JP2010501865A - センサ・ユニット - Google Patents
センサ・ユニット Download PDFInfo
- Publication number
- JP2010501865A JP2010501865A JP2009525889A JP2009525889A JP2010501865A JP 2010501865 A JP2010501865 A JP 2010501865A JP 2009525889 A JP2009525889 A JP 2009525889A JP 2009525889 A JP2009525889 A JP 2009525889A JP 2010501865 A JP2010501865 A JP 2010501865A
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- measurement
- measuring
- sensor unit
- unit according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005259 measurement Methods 0.000 claims abstract description 81
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000002775 capsule Substances 0.000 claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 32
- 239000011521 glass Substances 0.000 claims description 31
- 239000010703 silicon Substances 0.000 claims description 30
- 229910052710 silicon Inorganic materials 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 17
- 238000002485 combustion reaction Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 238000005516 engineering process Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- 239000010705 motor oil Substances 0.000 claims description 4
- 238000002161 passivation Methods 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 239000003921 oil Substances 0.000 claims description 3
- 239000012809 cooling fluid Substances 0.000 claims description 2
- 239000000446 fuel Substances 0.000 claims description 2
- 239000003502 gasoline Substances 0.000 claims description 2
- 239000010720 hydraulic oil Substances 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 24
- 239000002184 metal Substances 0.000 description 24
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 229910000831 Steel Inorganic materials 0.000 description 9
- 239000010959 steel Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000012212 insulator Substances 0.000 description 6
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 239000005297 pyrex Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000001627 detrimental effect Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000331006 Euchaeta media Species 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000012260 resinous material Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0069—Electrical connection means from the sensor to its support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Pressure Sensors (AREA)
Abstract
Description
2 媒体
3 センサ・カプセル
4 センサ
5 基体
6 センサ領域
7 測定開口部
8 測定用電子装
9 測定面
10 給電線
11 めっきスルーホール
12 ベース側
13 カバー層
14 基準手段
15 基準面
16 センサ支持体
17 結合解除手段
18 支持プレート
19 接続手段
20 絶縁層
21 金属被覆
22 BOX
71 孔ダイヤフラム
72 開口部
73 装着手段
80 接触ブリッジ
91 測定開口部の方を向いている側面
181 ガラス絶縁体
P0 基準測定変数
Claims (15)
