WO2008062579A1 - Appareil d'inspection de semi-conducteur - Google Patents

Appareil d'inspection de semi-conducteur Download PDF

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Publication number
WO2008062579A1
WO2008062579A1 PCT/JP2007/062433 JP2007062433W WO2008062579A1 WO 2008062579 A1 WO2008062579 A1 WO 2008062579A1 JP 2007062433 W JP2007062433 W JP 2007062433W WO 2008062579 A1 WO2008062579 A1 WO 2008062579A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor inspection
test
terminal
substrate
test electrode
Prior art date
Application number
PCT/JP2007/062433
Other languages
English (en)
Japanese (ja)
Inventor
Kazuaki Nakai
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to US12/159,354 priority Critical patent/US20100259287A1/en
Priority to JP2008517252A priority patent/JPWO2008062579A1/ja
Publication of WO2008062579A1 publication Critical patent/WO2008062579A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Definitions

  • the present invention relates to a semiconductor inspection apparatus for performing various measurements on a semiconductor integrated circuit as a device under test.
  • an interface substrate for transmitting a signal necessary for a test between a device under test and a measurement unit is mounted on a test head.
  • a movable structure using bimetal is adopted as a probe attached to a substrate so as to be in contact with an electrode of a chip on the wafer in the wafer test.
  • a movable structure using bimetal is adopted as a probe attached to a substrate so as to be in contact with an electrode of a chip on the wafer in the wafer test.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2002-313855
  • An object of the present invention is to make it possible to easily change the state of electrical connection between a measurement unit and an interface substrate.
  • the electrical connection state of the test electrode to the interface substrate for electrically connecting the test head to the interface substrate is determined. It was decided to change the state of electrical connection between the measurement unit and the interface board by arbitrarily controlling the movable part of each test electrode. Effect of the invention
  • mounting of the relay on the interface substrate is not required, and when connecting a plurality of device terminals to a specific measurement unit of the test head, or in a plurality of specific device terminals.
  • the assignment of measurement units is improved, and the ease of implementation when switching between measurement units according to inspection items is improved.
  • the inspection cost can be suppressed by simplifying the substrate wiring as compared with the case of mounting the relay. Furthermore, by eliminating the need for relays in the wiring between the measurement unit and the device terminals, it is possible to avoid the deterioration of the electrical characteristics.
  • FIG. 1 is a schematic side view of a semiconductor inspection device according to a first embodiment of the present invention.
  • FIG. 2 is an enlarged perspective view showing the unconnected state of the test electrode in FIG.
  • FIG. 3 is an enlarged perspective view showing the connection state of the test electrode in FIG.
  • FIG. 4 is a schematic side view of a semiconductor inspection device according to a second embodiment of the present invention.
  • FIG. 5 shows the test electrode in the semiconductor inspection device according to the third embodiment of the present invention. It is an enlarged plan view.
  • FIG. 6 is an enlarged perspective view showing the unconnected state of the test electrode of FIG.
  • FIG. 7 is an enlarged perspective view showing a connection state of one of the test electrodes of FIG.
  • FIG. 8 is an enlarged perspective view showing another connection state of the test electrode of FIG.
  • FIG. 9 is a cross-sectional view showing the contact of the test electrode and the interface substrate in the state of FIG.
  • FIG. 10 is a cross-sectional view showing the contact of the test electrode and the interface substrate in the state of FIG.
  • FIG. 1 is a device terminal
  • 2 is a device under test
  • 3 is a test head
  • 4 is a measurement unit (channel, power supply, signal unit, etc.)
  • 5 is a test electrode (pogo pin)
  • 6 is an interface substrate terminal.
  • FIG. 2 is an enlarged perspective view of the test electrode 5 and shows a non-connected state, in which 8 is a fixed portion and 9 is a movable portion.
  • Figure 3 is a test
  • FIG. 6 is an enlarged perspective view of an electrode 5 in a connected state.
  • connection state between the test electrode 5 and the interface substrate terminal 6 is changed by changing the state of the test electrode 5 as shown in FIGS. It is characterized by doing by changing.
  • test electrodes 5 electrically connected from a specific measurement unit 4 in the test head 3, and each test electrode 5 is connectable to the device terminal 1.
  • the selection of the device terminal 1 is made by the test electrode 5 physically moving as shown in FIGS.
  • the movable part 9 In the non-connected state with the interface board terminal 6, the movable part 9 is present inside the fixed part 8 as shown in FIG. When connecting to the interface board terminal 6, the movable portion 9 contacts the interface board terminal 6 so that electrical connection is made and signal propagation can be performed (see FIG. 3).
  • application of a spring type, application of an electric field, application of a magnetic field, etc. does not matter.
  • control of the connection path is optionally performed for each of the test electrodes 5. It will be possible to do.
  • FIG. 4 is a block diagram of the semiconductor inspection device of the second embodiment.
  • 1 is a device terminal
  • 2 is a device under test
  • 3 is a test head
  • 4 is a measurement unit
  • 5 is a test electrode
  • 6 is an interface substrate terminal.
  • switching of the connection state between the test electrode 5 and the interface substrate terminal 6 changes the state of the test electrode 5 as shown in FIG. It is characterized by performing by changing the state of continuity.
  • test electrodes 5 electrically connected to the plurality of measurement units 4 independently, and each test electrode 5 can be connected to a specific device terminal 1. .
  • the test electrode 5 is physically selected as shown in FIGS. 2 and 3 for the selection of the measurement unit 4 electrically connected to a specific device terminal 1. It does by moving.
  • control of the connection path is optionally performed for each of the test electrodes 5. It will be possible to do.
  • 5 to 10 are configuration diagrams of the test electrode 5 and the interface substrate 16 in the semiconductor inspection device according to the third embodiment of the present invention.
  • 8 is a fixed portion
  • 10 to 14 is a cylindrical, concentrically arranged movable portion
  • 15 is an insulating support bar.
  • An interface substrate 16 is adapted to the cylindrical test electrode 5.
  • the present embodiment provides a more stable and reliable connection method of the test electrode 5 connected to the interface substrate 16.
  • the test electrode 5 described in the first and second embodiments has only one connection path for one test electrode 5. Therefore, as described in the first embodiment, in the case of connecting a plurality of device terminals [a] to a specific measurement unit 4 , or in the case of connecting a specific device terminal 1 as described in the second embodiment, In the case where the measurement unit 4 is assigned and it is desired to switch the measurement unit 4 depending on the inspection item, a plurality of connection paths are required, and the test electrode 5 is necessary for the necessary connection path. In addition, although the electrical connection state of each test electrode 5 is changed by changing the test electrode 5 as shown in FIGS. 2 and 3, the positional relationship between the test electrode 5 and the interface substrate terminal 6 can not be confirmed. As a result, there is a problem in ensuring that the desired connection state can be realized.
  • a plurality of cylindrical movable portions 10 having test electrodes 5 for electrically connecting one or more measurement units 4 to the interface substrate 16 are provided.
  • ⁇ Has a combined structure of 14 and is characterized in that the electrical connection between the measurement unit 4 and the interface board 16 can be changed by each movable part 10 to 14 performing an independent operation. Do. Further, measurement is realized by combining with the interface board 16 corresponding to the test electrode 5.
  • the test electrode 5 has a cylindrical structure as shown in FIGS. Each has a different radius:! ⁇
  • the fifth movable parts 10 to 14 constitute the test electrode 5 in combination.
  • the movable parts 10 to 14 are insulated and not electrically connected to each other.
  • the terminal portion of the interface board 16 has a conical structure.
  • the terminal portion of the interface board 16 has independent terminals in a plurality of layers, and the terminals of each layer are electrically isolated from each other.
  • one combination test electrode 5 can have a plurality of connection paths, and when a plurality of device terminals 1 are connected to a specific measurement unit 4, or a specific device terminal 1 In the case where the plurality of measurement units 4 are assigned to the measurement unit 4 and the measurement units 4 are switched according to the inspection item, it is possible to suppress the increase in the number of electrodes.
  • the insulating support rod 15 present on the central axis of the test electrode 5 is used to maintain the positional relationship between the interface substrate 16 and the fixed portion 8. This enables stable and reliable electrode selection.
  • the semiconductor inspection apparatus is useful because the easiness of the inspection to switch the connection state between the device under test and the measurement unit is improved.

