WO2008032577A1 - Coating applicator - Google Patents

Coating applicator Download PDF

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Publication number
WO2008032577A1
WO2008032577A1 PCT/JP2007/066843 JP2007066843W WO2008032577A1 WO 2008032577 A1 WO2008032577 A1 WO 2008032577A1 JP 2007066843 W JP2007066843 W JP 2007066843W WO 2008032577 A1 WO2008032577 A1 WO 2008032577A1
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WO
WIPO (PCT)
Prior art keywords
nozzle
pump
processing liquid
pressure
pressure sensor
Prior art date
Application number
PCT/JP2007/066843
Other languages
French (fr)
Japanese (ja)
Inventor
Yoshiaki Masu
Atsuo Kajima
Kenji Yoshizawa
Original Assignee
Tokyo Ohka Kogyo Co., Ltd.
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Publication date
Application filed by Tokyo Ohka Kogyo Co., Ltd. filed Critical Tokyo Ohka Kogyo Co., Ltd.
Publication of WO2008032577A1 publication Critical patent/WO2008032577A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet

Definitions

  • the present invention relates to an apparatus for applying a processing solution such as a resist solution or a coating solution for a color filter onto a processing substrate such as a semiconductor wafer glass substrate.
  • Coating apparatuses that supply a resist solution to the surface of a semiconductor wafer or supply a coating solution for a color filter to the surface of a glass substrate generally use a processing solution (such as a resist solution or a coating solution for a color filter) in a tank.
  • the pump is sucked, the sucked processing liquid is pumped to the nozzle through the pipe, and is supplied from the nozzle to the surface of the substrate to be processed (semiconductor wafer glass substrate).
  • Patent Document 1 a sensor for measuring the suction pressure of the pump is provided on the upstream side of the pump, and a sensor for measuring the discharge pressure of the pump is provided on the downstream side of the pump. From this, it is detected that the liquid in the tank has run out, and the filter clogging is detected from the value of the sensor that measures the discharge pressure.
  • Patent Document 2 a pressure difference generator is provided in the processing liquid supply pipe downstream of the pump, a pressure sensor is provided between the pressure difference generator and the pump, and the pressure difference generator A configuration has been disclosed in which a difference is generated to eliminate pulsation and perform rectification to suppress the occurrence of coating unevenness.
  • Patent Document 3 discloses a content in which a pressure sensor is provided on the downstream side of the pump, and the film thickness profile can be finely adjusted by feeding back the detected value of the pressure sensor to the pump. .
  • Patent Document 4 Japanese Patent No. 3166056
  • Patent Document 2 JP 2005-262081 A
  • Patent Document 3 Japanese Patent Laid-Open No. 2005-288387
  • Patent Document 4 Japanese Patent No. 3554115
  • Patent Document 4 merely discloses the structure of the pump, and does not disclose any relationship with the nozzle.
  • the present invention provides a coating apparatus that sucks the processing liquid in the processing liquid tank with a pump and sends the processing liquid discharged from the pump to the nozzle through a pipe, and is derived from the nozzle.
  • a pressure sensor was attached to the discharge pipe of the treated liquid.
  • the present invention includes a case where a pressure sensor is provided in a processing liquid supply pipe that is connected only by a processing liquid discharge pipe led out from a nozzle.
  • pressure sensors are installed before and after a filter provided in the middle of the processing liquid supply pipe to detect clogging of the filter, or an open / close valve and nozzle provided in the middle of the processing liquid supply pipe It is also possible to provide a pressure sensor between them and determine the discharge amount of the processing liquid from the nozzle from the difference in detection value between this pressure sensor and the pressure sensor provided in the processing liquid discharge pipe. Furthermore, a pressure sensor for measuring the suction pressure of the pump may be provided between the processing liquid tank and the pump. By providing a pressure sensor for measuring the suction pressure in this way, it is possible to detect a liquid drain in the tank.
  • the pressure in the nozzle of the coating apparatus can be accurately detected. Therefore, the discharge pressure of the pump can be adjusted based on the detected value, and the thickness of the coating film formed on the substrate surface can be accurately controlled.
  • FIG. 1 is a configuration diagram of a coating apparatus according to the present invention.
  • FIG. 1 is a configuration diagram of a coating apparatus according to the present invention
  • FIG. 2 is an enlarged perspective view of a nozzle
  • FIG. 3 is a sectional view of a pump.
  • the coating apparatus according to the present invention stores a processing liquid such as a resist liquid.
  • the tank (buffer tank) 1 and the slit nozzle 2 for applying the processing liquid to the surface of the semiconductor or glass substrate are connected to the processing liquid supply pipe 3.
  • the upstream side close to the tank,
  • the pump 4 for processing liquid pressure, the filter 5 and the on / off valve 6 are provided in this order.
  • a joint portion 7 is provided at the center of the upper surface of the slit nozzle 2, and an end portion of the processing liquid supply pipe 3 is connected to the joint portion 7, and a discharge pipe 8 is led out from the joint portion 7.
  • a pressure sensor 9 is attached to the discharge pipe 8.
  • a tube diaphragm is used as the pump 4.
  • this tube flamm 4 has a small-diameter bellows section on the outside of the tube 10 that conveys the processing liquid.
  • 11 and the large-diameter bellows 12 are connected via a disk 13, and hydraulic fluid is supplied into the space 14 formed between the inside of the small-diameter bellows 11 and the large-diameter bellows 12 and the outside of the tube 10. It has an enclosed structure.
  • the processing liquid discharged from the pump 4 is sent to the slit nozzle 2 through the filter 5 and the on / off valve 6.
  • a part of the processing liquid supplied into the slit nozzle 2 is applied to the processing substrate surface from the discharge port at the lower end of the nozzle, and the remaining processing liquid is collected through the discharge pipe 8.
  • the pressure of the processing liquid in the discharge pipe 8 is measured by the pressure sensor 9. This measured value is the same as the pressure of the processing liquid in the slit nozzle 2.
  • FIG. 4 and 5 are configuration diagrams of a coating apparatus according to another embodiment.
  • pressure sensors 15 and 16 are provided upstream and downstream of the filter 5, and a pressure sensor 17 is provided downstream of the on / off valve 6.
  • the clogged state of the filter 5 can be known by the differential pressure of the pressure sensors 15 and 16, and the abnormality in the nozzle can be detected by the differential pressure of the pressure sensor 17 and the pressure sensor 9.
  • a pressure sensor 18 is provided on the upstream side of the pump 4.
  • the pressure sensor 18 can detect the lack of liquid in the tank 1.
  • the coating apparatus according to the present invention can be used when a processing solution such as a resist solution or a color filter coating solution is applied to the surface of a semiconductor wafer glass substrate.

