WO2008032577A1 - Applicateur de revêtement - Google Patents

Applicateur de revêtement Download PDF

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Publication number
WO2008032577A1
WO2008032577A1 PCT/JP2007/066843 JP2007066843W WO2008032577A1 WO 2008032577 A1 WO2008032577 A1 WO 2008032577A1 JP 2007066843 W JP2007066843 W JP 2007066843W WO 2008032577 A1 WO2008032577 A1 WO 2008032577A1
Authority
WO
WIPO (PCT)
Prior art keywords
nozzle
pump
processing liquid
pressure
pressure sensor
Prior art date
Application number
PCT/JP2007/066843
Other languages
English (en)
Japanese (ja)
Inventor
Yoshiaki Masu
Atsuo Kajima
Kenji Yoshizawa
Original Assignee
Tokyo Ohka Kogyo Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co., Ltd. filed Critical Tokyo Ohka Kogyo Co., Ltd.
Publication of WO2008032577A1 publication Critical patent/WO2008032577A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet

Definitions

  • the present invention relates to an apparatus for applying a processing solution such as a resist solution or a coating solution for a color filter onto a processing substrate such as a semiconductor wafer glass substrate.
  • Coating apparatuses that supply a resist solution to the surface of a semiconductor wafer or supply a coating solution for a color filter to the surface of a glass substrate generally use a processing solution (such as a resist solution or a coating solution for a color filter) in a tank.
  • the pump is sucked, the sucked processing liquid is pumped to the nozzle through the pipe, and is supplied from the nozzle to the surface of the substrate to be processed (semiconductor wafer glass substrate).
  • Patent Document 1 a sensor for measuring the suction pressure of the pump is provided on the upstream side of the pump, and a sensor for measuring the discharge pressure of the pump is provided on the downstream side of the pump. From this, it is detected that the liquid in the tank has run out, and the filter clogging is detected from the value of the sensor that measures the discharge pressure.
  • Patent Document 2 a pressure difference generator is provided in the processing liquid supply pipe downstream of the pump, a pressure sensor is provided between the pressure difference generator and the pump, and the pressure difference generator A configuration has been disclosed in which a difference is generated to eliminate pulsation and perform rectification to suppress the occurrence of coating unevenness.
  • Patent Document 3 discloses a content in which a pressure sensor is provided on the downstream side of the pump, and the film thickness profile can be finely adjusted by feeding back the detected value of the pressure sensor to the pump. .
  • Patent Document 4 Japanese Patent No. 3166056
  • Patent Document 2 JP 2005-262081 A
  • Patent Document 3 Japanese Patent Laid-Open No. 2005-288387
  • Patent Document 4 Japanese Patent No. 3554115
  • Patent Document 4 merely discloses the structure of the pump, and does not disclose any relationship with the nozzle.
  • the present invention provides a coating apparatus that sucks the processing liquid in the processing liquid tank with a pump and sends the processing liquid discharged from the pump to the nozzle through a pipe, and is derived from the nozzle.
  • a pressure sensor was attached to the discharge pipe of the treated liquid.
  • the present invention includes a case where a pressure sensor is provided in a processing liquid supply pipe that is connected only by a processing liquid discharge pipe led out from a nozzle.
  • pressure sensors are installed before and after a filter provided in the middle of the processing liquid supply pipe to detect clogging of the filter, or an open / close valve and nozzle provided in the middle of the processing liquid supply pipe It is also possible to provide a pressure sensor between them and determine the discharge amount of the processing liquid from the nozzle from the difference in detection value between this pressure sensor and the pressure sensor provided in the processing liquid discharge pipe. Furthermore, a pressure sensor for measuring the suction pressure of the pump may be provided between the processing liquid tank and the pump. By providing a pressure sensor for measuring the suction pressure in this way, it is possible to detect a liquid drain in the tank.
  • the pressure in the nozzle of the coating apparatus can be accurately detected. Therefore, the discharge pressure of the pump can be adjusted based on the detected value, and the thickness of the coating film formed on the substrate surface can be accurately controlled.
  • FIG. 1 is a configuration diagram of a coating apparatus according to the present invention.
  • FIG. 1 is a configuration diagram of a coating apparatus according to the present invention
  • FIG. 2 is an enlarged perspective view of a nozzle
  • FIG. 3 is a sectional view of a pump.
  • the coating apparatus according to the present invention stores a processing liquid such as a resist liquid.
  • the tank (buffer tank) 1 and the slit nozzle 2 for applying the processing liquid to the surface of the semiconductor or glass substrate are connected to the processing liquid supply pipe 3.
  • the upstream side close to the tank,
  • the pump 4 for processing liquid pressure, the filter 5 and the on / off valve 6 are provided in this order.
  • a joint portion 7 is provided at the center of the upper surface of the slit nozzle 2, and an end portion of the processing liquid supply pipe 3 is connected to the joint portion 7, and a discharge pipe 8 is led out from the joint portion 7.
  • a pressure sensor 9 is attached to the discharge pipe 8.
  • a tube diaphragm is used as the pump 4.
  • this tube flamm 4 has a small-diameter bellows section on the outside of the tube 10 that conveys the processing liquid.
  • 11 and the large-diameter bellows 12 are connected via a disk 13, and hydraulic fluid is supplied into the space 14 formed between the inside of the small-diameter bellows 11 and the large-diameter bellows 12 and the outside of the tube 10. It has an enclosed structure.
  • the processing liquid discharged from the pump 4 is sent to the slit nozzle 2 through the filter 5 and the on / off valve 6.
  • a part of the processing liquid supplied into the slit nozzle 2 is applied to the processing substrate surface from the discharge port at the lower end of the nozzle, and the remaining processing liquid is collected through the discharge pipe 8.
  • the pressure of the processing liquid in the discharge pipe 8 is measured by the pressure sensor 9. This measured value is the same as the pressure of the processing liquid in the slit nozzle 2.
  • FIG. 4 and 5 are configuration diagrams of a coating apparatus according to another embodiment.
  • pressure sensors 15 and 16 are provided upstream and downstream of the filter 5, and a pressure sensor 17 is provided downstream of the on / off valve 6.
  • the clogged state of the filter 5 can be known by the differential pressure of the pressure sensors 15 and 16, and the abnormality in the nozzle can be detected by the differential pressure of the pressure sensor 17 and the pressure sensor 9.
  • a pressure sensor 18 is provided on the upstream side of the pump 4.
  • the pressure sensor 18 can detect the lack of liquid in the tank 1.
  • the coating apparatus according to the present invention can be used when a processing solution such as a resist solution or a color filter coating solution is applied to the surface of a semiconductor wafer glass substrate.

