WO2007087660A1 - Élément de carte de circuits imprimés dans lequel est noyé au moins un composant, et procédé pour noyer au moins un composant dans un élément de carte de circuits imprimés - Google Patents

Élément de carte de circuits imprimés dans lequel est noyé au moins un composant, et procédé pour noyer au moins un composant dans un élément de carte de circuits imprimés Download PDF

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Publication number
WO2007087660A1
WO2007087660A1 PCT/AT2007/000045 AT2007000045W WO2007087660A1 WO 2007087660 A1 WO2007087660 A1 WO 2007087660A1 AT 2007000045 W AT2007000045 W AT 2007000045W WO 2007087660 A1 WO2007087660 A1 WO 2007087660A1
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WO
WIPO (PCT)
Prior art keywords
component
adhesive
adhesive film
circuit board
printed circuit
Prior art date
Application number
PCT/AT2007/000045
Other languages
German (de)
English (en)
Inventor
Arno Kriechbaum
Wolfgang Bauer
Johannes Stahr
Sabine Liebfahrt
Original Assignee
At & S Austria Technologie & Systemtechnik Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & S Austria Technologie & Systemtechnik Aktiengesellschaft filed Critical At & S Austria Technologie & Systemtechnik Aktiengesellschaft
Priority to AT07701291T priority Critical patent/ATE541314T1/de
Priority to CA002650700A priority patent/CA2650700A1/fr
Priority to EP07701291A priority patent/EP2027600B1/fr
Priority to EP10177700.1A priority patent/EP2259311B1/fr
Priority to US12/162,016 priority patent/US20110051384A1/en
Publication of WO2007087660A1 publication Critical patent/WO2007087660A1/fr

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    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Definitions

