WO2008062579A1 - Semiconductor inspection equipment - Google Patents

Semiconductor inspection equipment Download PDF

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Publication number
WO2008062579A1
WO2008062579A1 PCT/JP2007/062433 JP2007062433W WO2008062579A1 WO 2008062579 A1 WO2008062579 A1 WO 2008062579A1 JP 2007062433 W JP2007062433 W JP 2007062433W WO 2008062579 A1 WO2008062579 A1 WO 2008062579A1
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WIPO (PCT)
Prior art keywords
semiconductor inspection
test
terminal
substrate
test electrode
Prior art date
Application number
PCT/JP2007/062433
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French (fr)
Japanese (ja)
Inventor
Kazuaki Nakai
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to US12/159,354 priority Critical patent/US20100259287A1/en
Priority to JP2008517252A priority patent/JPWO2008062579A1/en
Publication of WO2008062579A1 publication Critical patent/WO2008062579A1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Definitions

  • the present invention relates to a semiconductor inspection apparatus for performing various measurements on a semiconductor integrated circuit as a device under test.
  • an interface substrate for transmitting a signal necessary for a test between a device under test and a measurement unit is mounted on a test head.
  • a movable structure using bimetal is adopted as a probe attached to a substrate so as to be in contact with an electrode of a chip on the wafer in the wafer test.
  • a movable structure using bimetal is adopted as a probe attached to a substrate so as to be in contact with an electrode of a chip on the wafer in the wafer test.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2002-313855
  • An object of the present invention is to make it possible to easily change the state of electrical connection between a measurement unit and an interface substrate.
  • the electrical connection state of the test electrode to the interface substrate for electrically connecting the test head to the interface substrate is determined. It was decided to change the state of electrical connection between the measurement unit and the interface board by arbitrarily controlling the movable part of each test electrode. Effect of the invention
  • mounting of the relay on the interface substrate is not required, and when connecting a plurality of device terminals to a specific measurement unit of the test head, or in a plurality of specific device terminals.
  • the assignment of measurement units is improved, and the ease of implementation when switching between measurement units according to inspection items is improved.
  • the inspection cost can be suppressed by simplifying the substrate wiring as compared with the case of mounting the relay. Furthermore, by eliminating the need for relays in the wiring between the measurement unit and the device terminals, it is possible to avoid the deterioration of the electrical characteristics.
  • FIG. 1 is a schematic side view of a semiconductor inspection device according to a first embodiment of the present invention.
  • FIG. 2 is an enlarged perspective view showing the unconnected state of the test electrode in FIG.
  • FIG. 3 is an enlarged perspective view showing the connection state of the test electrode in FIG.
  • FIG. 4 is a schematic side view of a semiconductor inspection device according to a second embodiment of the present invention.
  • FIG. 5 shows the test electrode in the semiconductor inspection device according to the third embodiment of the present invention. It is an enlarged plan view.
  • FIG. 6 is an enlarged perspective view showing the unconnected state of the test electrode of FIG.
  • FIG. 7 is an enlarged perspective view showing a connection state of one of the test electrodes of FIG.
  • FIG. 8 is an enlarged perspective view showing another connection state of the test electrode of FIG.
  • FIG. 9 is a cross-sectional view showing the contact of the test electrode and the interface substrate in the state of FIG.
  • FIG. 10 is a cross-sectional view showing the contact of the test electrode and the interface substrate in the state of FIG.
  • FIG. 1 is a device terminal
  • 2 is a device under test
  • 3 is a test head
  • 4 is a measurement unit (channel, power supply, signal unit, etc.)
  • 5 is a test electrode (pogo pin)
  • 6 is an interface substrate terminal.
  • FIG. 2 is an enlarged perspective view of the test electrode 5 and shows a non-connected state, in which 8 is a fixed portion and 9 is a movable portion.
  • Figure 3 is a test
  • FIG. 6 is an enlarged perspective view of an electrode 5 in a connected state.
  • connection state between the test electrode 5 and the interface substrate terminal 6 is changed by changing the state of the test electrode 5 as shown in FIGS. It is characterized by doing by changing.
  • test electrodes 5 electrically connected from a specific measurement unit 4 in the test head 3, and each test electrode 5 is connectable to the device terminal 1.
  • the selection of the device terminal 1 is made by the test electrode 5 physically moving as shown in FIGS.
  • the movable part 9 In the non-connected state with the interface board terminal 6, the movable part 9 is present inside the fixed part 8 as shown in FIG. When connecting to the interface board terminal 6, the movable portion 9 contacts the interface board terminal 6 so that electrical connection is made and signal propagation can be performed (see FIG. 3).