Landscapes

  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

L'invention concerne un applicateur de revêtement qui peut mesurer de façon précise la pression d'un liquide de traitement dans une buse. Dans l'applicateur de revêtement, le liquide de traitement éjecté à partir d'une pompe (4) est adressé à une buse à fente (2) à travers un filtre (5) et une soupape de marche/arrêt (6). Une partie du liquide de traitement adressé à la buse à fente (2) est appliquée à partir d'un orifice d'éjection au niveau d'une extrémité inférieure de la buse sur la surface d'un substrat à traiter, et le reste du liquide de traitement est récupéré par un tube de décharge (8). À ce moment, la pression du liquide de traitement dans le tube de décharge (8) est mesurée par un capteur de pression (9).
PCT/JP2007/066843 2006-09-11 2007-08-30 Applicateur de revêtement WO2008032577A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006244922A JP2008062207A (ja) 2006-09-11 2006-09-11 塗布装置
JP2006-244922 2006-09-11

Publications (1)

Publication Number Publication Date
WO2008032577A1 true WO2008032577A1 (fr) 2008-03-20

Family

ID=39183639

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/066843 WO2008032577A1 (fr) 2006-09-11 2007-08-30 Applicateur de revêtement

Country Status (3)

Country Link
JP (1) JP2008062207A (fr)
TW (1) TW200821049A (fr)
WO (1) WO2008032577A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010146928A1 (fr) * 2009-06-19 2010-12-23 タツモ株式会社 Appareil de revêtement de substrat
JP5504838B2 (ja) * 2009-11-17 2014-05-28 凸版印刷株式会社 異常検出方法及び異常検出システム
JP5897263B2 (ja) * 2011-03-18 2016-03-30 株式会社日立製作所 ペースト塗布ヘッド，ペースト塗布装置及びペースト塗布方法
CN102488324A (zh) * 2011-12-16 2012-06-13 新乡东方工业科技有限公司 一种卷烟机供胶装置
US9120115B2 (en) * 2012-10-25 2015-09-01 Nordson Corporation Dispensing systems and methods for monitoring actuation signals for diagnostics
JP6942497B2 (ja) * 2016-09-08 2021-09-29 東京エレクトロン株式会社 処理液供給装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1176906A (ja) * 1997-09-02 1999-03-23 Yamaho Kogyo Kk 薬液混合装置
JP2002336763A (ja) * 2001-05-15 2002-11-26 Sony Corp 塗布装置及び塗布方法
JP2004344695A (ja) * 2003-05-20 2004-12-09 Dainippon Printing Co Ltd 塗布ノズルへの液供給装置
JP2005034706A (ja) * 2003-07-17 2005-02-10 Dainippon Printing Co Ltd 塗布装置、及び、塗布液の充填方法
JP2005144376A (ja) * 2003-11-18 2005-06-09 Dainippon Screen Mfg Co Ltd 基板処理装置、スリットノズル、被充填体における液体充填度判定構造および気体混入度判定構造

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1176906A (ja) * 1997-09-02 1999-03-23 Yamaho Kogyo Kk 薬液混合装置
JP2002336763A (ja) * 2001-05-15 2002-11-26 Sony Corp 塗布装置及び塗布方法
JP2004344695A (ja) * 2003-05-20 2004-12-09 Dainippon Printing Co Ltd 塗布ノズルへの液供給装置
JP2005034706A (ja) * 2003-07-17 2005-02-10 Dainippon Printing Co Ltd 塗布装置、及び、塗布液の充填方法
JP2005144376A (ja) * 2003-11-18 2005-06-09 Dainippon Screen Mfg Co Ltd 基板処理装置、スリットノズル、被充填体における液体充填度判定構造および気体混入度判定構造

Also Published As

Publication number Publication date
JP2008062207A (ja) 2008-03-21
TW200821049A (en) 2008-05-16

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