WO2007125569A1 - スピーカ装置 - Google Patents
スピーカ装置 Download PDFInfo
- Publication number
- WO2007125569A1 WO2007125569A1 PCT/JP2006/306842 JP2006306842W WO2007125569A1 WO 2007125569 A1 WO2007125569 A1 WO 2007125569A1 JP 2006306842 W JP2006306842 W JP 2006306842W WO 2007125569 A1 WO2007125569 A1 WO 2007125569A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- diaphragm
- speaker
- edge
- hole
- speaker device
- Prior art date
Links
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 238000001035 drying Methods 0.000 description 8
- 238000004026 adhesive bonding Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010137 moulding (plastic) Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/06—Plane diaphragms comprising a plurality of sections or layers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/16—Mounting or tensioning of diaphragms or cones
- H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
- H04R7/20—Securing diaphragm or cone resiliently to support by flexible material, springs, cords, or strands
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
- H04R1/283—Enclosures comprising vibrating or resonating arrangements using a passive diaphragm
- H04R1/2834—Enclosures comprising vibrating or resonating arrangements using a passive diaphragm for loudspeaker transducers
Definitions
- the present invention relates to a speaker device having a notch radiator ( pass i ve radiator) used in video equipment such as a thin and large television receiver.
- FIG. 7 is a side sectional view of a conventional speaker device having a passive radiator.
- Two openings 4a and 4b are provided in the front of the speaker box 1.
- the speaker unit 2 has a magnetic circuit 2a and is attached to the opening 4a.
- the non-linear brazier 3 has a flat plate-like diaphragm 3b force and is attached to the opening 4b.
- the passive radiator 3 is attached to the speaker box 1 via an edge 3a as a support system.
- the passive radiator 3 is driven by utilizing the exhaust pressure into the spinning force box 1 generated when the speaker unit 2 is driven. By driving the passive radiator 3, the reproduction of sound in a predetermined low frequency range is enhanced.
- a conventional speaker device is disclosed in, for example, Japanese Utility Model Application Publication No. 57-2790 published in Japanese Utility Model Application.
- the vibration plate 3b and the edge 3a are bonded by adhesive bonding or by resin molding.
- the edge 3a is formed by outsert molding at the time of forming the diaphragm 3b.
- the diaphragm 3b is formed by cutting or forming the plate material, and then the diaphragm 3b and the edge 3a are adhesively bonded.
- the adhesive bonding method is advantageous in terms of cost because it does not use a molding die.
- the speaker device of the present invention includes a speaker box, a speaker unit mounted on the speaker box, and a passive radiator, and the nose brazier includes a first diaphragm and a second diaphragm.
- the inner peripheral edge portion is sandwiched between the first and second diaphragms, is adhesively bonded, and the outer peripheral edge is fixed to the speaker box.
- FIG. 1 is a side sectional view of a speaker device according to an embodiment of the present invention.
- FIG. 2 is a side sectional view of a passive radiator used in the speaker device shown in FIG.
- FIG. 3 is an exploded perspective view of the passive radiator shown in FIG. 2.
- FIG. 4 is a side sectional view of a passive radiator used in a speaker device according to another embodiment of the present invention.
- FIG. 5 is a cross-sectional view of the passive radiator shown in FIG. 4 taken along line 5-5.
- FIG. 6 is a side sectional view of a passive radiator used in a speaker device according to another embodiment of the present invention.
- FIG. 7 is a side sectional view of a conventional speaker device.
- FIG. 1 is a side sectional view of a speaker device according to an embodiment of the present invention.
- FIG. 2 is a side sectional view of a passive radiator used in the speaker device shown in FIG.
- FIG. 3 is an exploded perspective view of the nose brazier shown in FIG.
- two openings l la and l ib are provided on the front surface of the speaker box 11.
- the speaker unit 12 is attached to the opening 11a by screwing (not shown).
- the nose brazier 13 has a rectangular shape and is attached to the opening l ib.
- the speaker unit 12 includes a magnetic circuit 12a that forms a magnetic gap 12b, a speaker diaphragm 18 (hereinafter referred to as a diaphragm 18), a damper 16, and a dust cap 17.
- the magnetic circuit 12a includes a lower plate 12c, an annular magnet 12d, and an annular upper plate 12e that are adhesively coupled.
- the lower plate 12c has a center pole 12f.