  • application of a spring type, application of an electric field, application of a magnetic field, etc. does not matter.
  • control of the connection path is optionally performed for each of the test electrodes 5. It will be possible to do.
  • FIG. 4 is a block diagram of the semiconductor inspection device of the second embodiment.
  • 1 is a device terminal
  • 2 is a device under test
  • 3 is a test head
  • 4 is a measurement unit
  • 5 is a test electrode
  • 6 is an interface substrate terminal.
  • switching of the connection state between the test electrode 5 and the interface substrate terminal 6 changes the state of the test electrode 5 as shown in FIG. It is characterized by performing by changing the state of continuity.
  • test electrodes 5 electrically connected to the plurality of measurement units 4 independently, and each test electrode 5 can be connected to a specific device terminal 1. .
  • the test electrode 5 is physically selected as shown in FIGS. 2 and 3 for the selection of the measurement unit 4 electrically connected to a specific device terminal 1. It does by moving.
  • control of the connection path is optionally performed for each of the test electrodes 5. It will be possible to do.
  • 5 to 10 are configuration diagrams of the test electrode 5 and the interface substrate 16 in the semiconductor inspection device according to the third embodiment of the present invention.
  • 8 is a fixed portion
  • 10 to 14 is a cylindrical, concentrically arranged movable portion
  • 15 is an insulating support bar.
  • An interface substrate 16 is adapted to the cylindrical test electrode 5.
  • the present embodiment provides a more stable and reliable connection method of the test electrode 5 connected to the interface substrate 16.
  • the test electrode 5 described in the first and second embodiments has only one connection path for one test electrode 5. Therefore, as described in the first embodiment, in the case of connecting a plurality of device terminals [a] to a specific measurement unit 4 , or in the case of connecting a specific device terminal 1 as described in the second embodiment, In the case where the measurement unit 4 is assigned and it is desired to switch the measurement unit 4 depending on the inspection item, a plurality of connection paths are required, and the test electrode 5 is necessary for the necessary connection path. In addition, although the electrical connection state of each test electrode 5 is changed by changing the test electrode 5 as shown in FIGS. 2 and 3, the positional relationship between the test electrode 5 and the interface substrate terminal 6 can not be confirmed. As a result, there is a problem in ensuring that the desired connection state can be realized.
  • a plurality of cylindrical movable portions 10 having test electrodes 5 for electrically connecting one or more measurement units 4 to the interface substrate 16 are provided.
  • ⁇ Has a combined structure of 14 and is characterized in that the electrical connection between the measurement unit 4 and the interface board 16 can be changed by each movable part 10 to 14 performing an independent operation. Do. Further, measurement is realized by combining with the interface board 16 corresponding to the test electrode 5.
  • the test electrode 5 has a cylindrical structure as shown in FIGS. Each has a different radius:! ⁇
  • the fifth movable parts 10 to 14 constitute the test electrode 5 in combination.
  • the movable parts 10 to 14 are insulated and not electrically connected to each other.
  • the terminal portion of the interface board 16 has a conical structure.
  • the terminal portion of the interface board 16 has independent terminals in a plurality of layers, and the terminals of each layer are electrically isolated from each other.
  • one combination test electrode 5 can have a plurality of connection paths, and when a plurality of device terminals 1 are connected to a specific measurement unit 4, or a specific device terminal 1 In the case where the plurality of measurement units 4 are assigned to the measurement unit 4 and the measurement units 4 are switched according to the inspection item, it is possible to suppress the increase in the number of electrodes.
  • the insulating support rod 15 present on the central axis of the test electrode 5 is used to maintain the positional relationship between the interface substrate 16 and the fixed portion 8. This enables stable and reliable electrode selection.
  • the semiconductor inspection apparatus is useful because the easiness of the inspection to switch the connection state between the device under test and the measurement unit is improved.

Abstract

Electrical connection state between a measuring unit (4) and an interface substrate terminal (6) is varied by controlling the electrical connection state of a test electrode (5) for electrically connecting the measuring unit (4) and the interface substrate terminal (6) to the interface substrate terminal (6) arbitrarily by a test head (3) using a movable portion of each test electrode (5).