Landscapes

  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

Provided is a coating applicator which can accurately measure a pressure of a treatment liquid in a nozzle. In the coating applicator, the treatment liquid ejected from a pump (4) is fed to a slit nozzle (2) through a filter (5) and an on/off valve (6). A part of the treatment liquid supplied into the slit nozzle (2) is applied from an ejecting port at a nozzle lower end onto a surface of a substrate to be treated, and the rest of the treatment liquid is recovered through a discharge tube (8). At this time, the pressure of the treatment liquid in the discharge tube (8) is measured by a pressure sensor (9).

Description

明 細 書  Specification
塗布装置  Coating device
技術分野  Technical field
[0001] 本発明は半導体ゥエーハゃガラス基板などの処理基板にレジスト液やカラーフィル タ用の塗布液などの処理液を塗布する装置に関する。  The present invention relates to an apparatus for applying a processing solution such as a resist solution or a coating solution for a color filter onto a processing substrate such as a semiconductor wafer glass substrate.
背景技術  Background art
[0002] 半導体ゥエーハ表面にレジスト液を供給したり、ガラス基板表面にカラーフィルタ用 の塗布液を供給する塗布装置は、一般にタンク内の処理液（レジスト液やカラーフィ ルタ用の塗布液など）をポンプで吸引し、吸引した処理液を配管を介してノズルに圧 送し、ノズルから被処理基板（半導体ゥエーハゃガラス基板)表面に供給する構造に なっている。 （特許文献;!〜 3)  [0002] Coating apparatuses that supply a resist solution to the surface of a semiconductor wafer or supply a coating solution for a color filter to the surface of a glass substrate generally use a processing solution (such as a resist solution or a coating solution for a color filter) in a tank. The pump is sucked, the sucked processing liquid is pumped to the nozzle through the pipe, and is supplied from the nozzle to the surface of the substrate to be processed (semiconductor wafer glass substrate). (Patent Literature;! ~ 3)
[0003] 特許文献 1には、ポンプの上流側にポンプの吸引圧を測定するセンサを設け、ボン プの下流側にポンプの吐出圧を測定するセンサを設け、吸引圧を測定するセンサの 値からタンク内の液切れを検出し、吐出圧を測定するセンサの値からフィルタの目詰 まりを検出するようにしている。  [0003] In Patent Document 1, a sensor for measuring the suction pressure of the pump is provided on the upstream side of the pump, and a sensor for measuring the discharge pressure of the pump is provided on the downstream side of the pump. From this, it is detected that the liquid in the tank has run out, and the filter clogging is detected from the value of the sensor that measures the discharge pressure.
[0004] 特許文献 2には、ポンプよりも下流側の処理液供給配管に圧力差発生器を設け、こ の圧力差発生器とポンプとの間に圧力センサを設け、圧力差発生器によって圧力差 を発生させることで、脈動をなくして整流化を行い、塗布ムラの発生を抑制する構成 が開示されている。  [0004] In Patent Document 2, a pressure difference generator is provided in the processing liquid supply pipe downstream of the pump, a pressure sensor is provided between the pressure difference generator and the pump, and the pressure difference generator A configuration has been disclosed in which a difference is generated to eliminate pulsation and perform rectification to suppress the occurrence of coating unevenness.
[0005] 特許文献 3には、ポンプよりも下流側に圧力センサを設け、この圧力センサの検出 値をポンプにフィードバックすることで膜厚プロファイルを微細に調整できるようにした 内容が開示されている。  [0005] Patent Document 3 discloses a content in which a pressure sensor is provided on the downstream side of the pump, and the film thickness profile can be finely adjusted by feeding back the detected value of the pressure sensor to the pump. .
