CN109788632B - Circuit board and using method thereof - Google Patents
Circuit board and using method thereof Download PDFInfo
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- CN109788632B CN109788632B CN201910171438.9A CN201910171438A CN109788632B CN 109788632 B CN109788632 B CN 109788632B CN 201910171438 A CN201910171438 A CN 201910171438A CN 109788632 B CN109788632 B CN 109788632B
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Abstract
The invention discloses a circuit board, comprising: a substrate; a first conductive layer and a second conductive layer electrically insulated from each other; the first electric connector is insulated on the outer surface, a first metal layer is formed on the inner surface, and the first conducting layer is in conducting connection with the first metal layer; the outer surface of the second electric connector is insulated, a second metal layer is formed on the inner surface of the second electric connector, the second conductive layer is in conductive connection with the second metal layer, and the second electric connector comprises a metal columnar structure which can extend out of the second opening end; the outer surface of the third electric connector is insulated, a third metal layer is formed on the inner surface of the third electric connector, and the first metal layer is in conductive connection with the third metal layer; and the outer surface of the fourth electric connector is insulated, a fourth metal layer is formed on the inner surface of the fourth electric connector, and the second metal layer is in conductive connection with the fourth metal layer. The invention can realize the test of the circuit without damaging the original circuit and welding a measuring device.
Description
Technical Field
The invention relates to the technical field of circuit testing, in particular to a circuit board and a using method thereof.
Background
Currently, electronic devices typically use a measuring device, such as a multimeter, to measure current data in various circuits to verify that electrical parameters are correct. When current is tested, the measuring device needs to be connected in series into a circuit, most of the existing electronic equipment uses a circuit board to design a circuit or uses a connector (such as a mobile phone module screen and a mainboard are connected through a circuit connector) to electrically connect different modules, so that the circuit board needs to be cut off and welded with an access point of the measuring device, but because the circuits of the electronic equipment are dense and the wiring width is relatively thin, adjacent circuits or other bottom circuits are easily cut off, the condition that the circuit board is damaged and cannot be repaired is caused, and the manual welding measuring device also can increase difficulty for current testing.
Therefore, it is desirable to provide a circuit board and a method for using the same that can achieve testing of a circuit without damaging the original circuit and without soldering a measuring device.
Disclosure of Invention
In order to achieve the above object, a first aspect of the present invention provides a circuit board, including:
a substrate;
the first conducting layer and the second conducting layer are arranged on the substrate in an opposite mode and are electrically insulated from each other, and the first pin to be tested and the second pin to be tested are electrically connected to the first conducting layer and the second conducting layer respectively;
the first electric connector is arranged on the first conducting layer, the first electric connector is of a hollow structure with a first opening end, the outer surface of the first electric connector is insulated, a first metal layer is formed on the inner surface of the first electric connector, and the first conducting layer is in conductive connection with the first metal layer;
the second electric connector is arranged on the second conducting layer, the second electric connector is a hollow structure with a second open end, the outer surface of the second electric connector is insulated, a second metal layer is formed on the inner surface of the second electric connector, the second open end is opposite to the first open end, the second conducting layer is in conductive connection with the second metal layer, and the second electric connector comprises a metal columnar structure which can extend out of the second open end and is in conductive connection with the second metal layer;
the third electric connector is arranged on the first electric connector, the third electric connector is of a hollow structure with a third opening end, the outer surface of the third electric connector is insulated, a third metal layer is formed on the inner surface of the third electric connector, and the first metal layer is in conductive connection with the third metal layer;
and the fourth electric connector is arranged on the second electric connector, the fourth electric connector is of a hollow structure with a fourth opening end, the outer surface of the fourth electric connector is insulated, a fourth metal layer is formed on the inner surface of the fourth electric connector, and the second metal layer is in conductive connection with the fourth metal layer.
Preferably, in a first state of the circuit board, the first metal layer and the metal columnar structure are in conductive connection, and in a second state of the circuit board, the third metal layer and the fourth metal layer are in conductive connection.
Preferably, the first electrical connector is a cylindrical structure;
the third opening end and the fourth opening end are arranged in a reverse way,
the second electrical connector further comprises a telescoping control mechanism for telescoping the metal columnar structure relative to the second open end.
