WO2008010303A1 - Dispositif de coupe - Google Patents

Dispositif de coupe Download PDF

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Publication number
WO2008010303A1
WO2008010303A1 PCT/JP2006/316192 JP2006316192W WO2008010303A1 WO 2008010303 A1 WO2008010303 A1 WO 2008010303A1 JP 2006316192 W JP2006316192 W JP 2006316192W WO 2008010303 A1 WO2008010303 A1 WO 2008010303A1
Authority
WO
WIPO (PCT)
Prior art keywords
cutting
cut
workpiece
cutting tool
temperature
Prior art date
Application number
PCT/JP2006/316192
Other languages
English (en)
Japanese (ja)
Inventor
Masaaki Takita
Original Assignee
Takita Research & Development Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takita Research & Development Co., Ltd. filed Critical Takita Research & Development Co., Ltd.
Priority to CN2007800274974A priority Critical patent/CN101489746B/zh
Priority to JP2008525846A priority patent/JP4414473B2/ja
Priority to PCT/JP2007/063969 priority patent/WO2008010457A1/fr
Priority to KR1020097000370A priority patent/KR101069621B1/ko
Priority to TW096126441A priority patent/TW200812924A/zh
Publication of WO2008010303A1 publication Critical patent/WO2008010303A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/005—Devices for the automatic drive or the program control of the machines