Description

明 細 書  Specification
半導体検査装置  Semiconductor inspection equipment
技術分野  Technical field
[0001] 本発明は、半導体集積回路を被測定デバイスとして種々の測定を実施するための 半導体検査装置に関するものである。 背景技術  The present invention relates to a semiconductor inspection apparatus for performing various measurements on a semiconductor integrated circuit as a device under test. Background art
[0002] 半導体検査装置では、被測定デバイスと測定ユニットとの間で試験に必要な信号 を伝達するためのインタフェース基板がテストヘッドに装着される。  In a semiconductor inspection apparatus, an interface substrate for transmitting a signal necessary for a test between a device under test and a measurement unit is mounted on a test head.
[0003] ある先行技術に係る電子回路デバイスの検査装置によれば、ゥエーハ試験におい てゥエーハ上のチップの電極に接触させるように基板に取り付けられるプローブにバ ィメタルを利用した可動構造を採用し、以てチップ電極の損傷防止等を図る（特許文 献 1参照)。  According to an inspection apparatus of an electronic circuit device according to a prior art, a movable structure using bimetal is adopted as a probe attached to a substrate so as to be in contact with an electrode of a chip on the wafer in the wafer test. In order to prevent damage to the tip electrode (see Patent Document 1).
特許文献 1 :特開 2002— 313855号公報  Patent Document 1: Japanese Patent Application Laid-Open No. 2002-313855
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problem that invention tries to solve
[0004] 近年の半導体集積回路の高集積化に伴い、半導体集積回路の面積が増大すると ともにデバイス端子数も増加する傾向にある。また、検査の低コスト化対応として、複 数の半導体集積回路を同時に測定する傾向にある。しかし測定ユニット数は限られ ていることから、必要な検査を限られた測定ユニットで行うために、特定の測定ュニッ トに複数のデバイス端子を接続し、検査項目に応じて接続状態を切り替える必要が ある。 With the recent high integration of semiconductor integrated circuits, the area of semiconductor integrated circuits tends to increase and the number of device terminals also tends to increase. In addition, there is a tendency to measure multiple semiconductor integrated circuits at the same time in order to reduce the cost of inspection. However, since the number of measurement units is limited, it is necessary to connect multiple device terminals to a specific measurement unit and switch the connection state according to the inspection item in order to perform the necessary inspection with a limited measurement unit. There is.
[0005] また、デバイス端子の多機能化によって、例えば 1つのデバイス端子からデジタル 信号を出力したり、アナログ信号を出力したりすることが可能となっており、必要に応 じてデバイス端子の機能を切り替える。それに伴って、半導体集積回路の特定のデ バイス端子に対して複数の測定ユニットを割り当て、検查項目に応じて接続状態を切 り替える必要がある。  [0005] Also, with the multi-functionalization of device terminals, for example, it is possible to output a digital signal from one device terminal or output an analog signal, and the function of the device terminals can be made as needed. Switch. Along with this, it is necessary to assign a plurality of measurement units to specific device terminals of the semiconductor integrated circuit and switch the connection state according to the inspection item.
[0006] ところが、測定ユニットとデバイス端子との間の電気的接続状態を切り替える場合に 、接続配線間にリレーを介することによってこれを行レ、、そのリレーをインタフェース基 板上に実装することとすると、様々な課題が生じる。例えば、リレー数が増加すること でインタフェース基板への実装が困難となる。また、リレー数の増加や、リレーをイン タフエース基板へ実装することにより、基板配線が複雑になることによって検查コスト が増加する。更に、測定ユニットとデバイス端子との間の配線にリレーを介することに より、電気的特性の悪化を招く。 However, when switching the electrical connection between the measurement unit and the device terminal, If a relay is placed between the connection wiring and this relay is mounted on the interface board, various problems will arise. For example, as the number of relays increases, mounting on an interface board becomes difficult. In addition, the increase in the number of relays and mounting of relays on interface boards increase the complexity of board wiring, which increases the cost of inspection. Furthermore, the relay between the measurement unit and the device terminal causes deterioration of the electrical characteristics.
[0007] 本発明の目的は、測定ユニットとインタフェース基板との間の電気的接続状態を容 易に変更できるようにすることにある。  An object of the present invention is to make it possible to easily change the state of electrical connection between a measurement unit and an interface substrate.
