材^τ料α(X)の 系重合体 (Α) ] 系重合体 (B) ] (°C) 脂材料 (X)の状態 収縮率 (·½)
17 150 90 接着 溶融せず 2.9 17 155 60 接着 溶融せず 3.0 17 155 90 接着 溶融せず 4.9 17 160 30 接着 溶融せず 8.7 12 150 90 接着 溶融せず 6.9 12 155 90 接着 溶触せず 7.1 12 160 30 接着 溶融せず 7.2
160 60 接着せず 溶触せず
170 30 接着 やや溶融 12.2 175 30 接着 溶融 7.1 160 60 接着せず 溶融せず
170 30 接着 やや溶融 12.1 175 30 接着 溶融 7.1 160 60 接着せず やや溶融
170 30 接着 やや溶融 5.9 170 60 接着 溶触
150 90 接着 やや溶融
155 90 接着 溶融
160 30 接着 溶融
(a): 172°Cの融点を有するュピタ- -ル A40からなるマルチフィラメント
(b): 168°Cの融点を有するュピタ- -ル F40からなるマルチフィラメント
(c): 155°Cの融点を有するュピタ- -ル V40からなるマルチフィラメント

Claims

請求の範囲
[1] ォキシメチレン系重合体 (A)を含む樹脂材料 (X)と、樹脂材料 (Y)とを接着する樹 脂材料の接着方法であって、
前記樹脂材料 (Υ)を、前記ォキシメチレン系重合体 (Α)に対して融点が 5〜50°C 低レ、低融点ォキシメチレン系重合体(B)とし、ある!/、は、
前記樹脂材料 (Y)を、前記樹脂材料 (X)もしくは他種の樹脂材料とし、当該樹脂材 料 (Y)と樹脂材料 (X)との間に前記低融点ォキシメチレン系重合体 (B)を介在させ て、加熱処理を施す樹脂材料の接着方法。
[2] 低融点ォキシメチレン系重合体 (B) 1 前記ォキシメチレン系重合体 (A)に対して 融点が 10〜30°C低!/、請求項 1に記載の樹脂材料の接着方法。
[3] 加熱処理の温度を、前記ォキシメチレン系重合体 (A)の融点未満で、かつ、前記 低融点ォキシメチレン系重合体 (B)の融点より 20°C低い温度以上とする請求項 1に 記載の樹脂材料の接着方法。
[4] ォキシメチレン系重合体 (A)が、下記一般式(1)で表される繰り返し単位を含み、 かつ、
トリオキサンと、該トリオキサン 100質量部に対し 0. 5-30. 0質量部の 1種以上の コモノマーとの共重合物である請求項 1に記載の樹脂材料の接着方法。
[化 1]
Figure imgf000010_0001
(式中、
Figure imgf000010_0002
R2はそれぞれ独立に、水素原子、アルキル基、アルキル基を有する有機 基、フエ二ル基、フエ二ル基を有する有機基を表す。 mは 1〜6の整数を表す。 ) ォキシメチレン系重合体 (B)が、下記一般式(1)で表される繰り返し単位を含み、 かつ、
トリオキサンと、該トリオキサン 100質量部に対し 5. 0-50. 0質量部の 1種以上の コモノマーとの共重合物である請求項 1に記載の樹脂材料の接着方法。
[化 2]
Figure imgf000011_0001
(式中、
Figure imgf000011_0002
R2はそれぞれ独立に、水素原子、アルキル基、アルキル基を有する有機 基、フエ二ル基、フエ二ル基を有する有機基を表す。 mは 1〜6の整数を表す。 ) [6] コモノマーが、 1 , 3—ジォキソランおよびその誘導体、 1 , 3—ジォキセパンおよび その誘導体、 1 , 3,
5—トリオキセパン及びその誘導体、 1 , 3,
6—トリオキソカンおよ びその誘導体、および単官能グリシジルエーテルからなる群から選ばれる少なくとも 1 種である請求項 4または 5に記載の樹脂材料の接着方法。
[7] 樹脂材料 (X)が、射出成形品、押出成形品、延伸成形品、またはそれらを 2次加工 した成形品であることを特徴とする請求項 1に記載の樹脂材料の接着方法。
[8] 樹脂材料 (X)の表面に、予め前記低融点ォキシメチレン系重合体 (B)を層状、又 はドメインとして存在させる請求項 1に記載の樹脂材料の接着方法。
[9] 請求項 1に記載の接着方法で得られる構造体。
PCT/JP2007/073343 2006-12-04 2007-12-03 オキシメチレン系重合体を含む樹脂材料の接着方法および構造体 WO2008069182A1 (ja)

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