Definitions

  • the present invention relates to a cutting apparatus, and is applied to a cutting object made of a brittle material such as glass or ceramic, preferably a cutting object of a thin plate, and particularly, for example, a display of a liquid crystal or a plasma display.
  • the present invention relates to a cutting apparatus suitable for cutting a glass substrate in a panel manufacturing process.
  • an oblique cut line (cut line) [corresponding to “Niyu”] is formed on one main surface side of a glass plate with a diamond disc.
  • the glass plate is deformed by heating the surface with the cut line and the outside of the area surrounded by the cut line, and by this deformation, the oblique cut line instantaneously reaches the side opposite to the heating surface.
  • a glass cutting method characterized in that a portion surrounded by a cut line is separated (see, for example, Patent Document 2).
  • the surface of the glass sheet is irradiated with laser light such as a carbon dioxide laser, HF laser, and YAG laser to locally heat, and then rapidly cooled.
  • laser light such as a carbon dioxide laser, HF laser, and YAG laser
  • the prior art as the background of the present invention includes at least two points near the edge of the workpiece W made of a brittle material such as glass or alumina ceramic.
  • a laser beam such as a carbon dioxide laser or a YAG laser is simultaneously irradiated to two points in the vicinity of the Eve groove planned line) to generate an initial crack, and a unique thermal stress distribution is generated between the laser beam irradiation positions.
  • a brittle material cleaving method has also been proposed, characterized by increasing the tensile stress compared to the case of single-point laser beam irradiation and controlling the stress generation state to enhance cleaving control. (For example, see Patent Document 4).
  • the energy density in each part is uniform, and the cut portion of the glass substrate is heated by irradiating a laser beam in which the laser beam spot forms a vertically long shape in the cutting direction
  • a glass substrate that has a heating process and a cooling process that forms a microcrack by rapidly cooling a cut portion that is heated by laser beam irradiation, thereby enabling the generation of microcracks and improving productivity.
  • the prior art as the background of the present invention includes cracking means for making fine cracks at the cutting start point of the glass plate, irradiation heating means by at least one laser beam absorbed by the glass plate, and at least After irradiation heating with one laser beam, in a glass plate cutting device including a cooling means for cooling a glass plate with a cooling fluid and a braking means, an irradiation means in which the laser beam is a first carbon dioxide laser beam, and an irradiation means After the first control means for controlling the temperature within a predetermined range and the first cooling means by the cooling fluid provided at the rear of the first carbon dioxide laser beam irradiation means are arranged to generate the scribe line, the glass plate There has been proposed a glass plate cutting device or the like characterized by performing the braking process (see, for example, Patent Document 7).
  • Patent Document 1 JP-A-6-48755
  • Patent Document 2 Japanese Patent Laid-Open No. 7-223828
  • Patent Document 3 Japanese Patent Laid-Open No. 9-12327
  • Patent Document 4 JP-A-7-328781
  • Patent Document 5 Japanese Unexamined Patent Publication No. 2005-247603
  • Patent Document 6 Japanese Unexamined Patent Publication No. 2000-219528
  • Patent Document 7 Special Publication 2006—513121
  • Patent Document 2 it is difficult to control the direction in which the cut lines are generated, and there is a problem that a crack is generated inside the glass plate, resulting in poor product quality.
  • Patent Document 3 it is necessary to increase the irradiation output of the laser beam, so the distortion in the scribe groove may affect the crack in the in-plane direction of the glass plate.
  • the performance of the glass plate as a product is deteriorated, such as peeling of a glass piece along the scribe groove.
  • a laser beam is irradiated and generated by a localized concentrated stress generated by a steep temperature gradient generated between the center and the periphery of the beam.
  • the thermal stress (tensile stress) generated varies depending on various conditions such as temperature, the scattering state on the material surface and the light absorption rate in the material, and the local concentrated stress does not exceed the allowable stress of the material. Therefore, there is a problem that the certainty of the occurrence of the initial crack is low.
  • the path force of the movement of the laser beam irradiation position when inducing cracks may cause the cracks to shift and follow, so if the processing accuracy deteriorates, the problem remains.
  • the technique of Patent Document 5 requires a process of forming a processed part thinner than other parts in advance before drilling or cutting a processed part by irradiating a laser. In addition, it requires a press machine to form thinly, resulting in high manufacturing costs.
  • a main object of the present invention is to provide a cutting device that can prevent the occurrence of cracks and accurately and stably cut a workpiece without damaging the quality of the workpiece. That is.
  • the present invention is a cutting device that cuts a workpiece formed of a brittle material such as glass, ceramic, or semiconductor material, and abuts on a desired cutting site of the workpiece.
  • a cutting tool that can be arranged and a displacement means for generating a relative movement between the cutting tool and the workpiece along the cutting site, the cutting tool cutting the workpiece.
  • a heating element that heats the cutting edge at a temperature higher than the softening point of the object to be cut at a temperature higher than the softening point of the object to be cut, and is heated by the object to be cut and the heating element by the displacing means.
  • the cutting device is characterized in that a relative movement is generated between the cutting blade portion and the cutting portion of the workpiece is cut and cut.
  • heating is performed by the cutting tool force heating element disposed so as to be able to come into contact with a desired cutting site of the workpiece.
  • the edge part of the cutting edge part is heated to a temperature higher than the soft saddle point of the workpiece.
  • the cutting tool is moved relative to the workpiece by the displacement means. That is, the cutting edge portion of the cutting tool and Z or the object to be cut are relatively displaced along the desired cutting site. Therefore, a groove corresponding to the shape of the edge portion is formed by the edge portion of the cutting edge portion at a desired cutting site of the object to be cut.
  • the cutting portion is heated by the heated edge portion locally and rapidly at a temperature higher than the softening point of the object to be cut.
  • the object to be cut at the site to be plastically deformed. And The part that has undergone plastic deformation becomes chips and is scraped away from the object to be cut. Finally, the object to be cut is cut along the desired cutting site.
  • the cutting tool and the object to be cut are brought into contact with the desired cutting site of the object to be cut by bringing the edge part of the cutting edge heated to the soft saddle point or more of the object to be cut.
  • the present invention according to claim 2 is an invention dependent on the invention according to claim 1, wherein the cutting edge is maintained at a predetermined temperature while the workpiece is being cut by the cutting tool.
  • the cutting device further includes temperature control means for controlling the temperature of the heating element.
  • the temperature of the cutting edge is maintained at a predetermined temperature while the workpiece is being cut by the cutting tool by the temperature control means. Therefore, it is possible to stably apply the desired thermal tension to the groove portion and the vicinity of the groove portion, and it is possible to further cut the object to be cut accurately and stably without cutting failure.