[0006] また、薬液の搬送に適したポンプとして、特許文献 4に開示されるものがある。この ポンプは薬液を搬送するチューブの外側に、小径べローズ部と大径べローズ部を連 接し、小径べローズ部を伸張し大径べローズを圧縮することでチューブを圧縮して吐 出を行い、小径べローズ部を圧縮し大径べローズを伸張することでチューブを膨張さ せて吸引を行うようにしたものである。 [0007] 特許文献 1 :特許第 3166056号公報 [0006] Also, there is a pump disclosed in Patent Document 4 as a pump suitable for transporting a chemical solution. In this pump, a small-diameter bellows part and a large-diameter bellows part are connected to the outside of the tube carrying the chemical solution. The tube is expanded by compressing the small-diameter bellows part and expanding the large-diameter bellows to perform suction. [0007] Patent Document 1: Japanese Patent No. 3166056
特許文献 2 :特開 2005— 262081号公報  Patent Document 2: JP 2005-262081 A
特許文献 3：特開 2005— 288387号公報  Patent Document 3: Japanese Patent Laid-Open No. 2005-288387
特許文献 4：特許第 3554115号公報  Patent Document 4: Japanese Patent No. 3554115
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0008] 特許文献 1〜3の先行文献はいずれもポンプの下流側にセンサを設け、ポンプの 吐出圧を検出している。しかしながらこれら先行技術にあっては、直接ノズル内の圧 力を測定しているわけではない。即ち、ノズルの形状には吐出口がスリット状をなすタ イブなどがありノズル内で流路面積が変化するため、配管内の圧力とノズル内の圧力 とは必ずしも一致しない。このため圧力センサの検出値をフィードバックしても精度の 高レ、コントロール行えな!/、などの不具合がある。  [0008] In each of the prior art documents of Patent Documents 1 to 3, a sensor is provided on the downstream side of the pump to detect the pump discharge pressure. However, these prior arts do not directly measure the pressure in the nozzle. That is, the shape of the nozzle includes a slit having a slit-like shape and the flow path area changes in the nozzle, so the pressure in the pipe does not necessarily match the pressure in the nozzle. For this reason, even if the detection value of the pressure sensor is fed back, there are problems such as high accuracy and inability to control!
また特許文献 4は単にポンプの構造を開示するのみで、ノズルとの関係については 一切開示がない。  Patent Document 4 merely discloses the structure of the pump, and does not disclose any relationship with the nozzle.
課題を解決するための手段  Means for solving the problem
[0009] 上記課題を解決するため本発明は、処理液タンク内の処理液をポンプにて吸引し 、ポンプから吐出する処理液を配管を介してノズルに送り込む塗布装置において、前 記ノズルから導出される処理液の排出管に圧力センサを取り付けた。  In order to solve the above-mentioned problems, the present invention provides a coating apparatus that sucks the processing liquid in the processing liquid tank with a pump and sends the processing liquid discharged from the pump to the nozzle through a pipe, and is derived from the nozzle. A pressure sensor was attached to the discharge pipe of the treated liquid.
この場合、ノズルから導出される処理液の排出管内の圧力はノズル内の圧力と等し いため、排出管に圧力センサを取り付けることでノズル内の圧力を正確に検出するこ と力 Sできる。  In this case, since the pressure in the discharge pipe of the processing liquid led out from the nozzle is equal to the pressure in the nozzle, it is possible to accurately detect the pressure in the nozzle by attaching a pressure sensor to the discharge pipe.
[0010] 本発明は、ノズルから導出される処理液の排出管だけでなぐ処理液の供給用配 管に圧力センサを設ける場合も含む。  [0010] The present invention includes a case where a pressure sensor is provided in a processing liquid supply pipe that is connected only by a processing liquid discharge pipe led out from a nozzle.
例えば、処理液の供給用配管の途中に設けられたフィルタの前後に圧力センサを 設けてフィルタの目詰まりを検出したり、処理液の供給用配管の途中に設けられた開 閉弁とノズルとの間に圧力センサを設け、この圧力センサと前記処理液の排出管に 設けた圧力センサとの検出値の差から、ノズルからの処理液の吐出量を割り出すこと も可能である。 [0011] 更に、前記処理液タンクとポンプとの間にポンプの吸引圧を測定する圧力センサを 設けてもよい。このように吸引圧を測定する圧力センサを設けることで、タンクの液切 れを検知できる。 For example, pressure sensors are installed before and after a filter provided in the middle of the processing liquid supply pipe to detect clogging of the filter, or an open / close valve and nozzle provided in the middle of the processing liquid supply pipe It is also possible to provide a pressure sensor between them and determine the discharge amount of the processing liquid from the nozzle from the difference in detection value between this pressure sensor and the pressure sensor provided in the processing liquid discharge pipe. Furthermore, a pressure sensor for measuring the suction pressure of the pump may be provided between the processing liquid tank and the pump. By providing a pressure sensor for measuring the suction pressure in this way, it is possible to detect a liquid drain in the tank.