課題を解決するための手段  Means to solve the problem
[0008] 上記課題を解決するため、本発明の半導体検査装置では、テストヘッドとインタフエ ース基板との間を電気的に接続するためのテスト電極のインタフェース基板への電 気的接続状態を、各々のテスト電極ごとの可動部分を用いて任意に制御することによ り、測定ユニットとインタフェース基板との間の電気的接続状態を変えることとした。 発明の効果 In order to solve the above problems, in the semiconductor inspection device of the present invention, the electrical connection state of the test electrode to the interface substrate for electrically connecting the test head to the interface substrate is determined. It was decided to change the state of electrical connection between the measurement unit and the interface board by arbitrarily controlling the movable part of each test electrode. Effect of the invention
[0009] 本発明の半導体検查装置では、インタフェース基板上へのリレーの実装が不要と なり、テストヘッドの特定の測定ユニットに複数のデバイス端子を接続する場合、又は 、特定のデバイス端子に複数の測定ユニットを割り当て、検查項目によりその測定ュ ニットを切り替えたい場合の実施容易性が向上する。  In the semiconductor inspection device of the present invention, mounting of the relay on the interface substrate is not required, and when connecting a plurality of device terminals to a specific measurement unit of the test head, or in a plurality of specific device terminals. The assignment of measurement units is improved, and the ease of implementation when switching between measurement units according to inspection items is improved.
[0010] また、インタフェース基板上へのリレーの実装が不要となることから、リレーを実装す る場合と比較して基板配線が簡素化されることにより検査コストを抑制することが可能 となる。更に、測定ユニットとデバイス端子との間の配線にリレーを介す必要がなくな ることにより、電気的特性の悪化を回避することが可能となる。  Further, since the mounting of the relay on the interface substrate is not required, the inspection cost can be suppressed by simplifying the substrate wiring as compared with the case of mounting the relay. Furthermore, by eliminating the need for relays in the wiring between the measurement unit and the device terminals, it is possible to avoid the deterioration of the electrical characteristics.
図面の簡単な説明  Brief description of the drawings
[0011] [図 1]図 1は、本発明の第 1の実施形態に係る半導体検查装置の概略側面図である。  FIG. 1 is a schematic side view of a semiconductor inspection device according to a first embodiment of the present invention.
[図 2]図 2は、図 1中のテスト電極の非接続状態を表す拡大斜視図である。  [FIG. 2] FIG. 2 is an enlarged perspective view showing the unconnected state of the test electrode in FIG.
[図 3]図 3は、図 1中のテスト電極の接続状態を表す拡大斜視図である。  [FIG. 3] FIG. 3 is an enlarged perspective view showing the connection state of the test electrode in FIG.
[図 4]図 4は、本発明の第 2の実施形態に係る半導体検查装置の概略側面図である。  [FIG. 4] FIG. 4 is a schematic side view of a semiconductor inspection device according to a second embodiment of the present invention.
[図 5]図 5は、本発明の第 3の実施形態に係る半導体検查装置におけるテスト電極の 拡大平面図である。 [FIG. 5] FIG. 5 shows the test electrode in the semiconductor inspection device according to the third embodiment of the present invention. It is an enlarged plan view.
[図 6]図 6は、図 5のテスト電極の非接続状態を表す拡大斜視図である。  [FIG. 6] FIG. 6 is an enlarged perspective view showing the unconnected state of the test electrode of FIG.
[図 7]図 7は、図 5のテスト電極の 1つの接続状態を表す拡大斜視図である。  [FIG. 7] FIG. 7 is an enlarged perspective view showing a connection state of one of the test electrodes of FIG.
[図 8]図 8は、図 5のテスト電極の他の接続状態を表す拡大斜視図である。  [FIG. 8] FIG. 8 is an enlarged perspective view showing another connection state of the test electrode of FIG.
[図 9]図 9は、図 7の状態のテスト電極とインタフェース基板との接触を表す断面図で ある。  [FIG. 9] FIG. 9 is a cross-sectional view showing the contact of the test electrode and the interface substrate in the state of FIG.
[図 10]図 10は、図 8の状態のテスト電極とインタフェース基板との接触を表す断面図 である。  [FIG. 10] FIG. 10 is a cross-sectional view showing the contact of the test electrode and the interface substrate in the state of FIG.
符号の説明  Explanation of sign
[0012] 1 デバイス端子 [0012] 1 device terminal
2 被測定デバイス  2 Device under test
3 テストヘッド  3 Test head
4 測定ユニット  4 Measurement unit
5 テスト電極  5 Test electrode
6 インタフェース基板端子  6 Interface board terminal
8 固定部分  8 fixed part
9 可動部分  9 Moveable part
10〜： 14 可動部分  10 to 14 movable parts
15 絶縁支持棒  15 insulating support bar
16 インタフェース基板  16 interface board
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0013] 以下、本発明の実施形態を図面に基づいて詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail based on the drawings.
