WO2007101282A3 - Verbundwerkstoff und verfahren zu seiner herstellung - Google Patents
Verbundwerkstoff und verfahren zu seiner herstellung Download PDFInfo
- Publication number
- WO2007101282A3 WO2007101282A3 PCT/AT2007/000100 AT2007000100W WO2007101282A3 WO 2007101282 A3 WO2007101282 A3 WO 2007101282A3 AT 2007000100 W AT2007000100 W AT 2007000100W WO 2007101282 A3 WO2007101282 A3 WO 2007101282A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- carbon
- ppm
- vol
- expansion coefficient
- thermal expansion
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0084—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ carbon or graphite as the main non-metallic constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
- C22C47/02—Pretreatment of the fibres or filaments
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
- C22C47/14—Making alloys containing metallic or non-metallic fibres or filaments by powder metallurgy, i.e. by processing mixtures of metal powder and fibres or filaments
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
- C22C49/02—Alloys containing metallic or non-metallic fibres or filaments characterised by the matrix material
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
- C22C49/14—Alloys containing metallic or non-metallic fibres or filaments characterised by the fibres or filaments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3732—Diamonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
- C22C2026/002—Carbon nanotubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Powder Metallurgy (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Abstract
Die Erfindung betrifft einen Werkstoff umfassend: eine Metall-Matrix A, die bzw. deren Material in zumindest einer Raumrichtung einen thermischen Ausdehnungskoeffizienten im Bereich von 16 bis 20 ppm/K, aufweist und von Kupfer oder einer Kupferlegierung gebildet ist und 10 bis 75 vol.%. des Werkstoffes darstellt; zumindest einen metallischen und/oder keramischen Füllstoff B, der in zumindest einer Raumrichtung einen thermischen Ausdehnungskoeffizienten im Bereich von 4 bis 6 ppm/K aufweist, von Cu2O und/oder Al2O3 und/oder AlN und/oder Mo und/oder Cr und/oder W und/oder B und/oder Ta gebildet ist und im Werkstoff in einer Menge von 1 bis 40 vol.% vorliegt; und zumindest einen auf Kohlenstoff basierenden Füllstoff C, der durch einen thermischen Ausdehnungskoeffizienten von - 2 bis +2 ppm/K in zumindest einer Raumrichtung charakterisiert ist, hohe thermische Leitfähigkeit besitzt, von Graphit und/oder Kohlefasern und/oder Kohle-Nanofasern und/oder Kohlenstoff-Nanoröhrchen und/oder Diamant gebildet ist und in einer Menge von 5 bis 65 vol.% vorliegt.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07701341A EP1992015A2 (de) | 2006-03-09 | 2007-02-28 | Verbundwerkstoff und verfahren zu seiner herstellung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT3892006A AT503270B1 (de) | 2006-03-09 | 2006-03-09 | Verbundwerkstoff und verfahren zu seiner herstellung |
ATA389/2006 | 2006-03-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007101282A2 WO2007101282A2 (de) | 2007-09-13 |
WO2007101282A3 true WO2007101282A3 (de) | 2007-11-22 |
Family
ID=38093413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/AT2007/000100 WO2007101282A2 (de) | 2006-03-09 | 2007-02-28 | Verbundwerkstoff und verfahren zu seiner herstellung |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1992015A2 (de) |
AT (1) | AT503270B1 (de) |
