CN101371152A - Semiconductor inspection equipment - Google Patents

Semiconductor inspection equipment Download PDF

Info

Publication number
CN101371152A
CN101371152A CNA2007800027483A CN200780002748A CN101371152A CN 101371152 A CN101371152 A CN 101371152A CN A2007800027483 A CNA2007800027483 A CN A2007800027483A CN 200780002748 A CN200780002748 A CN 200780002748A CN 101371152 A CN101371152 A CN 101371152A
Authority
CN
China
Prior art keywords
test
mentioned
semiconductor detector
interface board
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007800027483A
Other languages
Chinese (zh)
Inventor
仲井一晃
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN101371152A publication Critical patent/CN101371152A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Electrical connection state between a measuring unit (4) and an interface substrate terminal (6) is varied by controlling the electrical connection state of a test electrode (5) for electrically connecting the measuring unit (4) and the interface substrate terminal (6) to the interface substrate terminal (6) arbitrarily by a test head (3) using a movable portion of each test electrode (5).

Description

Semiconductor detector
Technical field
The present invention relates to be used for SIC (semiconductor integrated circuit) is implemented as tested device the semiconductor detector of various tests.
Background technology
In semiconductor detector, the interface board that is used for the needed signal of transmission test between tested device and test cell is being installed on the measuring head.
Pick-up unit according to the electronic circuit of certain prior art, in wafer inspection, adopt movable structure to prevent to damage chip electrode etc., this movable structure is: the thermometal material is used to be installed in probe on the substrate, so that it contacts (with reference to patent documentation 1) with the electrode of chip on the wafer.
Patent documentation 1: TOHKEMY 2002-313855 communique
Summary of the invention
Highly integrated along with in recent years SIC (semiconductor integrated circuit) exists when the area of SIC (semiconductor integrated circuit) increases the tendency that device terminal quantity also increases.In addition, as the countermeasure that detects cost degradation, there is the trend that detects a plurality of SIC (semiconductor integrated circuit) simultaneously.But the test cell limited amount therefore in order to carry out needed detection with limited test cell, just need connect a plurality of device terminal, and switch connection status according to test item on specific test cell.
In addition, because the multifunction of device terminal for example can be exported digital signal sometimes from 1 device terminal and export simulating signal sometimes, come the function of switching device terminal as required.Follow in this, need switch connection status according to test item a plurality of test cells of certain device terminal assignment of SIC (semiconductor integrated circuit).
But, when the status of electrically connecting between switch test unit and the device terminal, carry out the switching of this status of electrically connecting by between connecting wiring, adding relay (relay), this relay is installed on the interface board, then produce variety of issue.For example, because the increase of relay quantity, and be difficult to be mounted on the interface board.In addition, be installed on the interface board, so the substrate wiring becomes complicated, the increase of feasible detection cost owing to the increase of relay quantity with relay.And, since in the wiring between test cell and the device terminal across relay, therefore cause electrical specification to worsen.
The objective of the invention is to enable the status of electrically connecting between the changed test unit and interface board easily.
For solving above-mentioned problem, in semiconductor detector of the present invention, use the moving part of each test electrode will be used for the status of electrically connecting of the test electrode docking port substrate that is electrically connected between measuring head and the interface board is controlled to be free position, change the status of electrically connecting between test cell and the interface board thus.
In semiconductor detector of the present invention, do not need relay is installed on the interface board, when on the particular test cell of measuring head, connecting a plurality of device terminal, perhaps, can improve easy implementation to a plurality of test cells of certain device terminal assignment and when wishing to switch its test cell according to test item.
In addition, owing to do not need relay is filled on the interface board,, semiconductor detector of the present invention is compared with the situation that relay is installed to be suppressed to detect cost therefore by simplifying the substrate wiring.And, owing to need in the wiring between test cell and the device terminal, not add relay, thus the deterioration of electrical specification can be avoided.
Description of drawings
Fig. 1 is the summary side elevation of the semiconductor detector of first embodiment of the invention.
Fig. 2 is the amplification stereogram of the notconnect state of the test electrode in the presentation graphs 1.
Fig. 3 is the amplification stereogram of the connection status of the test electrode in the presentation graphs 1.