Preferably, the first conductive layer includes a first portion and a second portion, and the second conductive layer includes a third portion and a fourth portion;
the circuit board further includes:
the first table-board is arranged on the first part and is in conductive connection with the first conducting layer;
a first rotating shaft penetrating through the first table top and used for enabling the first electric connector and the third electric connector to rotate around the first rotating shaft and to be in conductive connection with the first conducting layer, the first metal layer and the third metal layer;
the second table-board is arranged on the third part and is in conductive connection with the second conductive layer;
and the second rotating shaft penetrates through the second table top and is used for enabling the second electric connector and the fourth electric connector to rotate around the second rotating shaft and to be in conductive connection with the second conducting layer, the second metal layer and the fourth metal layer.
Preferably, the first electrical connector is of a cylindrical configuration,
the second electrical connector further comprises a telescoping control mechanism for telescoping the metal columnar structure relative to the second open end.
Preferably, the first electrical connector is a slot-like structure, the bottom wall of the slot-like structure facing the first conductive layer.
Preferably, the second portion and the fourth portion are respectively provided with a pad.
The second aspect of the present invention provides a method for using the circuit board, comprising the following steps:
in a first state of the circuit board, the first metal layer is electrically connected with the metal columnar structure;
under the second state of circuit board, make first metal level with metal columnar structure disconnection conductive connection and insert the first test pen of universal meter in the third opening end, the second test pen of universal meter inserts the fourth opening end to the electric current between first pin and the second pin that awaits measuring is awaited measuring to the test.
Preferably, the first electrical connector is a cylindrical structure;
the second electrical connector further comprises a telescopic control mechanism;
the electrically conductively connecting the first metal layer and the metal pillar structure further comprises:
the metal columnar structure extends into the first opening end through the telescopic control mechanism;
the electrically disconnecting the first metal layer from the metal pillar structure further comprises:
and the metal columnar structure is withdrawn from the first opening end through the telescopic control mechanism.
Preferably, the first conductive layer includes a first portion and a second portion, and the second conductive layer includes a third portion and a fourth portion;
the circuit board further includes:
the first table-board is arranged on the first part and is in conductive connection with the first conducting layer;
a first rotating shaft penetrating through the first table top and used for enabling the first electric connector and the third electric connector to rotate around the first rotating shaft and to be in conductive connection with the first conducting layer, the first metal layer and the third metal layer;
the second table-board is arranged on the third part and is in conductive connection with the second conductive layer;
a second rotating shaft penetrating through the second table top, for enabling the second electrical connector and the fourth electrical connector to rotate around the second rotating shaft, and being in conductive connection with the second conductive layer, the second metal layer and the fourth metal layer;
the first electrical connector is of a trough-like structure, a bottom wall of the trough-like structure facing the first conductive layer,
the electrically conductively connecting the first metal layer and the metal pillar structure further comprises:
pivoting the second electrical connector and the fourth electrical connector through a second rotating shaft so that the first metal layer is in contact with the metal columnar structure;
the electrically disconnecting the first metal layer from the metal pillar structure further comprises:
and the first electric connector and the third electric connector are pivoted from the first position to the second position through the first rotating shaft, and the second electric connector and the fourth electric connector are pivoted from the first position to the second position through the second rotating shaft, so that the first metal layer is disconnected from the metal columnar structure.
Preferably, the method further comprises the following steps: and the first test pen of the multimeter is electrically connected with the second part, and the second test pen of the multimeter is electrically connected with the fourth part, so that the voltage between the first pin to be tested and the second pin to be tested is tested.