  • the present invention according to claim 3 is an invention dependent on the invention according to claim 2, wherein the temperature control means is disposed in the vicinity of the heating element and detects the temperature of the edge portion of the cutting edge portion. While the workpiece is being cut by the cutting tool, based on the detection signal of the temperature detection sensor force, the relative speed generated between the cutting tool and the workpiece and the Z or workpiece
  • the cutting apparatus further includes a control unit that controls a cutting depth of the cutting blade portion with respect to the cut object.
  • the control unit detects the speed and Z according to the relative movement generated between the cutting tool and the workpiece in accordance with the detection signal from the temperature detection sensor. Or the cutting depth of the cutting edge part with respect to a to-be-cut object can be controlled suitably. Therefore, while cutting the workpiece with a cutting tool, the cutting of the workpiece due to the temperature conditions of the cutting blade portion of the cutting tool and the relative movement between the cutting tool and the workpiece. The conditions are always optimal, and the workpiece can be cut more accurately and stably without cutting defects.
  • the present invention according to claim 4 is an invention according to the invention according to any one of claims 1 to 3, wherein heating means for preliminarily heating a portion to be cut with a cutting tool is provided. Furthermore, it is a cutting device.
  • the part to be cut with the cutting tool is preliminarily heated by the heating means. Therefore, the workpiece can be heated to a temperature above the soft saddle point with a cutting tool even more easily. Accordingly, the cutting speed can be further improved and the machinability can be stabilized, so that more stable workability can be secured.
  • the cutting device of the present invention it is possible to prevent the generation of cracks and accurately and stably cut the workpiece without damaging the quality of the workpiece.
  • FIG. 1 is a perspective view of a principal part showing an example of an embodiment of a cutting device according to the present invention.
  • FIG. 2 is a schematic plan view schematically showing an example of a cutting tool applied to the embodiment of FIG.
  • FIG. 3 shows an example of a manufacturing method of a cutting tool applied to the embodiment of FIG. 1.
  • (A) is a perspective view showing a state in which a temperature detection sensor is formed on a ceramic substrate.
  • (B) is an illustration of a side view.
  • FIG. 4 shows an example of a manufacturing method of a cutting tool applied to the embodiment of FIG. 1.
  • (A) is a perspective view showing a state in which an insulating layer is formed on a temperature detection sensor.
  • (B) is an illustration of a side view.
  • FIG. 5 shows an example of a manufacturing method of a cutting tool applied to the embodiment of FIG. 1.
  • (A) is a perspective schematic view showing a state where a heating element is formed
  • (B ) Is an illustration of the side.
  • FIG. 6 shows an example of a manufacturing method of a cutting tool applied to the embodiment of FIG. 1.
  • (A) is a perspective view showing a state in which a wear-resistant layer is formed on a heating element.
  • (B) is a schematic side view.
  • FIG. 7 shows an example of a manufacturing method of a cutting tool applied to the embodiment of FIG. 1.
  • (A) is a perspective schematic view showing a state in which an electrode is formed at the end of a heating element.
  • (B) is a schematic illustration of its side.
  • FIG. 8 shows an example of a manufacturing method of a cutting tool applied to the embodiment of FIG. 1.
  • (A) is a perspective view showing a state in which a cutting edge portion is formed by blade grinding or the like.
  • FIG. 4B is an illustration of a side view thereof.
  • FIG. 9 is a fragmentary perspective view showing an example of another embodiment of the cutting device according to the present invention.
  • FIG. 1 is an essential part perspective view showing an example of an embodiment of a cutting device according to the present invention
  • FIG. 2 is a schematic view of an example of a cutting tool applied to the embodiment of FIG. FIG.
  • the cutting device according to the present invention can be applied to cut brittle materials such as optical glass, quartz glass, other glasses, ceramics, silicon, and semiconductor materials.
  • a cutting apparatus 10 suitable for cutting a glass plate in a liquid crystal and plasma display panel manufacturing process will be described.
  • the cutting device 10 includes a cutting tool 12.
  • the cutting tool 12 is disposed so as to be able to contact a desired cutting site ⁇ of a rectangular glass plate W as a workpiece (workpiece).
  • the cutting tool 10 has a local portion for cutting the glass sheet W (corresponding to a cutting edge part of a cutting edge part to be described later) at a temperature higher than the softening point of the glass sheet W.
  • a temperature detection sensor and a heating element are formed on a ceramic substrate so that the temperature can be accurately and rapidly controlled at a high temperature in the range of about 600 ° C to 1000 ° C.
  • the cutting edge portion of the glass plate W is cut and cut at the cutting edge of the cutting edge heated to a predetermined temperature.
  • the cutting tool 12 includes a cutting tool body 14 having, for example, a pentagonal shape in plan view as shown in FIG.
  • the cutting tool main body 14 includes, for example, a ceramic substrate 16 having a ceramic force.
  • the ceramic substrate 16 includes, for example, a V-shaped cutting edge 18 on one end side in the longitudinal direction.
  • the cutting edge portion 18 has a portion for cutting the glass plate W as an object to be cut, that is, a blade edge portion 20 as an edge portion.
  • the cutting edge 20 is one main surface of the ceramic substrate 16. It is located at the top end of the cutting edge 18 on the side.
  • an insulating material such as silicon oxide, silicon oxide aluminum, zirconium oxide, titanium oxide, or mullite can be used as appropriate.
  • a temperature detection sensor 22 having a U-shape in plan view is formed.
  • An electrode 22a and an electrode 22b are connected to one end and the other end of the temperature detection sensor 22, respectively.
  • the electrode 22a and the electrode 22b are each made of gold, gold, copper alloy, or the like.
  • a thermocouple made of chromel'alumel, platinum'rhodium, or the like, or an electric resistor made of platinum, gold tantalum, or the like can be used as appropriate.
  • an insulating layer 24 made of, for example, silicon dioxide or silicon dioxide is formed on one main surface side of the ceramic substrate 16 so as to cover the temperature detection sensor 22.
  • an insulating material such as silicon oxide, acid aluminum, zirconium oxide, titanium oxide, and mullite can be appropriately used.
  • a “U” -shaped heating element 26 is disposed on the upper surface of the insulating layer 24.
  • the heating element 26 is formed of a resistance heating element such as silicon carbide.
  • the temperature detection sensor 22 is disposed in the vicinity of the heating element 26.
  • zirconia can be used as a material for forming the heating element 26.
  • a wear-resistant layer 28 is formed on the upper surface of the heating element 26 excluding the one end portion 26 a and the other end portion 26 b of the heating element 26.
  • the wear resistant layer 28 is formed of titanium oxide, titanium nitride, or the like.
  • titanium oxide and titanium nitride for example, tungsten carbide, titanium carbide, boron carbide, or the like can be used as a material for forming the wear-resistant layer 28 as appropriate.
  • electrodes 30a and 30b made of an alloy of gold, gold, copper, etc. are connected to the upper surfaces of one end portion 26a and the other end portion 26b of the heating element 26, respectively. .
  • a rectangular parallelepiped-shaped ceramic substrate 16 having a zirco-equal force is prepared.
  • an electrode 22a and an electrode 22b having an alloying force of gold and copper are connected to one end and the other end of the sensor 22, respectively.
  • the temperature detection sensor 22 and the electrodes 22a and 22b are integrally formed on the upper surface of the ceramic substrate 16 by a thin film formation method such as sputtering.
  • a thin film is formed by such a method.
  • a thin film is formed on the upper surface of the insulating layer 24 as a heating element 26, for example, a resistance heating element having silicon carbide power by sputtering or the like.