Fig. 4 is the summary side elevation of the semiconductor detector of second embodiment of the invention.
Fig. 5 is the amplification plan view of the test electrode in the semiconductor detector of third embodiment of the invention.
Fig. 6 is the amplification stereogram of notconnect state of the test electrode of presentation graphs 5.
Fig. 7 is the amplification stereogram of a connection status of the test electrode of presentation graphs 5.
Fig. 8 is the amplification stereogram of other connection status of the test electrode of presentation graphs 5.
Fig. 9 is the test electrode of state of presentation graphs 7 and the cut-open view that contacts of interface board.
Figure 10 is the test electrode of state of presentation graphs 8 and the cut-open view that contacts of interface board.
Symbol description
1 device terminal
2 tested devices
3 measuring heads
4 test cells
5 test electrodes
6 interface board terminals
8 fixed parts
9 moving parts
10～14 moving parts
15 insulation supporter rods
16 interface boards
Embodiment
Below, describe embodiments of the present invention with reference to the accompanying drawings in detail.
[first embodiment]
First embodiment of semiconductor detector of the present invention is described.Fig. 1～Fig. 3 is the structural drawing of the semiconductor detector of first embodiment.The 1st, device terminal, the 2nd, tested device, the 3rd, measuring head, the 4th, test cell (passage, power supply, signal element etc.), the 5th, test electrode (elasticity pin (pogo pin)), the 6th, interface board terminal.Fig. 2 is the amplification stereogram of test electrode 5, and non-contacting state is shown, the 8th, and fixed part, the 9th, moving part.Fig. 3 is the amplification stereogram of test electrode 5, is connection status.
In the semiconductor detector of present embodiment, be characterised in that: change the status of electrically connecting switching by test electrode 5 is changed as Fig. 2, Fig. 3, thereby carry out the switching of the connection status of test electrode 5 and interface board terminal 6.
Have a plurality of test electrodes 5 that are electrically connected from specific test cell 4 in the measuring head 3, each test electrode 5 can be connected with device terminal 1 respectively.As Fig. 2, Fig. 3, carry out physical action by test electrode 5 and carry out the selection of this device terminal 1.
With interface board terminal 6 be under the situation of notconnect state, as shown in Figure 2, moving part 9 is present in the inside of fixed part 8, electric signal can not be sent to tested device 2.With situation that interface board terminal 6 is connected under, moving part 9 contacts with interface board terminal 6, can be electrically connected thus to fetch to carry out signal and transmit (with reference to Fig. 3).As the method that test electrode 5 is changed as Fig. 2, Fig. 3, can apply for spring, electric field, magnetic field applies etc.
Thus, relay be not installed on the interface board and a plurality of device terminal 1 are being connected in the structure on the test cell 4, can carry out the control of its access path respectively arbitrarily each test electrode 5.
[second embodiment]
Second embodiment of semiconductor detector of the present invention is described.Fig. 4 is the structural drawing of the semiconductor detector of second embodiment.The 1st, device terminal, the 2nd, tested device, the 3rd, measuring head, the 4th, test cell, the 5th, test electrode, the 6th, interface board terminal.
In the semiconductor detector of present embodiment, feature also is: change as Fig. 2 or Fig. 3 by the state that makes test electrode 5 and change status of electrically connecting, thus the connection status of switch test electrode 5 and interface board terminal 6.
Have in the measuring head 3 from the independent respectively a plurality of test electrodes 5 that are electrically connected of a plurality of test cell 4, each test electrode 5 can be connected on the particular device terminal 1.As Fig. 2, Fig. 3, carry out physical action by test electrode 5 and select the test cell 4 that is electrically connected with particular device terminal 1.
Thus, on a device terminal 1, connect in the structure of a plurality of test cells 4, can carry out the control of its access path respectively arbitrarily each test electrode 5 relay not being installed on the interface board.
[the 3rd embodiment]
The 3rd embodiment of semiconductor detector of the present invention is described.Fig. 5～Figure 10 is the test electrode 5 in the semiconductor detector of third embodiment of the invention and the structural drawing of interface board 16.In test electrode 5, the 8th, fixed part, 10～14th, drum also is configured to the moving part of concentric circles, and the 15th, the insulation supporter rod.The 16th, be applicable to the interface board of test electrode 5 cylindraceous.
Present embodiment provides a kind of more stable, reliable connection method more that is connected test electrode 5 on the interface board 16.
The test electrode 5 that illustrates in first embodiment and second embodiment only has an access path for a test electrode 5.Therefore, as the explanation of first embodiment, when on specific test cell 4, connecting a plurality of device terminal 1, or as the explanation of second embodiment, when switching its test cell 4 to the particular device terminal 1 a plurality of test cells 4 of distribution and according to test item, need many access paths, therefore, the number needs of test electrode 5 will be the quantity of required access path.In addition, change as Fig. 2, Fig. 3 by test electrode 5, thereby change the status of electrically connecting of each test electrode 5, but can't confirm the position relation of test electrode 5 and interface board terminal 6, therefore can realize having problems on the reliability of desired connection status whether.