The invention has the following beneficial effects:
the embodiment has the advantages of clear principle and simple design, and on one hand, the normal use of a circuit and a module is realized by conducting connection between the first metal layer and the metal columnar structure; on the other hand, in order to measure the current at two ends of the circuit or the module, a worker can disconnect the first metal layer and the metal columnar structure on the circuit board under normal use, and respectively insert a first test pen and a second test pen of a measuring device such as a multimeter into the third opening end and the fourth opening end so as to enable the third metal layer and the fourth metal layer to be in conductive connection, and further perform corresponding measurement, so that the circuit or the module can be measured without damaging the original circuit or the module and welding the measuring device, and the measurement convenience is improved.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;
fig. 2 is a schematic structural view illustrating the connection between the metal pillar structure and the first metal layer in the present embodiment;
fig. 3 is a schematic structural diagram illustrating a disconnection between the metal pillar structure and the first metal layer in another embodiment of the present embodiment;
fig. 4 is a schematic structural view illustrating the conductive connection between the metal pillar structure and the first metal layer in this embodiment;
fig. 5 shows a schematic structural diagram of the disconnection of the metal pillar structure from the first metal layer in the preferred embodiment.
Fig. 6 shows a schematic structural view between the second electrical connector and the fourth electrical connector in the present embodiment;
fig. 7 shows a schematic structural view between the first electrical connector and the third electrical connector in the present embodiment;
fig. 8 shows a flow chart of a using method using the circuit board according to a second embodiment of the invention.
In the figure: 100. a substrate; 200. a first conductive layer; 210. a first part; 220. a first table top; 230. a first rotating shaft; 240. a second section; 300. a second conductive layer; 310. a third section; 320. a second table top; 330. A second rotating shaft; 340. a fourth section; 400. a first electrical connector; 410. a trough-like structure; 500. a second electrical connector; 510. a metal columnar structure; 600. a third electrical connector; 700. a fourth electrical connector; 800. and a bonding pad.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below with reference to preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
Fig. 1 shows a schematic structural diagram of a circuit board according to an embodiment of the present invention, as shown in fig. 1, the circuit board includes a substrate 100 and a first conductive layer 200 and a second conductive layer 300 oppositely disposed on the substrate 100, the first conductive layer 200 and the second conductive layer 300 are electrically insulated from each other, wherein a first pin to be tested and a second pin to be tested are electrically connected to the first conductive layer 200 and the second conductive layer 300, respectively.
It should be noted that the number of the conductive layers may be multiple pairs, the multiple pairs of conductive layers are oppositely disposed on the substrate 100, the material of the conductive layers may be metal, and the pins to be tested may also be multiple pairs, where the first pin to be tested and the second pin to be tested should be understood as pins at two ends of one circuit or module.
The first conductive layer 200 is provided with a first electrical connector 400, wherein the first electrical connector 400 is a hollow structure having a first open end, an outer surface of the first open end is insulated, a first metal layer is formed on an inner surface, and the first conductive layer 200 is in conductive connection with the first metal layer.
The second conductive layer 300 is provided with a second electrical connector 500, wherein the second electrical connector 500 is a hollow structure having a second open end, the outer surface of the second open end is insulated, and a second metal layer is formed on the inner surface, wherein the second open end is opposite to the first open end, the second conductive layer 300 is in metal connection with the second metal layer, and the second electrical connector 500 further includes a metal column structure 510 capable of extending out of the second open end and in conductive connection with the second metal layer.
The first electrical connector 400 is further provided with a third electrical connector 600, wherein the third electrical connector 600 is a hollow structure having a third open end, an outer surface of the third open end is insulated, a third metal layer is formed on an inner surface of the third open end, and the first metal layer is electrically connected with the third metal layer.
The second electrical connector 500 is further provided with a fourth electrical connector 700, wherein the fourth electrical connector 700 is a hollow structure having a fourth opening end, an outer surface of the fourth opening end is insulated, a fourth metal layer is formed on an inner surface, and the second metal layer is electrically connected with the fourth metal layer.
In a specific implementation of the present embodiment, in the first state of the circuit board, the first metal layer is electrically connected to the metal pillar 510, and in the second state of the circuit board, the third metal layer is electrically connected to the fourth metal layer.
