JP2537892Y2 - IC test equipment - Google Patents

Description

[Detailed description of the invention] "Industrial application field" This invention relates to an IC test apparatus for testing various ICs.

[Background Art] In an IC test apparatus, a plurality of circuits are prepared for one terminal of an IC under test, and a test is performed by connecting the plurality of circuits to one terminal.

A performance board is used to branch one terminal of an IC under test into a plurality of terminals. An IC socket for mounting the IC under test is mounted on the performance board, and the terminal of the IC socket is branched into a plurality of terminals so that a plurality of circuits can be connected to each terminal of the IC under test.

FIG. 5 shows the structure of a conventional IC test apparatus. In the figure, 100 indicates a performance board, 101 indicates an IC socket, 200 indicates a motherboard, 300 indicates a pin card, and DUT indicates an IC under test.

Each of the pin cards 300 is constituted by one printed wiring board, and a test circuit for a plurality of terminals of the ICDUT under test is mounted on one pin card 300. Pin card 300
The part containing the is called the test head.

The motherboard 200 has a board 201, a signal contact housing 202, a contact 203 supported by the signal contact housing 202, and a coaxial cable for electrically connecting the contact 203 with a conductive pattern P formed on the lower surface of the board 201. A group 204 and a reinforcing dye 205 for reinforcing the board 201 are interposed between the performance board 100 and the pin card 300, and these performance boards 100
It is provided for electrical connection between the card and the pin card 300.

The connection between the performance board 100 and the motherboard 200 and the connection between the pin card and the motherboard 200 are made by contacts 203 and 301 conventionally called pogo pins.

As shown in FIG. 6, the pogo pin has a spring and a sliding contact 602 inserted into, for example, a conductive pipe 601 having a diameter of about 1 mm, and the sliding contact 602 is elastically outwardly biased by a biasing force of the spring. The conductive pipe 601 is supported at the upper ends of the signal contact housing 202 and the pin card 300, for example, by soldering to a conductive pattern, and the sliding contact 602 is pressed against the conductive pattern P formed on the performance board 100 and the motherboard 200. The pressure connection electrically connects the performance board 100 and the pin card 300 via the motherboard 200.

"Problem to be solved by the invention" The contacts 203 and 301 have a force of about 50 to 100 grams to push each sliding contact 602, but when the number of pins reaches several thousand, the contacts come into contact as a whole. The force for pressing and contracting each of the sliding contacts 602 of the contacts 203 and 301 is a force of several hundred kg.

In other words, the performance board 100 is replaced with the motherboard 200
Contact the motherboard 200 with the pin card 300
It is necessary to apply a force of about several hundred kg to each of the portions to be brought into contact with the contactor 301.

Therefore, the performance board 100, the motherboard 200, and the pin card 300 must have rigidity to withstand a force of several hundred kg. For this purpose, a reinforcing beam 205 is provided on the upper surface side of the board 201, or the performance board 100
The reinforcement frame 102 is provided around the four
With the addition of the reinforcing frame 102, the overall weight increases, and other parts must also be reinforced. Therefore, there is a disadvantage that the overall weight increases.

Also, since it has to be pressed with a force of about several hundred kg, it can not be operated very manually. For this reason, for example, it is conceivable to operate using an air cylinder or the like. However, a large air cylinder must be used, and this has the disadvantage that the weight and shape are further increased.

The purpose of this invention is to electrically connect between the performance board and the motherboard and between the motherboard and the pin card without giving large contact force,
An object of the present invention is to provide an IC test apparatus having a structure that can be separated.

"Means for solving the problem" In this invention, a zero insertion force type connector that does not require insertion / extraction force between the performance board and the motherboard and between the motherboard and the pin card is provided, and the zero insertion force type connector provides the performance. The configuration is such that the board 100 and the motherboard 200 and the motherboard 200 and the pin card 300 can be electrically connected and disconnected.

According to this invention, since the zero insertion force type connector is used, the part where the performance board 100 is brought into contact with the motherboard 200 and the part where the pin card 300 is connected to the motherboard 200 are connected without requiring any pressing force, and the connection is made again. The state can be maintained.