Therefore, in the semiconductor detector of present embodiment, be characterised in that: have and be used for structure that the test electrode 5 that is electrically connected between one or more test cells 4 and the interface board 16 is combined a plurality of moving parts 10～14 cylindraceous, independently move by each moving part 10～14, can change the status of electrically connecting between test cell 4 and the interface board terminal 6.In addition, by making it and make up, thereby realize test corresponding to the interface board 16 of this test electrode 5.
Test electrode 5 becomes cylindrical structure as Fig. 5～Fig. 8.Make up first～the 5th different moving part 10～14 of each radius and constitute test electrode 5.Be insulated between each moving part 10～14, be not electrically connected each other.
In addition, Fig. 9, Figure 10 illustrate and are applicable to have Fig. 5～structure of the interface board 16 of the test electrode 5 of structure illustrated in fig. 8.The terminal part of interface board 16 is a conical structure.The terminal part of this interface board 16 has independently terminal of a plurality of layers of difference, quilt difference electrical isolation between the terminal of each layer.
When not using in the detection, whole moving parts 10～14 are incorporated in the inside of the fixed part 8 that is used for being arranged on measuring head 3 as shown in Figure 6.When using the 3rd moving part 12, as shown in Figure 7, move to the top by making the 3rd moving part 12, can be as shown in Figure 9, connect the terminal of the specific layer (the 3rd layer of following beginning) of the 3rd moving part 12 and interface board 16, electric signal is sent to tested device 2.In addition, when using the 5th moving part 14, as shown in Figure 8 by making the 5th moving part 14 move to the top, can be as shown in Figure 10, connect the terminal of the certain layer (the superiors) different of the 5th moving part 14 and interface board 16, electric signal is sent to tested device 2 with Fig. 9.
Thus, can in the test electrode 5 of a combination, have many access paths, when when on specific test cell 4, connecting a plurality of device terminal 1 or to particular device terminal 1, distributing a plurality of test cells 4 and switching its test cell 4, can suppress the increase of number of electrodes according to test item.
In addition, the insulation supporter rod 15 that exists on the central shaft of test electrode 5 is used to keep the position relation of interface board 16 and fixed part 8.Thus, can stablize and carry out reliably the electrode selection.
Industrial utilizability
Just as described above, semiconductor detector of the present invention can be cut by Effective Raise Change the easy implementation of the detection of the connection status between tested device and the test cell.
Claims (according to the modification of the 19th of treaty)
1. (deletion)
2. (revise afterwards) a kind of semiconductor detector, comprising:
Has the shared measuring head that is connected a plurality of test electrodes on the test cell; With
The interface board that has respectively a plurality of base-plate terminals that are connected separately with a plurality of device terminal of tested device,
This semiconductor detector is characterised in that:
In order between above-mentioned test cell and above-mentioned a plurality of device terminal, to form optionally access path, above-mentioned a plurality of test electrode has and is used for separately realizing the moving part that is electrically connected by the contact to the base-plate terminal of the correspondence among above-mentioned a plurality of base-plate terminals, and
Each moving part of above-mentioned a plurality of test electrodes is configured to be each other concentric shape.
3. semiconductor detector according to claim 2 is characterized in that:
Above-mentioned interface board has the corresponding sandwich construction of each moving part with above-mentioned a plurality of test electrodes.
4. (deletion)
5. (revise afterwards) a kind of semiconductor detector, comprising:
The measuring head that has respectively a plurality of test electrodes that are connected separately with a plurality of test cells; With
Interface board with the base-plate terminal on the device terminal that is connected electrically in tested device,
This semiconductor detector is characterised in that:
In order to form optionally access path between above-mentioned a plurality of test cells and above-mentioned device terminal, above-mentioned a plurality of test electrodes have and are used for separately realizing the moving part that is electrically connected by the contact to the aforesaid substrate terminal, and,
Each moving part of above-mentioned a plurality of test electrodes is configured to be each other concentric shape.
6. semiconductor detector according to claim 5 is characterized in that:
Above-mentioned interface board has the corresponding sandwich construction of each moving part with above-mentioned a plurality of test electrodes.