  • Printed circuit board element with at least one embedded component and method for embedding at least one component in a printed circuit board element
  • the invention relates to a printed circuit board element with at least one embedded between a base and a cover layer, prefabricated electrical or electronic component, in particular a chip.
  • the invention relates to a method for embedding at least one electrical or electronic component, in particular a chip (semiconductor device), in a printed circuit board element, wherein the component is adhered to a pad, after which a cover layer is attached by pressing over the pad together with the component ,
  • a chip semiconductor device
  • a substrate layer for example, by injection molding or pressing, is attached to the adhesive layer and formed around the chip, so that finally the chip between this substrate and the connection layer, through which the chip is contacted, is embedded.
  • a similar application of chips to substrates by means of an adhesive layer is disclosed in DE 4 433 833 A, EP 611 129 A and US 5 564 181 A. This technology is expensive, with the surface applied adhesive layer as an additional layer, which is also present outside of the chips, disturbing. - -
  • the invention provides a printed circuit board element or a method as defined in the independent claims before.
  • Advantageous embodiments and further developments are specified in the subclaims. , __ T2007 / 000045
  • Klebef ⁇ lienab songs are used to attach the components to the respective documents by gluing.
  • These sections are separated from prefabricated, in particular band-shaped, preferably in roll form adhesive films, such as by cutting or punching, and they have a predetermined uniform thickness, for example in the order of 10 microns to 15 microns, preferably having a thickness of about 12 .mu.m.
  • These adhesive films or tapes are in particular thermosetting, wherein the adhesive, for example, after separate attachment of the respective section on the substrate by infrared radiation precured and finally, after attachment of the device, in a final oven can be completely cured.
  • the adhesive sheet sections are separated substantially with the dimensions of the components, e.g.
  • the adhesive film sections are pressed during positioning after positioning and, if appropriate, also pre-cured to a certain extent by using a heated tool.
  • a heated tool One possibility may further be that the adhesive film portions are applied to the backing and pressed, the backing being heated from the opposite side so as to cure the adhesive sheet portions to a limited extent, i. precure, where appropriate, the components are heated.
  • pre-curing is to adhere the adhesive film portion to the substrate sufficiently firmly, but the adhesive film portion should still remain sufficiently tacky to subsequently adhere the respective component by pressing.
  • the particular tape-shaped adhesive films may have a conventional structure, such as a structure with a carrier film which is coated on both sides with an adhesive, which in turn can be attached over these adhesive layers cover films. Another possibility is to omit the carrier film and only one adhesive layer, for example, also between two cover sheets to provide.
  • the carrier film allows for an increase in stability, and may be made of polyimide, for example consist.
  • polyimide for example consist.
  • polyethylene films or polyethylene terephthalate films (PE films or PET films) can be used as cover films.
  • a per se conventional polymeric adhesive such as low modulus of elasticity, preferably in combination with an epoxy resin and fillers used.
  • a modified polyimide may be used in combination with epoxy resin.
  • the procedure is preferably such that the one, lower cover film, e.g. a PE film is peeled off before mounting the adhesive sheet portion on the base so as to adhere the adhesive sheet portion to the base, and that the other upper cover sheet, e.g. a PET film is pulled off just before attaching the device, so as to protect the adhesive layer until then.
  • the one, lower cover film e.g. a PE film
  • the other upper cover sheet e.g. a PET film
  • An advantageous possibility is also to install the adhesive film sections in advance on the component at its side to be joined to the substrate and thus to tack the respective component together with the adhesive film section together on the substrate.
  • the pad together with glued component is expediently introduced into an oven and, for example, heated to a temperature of 130 0 C to 150 0 C or 170 0 C. It may also be advantageous to carry out this complete curing of the adhesive in a reactive or inert atmosphere, in particular in a nitrogen atmosphere.
  • a resin-copper cover layer can be applied over the base with component by pressing, such as a so-called RCC film (RCC - Resin Coated Copper foil - resin-coated copper foil). , and after that can contact holes through 7 000045
  • Fig. 1 shows schematically a cross-section through a part of a multilayer printed circuit board element with an embedded component, e.g. a thinned chip;
  • FIGS. 2A to 2E show, in schematic partial cross-sections, successive steps in the production of such a printed circuit board element with the embedding of a component
