WO2008035552A1 - Appareil de traitement par la chaleur - Google Patents

Appareil de traitement par la chaleur Download PDF

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Publication number
WO2008035552A1
WO2008035552A1 PCT/JP2007/066847 JP2007066847W WO2008035552A1 WO 2008035552 A1 WO2008035552 A1 WO 2008035552A1 JP 2007066847 W JP2007066847 W JP 2007066847W WO 2008035552 A1 WO2008035552 A1 WO 2008035552A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat treatment
substrate
treatment apparatus
condensate
fluororesin coating
Prior art date
Application number
PCT/JP2007/066847
Other languages
English (en)
Japanese (ja)
Inventor
Hidenori Miyamoto
Original Assignee
Tokyo Ohka Kogyo Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co., Ltd. filed Critical Tokyo Ohka Kogyo Co., Ltd.
Publication of WO2008035552A1 publication Critical patent/WO2008035552A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods

Definitions

  • the present invention relates to a heat treatment apparatus used in a manufacturing process of a semiconductor or a liquid crystal panel.
  • the structure of the heat treatment apparatus is such that a hot plate is arranged in a housing, a substrate to be treated is placed on the hot plate, and the substrate is heat treated by the hot plate (Patent Document 1).
  • a lid that forms a purge chamber is provided above the hot plate, and a reflector that faces the hot plate is formed on the back surface of the lid.
  • Patent Document 1 Japanese Patent Laid-Open No. 5-326532
  • the solvent is only evaporated from the coating film formed on the substrate surface.
  • the sublimation component caused by the resin or the like contained in the coating film is sublimated, and the inner surface including the ceiling surface of the housing It precipitates in.
  • the deposited sublimate may grow and fall on the substrate during the heat treatment. If the sublimate falls on the substrate in this way, it may cause defects such as pin holes. For this reason, it is necessary to clean the removed sublimate once every few weeks to reduce the risk that the sublimate will fall on the substrate. Production efficiency must be reduced To do.
  • a heat treatment apparatus includes a water repellent / oil repellent made of fluororesin or silicon resin on a ceiling surface of a housing or a lower surface of a top plate suspended from the ceiling surface. A film was formed.
  • the particle size of the first deposit is extremely small.
  • the ceiling surface of the housing or the top plate suspended from the ceiling surface may be inclined toward one side of the housing (the side with the exhaust port). By doing so, the liquid that becomes the precipitate adhering to the ceiling surface or the lower surface of the top plate moves along the inclination and falls to a place off the substrate.
  • Fluorine resin coatings include tetrafluorinated styrene resin (PTFE), tetrafluorinated styrene perfluoroalkyloxyalkyl ether copolymer (PFA), tetrafluorinated styrene hexahexafluoropropylene copolymer (FEP). ), Polychlorotrifluoroethylene (PCTFE), black trifluoroethylene.
  • ECTFE tetrafluorinated styrene resin
  • PFA tetrafluorinated styrene perfluoroalkyloxyalkyl ether copolymer
  • FEP tetrafluorinated styrene hexahexafluoropropylene copolymer
  • PCTFE Polychlorotrifluoroethylene
  • ECTFE tetrafluoride
  • ETFE ethylene copolymer
  • PVDF polyviriniden
  • the problem that precipitates fall on the object to be treated during heat treatment is solved. Moreover, the frequency
  • FIG. 1 is a cross-sectional view showing an example of a heat treatment apparatus according to the present invention.
  • FIG. 3 is a sectional view showing a modification of the heat treatment apparatus.
  • FIG. 1 is a cross-sectional view showing an example of a heat treatment apparatus according to the present invention.
  • Heat treatment equipment A housing 1 is provided, and a hot plate 2 is provided in the housing 1.
  • the hot plate 2 has a heating device inside, and heats the mounted substrate (object to be processed) 3.
  • the surface of the substrate 3 is coated with a photosensitive composition such as a photoresist composition, an SOG material, and the like.
  • the heat treatment apparatus includes elevating pins 4a to 4c penetrating the hot plate 2, and the substrate 3 before the heat treatment is carried by the arm via the shirt 5 and received by the raised pins 4a to 4c. Then, the pins 4a to 4c are lowered and placed on the hot plate. Then, the substrate is heated by a hot plate.
  • the housing 1 has first and second side walls la and lb facing each other across the hot plate 2 and a ceiling surface lc.
  • the side wall la is provided with a shirter 5, and the side wall lb is provided with a vacuum source.
  • a ceiling plate 10 is suspended from the ceiling surface lc of the woozing 1 so that its lower surface approaches the surface of the substrate 3 and opposes it.
  • the top plate 10 is inclined so that the shirter 5 side is high and the exhaust port 6 side is low.
  • a fluororesin coating 11 is formed on the bottom surface of the top plate 10 as a water / oil repellent coating.
  • RU Silicone resin film can be used instead of fluororesin film 11.
  • the solvent evaporated from the resist solution or the like applied to the surface of the substrate 3 or sublimated from the resin is aggregated in the fluororesin coating 11 on the lower surface of the top plate 10. Agglomerates are formed on the surface of the fluororesin coating 11 and thus have a fine diameter.
  • the fluororesin coating is more slippery, so it moves along an inclination as shown in FIG. Fall down. Since the position where the aggregated droplet falls is outside the substrate 3, it does not cause a decrease in yield.
  • FIG. 3 is a cross-sectional view showing another embodiment.
  • a top plate is not provided, and instead, a fluororesin film 11 is formed on the ceiling surface lc of the housing 1. .
  • the ceiling surface lc is not inclined, but it may be inclined toward the exhaust port 6 in the same manner as in the above embodiment.
  • the force for providing the exhaust port on the side wall may be provided on the upper side wall or the lower side wall.
  • an exhaust port can be provided in the upper side wall portion facing the top plate.
  • the water / oil repellent coating may be black. By doing this, the temperature of the water and oil repellent coating Since the degree is increased, there is an effect of suppressing the sublimate from being cooled and deposited.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