Claims (6)

1. semiconductor detector comprises:
Has the shared measuring head that is connected a plurality of test electrodes on the test cell; With
The interface board that has respectively a plurality of base-plate terminals that are connected separately with a plurality of device terminal of tested device,
This semiconductor detector is characterised in that:
In order to form optionally access path between above-mentioned test cell and above-mentioned a plurality of device terminal, above-mentioned a plurality of test electrodes have and are used for separately realizing the moving part that is electrically connected by the contact to the base-plate terminal of the correspondence among above-mentioned a plurality of base-plate terminals.
2. semiconductor detector according to claim 1 is characterized in that:
Each moving part of above-mentioned a plurality of test electrodes is configured to be each other concentric shape.
3. semiconductor detector according to claim 2 is characterized in that:
Above-mentioned interface board has the corresponding sandwich construction of each moving part with above-mentioned a plurality of test electrodes.
4. semiconductor detector comprises:
The measuring head that has respectively a plurality of test electrodes that are connected separately with a plurality of test cells; With
Interface board with the base-plate terminal on the device terminal that is connected electrically in tested device,
This semiconductor detector is characterised in that:
In order to form optionally access path between above-mentioned a plurality of test cells and above-mentioned device terminal, above-mentioned a plurality of test electrodes have: be used for separately realizing the moving part that is electrically connected by the contact to the aforesaid substrate terminal.
5. semiconductor detector according to claim 4 is characterized in that:
Each moving part of above-mentioned a plurality of test electrodes is configured to be each other concentric shape.
6. semiconductor detector according to claim 5 is characterized in that:
Above-mentioned interface board has the corresponding sandwich construction of each moving part with above-mentioned a plurality of test electrodes.
CNA2007800027483A 2006-11-22 2007-06-20 Semiconductor inspection equipment Pending CN101371152A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006315622 2006-11-22
JP315622/2006 2006-11-22

Publications (1)

Publication Number Publication Date
CN101371152A true CN101371152A (en) 2009-02-18

Family

ID=39429520

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007800027483A Pending CN101371152A (en) 2006-11-22 2007-06-20 Semiconductor inspection equipment

Country Status (3)

Country Link
JP (1) JPWO2008062579A1 (en)
CN (1) CN101371152A (en)
WO (1) WO2008062579A1 (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62134579A (en) * 1985-12-06 1987-06-17 Sharp Corp Universal fixture
JPH01284778A (en) * 1988-05-11 1989-11-16 Mitsubishi Electric Corp Test head for semiconductor device
JP2537892Y2 (en) * 1990-06-08 1997-06-04 株式会社アドバンテスト IC test equipment
JPH0636223U (en) * 1992-10-14 1994-05-13 コニカ株式会社 Contact structure
JPH0712889A (en) * 1993-06-15 1995-01-17 Mitsubishi Electric Corp Semiconductor inspection equipment
JP2001074816A (en) * 1999-09-09 2001-03-23 Advantest Corp Semiconductor test device
JP4285370B2 (en) * 2004-08-26 2009-06-24 横河電機株式会社 Semiconductor test equipment

Also Published As

Publication number Publication date
WO2008062579A1 (en) 2008-05-29
JPWO2008062579A1 (en) 2010-03-04

Similar Documents

Publication Publication Date Title
US7852094B2 (en) Sharing resources in a system for testing semiconductor devices
CN102656468B (en) For the wiring plate tested loading printed circuit board (PCB)
CN101084447B (en) System for testing and burning in of integrated circuits
TWI471574B (en) Dc test resource sharing for electronic device testing
KR101442154B1 (en) Probe card and testing apparatus
CN1159757C (en) Device for connection of test head and probe board in substrate-testing system
US7990168B2 (en) Probe card including a sub-plate with a main supporter and a sub-supporter with the sub-supporter having probe needles
US9500675B2 (en) Probe module supporting loopback test
US7884628B2 (en) Interposer and probe card having the same
US10295567B2 (en) Probe module supporting loopback test
JP2009002845A (en) Contact and connection apparatus
KR101962529B1 (en) Vertical ultra-low leakage current probe card for dc parameter test
CN102043117B (en) Test apparatus for electronic device package and method for testing electronic device package
CN102879720A (en) Test schemes and apparatus for passive interposers
KR100342318B1 (en) Film carrier tape and method of testing the same
CN101371152A (en) Semiconductor inspection equipment
KR102277916B1 (en) Inspection jig and apparatus for inspection having the same for bare board test
KR101999834B1 (en) Test Apparatus
CN102033193A (en) Method and system for measuring the electricity behavior of a circuit
US20100259287A1 (en) Semiconductor test equipment
US6150829A (en) Three-dimensional programmable connector
CN212255392U (en) Based on embedded multichannel four-wire resistance measurement auto-change over device
CN109788632B (en) Circuit board and using method thereof
TW513578B (en) Tablet with short testing function and method of measuring
CN114006661A (en) Detection device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20090218