Specifically, fig. 1 shows that the metal column-shaped structure 510 is disconnected from the first metal layer, fig. 2 shows a schematic structural diagram of the metal column-shaped structure 510 in this embodiment being connected to the first metal layer, as can be seen from fig. 1 and fig. 2, the first state in this embodiment should be understood as a state where the circuit or module in the circuit board is in normal use, and the second state is a state where the circuit board is tested, when the circuit board in this embodiment is in use, on one hand, in order to ensure the normal use of the circuit or module in the circuit board, since the first pin to be tested and the second pin to be tested at two ends of the circuit or module are electrically connected to the first conductive layer 200 and the second conductive layer 300 respectively, the first metal layer and the metal column-shaped structure 510 can be electrically connected to realize the normal use of the circuit or module, on the other hand, in order to measure the current at the two ends of the circuit or the module, the worker may disconnect the first metal layer on the circuit board from the metal columnar structure 510, insert the first test pen and the second test pen of the measuring device, such as a multimeter, into the third opening end and the fourth opening end, respectively, so as to connect the third metal layer and the fourth metal layer in a conductive manner, and further perform corresponding measurement.
In one embodiment of this embodiment, the first electrical connector 400 is a cylindrical structure;
the third opening end and the fourth opening end are arranged in a reverse way,
the second electrical connector 500 further comprises a telescoping control mechanism for telescoping the metal pillar 510 relative to the second open end.
Specifically, the expansion control mechanism in the second electrical connector 500 can control the metal pillar structure 510 to expand and contract relative to the second open end, so that, when the circuit board is in the first state, the metal pillar structure 510 is controlled by the expansion control mechanism to extend into the cylindrical structure, so as to contact the first metal layer with the metal pillar structure 510, thereby implementing the normal operation of the circuit or the module, and when the circuit board is in the second state, the metal pillar structure 510 is controlled by the expansion control mechanism to extend out of the first open end, so as to disconnect the first metal layer from the metal pillar structure 510, and the first test pen and the second test pen of the measuring device, such as a multimeter, are inserted into the third open end and the fourth open end to perform corresponding measurement, for example, the expansion control mechanism can be an external thread disposed on the outer surface of the metal pillar structure 510 and an internal thread disposed in the second open end of the second electrical connector 500, it should be noted that, in order to facilitate the insertion of the first test pen and the second test pen by the worker, the fourth opening end and the third opening end are disposed opposite to each other, so that the operable space is increased, and convenience is provided.
Fig. 3 is a schematic structural diagram illustrating a metal pillar structure 510 disconnected from a first metal layer in another embodiment of this embodiment, as shown in fig. 3, a first conductive layer 200 includes a first portion 210 and a second portion 240, and a second conductive layer 300 includes a third portion 310 and a fourth portion 340;
the circuit board further includes:
a first mesa 220 disposed on the first portion 210 and electrically connected to the first conductive layer 200;
a first rotating shaft 230 penetrating the first table 220 for enabling the first electrical connector 400 and the third electrical connector 600 to rotate around the first rotating shaft 230 and to be electrically connected with the first conductive layer 200, the first metal layer and the third metal layer;
a second mesa 320 disposed on the third portion 310 and conductively connected to the second conductive layer 300;
a second rotating shaft 330 penetrating the second table 320, for enabling the second electrical connector 500 and the fourth electrical connector 700 to rotate around the second rotating shaft 330, and to be electrically connected with the second conductive layer 300, the second metal layer and the fourth metal layer.
Specifically, fig. 4 is a schematic structural diagram of the conductive connection between the metal columnar structure 510 and the first metal layer in this embodiment, as can be seen from fig. 3 and fig. 4, the first rotating shaft 230 can rotate the first electrical connector 400 and the third electrical connector 600, and correspondingly, the second rotating shaft 330 can rotate the second electrical connector 500 and the fourth electrical connector 700, so that when the circuit board is in the first state, the first rotating shaft 230 and the second rotating shaft 330 can be rotated respectively to make the metal columnar structure 510 contact with the first metal layer, thereby implementing the normal operation of the circuit or the module, and when the circuit board is in the second state, the first rotating shaft and the second rotating shaft 330 can be rotated again to make the metal columnar structure 510 and the first metal layer release the contact state, and the first test pen and the second test pen of the measurement device, such as a multimeter, are inserted into the third open end and the fourth open end to perform the corresponding measurement, further, when the worker performs measurement, in order to insert the first test pen and the second test pen, the worker may rotate the first electrical connector 400, the third electrical connector 600, the second electrical connector 500, and the fourth electrical connector 700 to be perpendicular to the substrate 100 through the first rotating shaft 230 and the second rotating shaft 330, respectively, so that the operable space is increased, and convenience is provided.