  • FIG. 3 is a diagrammatic view of side-by-side different possibilities for mounting a component on a base of a printed circuit board element
  • FIG. 3A shows a schematic section through an embodiment of an adhesive film section
  • FIG. 4A to 4C show an advantageous possibility of applying a wide tape-shaped adhesive sheet material on a chip wafer (FIG. 4A) and dividing the wafer together with adhesive film into chips having adhesive sheet sections (FIG. 4B) and attaching the chips together with the adhesive sheet sections fixed thereto on a substrate or pad of a printed circuit board element ( Figure 4C); and
  • FIG. 5A to 5D show a modified embodiment of the method for mounting chips (or generally devices) on a substrate using adhesive sheet sections, the sections being cut off in advance from an adhesive tape, either by means of a cutting tool (FIG. 5A). or by means of a punching tool (Fig. 5D), then separately mounted on the backing (Fig. 5B), and finally the chips are adhered to these adhesive sheet portions (Fig. 5C).
  • FIG. 1 schematically shows a part of a printed circuit board element 1 which contains an embedded electrical component in the form of a thinned chip 2.
  • passive components such as resistors, capacitors, ESD (Electro Static Discharge - electrostatic discharge ) -Guide elements, laser diodes, photodiodes, etc.
  • These are discrete components, wherein preferably the thickness of these components - either from the outset, by the manufacturing process, such as in capacitors, or by subsequent back thinning, about 50 ⁇ m to 70 ⁇ m.
  • Such thin components can be used in embedding, e.g. for protection against moisture or mechanical stress, be securely enclosed by the resin, in which case a corresponding dielectric thickness is present over the component and a flat surface is achieved. This is important on the one hand for laser drilling processes, but also for other processes that require a flat surface.
  • the device or the chip 2 is by means of a portion 3 of a tape-shaped adhesive film, hereafter called adhesive film section 3, on a base 4, for example a conventional FR4 base material (resin core, in particular with conductor layer) or substrate, as in the printed circuit board technology in conventional Way is used, glued.
  • adhesive film section 3 a tape-shaped adhesive film, hereafter called adhesive film section 3, on a base 4, for example a conventional FR4 base material (resin core, in particular with conductor layer) or substrate, as in the printed circuit board technology in conventional Way is used, glued.
  • the circuit board element 1 can accordingly on the pad 4 in a conventional manner a conductor 5, for example in the form of a structured Cu layer, which leads to unspecified further electrical components in the printed circuit board element 1; Over this conductor 5 and over the chip 2, a cover layer 6 made of resin with an upper copper coating 7 is attached, which may be, for example, a conventional RCC film (Resin Coated Copper foil, ie a resin-copper foil laminate) , 2007/000045
  • this cover layer 6 further laser holes or micro-vias 8, 9 are provided for contacting the chip 2 and the conductor strip 5, which have on the side walls a galvanic metallization 10 and 11 respectively.
  • FIG. 2A shows in detail the attachment of a component or a chip 2 on such a base 4.
  • the pad 4 i. at the circuit board core, in a region 12, in advance, an exposure in the conductive coating, i. in the conductor 5, provided, and in this area 12 has already been an adhesive tape section 3 is positioned and adhered under pressing and also pre-cured to a predetermined extent, so that its liability to the pad 4 is ensured.
  • the chip 2 is now by pressing, as shown by the arrow 13, attached and glued.
  • the glued state of the chip 2 can be seen in the lower part of FIG. 2B.
  • the chip 2 further has contact areas 14, 15 at its upper side, which are later contacted via the laser bores 8 already mentioned with reference to FIG. 1 through the cover layer 6.
  • the pad 4 After attaching the adhesive tape portion 3 on the circuit board pad 4 and the chip 2 on the tape portion 3, as mentioned, the pad 4, preferably on a panel with a variety of similarly populated printed circuit board substrates placed in an oven to the adhesive completely cure. This can be done in a reactive or inert atmosphere, e.g. Nitrogen, happen.
  • a reactive or inert atmosphere e.g. Nitrogen
  • the bores 8, 9 for contacting the internal components, in particular chips 2, and conductor tracks 5 are then produced with the aid of laser beams; the result of this process step is shown in Fig. 2C.
  • an attachment of the contact points 14, 15 of the components 2 and the conductor tracks 5 in the interior of the multilayer is effected by galvanic metallization, the walls of the bores 8, 9 being covered with copper that the metallizations 10, 11 are obtained.
  • the upper copper layer 7 is patterned using a conventional photolithographic process, so that finally the printed circuit board element 1, as shown in Fig. 2E dar- is received.
  • FIG. 3 three different possibilities for a component fastening by means of adhesive film sections 3 are indicated schematically and for the sake of simplicity side by side in connection with a single substrate core as base 4.