- 基体(5)に配置されているセンサ領域(6)を有するセンサ・カプセル(3)内に配置されているセンサ(4)を備える、媒体(2)、特に、アグレッシブな液体又はガス状媒体(2)内の測定変数を測定するためのセンサ・ユニットであって、前記センサ・カプセル(3)内の前記センサ領域(6)内の前記測定変数を検出するために測定開口部(7)が設けられ、前記センサ領域(6)が、前記測定開口部の方を向いている1つの側面(91)上に位置し、測定面(9)が測定用電子装置(8)を含み、前記基体(5)及び前記測定用電子装置(8)の両方が、半導体材料からできていて、前記センサ(4)において前記測定用電子装置(8)が発生したセンサ信号を伝達するために、少なくとも1つの給電線(10)を備え、前記基体(5)内に少なくとも1つのめっきスルーホール(11)が設けられており、該スルーホール11により、前記測定用電子装置(8)が、前記測定開口部(7)の反対方向を向いている前記センサ(4)のベース側(12)上の前記給電線(10)と、前記基体(5)を通る信号を介して接続されることを特徴とするセンサ・ユニット。
- 前記測定開口部の方を向いている前記側面(91)が、カバー層(13)、特に前記媒体(2)を保護するための酸化シリコン及び/又は窒化シリコンからできているパッシベーション層(13)を含む、請求項1に記載のセンサ・ユニット。
- 前記測定面(9)に対向する基準面(15)が基準測定変数(P0)を受けることができるように、基準手段(14)が設けられる、請求項1又は2に記載のセンサ・ユニット。
- 孔ダイヤフラム(71)が、前記測定開口部(7)に設けられる、前記請求項のいずれか1項に記載のセンサ・ユニット。
- 前記センサ(4)が、センサ支持体(16)上、特にガラス・ウェーハ(16)又はシリコン・ウェーハ(16)上に配置される、前記請求項のいずれか1項に記載のセンサ・ユニット。
- 測定面(9)と基準面(15)との間で媒体を分離するために、前記センサ(4)が、密封状態で、特に前記ベース側(12)の、予め定めることができる領域内に陽極接合プロセスにより前記センサ支持体(16)と接続される、前記請求項のいずれか1項に記載のセンサ・ユニット。
- 前記センサ(4)が、高温センサ(4)であるか、及び/又はSOI技術により作られる、前記請求項のいずれか1項に記載のセンサ・ユニット。
- 前記センサ(4)が、特に前記センサ・カプセル(3)内の熱的及び/又は機械的に生じた変化から結合解除されるように、結合解除手段(17)が設けられる、前記請求項のいずれか1項に記載のセンサ・ユニット。
- 前記結合解除手段(17)が、前記基体(5)と前記センサ支持体(16)及び/又は前記センサ支持体(16)と支持プレート(18)との間に形成される、前記請求項のいずれか1項に記載のセンサ・ユニット。
- 前記結合解除手段(17)が、前記給電線(10)の領域内に設けられる、前記請求項のいずれか1項に記載のセンサ・ユニット。
- 前記結合解除手段(17)が、前記基体(5)及び/又は前記センサ支持体(16)及び/又は前記接続手段(19)及び/又は前記センサ・カプセル(3)及び/又は前記支持プレート(18)間の熱膨張係数を一致させることにより生成される、前記請求項のいずれか1項に記載のセンサ・ユニット。
- 前記センサ・ユニットが、取り付けのための装着手段を備え、前記装着手段が、M5ネジ山として特に設計されているか、及び/又は前記結合解除手段(17)の形をしている装着手段である、前記請求項のいずれか1項に記載のセンサ・ユニット。
- 前記センサ(4)が、圧力センサ(4)及び/又は温度センサ(4)、特に圧抵抗センサ(4)及び/又は圧電センサ(4)である、前記請求項のいずれか1項に記載のセンサ・ユニット。
- 特に、内燃機関のエンジン入口内、及び/又はエンジン排気開口部内又は燃焼室内及び/又はエンジン・ハウジング内、及び/又は排気システム内のガス圧及び/又は温度を測定するための、及び/又はタービン、特にガス・タービン内の圧力及び/又は温度を測定するための、又はエンジン・オイル、ブレーキ液、油圧オイル、トランスミッション・オイル、燃料、特にジーゼル又はガソリン、冷媒、又は冷却流体、特に水の圧力及び/又は温度を測定するための、請求項1〜12のいずれか1項に記載のセンサ・ユニット(1)を有するセンサ。
- 請求項1〜12のいずれか1項に記載のセンサ・ユニット(1)を有し、及び/又は請求項13に記載のセンサを有する燃焼エンジン、油圧又は空気圧ツール又は空調装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH13912006 | 2006-08-30 | ||
PCT/CH2007/000421 WO2008025182A2 (de) | 2006-08-30 | 2007-08-28 | Sensoreinheit |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2010501865A true JP2010501865A (ja) | 2010-01-21 |
Family
ID=38006624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009525889A Pending JP2010501865A (ja) | 2006-08-30 | 2007-08-28 | センサ・ユニット |
Country Status (4)
Country | Link |
---|---|
US (1) | US7963154B2 (ja) |
EP (1) | EP2057452A2 (ja) |
JP (1) | JP2010501865A (ja) |
WO (1) | WO2008025182A2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110301569A1 (en) | 2001-01-20 | 2011-12-08 | Gordon Wayne Dyer | Methods and apparatus for the CVCS |
FR2919942B1 (fr) * | 2007-08-08 | 2009-12-25 | Prospection Et D Inventsions T | Procede et systeme de tracabilite de la charge vibratoire d'un outil et l'outil du systeme |
US9046426B1 (en) | 2012-06-15 | 2015-06-02 | The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration | Modular apparatus and method for attaching multiple devices |