WO (1) | WO2007101282A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101706226B (zh) * | 2009-11-23 | 2012-01-25 | 陈盈同 | 一种散热结构及其制造方法 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008034258B4 (de) | 2008-07-17 | 2012-01-19 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Gesinterter Werkstoff und Verfahren zu dessen Herstellung |
DE102008034257B4 (de) * | 2008-07-17 | 2011-12-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Gesinterter schall- und schwingungsdämpfender Werkstoff und Verfahren zu dessen Herstellung |
WO2011049479A1 (en) * | 2009-10-21 | 2011-04-28 | Andrey Mikhailovich Abyzov | Composite material having high thermal conductivity and process of fabricating same |
US8475132B2 (en) * | 2011-03-16 | 2013-07-02 | General Electric Company | Turbine blade assembly |
EP2606996A1 (de) * | 2011-12-23 | 2013-06-26 | EPoS S.r.L. | Verfahren zum Sinter von Metallmatrixverbundmaterialien |
CN104475731A (zh) * | 2014-12-16 | 2015-04-01 | 深圳市东维丰电子科技股份有限公司 | 一种增强铜/金刚石复合散热材料及其制备方法 |
DE102017216290B4 (de) * | 2017-09-14 | 2022-09-08 | Freie Universität Berlin | Verbundwerkstoff und Verfahren zu dessen Herstellung, Kühlkörper und elektronisches Bauteil |
CN109811280A (zh) * | 2019-03-13 | 2019-05-28 | 中国科学院电工研究所 | 一种铜/碳纳米管复合材料及其制备方法 |
WO2021056133A1 (zh) * | 2019-09-23 | 2021-04-01 | 广东工业大学 | 一种新型陶瓷基金刚石复合片及其制备方法 |
DE102020209155A1 (de) * | 2020-07-21 | 2021-07-15 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit einem Verbindungselement mit verbesserter Wärmeleitung |
CN112941431B (zh) * | 2021-02-01 | 2022-03-04 | 吉林大学 | 一种细颗粒金刚石铜基复合散热材料的粉末冶金制备方法 |
CN113956062B (zh) * | 2021-10-25 | 2022-11-15 | 燕山大学 | 一种陶瓷基板AlN/Ti层状复合材料及其制备方法和应用 |
CN114455949B (zh) * | 2022-03-03 | 2023-04-14 | 西安交通大学 | 一种三维氮化铝骨架增强高取向片状石墨复合材料及其制备方法 |
CN117025998B (zh) * | 2023-10-09 | 2024-01-16 | 赣州金顺科技有限公司 | 一种嵌埋金刚石铜的散热基板及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1197593A (ja) * | 1997-09-22 | 1999-04-09 | Hitachi Ltd | 放熱基板およびその製造方法 |
US6238454B1 (en) * | 1993-04-14 | 2001-05-29 | Frank J. Polese | Isotropic carbon/copper composites |
EP1167559A1 (de) * | 1998-12-07 | 2002-01-02 | Hitachi, Ltd. | Kompositmaterial und dessen verwendung |
WO2005106952A1 (de) * | 2004-04-29 | 2005-11-10 | Plansee Se | Wärmesenke aus borhaltigem diamant-kupfer-verbundwerkstoff |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5253720A (en) * | 1975-10-29 | 1977-04-30 | Hitachi Ltd | Non-orientated cu-carbon fiber compoite and its manufacturing method |
JP2000012739A (ja) * | 1998-06-25 | 2000-01-14 | Furukawa Electric Co Ltd:The | 半導体装置の基板用複合材料 |
JP2004285372A (ja) * | 2003-03-19 | 2004-10-14 | Mitsubishi Electric Corp | 銅−炭素繊維複合材およびその製造方法ならびにそれを用いた半導体デバイス |
JP4711165B2 (ja) * | 2004-06-21 | 2011-06-29 | 日立金属株式会社 | 高熱伝導・低熱膨脹複合体およびその製造方法 |
-
2006
- 2006-03-09 AT AT3892006A patent/AT503270B1/de not_active IP Right Cessation
-
2007
- 2007-02-28 WO PCT/AT2007/000100 patent/WO2007101282A2/de active Application Filing
- 2007-02-28 EP EP07701341A patent/EP1992015A2/de not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6238454B1 (en) * | 1993-04-14 | 2001-05-29 | Frank J. Polese | Isotropic carbon/copper composites |
JPH1197593A (ja) * | 1997-09-22 | 1999-04-09 | Hitachi Ltd | 放熱基板およびその製造方法 |
EP1167559A1 (de) * | 1998-12-07 | 2002-01-02 | Hitachi, Ltd. | Kompositmaterial und dessen verwendung |
WO2005106952A1 (de) * | 2004-04-29 | 2005-11-10 | Plansee Se | Wärmesenke aus borhaltigem diamant-kupfer-verbundwerkstoff |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101706226B (zh) * | 2009-11-23 | 2012-01-25 | 陈盈同 | 一种散热结构及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
AT503270B1 (de) | 2008-03-15 |
AT503270A1 (de) | 2007-09-15 |
WO2007101282A2 (de) | 2007-09-13 |
EP1992015A2 (de) | 2008-11-19 |
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