  • an adhesive film portion 3 which consists only of adhesive material, wherein any lower and upper cover sheets have already been deducted, was positioned in advance on the base 4, pressed and pre-cured. Thereafter, a component 2, which is held by means of vacuum on the tool 17, brought computer-controlled in position and pressed according to the arrow 13 (see also Fig. 2A) on the adhesive film section 3 with the aid of a tempered stamp-suction tool 17.
  • the thin or thinned component 2 may for example have a thickness of the order of only about 50 ⁇ m, cf. the dimension D in Fig. 3, and the adhesive film portion 3 may for example have a thickness d on the order of only 8 ⁇ m to 15 ⁇ m.
  • FIG. 3 A comparable attachment of a thinned or thin component 2 by means of a tool 17 is illustrated in the middle part of FIG. 3, but here an adhesive film portion 3 is shown which has a carrier film 3a between two adhesive layers 3b, 3c, cf. otherwise Fig. 3A.
  • this adhesive film section 3 may have a lower cover film 3d and an upper cover film 3e, as illustrated in FIG. 3A, these cover films 3d, 3e being removed during the application of the adhesive film section 3 or the component 2, as shown schematically in FIG Fig. 3A is indicated.
  • the lower cover layer 3d is withdrawn, after which the adhesive film section 3 is pressed onto the circuit board pad 4 as the first.
  • the upper cover film 3e is preferably removed only immediately before the attachment of the component 2 so as to protect the upper adhesive layer 3c as long as possible.
  • a thickness between, for example, 10 .mu.m and 50 .mu.m (without cover films) may be given, while an adhesive film section with adhesive layers 3b, 3c on both sides of a carrier film 3a may well be somewhat thicker, about 12 .mu.m to 200 .mu.m thick.
  • the upper cover film can for example consist of PET and have a thickness of 50 .mu.m, whereas the lower, first deducted cover sheet of PE material and may have a thickness of 25 microns.
  • the adhesive material is a polymeric Adhesiv combination, which may also contain epoxy resin, and which may be prepared, for example, based on a modified Polyixnids or a polymer with low modulus of elasticity.
  • FIGS. 4A, 4B and 4C Such prior attachment of adhesive foil sections 3 to the components 2 is advantageously obtained when, as shown in FIGS. 4A, 4B and 4C, a correspondingly wide adhesive tape, i. tape-shaped adhesive sheet material 19 is attached to the underside of a wafer 18 containing a plurality of chips 2 or the like.
  • FIG. 4A also schematically indicates at 20 how the adhesive film material 19 is laminated to the wafer 18 after removal of any lower PE cover film with the aid of a roll.
  • the upper PET cover film which then comes to lie on the underside during the attachment according to the representation in FIG. 3 on the right side, can likewise be removed immediately or only immediately before the chips 2 are mounted on the printed circuit board substrate 4.
  • the wafer 18 is subdivided into the individual chips 2, which is indicated very schematically with the aid of a cutting tool 21. 7 000045
  • the chips 2 with the adhesive film sections 3 thus obtained directly on the underside of the chips 2 are mounted on the printed circuit board substrate 4, for which purpose the tempered suction tool 17 already explained with reference to FIG. 3 can be used.
  • the pad 4 can be heated from the underside with the aid of a heating block 22, as well as the application of the adhesive film material 19 on the wafer 18 as shown in FIG. 4A a heated block 23, which is maintained for example at a temperature of about 8O 0 C. , Can be used so as to already partially harden the adhesive material.
  • FIGS. 5A to 5D illustrate, as an alternative to FIGS. 4A to 4C, a technique in which, by means of a cutting tool 24, the individual adhesive film sections 3 are cut off from a tape-shaped adhesive film material 19, for example by means of a cutting tool 24.
  • the one cover film namely the PE cover film
  • the individual adhesive film sections 3 are cut and applied with the aid of the tool 17 to the printed circuit board substrate 4, cf.
  • Fig. 5B wherein the circuit board pad 4 can in turn rest on a heated block 22 so as to already provisionally cure the adhesive material of the adhesive film sections 3 to a certain extent.
  • a punching tool 25 can be used for punching out and directly pressing the adhesive film sections 3 onto the base 4.
  • the pad 4 can rest on a modified heating block 22 ', which is maintained for example at a temperature of 140 0 C.
  • any top PET cover sheet is peeled off from the adhesive sheet portions 3.
  • the adhesive sheet material 19 may be as in FIGS. 4A or 5A or 5D T2007 / 000045
  • this pad Before attaching the adhesive film sections 3 (or the component 2 together with the previously attached to them adhesive film sections 3) on the base 4, this pad can also be irradiated with an infrared lamp in the mounting positions and preheated, the heating time depending on the power of the infrared lamp 10th can be up to 20 seconds.
  • the force applied when the adhesive film sections 3 or the components 2 were pressed was 37N in tests.
  • the curing temperature for the adhesive of the adhesive film sections 3 was 150 0 C and 17O 0 C.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Details Of Resistors (AREA)