  • the upper surface of the heating element 26 excluding one end portion 26 a and the other end portion 26 b of the heating element 26 is provided with a resistance against, for example, titanium nitride.
  • the wear layer 28 is formed into a thin film by a method such as sputtering.
  • electrodes made of an alloy of gold, gold, copper, etc. are respectively formed on the upper surfaces of the one end portion 26a and the other end portion 26b of the heating element 26.
  • 30a and 30b are formed into a thin film by a method such as sputtering.
  • a V-shaped cutting blade portion 18 is formed in a plan view.
  • a blade edge portion 20 is formed at the top end portion of the cutting edge portion 18 on the one main surface side of the ceramic substrate 16 and serves as a portion for cutting the glass plate W that is a workpiece.
  • the resistance heating element as the heating element 26 when a direct current voltage is applied to the electrodes 30a and 30b of the cutting tool 12, for example, the resistance heating element as the heating element 26 generates heat and the surface temperature is increased.
  • the force can be raised to a predetermined temperature, in this case a high temperature, for example in the range of about 600 ° C to 1000 ° C.
  • the temperature rise of the heating element 26 can be further increased by changing the DC voltage application to, for example, a pulse voltage application to increase the applied voltage.
  • the displacing means (not shown) is constituted by a drive mechanism (not shown) including, for example, a motor (not shown) and an actuator (not shown), and the cutting blade portion 18 of the cutting tool 12 and Z or glass plate W (object to be cut) is relatively displaced along the desired cutting site.
  • a glass plate W (object to be cut) is fixed to a mounting table (not shown) or the like, and the cutting tool 12 is moved along a desired cutting site ⁇ .
  • the desired cutting site ⁇ of the glass plate W (object to be cut) is provided at the cutting edge portion 20 by the cutting edge portion 20 of the cutting blade portion 18 heated to a predetermined temperature, for example, as shown in FIG.
  • a V-shaped groove portion 40 corresponding to the shape of 20 is formed, and at the same time, the cutting site ⁇ is locally and rapidly heated by the heated blade edge portion 20 with the glass plate W (object to be cut). ) Is heated above the soft saddle point. Therefore, the glass plate W (object to be cut) at the part where the cutting edge portion 20 contacts (contacts) is plastically deformed, and the plastically deformed portion becomes chip c and becomes the glass plate W (cut object). The glass plate W (object to be cut) is finally cut along the desired cutting site ⁇ .
  • the contact (contact) portion where the blade edge portion 20 is pressed is subjected to thermal expansion, and compressive stress is generated toward the periphery around the portion where the blade edge portion 20 is in contact.
  • the part where 20 is in contact is heated to a temperature higher than the softening point of the glass plate W (object to be cut), so that the glass plate W (object to be cut) in the contact part is plastically deformed. , The compressive stress is released.
  • the glass plate W (the object to be cut) itself has a strong compressive force, the glass plate W (the object to be cut) is cracked by the compressive stress generated around the contact area. That's also true.
  • the generation of cracks is prevented and the glass plate W (cut object) is accurately and stably prevented from deteriorating the quality of the glass plate W (cut object). Can be cut off.
  • the temperature detection sensor 22 is controlled by a temperature control means (not shown), and the glass plate W is cut by the cutting tool 12 by this temperature control means.
  • the temperature of the cutting edge 18 of the cutting edge 18 is maintained at a predetermined temperature. It is configured to be.
  • the glass plate W (object to be cut) has different physical properties depending on the type of glass material, and also has different soft saddle points. Therefore, the blade edge portion is appropriately selected according to the softening point of the object to be cut. 20 temperature settings are made.
  • the cutting tool 12 and the galley are separated based on the detection signal from the temperature detection sensor 22 while the cutting tool 12 is cutting the glass plate W (cut object).
  • a control unit (not shown) is configured to control the speed related to the relative movement generated between the steel plate W (the workpiece) and Z or the cutting depth of the cutting blade relative to the workpiece. .
  • the control unit can appropriately control the moving speed of the cutting tool 14 and the depth of the groove 40.
  • the cutting edge portion 20 heated to a soft spot or higher of the glass plate W (object to be cut) is desired for the glass plate W (object to be cut).
  • the desired cutting site ⁇ of the glass plate W (cut object) is brought into contact with the cutting site ⁇ and a relative movement is applied between the cutting tool 12 and the glass plate W (cut object). Accordingly, the glass plate W (object to be cut) can be cut accurately and stably without being subjected to an impact.
  • the temperature of the cutting edge portion 18 of the cutting edge portion 18 is maintained at a predetermined temperature while the cutting tool 12 is cutting the glass plate W (object to be cut) by the temperature control means.
  • plastic deformation can be caused stably, and the glass plate W (object to be cut) can be cut and cut so as to be accurate and stable with no cutting failure.
  • the cutting conditions of the glass plate W (cutting object) are always optimal due to the temperature conditions of the cutting edge part 20 of the blade part 18 and the relative movement of the cutting tool 12 and the glass plate W (cutting object). Further, the glass plate W (object to be cut) can be cut and cut accurately and stably so that there is no cutting failure.
  • the wear-resistant layer 28 of the cutting tool 12 is made of titanium oxide, nitride. Since it is formed of titanium or the like, when the glass plate W (object to be cut) is cut with the cutting tool 12, it becomes possible to prevent the glass material at the cut site from adhering to the blade edge portion 20.
  • a release oil may be applied to the portion of the blade edge portion 20 to form a release layer.
  • the edge part 201 forming the edge part as a part for cutting the object to be cut is partly formed on the cutting edge part 18 as a part for cutting the object to be cut. Even if it forms an edge part.
  • FIG. 9 is a perspective view of relevant parts showing an example of another embodiment of the cutting device according to the present invention.
  • the cutting tool is used when cutting the glass plate W (to-be-cut object) with the cutting tool 12 and cutting it, as compared with the above-described embodiment shown in FIGS.
  • the portion to be cut with the cutting tool 12 is preliminarily heated in advance by a heating means such as a laser.
  • the cutting tool 12 used in the cutting device 10 that works on the embodiment shown in FIG. 9 has the same structure as the cutting tool 12 shown in the above-described embodiment, and has the same effect. It is.
  • the cutting device 10 according to this embodiment shown in FIG. 9 is based on the configuration of the cutting device 10 according to the above-described embodiment, and a laser such as a carbon dioxide laser is used as a heating means. Further includes vessel 50.
  • the laser device 50 uses a cylindrical lens (not shown) or a cylindrical mirror (not shown) to output a laser beam on a glass plate W (object to be cut) (beam spot).
  • a laser light source 52 which is oblong.
  • the laser light 54 emitted from the laser light source 52 forms an oblong beam spot 56 in front of the cutting tool 12 as shown in FIG. 9, and the beam spot 56 is preliminarily heated. It becomes an area.
  • the part to be cut by the cutting tool 12 is preliminarily heated by the beam spot 56, which is much easier than in the above-described embodiment.
  • the cutting tool 12 can heat the glass plate W (the object to be cut) to a temperature above the soft saddle point. Therefore, in the cutting device 10 that works on the present embodiment shown in FIG. Compared with the embodiment shown in FIGS. 1 to 8, the cutting speed can be further improved and the machinability can be stabilized, and a more stable force property can be secured.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