- the outer periphery of diaphragm 18 is adhesively bonded to speaker frame 14 (hereinafter referred to as frame 14) via speaker edge 12g. It is adhesively bonded to coil 15.
- a magnetic gap 12 b is formed at one end of the voice coil 15.
- the inner periphery of the damper 16 is adhesively bonded to the voice coil 15, and the outer periphery of the damper 16 is adhesively bonded to the frame 14.
- the dust cap 17 is configured to cover the voice coil 15 from above the voice coil 15.
- the bottom surface of the frame 14 is adhesively bonded to the upper plate 12e.
- the passive radiator 13 includes a frame 13a, an edge 13b, a first diaphragm 13d (hereinafter referred to as diaphragm 13d), and a second diaphragm 13c (hereinafter referred to as diaphragm 13c). )).
- the frame 13a is made of a thin metal plate and has a screw hole 13i for attaching the passive radiator 13 to the speaker box 11 and a rectangular opening 13j.
- the edge 13b has a function of a support part for adhesively bonding the outer periphery of the diaphragm 13c and the diaphragm 13d to the frame 13a.
- the diaphragm 13c is formed of a rectangular plastic molding plate, and is located on the outer surface side of the speaker box 11 at the inner peripheral edge of the edge 13b.
- the diaphragm 13 d also has a rectangular plastic molding plate force, and is positioned inside the casing of the speaker box 11 at the inner peripheral edge of the edge 13 b.
- edge 13b and the diaphragm 13c, and the edge 13b and the diaphragm 13d are adhesively bonded by an adhesive (not shown), respectively. Further, the edge 13b is sandwiched between the diaphragm 13c and the diaphragm 13d.
- the edge 13b is sandwiched and bonded by the diaphragm 13c and the diaphragm 13d.
- the joint strength between the edge 13b and the diaphragm 13c, the edge 13b and the diaphragm 13d is improved, and the high input resistance characteristic of the nose brazier 13 is improved.
- a speaker device with improved high input resistance is provided as a speaker device for the low sound range.
- a plurality of through holes 13e are provided in the vicinity of the adhesive bonding portion between the diaphragm 13d and the edge 13b.
- the through hole 13e is provided in the short side direction of the diaphragm 13d.
- the through-hole 13e may be provided in the long side direction of the diaphragm 13d while applying a force. Further, the through hole 13e may be provided in both the short side direction and the long side direction of the diaphragm 13d.
- the through-hole 13e is provided with such a strength that the strength of the diaphragm 13d is not extremely reduced.
- the formation state of the through-hole 13e may be appropriately selected as necessary. example For example, the size of the through holes 13e, the length of the interval between the through holes 13e, the position where the through holes 13e are provided, the quantity, and the like are appropriately selected.
- the adhesive used for the adhesive bonding between the diaphragm 13c and the edge 13b and between the diaphragm 13d and the edge 13b is allowed to Increase contact opportunities. This is because the outside air enters through the through-hole 13e and touches the adhesive applied between the diaphragm 13c and the edge 13b and between the diaphragm 13d and the edge 13b. As a result, evaporation of the solvent contained in the adhesive is promoted, variation in the drying time of the adhesive between the bonded portions is improved, and drying time is shortened. As a result, productivity is improved when the nossi brajator 13 is produced.
- a convex portion 13f is provided over the entire periphery of the diaphragm 13d on the inner side of the adhesively bonded portion between the outer periphery of the diaphragm 13d and the edge 13b.
- the convex portion 13f is provided to such an extent that the clamping relationship between the edge 13b and the diaphragm 13c and the edge 13b and the diaphragm 13d is maintained. That is, the height of the convex portion 13f is set to such an extent that sufficient pressure can be obtained for the diaphragm 13c and the diaphragm 13d to sandwich the edge 13b.
- a gap corresponding to the height of the convex portion 13f is formed between the diaphragm 13c and the diaphragm 13d.
- the adhesive between the diaphragm 13c and the edge 13b and between the diaphragm 13d and the edge 13b is separated from the outside air. Increases contact area. Therefore, evaporation of the solvent contained in the adhesive is promoted through the through-hole 13e over the entire outer periphery of the diaphragm 13d. As a result, there is less glue drying and the drying time is shortened.
- FIG. 4 is a side sectional view of a passive radiator according to another embodiment.
- FIG. 5 is a sectional view of the passive radiator shown in FIG. 4 taken along line 5-5.
- the convex portion may not be provided continuously over the entire outer periphery of the diaphragm 13d.
