WO2008069182A1 - オキシメチレン系重合体を含む樹脂材料の接着方法および構造体 - Google Patents
オキシメチレン系重合体を含む樹脂材料の接着方法および構造体 Download PDFInfo
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- WO2008069182A1 WO2008069182A1 PCT/JP2007/073343 JP2007073343W WO2008069182A1 WO 2008069182 A1 WO2008069182 A1 WO 2008069182A1 JP 2007073343 W JP2007073343 W JP 2007073343W WO 2008069182 A1 WO2008069182 A1 WO 2008069182A1
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- WIPO (PCT)
- Prior art keywords
- resin material
- melting point
- oxymethylene polymer
- polymer
- oxymethylene
- Prior art date
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- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- C09J159/00—Adhesives based on polyacetals; Adhesives based on derivatives of polyacetals
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/40—Applying molten plastics, e.g. hot melt
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
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- B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
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- B29C66/73116—Melting point of different melting point, i.e. the melting point of one of the parts to be joined being different from the melting point of the other part
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- B29C66/737—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the state of the material of the parts to be joined
- B29C66/7377—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the state of the material of the parts to be joined amorphous, semi-crystalline or crystalline
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- B29C66/73776—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the state of the material of the parts to be joined amorphous, semi-crystalline or crystalline the to-be-joined area of at least one of the parts to be joined being crystalline the to-be-joined areas of both parts to be joined being crystalline
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
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- B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/90—Measuring or controlling the joining process
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- B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
- B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
- B29C66/91411—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J159/00—Adhesives based on polyacetals; Adhesives based on derivatives of polyacetals
- C09J159/02—Polyacetals containing polyoxymethylene sequences only
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J159/00—Adhesives based on polyacetals; Adhesives based on derivatives of polyacetals
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- B29C66/737—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the state of the material of the parts to be joined
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- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/12—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of short lengths, e.g. chopped filaments, staple fibres or bristles
- B29K2105/126—Whiskers, i.e. reinforcement in the form of monocrystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/16—Fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
- B29K2309/08—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
- B29K2309/10—Mica
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
- B29K2995/0041—Crystalline
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
Definitions
- the present invention relates to a resin material bonding method using an oxymethylene polymer having a specific melting point and a structure obtained by the bonding method in order to bond resin materials containing an oxymethylene polymer.
- An oxymethylene polymer is an aliphatic ether type or a polymer mainly composed of an aliphatic ether, and is considered to be a material having a low environmental impact, which is derived from methanol power, which is a raw material independent of petroleum. . It is an excellent material that is currently widely used as engineering plastics with high mechanical properties such as rigidity.
- an oxymethylene polymer is a resin having high crystallinity, and when bonding between an injection molded product, an extrusion molded product, and a stretched material containing the polymer, a heat history at a high temperature or a long time is required for bonding. After that, the heat shrinkage is larger than expected, and further, the melting on the material side cannot be ignored, and there is a problem that it is impossible to manufacture a structure that maintains the shape accurately.
- Patent Document 1 Japanese Patent Laid-Open No. 1132638
- Patent Document 2 JP-A-8-60125
- Patent Document 3 International Publication 2002-077049
- the present invention improves the adhesion between resin materials containing an oxymethylene-based polymer and can suppress the thermal shrinkage and thermal deformation of the structure, and the adhesion method. It aims at providing the structure obtained.
- the inventors of the present invention have compared the melting point of the oxymethylene polymer contained in one resin material when the resin materials containing the oxymethylene polymer are bonded to each other.
- the present inventors have conceived the present invention in which a heat treatment is carried out using a resin material containing an oxymethylene polymer having a specific melting point difference as (1) the other material or (2) an adhesive layer.
- a resin material containing an oxymethylene polymer having a specific melting point difference as (1) the other material or (2) an adhesive layer.
- the present invention is a resin material bonding method for bonding a resin material (X) containing an oxymethylene polymer (A) and a resin material (Y), the resin material (Y) Is a low melting point oximethylene polymer (B) having a melting point of 5 to 50 ° C. lower than that of the oximethylene polymer (A), or the resin material (Y) is the resin material (X). Or another kind of resin The low melting point between the resin material (Y) and the resin material (X).
- this invention is a structure obtained by the said adhesion
- a method for bonding a resin material capable of improving the adhesion between resin materials containing an oxymethylene polymer and suppressing thermal shrinkage and thermal deformation of the structure and A structure obtained by the bonding method can be provided.