Abstract

Un état de connexion électrique entre une unité de mesure (4) et une borne de substrat d'interface (6) est amené à varier par un ajustement d'un état de connexion électrique d'une électrode de test (5) pour connecter électriquement l'unité de mesure (4) et la borne de substrat d'interface (6) à la borne de substrat d'interface (6) arbitrairement par une tête d'essai (3) en utilisant un segment mobile de chaque électrode de test (5).
PCT/JP2007/062433 2006-03-31 2007-06-20 Appareil d'inspection de semi-conducteur WO2008062579A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/159,354 US20100259287A1 (en) 2006-03-31 2007-06-20 Semiconductor test equipment
JP2008517252A JPWO2008062579A1 (ja) 2006-11-22 2007-06-20 半導体検査装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006315622 2006-11-22
JP2006-315622 2006-11-22

Publications (1)

Publication Number Publication Date
WO2008062579A1 true WO2008062579A1 (fr) 2008-05-29

Family

ID=39429520

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/062433 WO2008062579A1 (fr) 2006-03-31 2007-06-20 Appareil d'inspection de semi-conducteur

Country Status (3)

Country Link
JP (1) JPWO2008062579A1 (fr)
CN (1) CN101371152A (fr)
WO (1) WO2008062579A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62134579A (ja) * 1985-12-06 1987-06-17 Sharp Corp ユニバ−サルフイクスチヤ−
JPH01284778A (ja) * 1988-05-11 1989-11-16 Mitsubishi Electric Corp 半導体装置用テストヘツド
JPH0421881U (fr) * 1990-06-08 1992-02-24
JPH0636223U (ja) * 1992-10-14 1994-05-13 コニカ株式会社 接点構造
JPH0712889A (ja) * 1993-06-15 1995-01-17 Mitsubishi Electric Corp 半導体検査装置
JP2001074816A (ja) * 1999-09-09 2001-03-23 Advantest Corp 半導体試験装置
JP2006064488A (ja) * 2004-08-26 2006-03-09 Yokogawa Electric Corp 半導体試験装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62134579A (ja) * 1985-12-06 1987-06-17 Sharp Corp ユニバ−サルフイクスチヤ−
JPH01284778A (ja) * 1988-05-11 1989-11-16 Mitsubishi Electric Corp 半導体装置用テストヘツド
JPH0421881U (fr) * 1990-06-08 1992-02-24
JPH0636223U (ja) * 1992-10-14 1994-05-13 コニカ株式会社 接点構造
JPH0712889A (ja) * 1993-06-15 1995-01-17 Mitsubishi Electric Corp 半導体検査装置
JP2001074816A (ja) * 1999-09-09 2001-03-23 Advantest Corp 半導体試験装置
JP2006064488A (ja) * 2004-08-26 2006-03-09 Yokogawa Electric Corp 半導体試験装置

Also Published As

Publication number Publication date
JPWO2008062579A1 (ja) 2010-03-04
CN101371152A (zh) 2009-02-18

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