US9964460B2 (en) | 2014-02-24 | 2018-05-08 | Kulite Semiconductor Products, Inc. | Pressure sensor having a front seal |
US9341536B2 (en) * | 2014-02-24 | 2016-05-17 | Kulite Semiconductor Products, Inc. | Pressure sensor having a front seal |
DE102015116648A1 (de) * | 2015-10-01 | 2017-04-06 | Biotronik Se & Co. Kg | Implantierbare Drucksensorvorrichtung |
KR101782535B1 (ko) * | 2016-01-28 | 2017-10-24 | 대모 엔지니어링 주식회사 | 유압브레이커 |
US11092083B2 (en) | 2017-02-10 | 2021-08-17 | General Electric Company | Pressure sensor assembly for a turbine engine |
WO2018155915A1 (ko) * | 2017-02-22 | 2018-08-30 | 타이코에이엠피 주식회사 | 압력 센서 |
EP3755590B1 (en) * | 2018-02-23 | 2023-01-11 | Continental Automotive Technologies GmbH | Electric parking brake actuator mounting assembly, supporting bracket, brake backplate and a process for mounting |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0534225A (ja) * | 1991-07-31 | 1993-02-09 | Casio Comput Co Ltd | センサ装置 |
JPH0575637U (ja) * | 1992-03-16 | 1993-10-15 | 横河電機株式会社 | 圧力センサ |
JPH09126920A (ja) * | 1995-10-26 | 1997-05-16 | Matsushita Electric Works Ltd | 半導体圧力センサ |
JP2001304996A (ja) * | 2000-04-25 | 2001-10-31 | Matsushita Electric Works Ltd | 集積型半導体圧力センサおよびその製造方法 |
JP2002071491A (ja) * | 2000-08-25 | 2002-03-08 | Denso Corp | 圧力センサ |
JP2003322573A (ja) * | 2002-04-30 | 2003-11-14 | Fujikura Ltd | 電子デバイスの取付構造 |
JP2005043159A (ja) * | 2003-07-25 | 2005-02-17 | Hitachi Unisia Automotive Ltd | 圧力センサ |
JP2007285750A (ja) * | 2006-04-13 | 2007-11-01 | Denso Corp | 圧力センサ |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8615305D0 (en) | 1986-06-23 | 1986-07-30 | Stc Plc | Pressure sensor |
CH683718A5 (de) * | 1992-05-15 | 1994-04-29 | Kk Holding Ag | Kombinierter Kraft-, Dehnungs- und Schallemissionsaufnehmer. |
FR2717262B1 (fr) | 1994-03-14 | 1997-09-26 | Nippon Denso Co | Détecteur de pression. |
DE19716521C2 (de) * | 1997-04-19 | 2001-03-01 | Bosch Gmbh Robert | Kraftsensor in LTCC-Technologie |
JPH118270A (ja) | 1997-06-16 | 1999-01-12 | Tokai Rika Co Ltd | 半導体チップの搭載方法、チップオンチップ構造体の製造方法及びチップオンボード構造体の製造方法 |
US5973590A (en) | 1998-03-12 | 1999-10-26 | Kulite Semiconductor Products, Inc. | Ultra thin surface mount wafer sensor structures and methods for fabricating same |
US7273763B1 (en) * | 1998-12-15 | 2007-09-25 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Method of producing a micro-electromechanical element |
JP2002082009A (ja) | 2000-06-30 | 2002-03-22 | Denso Corp | 圧力センサ |
US6845664B1 (en) * | 2002-10-03 | 2005-01-25 | The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration | MEMS direct chip attach packaging methodologies and apparatuses for harsh environments |
DE102004013073A1 (de) * | 2004-03-11 | 2005-09-29 | Ab Elektronik Sachsen Gmbh | Verfahren zur Herstellung von Druckmesselementen und Druckmesselemente |
WO2007009277A1 (de) * | 2005-07-20 | 2007-01-25 | Kistler Holding Ag | Sensoreinheit |