Cette invention propose un appareil de traitement par la chaleur qui empêche de manière efficace tout dépôt de produits de sublimation se produisant pendant un traitement par la chaleur. Lorsqu'un substrat (3) est chauffé, la sublimation de résine ou l'évaporation de solvant à partir d'un liquide de réserve, etc., appliquée à la surface du substrat (3) conduit à provoquer une condensation sur le revêtement de fluororésine (11) formant une surface inférieure d'un panneau supérieur (10). Le condensat à un diamètre minuscule en raison de la formation sur la surface du revêtement de fluororésine (11), et en outre le revêtement de fluororésine est glissant. Ainsi, le condensat se déplace le long de la pente de celui-ci et tombe vers le bas à partir d'une partie d'extrémité du panneau supérieur (10). La position à laquelle des gouttes de condensat tombent se trouve à l'extérieur du substrat (3), de telle sorte que le condensat ne provoque pas de diminution du rendement.
PCT/JP2007/066847 2006-09-21 2007-08-30 Appareil de traitement par la chaleur WO2008035552A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-256177 2006-09-21
JP2006256177A JP2008078402A (ja) 2006-09-21 2006-09-21 加熱処理装置

Publications (1)

Publication Number Publication Date
WO2008035552A1 true WO2008035552A1 (fr) 2008-03-27

Family

ID=39200379

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/066847 WO2008035552A1 (fr) 2006-09-21 2007-08-30 Appareil de traitement par la chaleur

Country Status (3)

Country Link
JP (1) JP2008078402A (fr)
TW (1) TW200827947A (fr)
WO (1) WO2008035552A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107444776A (zh) * 2017-07-28 2017-12-08 武汉华星光电技术有限公司 高温加热设备的承载装置及其清洁方法、高温加热设备

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5734733B2 (ja) * 2011-05-12 2015-06-17 ラピスセミコンダクタ株式会社 熱処理装置の排気構造
JP2012253171A (ja) * 2011-06-02 2012-12-20 Toppan Printing Co Ltd プリベーク装置およびプリベーク方法
JP6576652B2 (ja) * 2015-03-03 2019-09-18 株式会社三井ハイテック 熱処理装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04147612A (ja) * 1990-10-11 1992-05-21 Tokyo Electron Ltd 基板加熱装置
JP2002228375A (ja) * 2001-01-26 2002-08-14 Tokyo Electron Ltd 加熱処理装置
JP2004158549A (ja) * 2002-11-05 2004-06-03 Tokyo Electron Ltd 基板乾燥装置および基板乾燥方法
JP2005019593A (ja) * 2003-06-25 2005-01-20 Matsushita Electric Ind Co Ltd 熱処理方法および装置
JP2006165500A (ja) * 2004-06-10 2006-06-22 Nikon Corp 露光装置、露光方法及びデバイス製造方法
WO2006080516A1 (fr) * 2005-01-31 2006-08-03 Nikon Corporation Appareil d’exposition et methode de fabrication du dispositif

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04147612A (ja) * 1990-10-11 1992-05-21 Tokyo Electron Ltd 基板加熱装置
JP2002228375A (ja) * 2001-01-26 2002-08-14 Tokyo Electron Ltd 加熱処理装置
JP2004158549A (ja) * 2002-11-05 2004-06-03 Tokyo Electron Ltd 基板乾燥装置および基板乾燥方法
JP2005019593A (ja) * 2003-06-25 2005-01-20 Matsushita Electric Ind Co Ltd 熱処理方法および装置
JP2006165500A (ja) * 2004-06-10 2006-06-22 Nikon Corp 露光装置、露光方法及びデバイス製造方法
WO2006080516A1 (fr) * 2005-01-31 2006-08-03 Nikon Corporation Appareil d’exposition et methode de fabrication du dispositif

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107444776A (zh) * 2017-07-28 2017-12-08 武汉华星光电技术有限公司 高温加热设备的承载装置及其清洁方法、高温加热设备

Also Published As

Publication number Publication date
JP2008078402A (ja) 2008-04-03
TW200827947A (en) 2008-07-01

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