- the convex portion may be provided intermittently as in the convex portion 13k.
- the formation state of the convex portion 13k may be appropriately selected as necessary. For example, when the convex portion 13k is intermittently provided, the length and size of the convex portion 13k, the length of the interval between the respective convex portions 13k, the position where the convex portion 13k is provided, the quantity, etc. are appropriately selected.
- a gap is provided between the diaphragm 13c and the diaphragm 13d by the projections 13f and 13k provided on the diaphragm 13d. This increases the contact area with the air that the adhesive enters through the through-hole 13e, thereby shortening the drying time of the adhesive and making the drying state uniform. As a result, the productivity of the speaker device is improved.
- FIG. 6 is a side sectional view of a passive radiator according to still another embodiment.
- the configuration in which the through-hole 13e is provided in the diaphragm 13d and the diaphragm 13d is located inside the casing of the speaker box 11 at the inner peripheral edge of the edge 13b has been described.
- the first diaphragm 13d as shown in FIG. 6 is located on the outer surface side of the speaker force box 11 at the inner peripheral edge of the edge 13b
- the second diaphragm 13c is located on the speaker box 11. It is good as a configuration located inside the housing.
- the through hole 13e is formed on the outer surface side of the speaker box 11.
- the through hole 13e is provided on the outer surface side of the speaker box 11, it is preferable to consider the intrusion of dust or the like between the diaphragm 13c and the diaphragm 13d or to take a dustproof measure.
- a measure against dust it is considered to apply an adhesive or the like (not shown) for closing the through-hole 13e after the adhesive that bonds between the edge 13b and the diaphragms 13c and 13d is dried. It is done.
- the diaphragm 13c has a flat plate shape with a simple structure. This will The moving plate 13c can be easily produced, and the manufacturing cost can be kept low.
- the structure may be such that the through-hole 13e is provided in the diaphragm 13d and the protrusions 13f and 13k are provided in the diaphragm 13c while applying force. In this case, it is easy to set the through-hole 13e and the projections 13f and 13k suitable for drying the adhesive while ensuring the mechanical strength and accuracy of the diaphragm 13d and the diaphragm 13c.
- the speaker device of the present invention makes it possible to increase the input resistance of a nossi bragitator, thereby enabling electronic devices such as audiovisual equipment, information communication equipment, and game equipment, and audio equipment for automobiles and the like. It is also used for low-frequency speaker devices.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Manufacturing & Machinery (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006800540499A CN101411212B (zh) | 2006-03-31 | 2006-03-31 | 扬声器装置 |
US12/281,553 US8160286B2 (en) | 2006-03-31 | 2006-03-31 | Speaker system |
JP2008513018A JPWO2007125569A1 (ja) | 2006-03-31 | 2006-03-31 | スピーカ装置 |
PCT/JP2006/306842 WO2007125569A1 (ja) | 2006-03-31 | 2006-03-31 | スピーカ装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/306842 WO2007125569A1 (ja) | 2006-03-31 | 2006-03-31 | スピーカ装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007125569A1 true WO2007125569A1 (ja) | 2007-11-08 |
Family
ID=38655116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/306842 WO2007125569A1 (ja) | 2006-03-31 | 2006-03-31 | スピーカ装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8160286B2 (ja) |
JP (1) | JPWO2007125569A1 (ja) |
CN (1) | CN101411212B (ja) |