発明の効果  The invention's effect
[0012] 本発明によれば、塗布装置のノズル内の圧力を正確に検出することができる。した がって、当該検出値に基づいて、ポンプの吐出圧を調整でき、基板表面に形成され る塗膜の厚さも正確にコン卜ローノレすることカできる。  [0012] According to the present invention, the pressure in the nozzle of the coating apparatus can be accurately detected. Therefore, the discharge pressure of the pump can be adjusted based on the detected value, and the thickness of the coating film formed on the substrate surface can be accurately controlled.
[0013] また、処理液を搬送する配管の他の箇所に設けた圧力センサと組み合わせて用い ることで、塗布状態の監視を常時行え、必要なときには瞬時にインターロックをかける ことあでさる。 [0013] In addition, by using in combination with a pressure sensor provided in another part of the piping for transporting the processing liquid, it is possible to constantly monitor the application state, and instantly interlock when necessary.
図面の簡単な説明  Brief Description of Drawings
[0014] [図 1]本発明に係る塗布装置の構成図  FIG. 1 is a configuration diagram of a coating apparatus according to the present invention.
[図 2]ノズルの拡大斜視図  [Figure 2] Enlarged perspective view of nozzle
[図 3]ポンプの断面図  [Figure 3] Cross section of pump
[図 4]同塗布装置の別実施例の構成図  [Fig. 4] Configuration diagram of another embodiment of the coating apparatus
[図 5]同塗布装置の別実施例の構成図  [Fig. 5] Configuration diagram of another embodiment of the coating apparatus
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0015] 以下に本発明の実施例を添付図面に基づいて説明する。図 1は本発明に係る塗 布装置の構成図、図 2はノズルの拡大斜視図、図 3はポンプの断面図であり、本発明 に係る塗布装置は、レジスト液などの処理液を貯留するタンク (バッファタンク） 1と前 記処理液を半導体やガラス基板の表面に塗布するスリットノズル 2とをつなぐ処理液 供給配管 3を備え、この処理液供給配管 3に上流側（タンクに近レ、側）から順に、処理 液圧送用のポンプ 4、フィルタ 5およびオン ·オフバルブ 6を設けている。  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a configuration diagram of a coating apparatus according to the present invention, FIG. 2 is an enlarged perspective view of a nozzle, and FIG. 3 is a sectional view of a pump. The coating apparatus according to the present invention stores a processing liquid such as a resist liquid. The tank (buffer tank) 1 and the slit nozzle 2 for applying the processing liquid to the surface of the semiconductor or glass substrate are connected to the processing liquid supply pipe 3. The upstream side (close to the tank, The pump 4 for processing liquid pressure, the filter 5 and the on / off valve 6 are provided in this order.
[0016] 前記スリットノズル 2の上面中央にはジョイント部 7が設けられ、このジョイント部 7に 前記処理液供給配管 3の端部が連結され、またジョイント部 7からは排出管 8が導出 され、この排出管 8に圧力センサ 9が取り付けられている。  [0016] A joint portion 7 is provided at the center of the upper surface of the slit nozzle 2, and an end portion of the processing liquid supply pipe 3 is connected to the joint portion 7, and a discharge pipe 8 is led out from the joint portion 7. A pressure sensor 9 is attached to the discharge pipe 8.
[0017] 一方、この実施例ではポンプ 4としてチューブフラムを用いている。このチューブフ ラム 4は図 3に示すように、処理液を搬送するチューブ 10の外側に、小径べローズ部 11と大径べローズ部 12をディスク 13を介して連接し、これら小径べローズ部 11と大 径べローズ部 12の内側とチューブ 10の外側の間に形成される空間 14内に作動油を 封入した構造になっている。 On the other hand, in this embodiment, a tube diaphragm is used as the pump 4. As shown in Fig. 3, this tube flamm 4 has a small-diameter bellows section on the outside of the tube 10 that conveys the processing liquid. 11 and the large-diameter bellows 12 are connected via a disk 13, and hydraulic fluid is supplied into the space 14 formed between the inside of the small-diameter bellows 11 and the large-diameter bellows 12 and the outside of the tube 10. It has an enclosed structure.
