WO2008025182A3 - Sensoreinheit - Google Patents
Sensoreinheit Download PDFInfo
- Publication number
- WO2008025182A3 WO2008025182A3 PCT/CH2007/000421 CH2007000421W WO2008025182A3 WO 2008025182 A3 WO2008025182 A3 WO 2008025182A3 CH 2007000421 W CH2007000421 W CH 2007000421W WO 2008025182 A3 WO2008025182 A3 WO 2008025182A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sensor
- measurement
- base body
- electronics
- opening
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0069—Electrical connection means from the sensor to its support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Pressure Sensors (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009525889A JP2010501865A (ja) | 2006-08-30 | 2007-08-28 | センサ・ユニット |
EP07785111A EP2057452A2 (de) | 2006-08-30 | 2007-08-28 | Sensoreinheit |
US12/439,273 US7963154B2 (en) | 2006-08-30 | 2007-08-28 | Sensor unit for the measurment of a variable in a medium |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH13912006 | 2006-08-30 | ||
CH1391/06 | 2006-08-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008025182A2 WO2008025182A2 (de) | 2008-03-06 |
WO2008025182A3 true WO2008025182A3 (de) | 2008-05-29 |
Family
ID=38006624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CH2007/000421 WO2008025182A2 (de) | 2006-08-30 | 2007-08-28 | Sensoreinheit |
Country Status (4)
Country | Link |
---|---|
US (1) | US7963154B2 (de) |
EP (1) | EP2057452A2 (de) |
JP (1) | JP2010501865A (de) |
WO (1) | WO2008025182A2 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110301569A1 (en) | 2001-01-20 | 2011-12-08 | Gordon Wayne Dyer | Methods and apparatus for the CVCS |
FR2919942B1 (fr) * | 2007-08-08 | 2009-12-25 | Prospection Et D Inventsions T | Procede et systeme de tracabilite de la charge vibratoire d'un outil et l'outil du systeme |
US9046426B1 (en) | 2012-06-15 | 2015-06-02 | The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration | Modular apparatus and method for attaching multiple devices |
US9964460B2 (en) * | 2014-02-24 | 2018-05-08 | Kulite Semiconductor Products, Inc. | Pressure sensor having a front seal |
US9341536B2 (en) * | 2014-02-24 | 2016-05-17 | Kulite Semiconductor Products, Inc. | Pressure sensor having a front seal |
DE102015116648A1 (de) * | 2015-10-01 | 2017-04-06 | Biotronik Se & Co. Kg | Implantierbare Drucksensorvorrichtung |
KR101782535B1 (ko) * | 2016-01-28 | 2017-10-24 | 대모 엔지니어링 주식회사 | 유압브레이커 |
US11092083B2 (en) | 2017-02-10 | 2021-08-17 | General Electric Company | Pressure sensor assembly for a turbine engine |
WO2018155915A1 (ko) * | 2017-02-22 | 2018-08-30 | 타이코에이엠피 주식회사 | 압력 센서 |
EP3755590B1 (de) * | 2018-02-23 | 2023-01-11 | Continental Automotive Technologies GmbH | Montageanordnung für ein stellglied einer elektrischen feststellbremse, halterung, ankerplatte und verfahren zur montage |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19716521A1 (de) * | 1997-04-19 | 1998-10-22 | Bosch Gmbh Robert | Kraftsensor in LTCC-Technologie |
EP1144977A1 (de) * | 1998-12-15 | 2001-10-17 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. | Verfahren zum erzeugen eines mikro-elektromechanischen elements |
US6845664B1 (en) * | 2002-10-03 | 2005-01-25 | The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration | MEMS direct chip attach packaging methodologies and apparatuses for harsh environments |
DE102004013073A1 (de) * | 2004-03-11 | 2005-09-29 | Ab Elektronik Sachsen Gmbh | Verfahren zur Herstellung von Druckmesselementen und Druckmesselemente |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8615305D0 (en) | 1986-06-23 | 1986-07-30 | Stc Plc | Pressure sensor |
JPH0534225A (ja) * | 1991-07-31 | 1993-02-09 | Casio Comput Co Ltd | センサ装置 |
JPH0575637U (ja) * | 1992-03-16 | 1993-10-15 | 横河電機株式会社 | 圧力センサ |
CH683718A5 (de) * | 1992-05-15 | 1994-04-29 | Kk Holding Ag | Kombinierter Kraft-, Dehnungs- und Schallemissionsaufnehmer. |
DE19509188B4 (de) | 1994-03-14 | 2004-04-29 | Denso Corp., Kariya | Druckdetektor |
JP3136087B2 (ja) * | 1995-10-26 | 2001-02-19 | 松下電工株式会社 | 半導体圧力センサ |
JPH118270A (ja) | 1997-06-16 | 1999-01-12 | Tokai Rika Co Ltd | 半導体チップの搭載方法、チップオンチップ構造体の製造方法及びチップオンボード構造体の製造方法 |
US5973590A (en) * | 1998-03-12 | 1999-10-26 | Kulite Semiconductor Products, Inc. | Ultra thin surface mount wafer sensor structures and methods for fabricating same |
JP2001304996A (ja) * | 2000-04-25 | 2001-10-31 | Matsushita Electric Works Ltd | 集積型半導体圧力センサおよびその製造方法 |
JP2002082009A (ja) | 2000-06-30 | 2002-03-22 | Denso Corp | 圧力センサ |
JP2002071491A (ja) * | 2000-08-25 | 2002-03-08 | Denso Corp | 圧力センサ |
JP2003322573A (ja) * | 2002-04-30 | 2003-11-14 | Fujikura Ltd | 電子デバイスの取付構造 |
JP2005043159A (ja) * | 2003-07-25 | 2005-02-17 | Hitachi Unisia Automotive Ltd | 圧力センサ |
JP2009501910A (ja) * | 2005-07-20 | 2009-01-22 | キストラー ホールディング アクチエンゲゼルシャフト | センサ・ユニット |
JP5050392B2 (ja) * | 2006-04-13 | 2012-10-17 | 株式会社デンソー | 圧力センサ |
-
2007
- 2007-08-28 JP JP2009525889A patent/JP2010501865A/ja active Pending
- 2007-08-28 EP EP07785111A patent/EP2057452A2/de not_active Withdrawn
- 2007-08-28 US US12/439,273 patent/US7963154B2/en not_active Expired - Fee Related
- 2007-08-28 WO PCT/CH2007/000421 patent/WO2008025182A2/de active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19716521A1 (de) * | 1997-04-19 | 1998-10-22 | Bosch Gmbh Robert | Kraftsensor in LTCC-Technologie |
EP1144977A1 (de) * | 1998-12-15 | 2001-10-17 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. | Verfahren zum erzeugen eines mikro-elektromechanischen elements |
US6845664B1 (en) * | 2002-10-03 | 2005-01-25 | The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration | MEMS direct chip attach packaging methodologies and apparatuses for harsh environments |
DE102004013073A1 (de) * | 2004-03-11 | 2005-09-29 | Ab Elektronik Sachsen Gmbh | Verfahren zur Herstellung von Druckmesselementen und Druckmesselemente |
Also Published As
Publication number | Publication date |
---|---|
US20100018494A1 (en) | 2010-01-28 |
JP2010501865A (ja) | 2010-01-21 |
EP2057452A2 (de) | 2009-05-13 |
US7963154B2 (en) | 2011-06-21 |
WO2008025182A2 (de) | 2008-03-06 |
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