Therefore, according to the present invention, the connection between the performance board and the motherboard and the connection between the motherboard and the pin card can be made by hand alone. In the connected state, there is no need to apply any biasing force, so there is no need to reinforce the performance board and motherboard.

Therefore, there is an advantage that the multi-pin IC test apparatus can be reduced in size and weight.

FIG. 1 shows an embodiment of the present invention. In FIG. 1, parts corresponding to those in FIG. 5 are denoted by the same reference numerals.

In this invention, a zero insertion force type connector 4 is provided between the motherboard 200 and the performance board 100 and between the motherboard 200 and the pin card 300.
The structure is such that they are connected by 00.

Therefore, in this example, an example is shown in which a zero insertion force type connector main body 401 is provided on the motherboard 200, and conductive pins 402 are planted on the lower surface of the performance board 100 and the upper side of the pin card 300.

2 and 3 show an example of the internal structure of the zero insertion force type connector main body 401. FIG. Each of the connector bodies 401 is formed of an elongated rectangular cylindrical insulator, and a hole 403 into which the conductive pin 402 is inserted is formed on one surface thereof.

A movable contact 404 and a fixed contact 405 are provided at the position of the hole 403. The movable contact 404 is biased by its own spring force, for example, in a direction away from the fixed contact 405 at all times.

A push plate 406 and an operation plate 407 are provided in the direction in which the movable contacts 404 are arranged. The push plate 406 is formed with, for example, a ridge 406A in the vertical direction, and the operation plate 407 is formed with a serrated concave groove 407A, and the ridge 406A and the serrated concave groove 407A are engaged with each other.
By moving 407 to the left in the example of FIG. 2,
The push plate 406 is biased toward the movable contact 404, and the movable contact 404 is displaced toward the fixed contact 405 via the push plate 406. When the movable contact 404 is displaced and the conductive pin 402 exists between the movable contact 404 and the fixed contact 405, the conductive pin 402
Is in a contact state between the fixed contact 405 and the movable contact 404.

Fig. 4 shows the zero insertion force type connector body
6 shows an example of a mechanism for moving an operation plate 407 of 401. One zero insertion force type connector main body 401 in the figure has an insertion hole 403 for 60 to 80 pins, and one pin card 300 is connected to one connector main body 401.

The connector bodies 401 are arranged in an arrangement equal to the arrangement pitch of the pin cards 300. At the end of each connector body 401, a mounting projection 408 and an end 407B of the operation plate 407 protrude.

A projection 501 protruding from the plate surface of the movable plate 500 at the operation plate end 407B.
And the operation plates 407 of the plurality of connector bodies 401 are connected via the movable plate 500.

As a mechanism for displacing the movable plate 500, for example, a lever 5
02, the eccentric cam 503 is rotated. By this rotating operation, the pin 504 protruding from the movable plate 500 is engaged with the eccentric cam 503, and the pin 504 and the eccentric cam 503 are engaged. Depending on the case, the movable plate 500 can be mounted so as to be able to advance and retreat in the longitudinal direction of the connector main body 401.

According to this configuration, the movable plate 500 can be advanced in the direction of the arrow Q by moving the lever 502 in the direction of the arrow P. As the movable plate 500 moves forward in the direction of arrow Q, each operation plate 407 of the connector body 401 moves, and drives the movable contact 404 in a direction to close. In this manner, a large number of zero insertion force type connectors can be operated by rotating the single lever 502.

As described above, according to the present invention, the performance board 100 and the motherboard 200 and the motherboard 200 and the pin card 300 are connected by the zero insertion force type connector 400. ,
When connecting and disconnecting between the performance board 100 and the motherboard 200, insertion and removal can be performed without resistance. In addition, there is no need to apply any press contact force to maintain the connection state, so that it is not necessary to reinforce the performance board 100 and the motherboard 200.