Preferably, the second portion 240 and the fourth portion 340 are respectively provided with a pad 800.
In measuring the voltage of the circuit or module, the measurement of the voltage may be achieved by contacting a first test pen of a test device, such as a multimeter, with a second test pen to the pads 800 disposed on the second and fourth portions 240 and 340.
Preferably, the first electrical connector 400 is a cylindrical structure,
the second electrical connector 500 further comprises a telescoping control mechanism for telescoping the metal pillar 510 relative to the second open end.
Fig. 5 shows a schematic structural diagram of the metal pillar structure 510 in the present preferred embodiment disconnected from the first metal layer.
Specifically, when using, the metal columnar structure 510 is controlled to stretch out or shrink by the telescopic control structure, on one hand, the metal columnar structure 510 is stretched into the tubular structure by the telescopic control structure, so that the circuit board can be in the first state, and on the other hand, the metal columnar structure 510 can be shrunk out of the tubular structure by the telescopic control structure, so that the circuit board can be in the second state.
Further, fig. 7 shows a schematic structural view between the first electrical connector 400 and the third electrical connector 600, fig. 6 shows a schematic structural view between the second electrical connector 500 and the fourth electrical connector 700, and as can be seen from fig. 7, the first electrical connector 400 is a groove-shaped structure 410, and a bottom wall of the groove-shaped structure 410 faces the first conductive layer 200.
In particular, since the first electrical connector 400 is a slot-like structure 410, and the bottom wall of the slot-like structure 410 faces the first conductive layer 200, in use, therefore,
the worker can rotate the first electrical connector 400, the third electrical connector 600, the second electrical connector 500 and the fourth electrical connector 700 to be parallel to the substrate 100 through the first rotating shaft 230 and the second rotating shaft 330, respectively, so that the metal columnar structure 510 can be electrically connected with the groove-shaped structure 410, the circuit board can be in the first state, and the occupied area is reduced.
In summary, the present embodiment has the advantages of clear principle and simple design, and on one hand, the normal use of the circuit and the module is realized by electrically connecting the first metal layer and the metal columnar structure 510; on the other hand, in order to measure the current at the two ends of the circuit or the module, a worker can disconnect the first metal layer on the circuit board under normal use from the metal columnar structure 510, and insert the first test pen and the second test pen of the measuring device, such as a multimeter, into the third opening end and the fourth opening end respectively, so that the third metal layer is conductively connected with the fourth metal layer, and further perform corresponding measurement, thereby realizing the measurement of the circuit or the module without damaging the original circuit or the module and welding the measuring device, and improving the measurement convenience.
Fig. 8 shows a flow chart of a using method using the circuit board according to a second embodiment of the present invention, as shown in fig. 8, including the following steps:
in a first state of the circuit board, the first metal layer is electrically connected with the metal columnar structure 510;
under the second state of circuit board, make first metal level with metal columnar structure 510 disconnection electrically conductive connection and insert the first test pen of universal meter in the third opening end, the second test pen of universal meter inserts the fourth opening end to the electric current between first base pin and the second base pin that awaits measuring is surveyed to the test.
Preferably, the first electrical connector 400 is a cylindrical structure;
the second electrical connector 500 further comprises a telescoping control mechanism;
the electrically connecting the first metal layer and the metal pillar structure 510 further comprises:
the metal columnar structure 510 extends into the first opening end through the telescopic control mechanism;
said electrically disconnecting the first metal layer from the metal pillar structures 510 further comprises:
the metal pillar 510 is withdrawn from the first open end by the telescoping control mechanism.