Dispositif de coupe capable du couper précisément et stablement un matériau coupé sans dégrader la qualité de l'élément coupé en empêchant les fissures de se produire à l'intérieur. Le dispositif de coupe (10) pour couper le matériau (W) à couper, qui est réalisé en matériau fragile tel que verre, céramique et matériaux semi-conducteurs, comprend un outil coupant (12) disposé pour venir en contact avec la partie coupée (ω) spécifiée du matériau (W) et un moyen de déplacement pour produire un mouvement relatif entre l'outil coupant (12) et le matériau (W) le long de la partie coupée (ω). L'outil coupant (12) comprend une partie (18) de lame coupante présentant une partie (20) de pointe de lame (partie bord) coupant le matériau (W) et un élément chauffant, chauffant la partie (18) de lame coupante à une température supérieure au point de ramollissement du matériau (W). En produisant le mouvement relatif par un moyen de déplacement entre le matériau (W) et la partie (20) de pointe de lame chauffée par l'élément chauffant, la partie coupée (ω) du matériau (W) peut être découpée.
PCT/JP2006/316192 2006-07-20 2006-08-17 Dispositif de coupe WO2008010303A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2007800274974A CN101489746B (zh) 2006-07-20 2007-07-13 切割装置
JP2008525846A JP4414473B2 (ja) 2006-07-20 2007-07-13 切断方法
PCT/JP2007/063969 WO2008010457A1 (fr) 2006-07-20 2007-07-13 appareil de découpe
KR1020097000370A KR101069621B1 (ko) 2006-07-20 2007-07-13 절단 방법
TW096126441A TW200812924A (en) 2006-07-20 2007-07-19 Cutting apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-198666 2006-07-20
JP2006198666 2006-07-20