Abstract

La présente invention concerne un élément de carte de circuits imprimés (1) comprenant au moins un composant (2) noyé entre une couche de base (4) et une couche de recouvrement (6) et collé sur la couche de base (4) au moyen d'une section de film adhésif (3).
PCT/AT2007/000045 2006-02-02 2007-02-01 Élément de carte de circuits imprimés dans lequel est noyé au moins un composant, et procédé pour noyer au moins un composant dans un élément de carte de circuits imprimés WO2007087660A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AT07701291T ATE541314T1 (de) 2006-02-02 2007-02-01 Verfahren zum einbetten zumindest eines bauelements in einem leiterplattenelement
CA002650700A CA2650700A1 (fr) 2006-02-02 2007-02-01 Element de carte de circuits imprimes comprenant au moins un element integre, et procede d'integration
EP07701291A EP2027600B1 (fr) 2006-02-02 2007-02-01 Procédé pour noyer au moins un composant dans un élément de carte de circuits imprimés
EP10177700.1A EP2259311B1 (fr) 2006-02-02 2007-02-01 Procédé d'encastrement d'au moins un composant dans un élément de plaquettes
US12/162,016 US20110051384A1 (en) 2006-02-02 2007-02-02 Printed circuit board element having at least one component embedded therein and method for embedding at least one component in a printed circuit board element

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATA160/2006 2006-02-02
AT0016006A AT503191B1 (de) 2006-02-02 2006-02-02 Leiterplattenelement mit wenigstens einem eingebetteten bauelement sowie verfahren zum einbetten zumindest eines bauelements in einem leiterplattenelement

Publications (1)

Publication Number Publication Date
WO2007087660A1 true WO2007087660A1 (fr) 2007-08-09

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Country Status (6)

Country Link
US (1) US20110051384A1 (fr)
EP (2) EP2027600B1 (fr)
AT (2) AT503191B1 (fr)
CA (1) CA2650700A1 (fr)
FR (1) FR2896947A1 (fr)
WO (1) WO2007087660A1 (fr)

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WO2009143550A1 (fr) * 2008-05-30 2009-12-03 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Procédé pour intégrer au moins un composant électronique dans un circuit imprimé et circuit imprimé
WO2014005167A1 (fr) 2012-07-02 2014-01-09 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Procédé permettant d'intégrer au moins un composant dans une carte de circuit imprimé
US10187997B2 (en) 2014-02-27 2019-01-22 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method for making contact with a component embedded in a printed circuit board
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US10779413B2 (en) 2013-12-12 2020-09-15 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method of embedding a component in a printed circuit board
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WO2009143550A1 (fr) * 2008-05-30 2009-12-03 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Procédé pour intégrer au moins un composant électronique dans un circuit imprimé et circuit imprimé
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AT513047B1 (de) * 2012-07-02 2014-01-15 Austria Tech & System Tech Verfahren zum Einbetten zumindest eines Bauteils in eine Leiterplatte
AT513047A4 (de) * 2012-07-02 2014-01-15 Austria Tech & System Tech Verfahren zum Einbetten zumindest eines Bauteils in eine Leiterplatte
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US11172576B2 (en) 2013-11-27 2021-11-09 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method for producing a printed circuit board structure
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US10187997B2 (en) 2014-02-27 2019-01-22 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method for making contact with a component embedded in a printed circuit board
US11523520B2 (en) 2014-02-27 2022-12-06 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method for making contact with a component embedded in a printed circuit board

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CA2650700A1 (fr) 2007-08-09
EP2027600A1 (fr) 2009-02-25
US20110051384A1 (en) 2011-03-03
AT503191A1 (de) 2007-08-15
EP2259311B1 (fr) 2018-07-25
EP2259311A2 (fr) 2010-12-08
AT503191B1 (de) 2008-07-15
FR2896947A1 (fr) 2007-08-03
EP2259311A3 (fr) 2014-01-15
EP2027600B1 (fr) 2012-01-11

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