- the resin material bonding method of the present invention is a method in which the resin material (X) containing the oxymethylene polymer ( ⁇ ) and the resin material ( ⁇ ) are bonded by heat treatment.
- the various materials and heat treatment conditions are described below.
- Examples of the oxymethylene polymer (i) include commercially available les, oxymethylene homopolymers and oxymethylene block copolymers. Among these, a copolymer of trioxane and 0.5 to 30.0 parts by mass of at least one comonomer containing a repeating unit represented by the following general formula (1) is preferable with respect to 100 parts by mass of the trioxane. .
- the comonomer with respect to 100 parts by mass of trioxane is more preferably from 0.5 to 10.0 parts by mass.
- R 2 independently represents a hydrogen atom, an alkyl group, an organic group having an alkyl group, a phenyl group, or an organic group having a phenyl group.
- m represents an integer of;! ⁇ 6.
- Examples of the alkyl group include an alkyl group having 1 to 8 carbon atoms.
- Examples of the comonomer include cyclic formal and cyclic ether. Concrete 1, 3-dioxolan and derivatives thereof; 1,3-dioxepane and derivatives thereof; 1, 3,5-trioxepane and derivatives thereof; 1, 3,6-trioxocane and derivatives thereof; and monofunctional glycidyl Ether is preferred!
- the oxymethylene polymer (A) in the resin material (X) is preferably 50 vol% or more, and the resin material (X) preferably has an oxymethylene polymer (A) force. ,.
- the melting point of the low melting point oximethylene polymer (B) contained in the resin material (Y) is preferably 5 to 50 ° C. lower by 10 to 30 ° C. than the oxymethylene polymer (A).
- the difference in melting point is smaller than this, the temperature for bonding is very close to the melting point of the oxymethylene polymer (A), so that the thermal shrinkage of the material containing the oxymethylene polymer (A) is increased. There is a risk of thermal deformation, melting, and loss of shape.
- the difference in melting points is large, the heat resistance after bonding is inferior as described above, or sufficient adhesive strength cannot be obtained.
- the low melting point oxymethylene polymer (B) is also the same as that represented by the general formula (1), but the trioxane and 100 parts by weight of the trioxane are used in an amount of 10.0 to 50 parts by weight. Preferably it is a copolymer with one or more comonomers.
- (B) is preferably composed only of the polymer (B) which is preferably 50 vol% or more.
- the resin material (Y) does not contain the low melting point oxymethylene polymer (B), that is, the low melting point oxymethylene polymer (B) contains the resin material (X) and the resin material (Y).
- the low melting point oxymethylene polymer (B) contains the resin material (X) and the resin material (Y).
- other materials may be used in combination as long as the polymer (B) is a main component.
- the resin material (Y) in the case where the low melting point oxymethylene polymer (B) is used as an adhesive layer may be the same material as the resin material (X) or another kind of material.
- examples of other types of materials include materials having different contents of the oxymethylene-based polymer (A), and materials having components other than the oxymethylene-based polymer (A).
- the heat treatment conditions are preferably in the range of a temperature lower than the melting point of the oxymethylene polymer (A) and 20 ° C lower than the melting point of the low melting point oxymethylene polymer (B).
- the temperature By setting the temperature to less than the above melting point, the thermal shrinkage of the material containing the oxymethylene polymer (A) can be suppressed, and it is possible to prevent the shape from being damaged due to thermal deformation or melting.
- sufficient adhesion strength can be imparted by treating at a temperature 20 ° C. lower than the melting point of the low melting point oxymethylene polymer (B).
- the material containing the oxymethylene-based polymer of the present invention mainly contains the above-mentioned oxymethylene-based polymer, but any known additives or additives within the range not impairing the original purpose of the present invention. It is possible to add a filler.
- additives include crystal nucleating agents, antioxidants, plasticizers, anti-foaming agents, foaming agents, lubricants, mold release agents, antistatic agents, ultraviolet absorbers, light stabilizers, heat stabilizers, Examples include deodorants, flame retardants, sliding agents, fragrances, and antibacterial agents.
- the filler include glass fiber, talc, my strength, calcium carbonate, and potassium titanate whisker. It is also possible to add pigments and dyes to achieve the desired color. It is also possible to modify by adding various monomers, cutting agents, end treatment agents, other resins, wood flour, starch and the like.
- the form of the resin material (X) and the resin material (Y) according to the present invention is not limited. I like it.