-
2007
- 2007-08-28 WO PCT/CH2007/000421 patent/WO2008025182A2/de active Application Filing
- 2007-08-28 EP EP07785111A patent/EP2057452A2/de not_active Withdrawn
- 2007-08-28 US US12/439,273 patent/US7963154B2/en not_active Expired - Fee Related
- 2007-08-28 JP JP2009525889A patent/JP2010501865A/ja active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0534225A (ja) * | 1991-07-31 | 1993-02-09 | Casio Comput Co Ltd | センサ装置 |
JPH0575637U (ja) * | 1992-03-16 | 1993-10-15 | 横河電機株式会社 | 圧力センサ |
JPH09126920A (ja) * | 1995-10-26 | 1997-05-16 | Matsushita Electric Works Ltd | 半導体圧力センサ |
JP2001304996A (ja) * | 2000-04-25 | 2001-10-31 | Matsushita Electric Works Ltd | 集積型半導体圧力センサおよびその製造方法 |
JP2002071491A (ja) * | 2000-08-25 | 2002-03-08 | Denso Corp | 圧力センサ |
JP2003322573A (ja) * | 2002-04-30 | 2003-11-14 | Fujikura Ltd | 電子デバイスの取付構造 |
JP2005043159A (ja) * | 2003-07-25 | 2005-02-17 | Hitachi Unisia Automotive Ltd | 圧力センサ |
JP2007285750A (ja) * | 2006-04-13 | 2007-11-01 | Denso Corp | 圧力センサ |
Also Published As
Publication number | Publication date |
---|---|
US7963154B2 (en) | 2011-06-21 |
EP2057452A2 (de) | 2009-05-13 |
US20100018494A1 (en) | 2010-01-28 |
WO2008025182A2 (de) | 2008-03-06 |
WO2008025182A3 (de) | 2008-05-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2010501865A (ja) | センサ・ユニット | |
KR100402875B1 (ko) | 매개체에적합한마이크로센서구조물및이의제조방법 | |
US7540196B2 (en) | Pressure transducer adapted to measure engine pressure parameters | |
US9054222B2 (en) | Pressure resistently encapsulated, pressure difference sensor | |
EP2316008B1 (en) | Sensor device packaging and corresponding method | |
US7216547B1 (en) | Pressure sensor with silicon frit bonded cap | |
US7703329B2 (en) | Pressure sensor | |
CN109696268B (zh) | 压力传感器组件 | |
US7563634B2 (en) | Method for mounting semiconductor chips, and corresponding semiconductor chip system | |
US7549344B2 (en) | Pressure sensor package and electronic part | |
CN109642844B (zh) | 用于减少压力测量室的容积的填充体 | |
US6782757B2 (en) | Membrane pressure sensor containing silicon carbide and method of manufacture | |
CA2975342C (en) | Mems sensor with electronics integration | |
JPH05507358A (ja) | 内燃機関の燃焼室内の圧力を検出するための圧力センサ | |
JP2007240250A (ja) | 圧力センサ、圧力センサパッケージ、圧力センサモジュール、及び電子部品 | |
US20110073969A1 (en) | Sensor system and method for manufacturing same | |
JP2009501910A (ja) | センサ・ユニット | |
JP2006194682A (ja) | 温度センサ一体型圧力センサ装置 | |
KR100511143B1 (ko) | 내연기관의흡입관내의압력및온도검출장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100813 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120706 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120717 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20121017 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20121024 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121116 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130927 |