[0018] 以上において、ディスク 13を図 3において A方向に移動すると小径べローズ部 11 が伸張し大径べローズ 12が圧縮せしめられ、空間 14の容積が縮小しょうとする。しか しながら空間 14内の作動油は非圧縮性であるので、チューブ 10が縮小してチュー ブ 10内の処理液がポンプ 4から吐出する。また、ディスク 13を B方向に移動すると小 径べローズ部 11が圧縮し大径べローズ 12が伸張せしめられ、空間 14の容積が拡大 しょうとする。し力もながら空間 14内の作動油は非圧縮性であるので、チューブ 10が 膨張してチューブ 10内に処理液が吸引される。これを繰り返すことによって、処理液 供給配管 3内を一定方向に処理液が流れる。尚、処理液が流れる方向を一定にする ため、配管には逆止弁を設けてもよい。  In the above, when the disk 13 is moved in the direction A in FIG. 3, the small-diameter bellows portion 11 is expanded, the large-diameter bellows 12 is compressed, and the volume of the space 14 is to be reduced. However, since the hydraulic oil in the space 14 is incompressible, the tube 10 shrinks and the processing liquid in the tube 10 is discharged from the pump 4. Further, when the disk 13 is moved in the B direction, the small-diameter bellows portion 11 is compressed and the large-diameter bellows 12 is expanded, so that the volume of the space 14 is increased. However, since the hydraulic oil in the space 14 is incompressible, the tube 10 expands and the processing liquid is sucked into the tube 10. By repeating this, the treatment liquid flows in the treatment liquid supply pipe 3 in a certain direction. Note that a check valve may be provided in the pipe in order to make the direction in which the processing liquid flows constant.
[0019] ポンプ 4から吐出した処理液はフィルタ 5及びオン ·オフバルブ 6を介してスリットノズ ル 2に送られる。スリットノズル 2内に供給された処理液の一部はノズノレ下端の吐出口 から処理基板表面に塗布され、残りの処理液は排出管 8を介して回収される。このと き排出管 8内の処理液の圧力は圧力センサ 9によって測定される。この測定値はスリ ットノズル 2内の処理液の圧力と同じである。  The processing liquid discharged from the pump 4 is sent to the slit nozzle 2 through the filter 5 and the on / off valve 6. A part of the processing liquid supplied into the slit nozzle 2 is applied to the processing substrate surface from the discharge port at the lower end of the nozzle, and the remaining processing liquid is collected through the discharge pipe 8. At this time, the pressure of the processing liquid in the discharge pipe 8 is measured by the pressure sensor 9. This measured value is the same as the pressure of the processing liquid in the slit nozzle 2.
[0020] 図 4及び図 5は別実施例に係る塗布装置の構成図である。図 4に示す塗布装置に あっては、フィルタ 5の上流側と下流側に圧力センサ 15, 16を設け、またオン'オフバ ルブ 6の下流側に圧力センサ 17を設けている。圧力センサ 15, 16の差圧によってフ ィルタ 5の目詰まり状態を知ることができ、また圧力センサ 17と圧力センサ 9の差圧に よってノズル内の異常を検出することができる。  4 and 5 are configuration diagrams of a coating apparatus according to another embodiment. In the coating apparatus shown in FIG. 4, pressure sensors 15 and 16 are provided upstream and downstream of the filter 5, and a pressure sensor 17 is provided downstream of the on / off valve 6. The clogged state of the filter 5 can be known by the differential pressure of the pressure sensors 15 and 16, and the abnormality in the nozzle can be detected by the differential pressure of the pressure sensor 17 and the pressure sensor 9.
[0021] 図 5に示す塗布装置にあっては、ポンプ 4の上流側に圧力センサ 18を設けている。  In the coating apparatus shown in FIG. 5, a pressure sensor 18 is provided on the upstream side of the pump 4.
この圧力センサ 18によってタンク 1内の液切れを検出することができる。  The pressure sensor 18 can detect the lack of liquid in the tank 1.
産業上の利用可能性  Industrial applicability
[0022] 本発明に係る塗布装置は、レジスト液やカラーフィルター用塗布液などの処理液を 半導体ゥエーハゃガラス基板表面に塗布する場合に利用できる。 The coating apparatus according to the present invention can be used when a processing solution such as a resist solution or a color filter coating solution is applied to the surface of a semiconductor wafer glass substrate.