[0014] 《第 1の実施形態》 First Embodiment
本発明の半導体検査装置の第 1の実施形態を説明する。図 1〜図 3は第 1の実施 形態の半導体検査装置の構成図である。 1はデバイス端子、 2は被測定デバイス、 3 はテストヘッド、 4は測定ユニット（チャネル、電源、シグナルユニット等）、 5はテスト電 極（ポゴピン）、 6はインタフェース基板端子である。図 2はテスト電極 5の拡大斜視図 であり、非接続状態を示しており、 8は固定部分、 9は可動部分である。図 3はテスト 電極 5の拡大斜視図であり、接続状態である。 A first embodiment of the semiconductor inspection device of the present invention will be described. 1 to 3 are block diagrams of the semiconductor inspection apparatus according to the first embodiment. 1 is a device terminal, 2 is a device under test, 3 is a test head, 4 is a measurement unit (channel, power supply, signal unit, etc.), 5 is a test electrode (pogo pin), and 6 is an interface substrate terminal. FIG. 2 is an enlarged perspective view of the test electrode 5 and shows a non-connected state, in which 8 is a fixed portion and 9 is a movable portion. Figure 3 is a test FIG. 6 is an enlarged perspective view of an electrode 5 in a connected state.
[0015] 本実施形態の半導体検査装置では、テスト電極 5とインタフェース基板端子 6との 接続状態の切り替えを、テスト電極 5の状態を図 2、図 3のように変化させて電気的接 続状態を変えることにより、行うことを特徴とする。 In the semiconductor inspection apparatus of the present embodiment, the connection state between the test electrode 5 and the interface substrate terminal 6 is changed by changing the state of the test electrode 5 as shown in FIGS. It is characterized by doing by changing.
[0016] テストヘッド 3内で特定の測定ユニット 4から電気的に接続された複数のテスト電極 5 があり、各々のテスト電極 5がそれぞれデバイス端子 1に接続可能になっている。この デバイス端子 1の選択を、テスト電極 5が図 2、図 3のように物理的に動くことによって 行う。 There are a plurality of test electrodes 5 electrically connected from a specific measurement unit 4 in the test head 3, and each test electrode 5 is connectable to the device terminal 1. The selection of the device terminal 1 is made by the test electrode 5 physically moving as shown in FIGS.
[0017] インタフェース基板端子 6と非接続状態の場合、図 2のように可動部分 9は固定部 分 8の内部に存在し、電気信号が被測定デバイス 2に送られることはない。インタフヱ ース基板端子 6と接続する場合には、可動部分 9がインタフェース基板端子 6と接触 することで電気的接続がされ、信号伝搬を行うことができる（図 3参照）。テスト電極 5 を図 2、図 3のように変化させる方法としては、ばね式、電場の印加、磁場の印加等は 問わない。  In the non-connected state with the interface board terminal 6, the movable part 9 is present inside the fixed part 8 as shown in FIG. When connecting to the interface board terminal 6, the movable portion 9 contacts the interface board terminal 6 so that electrical connection is made and signal propagation can be performed (see FIG. 3). As a method of changing the test electrode 5 as shown in FIG. 2 and FIG. 3, application of a spring type, application of an electric field, application of a magnetic field, etc. does not matter.
[0018] これによつて、インタフェース基板にリレーを実装することなぐ 1つの測定ユニット 4 に複数のデバイス端子 1を接続する構成において、その接続経路の制御を各々のテ スト電極 5ごとに任意に行うことが可能となる。  Thus, in a configuration in which a plurality of device terminals 1 are connected to one measurement unit 4 without mounting a relay on the interface board, control of the connection path is optionally performed for each of the test electrodes 5. It will be possible to do.
[0019] 《第 2の実施形態》  Second Embodiment
本発明の半導体検査装置の第 2の実施形態を説明する。図 4は、第 2の実施形態 の半導体検査装置の構成図である。 1はデバイス端子、 2は被測定デバイス、 3はテ ストヘッド、 4は測定ユニット、 5はテスト電極、 6はインタフェース基板端子である。  A second embodiment of the semiconductor inspection device of the present invention will be described. FIG. 4 is a block diagram of the semiconductor inspection device of the second embodiment. 1 is a device terminal, 2 is a device under test, 3 is a test head, 4 is a measurement unit, 5 is a test electrode, and 6 is an interface substrate terminal.