- Other examples include, but are not limited to, blow molded products, films, sheets, fibers, multifilaments, monofilaments, ropes, nets, woven fabrics, knitted fabrics, nonwoven fabrics, filters, and materials obtained by secondary processing thereof. It is not something.
- the oxymethylene polymer (B) is interposed between these materials and thermally bonded
- examples of the interposed form include the low-melting oxymethylene polymer (B) in advance on the surface of the resin material (A). The ability to exist as a layer or as a domain.
- the surface containing the oximethylene-based polymer (A) is simultaneously or sequentially applied to the surface in advance. It may be interposed, or may be interposed in the process from the primary processing of the material containing the oxymethylene polymer (A) to the formation of the structure.
- the structure of the present invention can be obtained by the above-described method for bonding a resin material of the present invention.
- This structure has good adhesion between resin materials containing an oxymethylene polymer, and heat shrinkage and thermal deformation are suppressed.
- Such a structure may be used as it is, or may be further processed.
- the structure once bonded can be bonded to a resin material containing another oxymethylene polymer (A) having a different shape to form a more advanced structure.
- the layer structure in the case where the structure is a multi-layer fiber has two or more layers exposed on the fiber surface in the cross section of the same fiber, and the components constituting the layer are as follows. It consists of at least two components of the above resin materials (X) and (Y).
- the exposure ratio on the surface is not particularly limited, but the exposure ratio of the resin material (Y) (particularly the oxymethylene polymer (B) component) that functions as an adhesive layer during secondary processing is low! Thus, the adhesive strength becomes better. Therefore, the resin material (Y) may be formed as a plurality of separate layers.
- oxymethylene-based polymer (a)! Wupital F40 (hereinafter referred to as oxymethylene polymer (b) and! /) was used as the resin material (X) of the examples.
- oxymethylene-based polymer (a)! Wupital F40 (hereinafter referred to as oxymethylene polymer (b) and! /) was melt-spun and processed into multifilaments having a draw ratio of 4 and a single fineness of 5 dtex.
- oxymethylene polymer (c) and! /, U) having a melting point of 155 ° C was used as the resin material (Y) of the examples. I used it. This oxymethylene polymer (c) was melt-spun and processed into a multifilament of 5 dte X with a draw ratio of 1 and a single fineness.
- the oxymethylene polymers (a) and (b) may become the resin material (or the oxymethylene polymer (c) may become the resin material (X).
- the temperature was raised from 30 ° C. to 210 ° C. at a rate of 10 ° C./min, and the melting peak temperature was measured using a differential scanning calorimeter (DSC6200 manufactured by Seiko Instruments Inc.) to obtain the melting point.
- DSC6200 differential scanning calorimeter manufactured by Seiko Instruments Inc.
- Resin material (X) multifilament cut to 10 cm length is placed on an iron plate in a straight line, then resin material (Y) multifilament cut to 3 cm length is resin material (X) It was placed at the top so that it intersects with another iron plate. This was subjected to heat bonding treatment (heating treatment) under a heating and pressurizing condition for a predetermined time by a hydraulic hot press apparatus preheated to the temperature shown in Table 1 below.
- the adhesion state between the resin material (X) and the resin material (Y) was visually confirmed to confirm whether each was melted or not melted. Further, the length of the resin material (X) after the treatment was measured, and the heat shrinkage ratio before and after the treatment was measured.