Claims

請求の範囲 The scope of the claims
[1] 処理液タンク内の処理液をポンプにて吸引し、ポンプから吐出する処理液を配管を 介してノズルに送り込む塗布装置にお!/、て、前記ノズルから導出される処理液の排 出管に圧力センサを取り付けたことを特徴とする塗布装置。  [1] In a coating apparatus that sucks the processing liquid in the processing liquid tank with a pump and sends the processing liquid discharged from the pump to the nozzle via a pipe! /, And discharges the processing liquid derived from the nozzle. A coating apparatus comprising a pressure sensor attached to the outlet pipe.
[2] 請求項 1に記載の塗布装置において、前記ポンプとノズルとをつなぐ配管にはフィル タと開閉弁がこの順序で設けられ、前記フィルタの上流側と下流側、及び前記開閉 弁とノズルとの間にはそれぞれ圧力センサが設けられていることを特徴とする塗布装 置。  [2] The coating apparatus according to claim 1, wherein a filter and an on-off valve are provided in this order on a pipe connecting the pump and the nozzle, and the upstream and downstream sides of the filter, and the on-off valve and the nozzle. An applicator characterized in that a pressure sensor is provided between each.
[3] 請求項 1に記載の塗布装置において、前記処理液タンクとポンプとの間には圧力セ ンサが設けられて!/、ることを特徴とする塗布装置。  [3] The coating apparatus according to claim 1, wherein a pressure sensor is provided between the processing liquid tank and the pump.
PCT/JP2007/066843 2006-09-11 2007-08-30 Coating applicator WO2008032577A1 (en)

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JP2006244922A JP2008062207A (en) 2006-09-11 2006-09-11 Coating apparatus

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JP5897263B2 (en) * 2011-03-18 2016-03-30 株式会社日立製作所 Paste application head, paste application device, and paste application method
CN102488324A (en) * 2011-12-16 2012-06-13 新乡东方工业科技有限公司 Glue supply device for cigarette making machine
US9120115B2 (en) * 2012-10-25 2015-09-01 Nordson Corporation Dispensing systems and methods for monitoring actuation signals for diagnostics
JP6942497B2 (en) * 2016-09-08 2021-09-29 東京エレクトロン株式会社 Processing liquid supply device

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