Publications (1)

Publication Number Publication Date
WO2008010303A1 true WO2008010303A1 (fr) 2008-01-24

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Application Number Title Priority Date Filing Date
PCT/JP2006/316192 WO2008010303A1 (fr) 2006-07-20 2006-08-17 Dispositif de coupe

Country Status (5)

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JP (1) JP4414473B2 (fr)
KR (1) KR101069621B1 (fr)
CN (1) CN101489746B (fr)
TW (1) TW200812924A (fr)
WO (1) WO2008010303A1 (fr)

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TWI456647B (zh) * 2011-05-09 2014-10-11 Mitsuboshi Diamond Ind Co Ltd 刻劃裝置
CN102749746B (zh) * 2012-06-21 2015-02-18 深圳市华星光电技术有限公司 液晶基板切割装置及液晶基板切割方法
KR101405442B1 (ko) * 2012-08-01 2014-06-13 주식회사 라미넥스 고주파 유도 가열기를 이용한 유리 모서리 가공 방법 및 장치
KR101420627B1 (ko) * 2013-04-10 2014-07-17 박명아 유리 기판 열 커팅 장치
TWI471279B (zh) * 2013-04-22 2015-02-01 Taiwan Mitsuboshi Diamond Ind Co Ltd 用於一化學強化玻璃基板之加工方法及加工設備
TWI547346B (zh) * 2014-01-27 2016-09-01 rong-feng Lin Method of processing glass
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CN105058605B (zh) * 2015-08-02 2017-08-29 河南鸿昌电子有限公司 一种线切割机和半导体晶棒的线切割方法
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