Preferably, the first conductive layer 200 includes a first portion 210 and a second portion 240, and the second conductive layer 300 includes a third portion 310 and a fourth portion 340;
the circuit board further includes:
a first mesa 220 disposed on the first portion 210 and electrically connected to the first conductive layer 200;
a first rotating shaft 230 penetrating the first table 220 for enabling the first electrical connector 400 and the third electrical connector 600 to rotate around the first rotating shaft 230 and to be electrically connected with the first conductive layer 200, the first metal layer and the third metal layer;
a second mesa 320 disposed on the third portion 310 and conductively connected to the second conductive layer 300;
a second rotating shaft 330 penetrating the second table 320, for enabling the second electrical connector 500 and the fourth electrical connector 700 to rotate around the second rotating shaft 330, and being in conductive connection with the second conductive layer 300, the second metal layer and the fourth metal layer;
the first electrical connector 400 is a slot-like structure 410, the bottom wall of the slot-like structure 410 faces the first conductive layer 200,
the electrically connecting the first metal layer and the metal pillar structure 510 further comprises:
pivoting the second electrical connector 500 and the fourth electrical connector 700 by the second rotating shaft 330, so that the first metal layer is in contact with the metal pillar 510;
said electrically disconnecting the first metal layer from the metal pillar structures 510 further comprises:
the first electrical connector 400 and the third electrical connector 600 are pivoted from the first position to the second position by the first rotating shaft 230, and the second electrical connector 500 and the fourth electrical connector 700 are pivoted from the first position to the second position by the second rotating shaft 330, so that the first metal layer is disconnected from the metal columnar structure 510.
Preferably, the method further comprises: the first test pen of the multimeter is in conductive connection with the second part 240, and the second test pen of the multimeter is in conductive connection with the fourth part 340, so that the voltage between the first pin to be tested and the second pin to be tested is tested.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (11)
1. A circuit board, comprising:
a substrate;
the first conducting layer and the second conducting layer are arranged on the substrate in an opposite mode and are electrically insulated from each other, and the first pin to be tested and the second pin to be tested are electrically connected to the first conducting layer and the second conducting layer respectively;
the first electric connector is arranged on the first conducting layer, the first electric connector is of a hollow structure with a first opening end, the outer surface of the first electric connector is insulated, a first metal layer is formed on the inner surface of the first electric connector, and the first conducting layer is in conductive connection with the first metal layer;
the second electric connector is arranged on the second conducting layer, the second electric connector is a hollow structure with a second open end, the outer surface of the second electric connector is insulated, a second metal layer is formed on the inner surface of the second electric connector, the second open end is opposite to the first open end, the second conducting layer is in conductive connection with the second metal layer, and the second electric connector comprises a metal columnar structure which can extend out of the second open end and is in conductive connection with the second metal layer;
the third electric connector is arranged on the first electric connector, the third electric connector is of a hollow structure with a third opening end, the outer surface of the third electric connector is insulated, a third metal layer is formed on the inner surface of the third electric connector, and the first metal layer is in conductive connection with the third metal layer;
and the fourth electric connector is arranged on the second electric connector, the fourth electric connector is of a hollow structure with a fourth opening end, the outer surface of the fourth electric connector is insulated, a fourth metal layer is formed on the inner surface of the fourth electric connector, and the second metal layer is in conductive connection with the fourth metal layer.
2. The wiring board of claim 1,
and in the first state of the circuit board, the first metal layer is in conductive connection with the metal columnar structure, and in the second state of the circuit board, the third metal layer is in conductive connection with the fourth metal layer.
3. Wiring board according to claim 1 or 2,
the first electric connector is of a cylindrical structure;
the third opening end and the fourth opening end are arranged in a reverse way,
the second electrical connector further comprises a telescoping control mechanism for telescoping the metal columnar structure relative to the second open end.
4. Wiring board according to claim 1 or 2,
the first conductive layer includes a first portion and a second portion, and the second conductive layer includes a third portion and a fourth portion;
the circuit board further includes:
the first table-board is arranged on the first part and is in conductive connection with the first conducting layer;
a first rotating shaft penetrating through the first table top and used for enabling the first electric connector and the third electric connector to rotate around the first rotating shaft and to be in conductive connection with the first conducting layer, the first metal layer and the third metal layer;
the second table-board is arranged on the third part and is in conductive connection with the second conductive layer;
and the second rotating shaft penetrates through the second table top and is used for enabling the second electric connector and the fourth electric connector to rotate around the second rotating shaft and to be in conductive connection with the second conducting layer, the second metal layer and the fourth metal layer.