[0020] 本実施形態の半導体検查装置でも、テスト電極 5とインタフェース基板端子 6との接 続状態の切り替えを、テスト電極 5の状態を図 2又は図 3のように変化させて電気的接 続状態を変えることにより、行うことを特徴とする。  Also in the semiconductor inspection device of the present embodiment, switching of the connection state between the test electrode 5 and the interface substrate terminal 6 changes the state of the test electrode 5 as shown in FIG. It is characterized by performing by changing the state of continuity.
[0021] テストヘッド 3内で複数の測定ユニット 4からそれぞれ独立に電気的に接続された複 数のテスト電極 5があり、各々のテスト電極 5が特定のデバイス端子 1に接続可能にな つている。テストヘッド 3内の複数の測定ユニット 4のうち、特定のデバイス端子 1に電 気的に接続する測定ユニット 4の選択を、テスト電極 5が図 2、図 3のように物理的に 動くことによって行う。 In the test head 3, there are a plurality of test electrodes 5 electrically connected to the plurality of measurement units 4 independently, and each test electrode 5 can be connected to a specific device terminal 1. . Of the plurality of measurement units 4 in the test head 3, the test electrode 5 is physically selected as shown in FIGS. 2 and 3 for the selection of the measurement unit 4 electrically connected to a specific device terminal 1. It does by moving.
[0022] これによつて、インタフェース基板にリレーを実装することなぐ 1つのデバイス端子 1 に複数の測定ユニット 4を接続する構成において、その接続経路の制御を各々のテ スト電極 5ごとに任意に行うことが可能となる。  Thus, in a configuration in which a plurality of measurement units 4 are connected to one device terminal 1 without mounting a relay on the interface board, control of the connection path is optionally performed for each of the test electrodes 5. It will be possible to do.
[0023] 《第 3の実施形態》  Third Embodiment
本発明の半導体検查装置の第 3の実施形態を説明する。図 5〜図 10は、本発明の 第 3の実施形態に係る半導体検查装置におけるテスト電極 5及びインタフェース基板 16の構成図である。テスト電極 5において、 8は固定部分、 10〜： 14は円筒形状で同 心円状に配置された可動部分、 15は絶縁支持棒である。 16は円筒状のテスト電極 5 に適応したインタフェース基板である。  A third embodiment of the semiconductor inspection device of the present invention will be described. 5 to 10 are configuration diagrams of the test electrode 5 and the interface substrate 16 in the semiconductor inspection device according to the third embodiment of the present invention. In the test electrode 5, 8 is a fixed portion, 10 to 14 is a cylindrical, concentrically arranged movable portion, and 15 is an insulating support bar. An interface substrate 16 is adapted to the cylindrical test electrode 5.
[0024] 本実施形態は、インタフェース基板 16に接続するテスト電極 5のより安定した、確実 な接続方法を提供する。  The present embodiment provides a more stable and reliable connection method of the test electrode 5 connected to the interface substrate 16.
[0025] 第 1及び第 2の実施形態で説明したテスト電極 5は、 1つのテスト電極 5に対して 1つ の接続経路しか持っていない。したがって、第 1の実施形態で説明したように特定の 測定ユニット 4に複数のデバイス端子：[を接続する場合、又は、第 2の実施形態で説 明したように特定のデバイス端子 1に複数の測定ユニット 4を割り当て、検査項目によ りその測定ユニット 4を切り替えたい場合においては、複数の接続経路が必要である こと力 、テスト電極 5が必要接続経路分だけ必要である。また、テスト電極 5が図 2、 図 3のように変化することにより、各テスト電極 5の電気的接続状態を変えているが、 テスト電極 5とインタフェース基板端子 6との位置関係を確認できなレ、ため、所望の接 続状態を実現できているかの確実性に課題がある。 The test electrode 5 described in the first and second embodiments has only one connection path for one test electrode 5. Therefore, as described in the first embodiment, in the case of connecting a plurality of device terminals [a] to a specific measurement unit 4 , or in the case of connecting a specific device terminal 1 as described in the second embodiment, In the case where the measurement unit 4 is assigned and it is desired to switch the measurement unit 4 depending on the inspection item, a plurality of connection paths are required, and the test electrode 5 is necessary for the necessary connection path. In addition, although the electrical connection state of each test electrode 5 is changed by changing the test electrode 5 as shown in FIGS. 2 and 3, the positional relationship between the test electrode 5 and the interface substrate terminal 6 can not be confirmed. As a result, there is a problem in ensuring that the desired connection state can be realized.