In addition, the motherboard 200 and the pin card 300 can be inserted and removed without resistance for the same reason, and it is not necessary to apply any press-contact force to maintain the connection state. There is no need to specially reinforce the card 300. Therefore, there is an advantage that a reduction in size and weight can be achieved because no member for reinforcement is required.

Further, since the structure of the zero insertion force type connector is configured such that the ridge 406A of the push plate 406 is pressed by the inclined surface of the serrated concave groove 407A and the movable contact 404 is moved via the push plate 406, the operation plate 407 is provided. The force to move is small. Therefore, even with a structure in which a large number of zero insertion force type connectors are operated simultaneously, the operation can be performed with a small force. As a result, the strength of the movable plate 500, the lever 502, and the like for simultaneously operating a large number of zero insertion force type connectors can be small, so that the movable plate 500 and the lever 502 can be made small. Therefore, there is an advantage that the entire configuration of the IC test apparatus can be made small.

A conductive pin 402 is provided between the movable contact 404 and the fixed contact 405.
While the connection state is maintained, the operation plate 407
Is moved to a state in which it is engaged with the flat surface deviated from the position where it engages with the serrated groove 407A with respect to the ridge 406A,
No biasing force in the return direction is generated on the operation plate 407. Therefore, no force is required to maintain the insertion force type connector in the connected state. Therefore,
Also in this respect, strength is not required for the movable plate 500 and the lever 502, so that an advantage that the entire IC test apparatus can be made small can be obtained.

In addition, by adopting a structure in which multiple insertion force type connectors are operated simultaneously, the connection between the performance board, motherboard and pin card can be set by one operation, improving operability. Can be.

[Brief description of the drawings]

FIG. 1 is a side view showing an embodiment of the present invention, FIG. 2 is a partially cutaway perspective view showing an example of a zero insertion force type connector, and FIG. 3 is an example of a zero insertion force type connector. FIG. 4 is a cross-sectional view for explaining, FIG. 4 is a plan view showing an example of a driving mechanism of an operation plate of a zero insertion force type connector, FIG. 5 is a side view for explaining a conventional technique, and FIG. It is a perspective view for explaining the structure of the contact used. 100: performance board, 101: IC socket, 200: motherboard, 300: pin card, 400: zero insertion force type connector.

Claims (1)

(57) [Scope of request for utility model registration] 1. A performance boat in which a socket for an IC under test is mounted, and a plurality of terminals for connecting to various test circuits are derived from each one terminal of the socket for an IC under test. A pin card on which an electric circuit connected to each derived terminal is mounted, a motherboard interposed between the pin card and the performance boat, and electrically connecting the performance boat and the pin card; In an IC test apparatus configured to connect and disconnect between a motherboard and a performance boat and between a motherboard and a pin card by using a zero insertion force type connector, the zero insertion force type connector is composed of: C. One side of the connector body, formed with an elongated rectangular tubular connector body; D. a plurality of holes arranged in the longitudinal direction of the connector body for inserting mating conductive pins to be brought into contact with each other; D. inside the connector body, one of the connector bodies for each position of the hole E. a fixed contact disposed along the inner wall of the connector; E. facing the fixed contact, arranged along the other wall of the connector body, and having a biasing force in a direction away from the fixed contact by its own spring force. A movable contact, F. interposed between the movable contact and the other wall of the connector body, and protruding toward the other wall of the connector body at a position on the back side of a surface facing each movable contact. A push plate having a projection, G. a deep recess inserted between the push plate and the other wall surface and facing the position of the projection formed on the push plate;
A serrated concave groove having a shape that gradually becomes shallower from this deep recess toward one of the longitudinal directions of the connector main body, and a protruding portion that protrudes from one of the longitudinal ends of the connector main body. H. A plurality of the connector bodies constituted by the zero insertion force type connector are arranged side by side on the motherboard,
A movable plate connected to a protruding end of the operation plate protruding from the plurality of connector bodies arranged in parallel and a lever for driving the movable plate in the movable direction of the operation plate are provided, and by operating this lever An IC test apparatus characterized in that the operation plates of a plurality of zero insertion force type connectors can be operated simultaneously.