WO (1) | WO2007125569A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010283491A (ja) * | 2009-06-03 | 2010-12-16 | Foster Electric Co Ltd | パッシブラジエーター |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2624595A4 (en) * | 2011-05-19 | 2015-07-01 | Tang Band Ind Co Ltd | VIBRATING PLATE DEVICE OF AN ELECTROMAGNETIC VIBRATOR AND METHOD FOR MANUFACTURING THE SAME |
CN102572639A (zh) * | 2011-12-31 | 2012-07-11 | 李世煌 | 镜像振动式音箱 |
WO2013100862A2 (en) * | 2011-12-31 | 2013-07-04 | Shihuang Li | Mirror vibration speaker |
US9485586B2 (en) * | 2013-03-15 | 2016-11-01 | Jeffery K Permanian | Speaker driver |
US20140355806A1 (en) | 2013-06-03 | 2014-12-04 | Allen T. Graff | Portable Loudspeaker |
EP2827608B1 (en) | 2013-07-18 | 2016-05-25 | GN Netcom A/S | Earphone with noise reduction |
US9271098B2 (en) * | 2013-10-07 | 2016-02-23 | Incipio Technologies, Inc. | Audio speaker with externally reinforced passive radiator attachment |
JP6544243B2 (ja) * | 2013-12-27 | 2019-07-17 | ソニー株式会社 | 振動板のエッジ構造 |
TWI568276B (zh) * | 2014-01-06 | 2017-01-21 | 緯創資通股份有限公司 | 揚聲模組及具有其之薄型電子裝置 |
KR102274735B1 (ko) | 2015-06-19 | 2021-07-09 | 삼성전자주식회사 | 스피커 장치 |
CN106060733A (zh) * | 2016-07-20 | 2016-10-26 | 深圳市信维通信股份有限公司 | 一种高性能speakerbox及其制作方法 |
CN109922407A (zh) * | 2017-12-13 | 2019-06-21 | 富泰华工业(深圳)有限公司 | 音箱及应用该音箱的电子装置 |
CN110430511B (zh) * | 2019-08-13 | 2022-06-24 | 美特科技(苏州)有限公司 | 扬声器模块 |
US20230022584A1 (en) * | 2021-07-22 | 2023-01-26 | Bose Corporation | Hearing aids and related devices and methods |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57160288U (ja) * | 1981-03-31 | 1982-10-07 | ||
JPS57199399A (en) * | 1981-06-02 | 1982-12-07 | Matsushita Electric Ind Co Ltd | Speaker |
JPH0186395U (ja) * | 1987-11-26 | 1989-06-07 | ||
JP2005268948A (ja) * | 2004-03-16 | 2005-09-29 | Pioneer Electronic Corp | スピーカ用振動部品 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5426932A (en) * | 1977-08-02 | 1979-02-28 | Daiwa Kasei Kenkyusho | Anode coloring oxidation bath for aluminum or aluminum alloy |
JPS57160288A (en) * | 1981-03-30 | 1982-10-02 | Sony Corp | Processing circuit for chrominance signal |
JPS6486395A (en) * | 1987-09-29 | 1989-03-31 | Fujitsu Ltd | Storage device |
US6782112B1 (en) * | 1997-10-02 | 2004-08-24 | Earl R. Geddes | Low frequency transducer enclosure |
US6675931B2 (en) * | 1998-11-30 | 2004-01-13 | Joseph Yaacoub Sahyoun | Low profile audio speaker |
US6044925A (en) * | 1998-11-30 | 2000-04-04 | Sahyoun; Joseph Yaacoub | Passive speaker |
US6704426B2 (en) * | 1999-03-02 | 2004-03-09 | American Technology Corporation | Loudspeaker system |
TW511388B (en) * | 2000-03-28 | 2002-11-21 | Koninkl Philips Electronics Nv | Passive radiator having mass elements |
US7133533B2 (en) * | 2003-07-21 | 2006-11-07 | Bose Corporation | Passive acoustic radiating |
US7974431B2 (en) * | 2004-09-13 | 2011-07-05 | Panasonic Corporation | Speaker system |
-
2006
- 2006-03-31 CN CN2006800540499A patent/CN101411212B/zh not_active Expired - Fee Related
- 2006-03-31 JP JP2008513018A patent/JPWO2007125569A1/ja active Pending
- 2006-03-31 US US12/281,553 patent/US8160286B2/en not_active Expired - Fee Related
- 2006-03-31 WO PCT/JP2006/306842 patent/WO2007125569A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57160288U (ja) * | 1981-03-31 | 1982-10-07 | ||
JPS57199399A (en) * | 1981-06-02 | 1982-12-07 | Matsushita Electric Ind Co Ltd | Speaker |
JPH0186395U (ja) * | 1987-11-26 | 1989-06-07 | ||
JP2005268948A (ja) * | 2004-03-16 | 2005-09-29 | Pioneer Electronic Corp | スピーカ用振動部品 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010283491A (ja) * | 2009-06-03 | 2010-12-16 | Foster Electric Co Ltd | パッシブラジエーター |
Also Published As
Publication number | Publication date |
---|---|
CN101411212A (zh) | 2009-04-15 |
US20110243361A1 (en) | 2011-10-06 |
US8160286B2 (en) | 2012-04-17 |
JPWO2007125569A1 (ja) | 2009-09-10 |
CN101411212B (zh) | 2012-02-15 |
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