[0026] そこで、本実施形態の半導体検查装置では、 1又は複数の測定ユニット 4とインタフ エース基板 16との間を電気的に接続するためのテスト電極 5が円筒状の複数の可動 部分 10〜： 14を組み合わせた構造を持ち、各々の可動部分 10〜： 14が独立した動作 を行うことにより測定ユニット 4とインタフェース基板 16との間の電気的接続状態を変 えることができることを特徴とする。また、このテスト電極 5に対応したインタフェース基 板 16と組み合わせることにより、測定を実現する。  Therefore, in the semiconductor inspection device according to the present embodiment, a plurality of cylindrical movable portions 10 having test electrodes 5 for electrically connecting one or more measurement units 4 to the interface substrate 16 are provided. ~: Has a combined structure of 14 and is characterized in that the electrical connection between the measurement unit 4 and the interface board 16 can be changed by each movable part 10 to 14 performing an independent operation. Do. Further, measurement is realized by combining with the interface board 16 corresponding to the test electrode 5.
[0027] テスト電極 5は、図 5〜図 8のように円筒構造となっている。各々半径の異なる第：!〜 第 5の可動部分 10〜： 14を組み合わせてテスト電極 5を構成する。各可動部分 10〜1 4の間は絶縁されており、相互に電気的には接続されない。 The test electrode 5 has a cylindrical structure as shown in FIGS. Each has a different radius:! ~ The fifth movable parts 10 to 14 constitute the test electrode 5 in combination. The movable parts 10 to 14 are insulated and not electrically connected to each other.
[0028] また、図 5〜図 8で説明した構造を持つテスト電極 5に適したインタフェース基板 16 の構造を図 9、図 10に示す。インタフェース基板 16の端子部分は円錐構造となって いる。このインタフェース基板 16の端子部分は複数の層でそれぞれ独立した端子を 持ち、各層の端子間はそれぞれ電気的に絶縁されている。  Further, the structure of the interface substrate 16 suitable for the test electrode 5 having the structure described in FIGS. 5 to 8 is shown in FIGS. The terminal portion of the interface board 16 has a conical structure. The terminal portion of the interface board 16 has independent terminals in a plurality of layers, and the terminals of each layer are electrically isolated from each other.
[0029] 検查未使用時、全ての可動部分 10〜14は、図 6に示すとおりテストヘッド 3に設置 するための固定部分 8の内部に収納されている。第 3の可動部分 12を使用する場合 、図 7で示すとおり当該第 3の可動部分 12を上方に移動させることにより、図 9で示す とおり第 3の可動部分 12とインタフェース基板 16の特定の層（下から 3番目の層）の 端子とが接続され、電気信号を被測定デバイス 2へ伝搬することができる。また、第 5 の可動部分 14を使用する場合は図 8で示すとおり当該第 5の可動部分 14を上方に 移動させることにより、図 10で示すとおり第 5の可動部分 14とインタフェース基板 16 の図 9とは異なる特定の層（最上層）の端子とが接続され、電気信号を被測定デバィ ス 2へ伝搬することができる。  [0029] When inspection is not in use, all movable parts 10 to 14 are accommodated inside fixed part 8 for installation on test head 3 as shown in FIG. When the third movable part 12 is used, by moving the third movable part 12 upward as shown in FIG. 7, the third movable part 12 and the specific layer of the interface substrate 16 as shown in FIG. The terminal of (the third layer from the bottom) is connected, and an electrical signal can be propagated to the device under test 2. When the fifth movable part 14 is used, by moving the fifth movable part 14 upward as shown in FIG. 8, the drawing of the fifth movable part 14 and the interface board 16 as shown in FIG. The terminal of a specific layer (upper layer) different from 9 is connected, and an electrical signal can be propagated to the device under test 2.
[0030] これにより、 1つの組み合わせテスト電極 5で複数の接続経路を持つことが可能とな り、特定の測定ユニット 4に複数のデバイス端子 1を接続する場合、又は、特定のデ バイス端子 1に複数の測定ユニット 4を割り当て、検査項目によりその測定ユニット 4を 切り替える場合において、電極数の増大を抑えることが可能となる。  [0030] Thereby, one combination test electrode 5 can have a plurality of connection paths, and when a plurality of device terminals 1 are connected to a specific measurement unit 4, or a specific device terminal 1 In the case where the plurality of measurement units 4 are assigned to the measurement unit 4 and the measurement units 4 are switched according to the inspection item, it is possible to suppress the increase in the number of electrodes.
[0031] また、テスト電極 5の中心軸に存在する絶縁支持棒 15は、インタフェース基板 16と 固定部分 8との位置関係を保っために使用する。これにより、安定かつ確実に電極 選択を行うことが可能となる。  Also, the insulating support rod 15 present on the central axis of the test electrode 5 is used to maintain the positional relationship between the interface substrate 16 and the fixed portion 8. This enables stable and reliable electrode selection.