5. The wiring board of claim 4,
the first electrical connector is of a cylindrical structure,
the second electrical connector further comprises a telescoping control mechanism for telescoping the metal columnar structure relative to the second open end.
6. The wiring board of claim 4,
the first electrical connector is a slot-like structure with a bottom wall facing the first conductive layer.
7. The wiring board of claim 4,
and the second part and the fourth part are respectively provided with a welding pad.
8. A method of using the wiring board of claim 1, comprising the steps of:
in a first state of the circuit board, the first metal layer is electrically connected with the metal columnar structure;
under the second state of circuit board, make first metal level with metal columnar structure disconnection conductive connection and insert the first test pen of universal meter in the third opening end, the second test pen of universal meter inserts the fourth opening end to the electric current between first pin and the second pin that awaits measuring is awaited measuring to the test.
9. The method of claim 8,
the first electric connector is of a cylindrical structure;
the second electrical connector further comprises a telescopic control mechanism;
the electrically conductively connecting the first metal layer and the metal pillar structure further comprises:
the metal columnar structure extends into the first opening end through the telescopic control mechanism;
the electrically disconnecting the first metal layer from the metal pillar structure further comprises:
and the metal columnar structure is withdrawn from the first opening end through the telescopic control mechanism.
10. The method of claim 8,
the first conductive layer includes a first portion and a second portion, and the second conductive layer includes a third portion and a fourth portion;
the circuit board further includes:
the first table-board is arranged on the first part and is in conductive connection with the first conducting layer;
a first rotating shaft penetrating through the first table top and used for enabling the first electric connector and the third electric connector to rotate around the first rotating shaft and to be in conductive connection with the first conducting layer, the first metal layer and the third metal layer;
the second table-board is arranged on the third part and is in conductive connection with the second conductive layer;
a second rotating shaft penetrating through the second table top, for enabling the second electrical connector and the fourth electrical connector to rotate around the second rotating shaft, and being in conductive connection with the second conductive layer, the second metal layer and the fourth metal layer;
the first electrical connector is of a trough-like structure, a bottom wall of the trough-like structure facing the first conductive layer,
the electrically conductively connecting the first metal layer and the metal pillar structure further comprises:
pivoting the second electrical connector and the fourth electrical connector through a second rotating shaft so that the first metal layer is in contact with the metal columnar structure;
the electrically disconnecting the first metal layer from the metal pillar structure further comprises:
and the first electric connector and the third electric connector are pivoted from the first position to the second position through the first rotating shaft, and the second electric connector and the fourth electric connector are pivoted from the first position to the second position through the second rotating shaft, so that the first metal layer is disconnected from the metal columnar structure.
11. The method of claim 10, further comprising: and the first test pen of the multimeter is electrically connected with the second part, and the second test pen of the multimeter is electrically connected with the fourth part, so that the voltage between the first pin to be tested and the second pin to be tested is tested.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910171438.9A CN109788632B (en) | 2019-03-07 | 2019-03-07 | Circuit board and using method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910171438.9A CN109788632B (en) | 2019-03-07 | 2019-03-07 | Circuit board and using method thereof |
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| CN109788632A CN109788632A (en) | 2019-05-21 |
| CN109788632B true CN109788632B (en) | 2020-05-15 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN204271300U (en) * | 2014-12-01 | 2015-04-15 | Tcl显示科技（惠州）有限公司 | ZIF formula FPC connector and use the test board of this ZIF formula FPC connector |
| CN104934739B (en) * | 2015-06-24 | 2018-05-01 | 常州金信诺凤市通信设备有限公司 | Printed wiring board test connector |
| KR20180010370A (en) * | 2016-07-20 | 2018-01-31 | 삼성디스플레이 주식회사 | Display apparatus |
| CN106658947B (en) * | 2016-12-30 | 2019-05-17 | 上海天马有机发光显示技术有限公司 | A kind of flexible circuit board and display panel |
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2019
- 2019-03-07 CN CN201910171438.9A patent/CN109788632B/en active Active
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