- Resin material (X) Resin material (Y) (A) and (B) and Li k 70, Li k ⁇
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008548280A JPWO2008069182A1 (ja) | 2006-12-04 | 2007-12-03 | オキシメチレン系重合体を含む樹脂材料の接着方法および構造体 |
EP07832963.8A EP2090630B1 (en) | 2006-12-04 | 2007-12-03 | Method for bonding resin materials containing oxymethylene polymer and structures |
US12/517,418 US8617345B2 (en) | 2006-12-04 | 2007-12-03 | Method for bonding resin materials containing oxymethylene polymer and structures |
CN2007800440616A CN101627098B (zh) | 2006-12-04 | 2007-12-03 | 含有甲醛系聚合物的树脂材料的粘接方法以及结构体 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2006-327653 | 2006-12-04 | ||
JP2006327653 | 2006-12-04 |
Publications (1)
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WO2008069182A1 true WO2008069182A1 (ja) | 2008-06-12 |
Family
ID=39492070
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PCT/JP2007/073343 WO2008069182A1 (ja) | 2006-12-04 | 2007-12-03 | オキシメチレン系重合体を含む樹脂材料の接着方法および構造体 |
Country Status (6)
Country | Link |
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US (1) | US8617345B2 (ja) |
EP (1) | EP2090630B1 (ja) |
JP (1) | JPWO2008069182A1 (ja) |
KR (1) | KR20090086416A (ja) |
CN (1) | CN101627098B (ja) |
WO (1) | WO2008069182A1 (ja) |
Families Citing this family (4)
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WO2012092104A1 (en) | 2010-12-30 | 2012-07-05 | Ticona Llc | Powder containing a polyoxymethylene polymer for coating metallic substrates |
EP3220946B1 (en) | 2014-06-16 | 2021-06-09 | Codexis, Inc. | Compositions and methods for attenuating and preventing intestinal inflammation due to the presence of peptidic food antigens in an intestine |
WO2017106798A2 (en) | 2015-12-16 | 2017-06-22 | Nepetx, Llc | Compositions and methods for treating gluten intolerance and disorders arising therefrom |
US10082082B2 (en) | 2016-01-05 | 2018-09-25 | Solar Turbines Incorporated | Fuel injector with multi tube gas distribution |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01132638A (ja) | 1987-09-14 | 1989-05-25 | Hoechst Celanese Corp | アセタールポリマー接合物品 |
JPH02166184A (ja) * | 1988-10-11 | 1990-06-26 | Hoechst Celanese Corp | アセタールコポリマー接合樹脂を用いた物品 |
JPH0860125A (ja) | 1994-08-25 | 1996-03-05 | Polyplastics Co | ポリアセタール樹脂用接着剤、接合方法およびその接合物 |
WO2002077049A1 (fr) | 2001-03-27 | 2002-10-03 | Mitsubishi Gas Chemical Company, Inc. | Copolymere polyoxymethylene et article moule correspondant |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08157687A (ja) * | 1994-12-02 | 1996-06-18 | Daihachi Chem Ind Co Ltd | ポリアセタール系樹脂組成物 |
DE10061767B4 (de) * | 1999-12-17 | 2009-10-15 | Asahi Kasei Kabushiki Kaisha | Polyacetalharzzusammensetzung |
WO2008069183A1 (ja) | 2006-12-04 | 2008-06-12 | Mitsubishi Gas Chemical Company, Inc. | オキシメチレン系重合体を含む樹脂材料の接着方法および構造体 |
JP5261924B2 (ja) | 2006-12-04 | 2013-08-14 | 三菱瓦斯化学株式会社 | オキシメチレン共重合体多層繊維 |
-
2007
- 2007-12-03 KR KR1020097010869A patent/KR20090086416A/ko not_active Application Discontinuation
- 2007-12-03 EP EP07832963.8A patent/EP2090630B1/en active Active
- 2007-12-03 US US12/517,418 patent/US8617345B2/en active Active
- 2007-12-03 CN CN2007800440616A patent/CN101627098B/zh active Active
- 2007-12-03 JP JP2008548280A patent/JPWO2008069182A1/ja active Pending
- 2007-12-03 WO PCT/JP2007/073343 patent/WO2008069182A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01132638A (ja) | 1987-09-14 | 1989-05-25 | Hoechst Celanese Corp | アセタールポリマー接合物品 |
JPH02166184A (ja) * | 1988-10-11 | 1990-06-26 | Hoechst Celanese Corp | アセタールコポリマー接合樹脂を用いた物品 |
JPH0860125A (ja) | 1994-08-25 | 1996-03-05 | Polyplastics Co | ポリアセタール樹脂用接着剤、接合方法およびその接合物 |
WO2002077049A1 (fr) | 2001-03-27 | 2002-10-03 | Mitsubishi Gas Chemical Company, Inc. | Copolymere polyoxymethylene et article moule correspondant |
Non-Patent Citations (1)
Title |
---|
See also references of EP2090630A4 |
Also Published As
Publication number | Publication date |
---|---|
EP2090630A1 (en) | 2009-08-19 |
CN101627098B (zh) | 2013-04-24 |
EP2090630A4 (en) | 2011-08-24 |
JPWO2008069182A1 (ja) | 2010-03-18 |
US20100021752A1 (en) | 2010-01-28 |
US8617345B2 (en) | 2013-12-31 |
EP2090630B1 (en) | 2019-06-05 |
CN101627098A (zh) | 2010-01-13 |
KR20090086416A (ko) | 2009-08-12 |
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