産業上の利用の可能性  Industrial Applicability
[0032] 以上説明してきたとおり、本発明に係る半導体検査装置は、被測定デバイスと測定 ユニットとの間の接続状態を切り替える検査の実施容易性が向上するので有用であ る。  As described above, the semiconductor inspection apparatus according to the present invention is useful because the easiness of the inspection to switch the connection state between the device under test and the measurement unit is improved.

Claims

請求の範囲 The scope of the claims
[1] 1つの測定ユニットに共通接続された複数のテスト電極を有するテストヘッドと、 被測定デバイスの複数のデバイス端子にそれぞれ個別に接続される複数の基板端 子を有するインタフェース基板とを備えた半導体検查装置であって、  [1] A test head having a plurality of test electrodes commonly connected to one measurement unit, and an interface substrate having a plurality of substrate terminals individually connected to a plurality of device terminals of a device under test A semiconductor inspection device,
前記測定ユニットと前記複数のデバイス端子との間に選択的な接続経路を形成す るように、前記複数のテスト電極は、各々前記複数の基板端子のうちの対応する基板 端子への接触により電気的接続を達成するための可動部分を有することを特徴とす る半導体検査装置。  Each of the plurality of test electrodes is electrically connected to a corresponding one of the plurality of substrate terminals so as to form a selective connection path between the measurement unit and the plurality of device terminals. Semiconductor inspection apparatus characterized in that it has a movable part for achieving a dynamic connection.
[2] 請求項 1記載の半導体検査装置において、  [2] In the semiconductor inspection device according to claim 1,
前記複数のテスト電極の各々の可動部分が互いに同心状に配置されたことを特徴 とする半導体検査装置。  A semiconductor inspection apparatus characterized in that movable parts of each of the plurality of test electrodes are arranged concentrically with each other.
[3] 請求項 2記載の半導体検査装置において、  [3] In the semiconductor inspection device according to claim 2,
前記インタフェース基板は、前記複数のテスト電極の各々の可動部分に対応した 多層構造を有することを特徴とする半導体検査装置。  A semiconductor inspection apparatus characterized in that the interface substrate has a multilayer structure corresponding to the movable portion of each of the plurality of test electrodes.
[4] 複数の測定ユニットにそれぞれ個別に接続された複数のテスト電極を有するテスト ヘッド、と、 [4] a test head having a plurality of test electrodes individually connected to a plurality of measurement units,
被測定デバイスの 1つのデバイス端子に電気接続される基板端子を有するインタフ エース基板とを備えた半導体検査装置であって、  What is claimed is: 1. A semiconductor inspection apparatus comprising: an interface substrate having a substrate terminal electrically connected to one device terminal of a device under test;
前記複数の測定ユニットと前記デバイス端子との間に選択的な接続経路を形成す るように、前記複数のテスト電極は、各々前記基板端子への接触により電気的接続を 達成するための可動部分を有することを特徴とする半導体検査装置。  The plurality of test electrodes are each movable parts for achieving electrical connection by contact to the substrate terminal so as to form a selective connection path between the plurality of measurement units and the device terminal. The semiconductor inspection apparatus characterized by having.
[5] 請求項 4記載の半導体検査装置において、 [5] In the semiconductor inspection device according to claim 4,
前記複数のテスト電極の各々の可動部分が互いに同心状に配置されたことを特徴 とする半導体検査装置。  A semiconductor inspection apparatus characterized in that movable parts of each of the plurality of test electrodes are arranged concentrically with each other.
[6] 請求項 5記載の半導体検査装置において、  [6] In the semiconductor inspection device according to claim 5,
前記インタフェース基板は、前記複数のテスト電極の各々の可動部分に対応した 多層構造を有することを特徴とする半導体検査装置。  A semiconductor inspection apparatus characterized in that the interface substrate has a multilayer structure corresponding to the movable portion of each of the plurality of test electrodes.
PCT/JP2007/062433 2006-03-31 2007-06-20 Semiconductor inspection equipment WO2008062579A1 (en)

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JPS62134579A (en) * 1985-12-06 1987-06-17 Sharp Corp Universal fixture
JPH01284778A (en) * 1988-05-11 1989-11-16 Mitsubishi Electric Corp Test head for semiconductor device
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JPH0636223U (en) * 1992-10-14 1994-05-13 コニカ株式会社 Contact structure
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