Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C33/00—Moulds or cores; Details thereof or accessories therefor
  • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C33/00—Moulds or cores; Details thereof or accessories therefor
  • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C33/00—Moulds or cores; Details thereof or accessories therefor
  • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
  • B29C33/60—Releasing, lubricating or separating agents
• • C—CHEMISTRY; METALLURGY
  • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
  • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
  • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
  • C04B35/50—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
• • C—CHEMISTRY; METALLURGY
  • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
  • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
  • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
  • C04B35/50—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
  • C04B35/505—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds based on yttrium oxide
• • C—CHEMISTRY; METALLURGY
  • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
  • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
  • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
  • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
  • C04B35/64—Burning or sintering processes
  • C04B35/645—Pressure sintering
• • C—CHEMISTRY; METALLURGY
  • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
  • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
  • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
  • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
  • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
  • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
  • C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
  • C04B2235/3213—Strontium oxides or oxide-forming salts thereof
• • C—CHEMISTRY; METALLURGY
  • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
  • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
  • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
  • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
  • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
  • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
  • C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
  • C04B2235/3225—Yttrium oxide or oxide-forming salts thereof
• • C—CHEMISTRY; METALLURGY
  • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
  • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
  • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
  • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
  • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
  • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
  • C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
  • C04B2235/3227—Lanthanum oxide or oxide-forming salts thereof

Definitions

• At least a mold surface is formed of a material having low adhesion to a substance having basicity (hereinafter referred to as “low adhesion material”) and such low adhesion material.
• low adhesion material a material having low adhesion to a substance having basicity
• the present invention relates to a resin mold and an antifouling material having a function of preventing adhesion of dirt made of an organic substance.
• a molded product having a cured resin is completed as follows by transfer molding, injection molding, compression molding and the like. That is, the cavity provided in the mold for resin molding is filled with the flowable resin, and the flowable resin is hardened to form a hardened resin to complete the molded body. . And, tool steel is mainly used as a mold material. Also, by using a ejector mechanism, the mold force is also made to be easy to take out by projecting the molded body.
• a chip-like electronic component such as an LSI (Large Scale Integration) chip mounted on a lead frame or a printed circuit board, etc.
• a thermosetting resin containing a filler made of ceramic cake for example, an epoxy resin having basicity is used. Since this filler wears the mold surface, the mold It is practiced to form a metal-based high-hardness material having wear resistance on the surface.
• a metal-based high-hardness material excellent in wear resistance such as Cr, TiC, or CrN is used as a physical vapor deposition (PVD), 3; a chemical vapor deposition (CVD).
• PVD physical vapor deposition
• CVD chemical vapor deposition
• Y O is an epoxy that is a stable sintered body in air.
• O is a basic acid. From this, it is possible to use basic epoxy resin as Yo
• the binding strength of a material to a substance having basicity is smaller as the basicity of the material becomes stronger. Therefore, when the material has better releasability than Y O
• the basicity in the present application document means the donating property of the electron pair, that is, the property of donating the electron pair, or the property of being awarded a proton (for example, the Science Dictionary 4th Edition) , Iwanami Shoten, 1987, p. 161).
• a small amount of a cured resin and the like easily adhere to the surface of a member to which a basic substance such as fluid epoxy resin and the like comes in contact. Then, when those members are subsequently used, stains such as hardened resin adhere to their surfaces.
• Patent Document 1 Japanese Patent Application Laid-Open No. 7-329099 (Page 3 Page 4)
• Patent Document 2 Japanese Patent Application Laid-Open No. 2005-274478 (page 8)
• metal-based high hardness material having excellent wear resistance such as Cr, TiC, or CrN
• these metal-based high hardness materials can be used against the flowable resin. Because of their sufficient non-wetting properties, the releasability between the metal-based high hardness material and the mold surface is insufficient.
• An object of the present invention is to have a lower adhesion to a substance having basicity than Y 2 O
• the low adhesion material of the present invention is low for substances having basicity! It is a low adhesion material that has adhesive properties.
• the low adhesion material comprises a first material and a second material which are Y.sub.O.
• the shape retention that is, the property of maintaining a constant shape is obtained.
• the second material also has acidity.
• the acid hydrate satisfies at least one of the condition that it contains a substance having an ionic radius larger than Y 3 + and the condition that it has a stronger basicity than the first material.
• the second material is LaO
• the first material and the second material are LaO
• the second material is LaO
• the first material and the second material are LaO
• the material may contain at least a complex acid product produced from the material.
• the second material is LaO, YO and LaO, etc.
• the second material may be SrO, and the solid solution formed from the first material and the second material may be included.
• the second material may be SrO, and may include a composite oxide formed from the first material and the second material.
• the second material is SrO
• the second material is a raw material from YO and SrO.
• the low adhesion material according to another aspect of the present invention is a low adhesion material having low adhesion to a substance having basicity. Its low adhesion material is Y O
• the low adhesion material has a shape retention property, that is, the property of maintaining a certain shape, when the ratio of each of the plurality of materials to the total of the first material and the plurality of materials is a predetermined value. .
• Multiple materials Each of the meals consists of an acid cake.
• Each of the oxides satisfies at least one of the condition that it contains a substance having an ionic radius larger than Y 3 + and the condition that it has a stronger basicity than the first material.
• the resin mold of the present invention is used in the case where a cavity is provided, is filled with the cavity, and the flowable resin having basicity is cured to form a cured resin, It is a resin mold having a low adhesion between the mold surface, which also comes in contact with the flowable resin, and the cured resin.
• at least a part of the mold surface is made of low adhesion material.
• the low adhesion material consists of a first material and a second material
• the low adhesion material has the shape retention property, that is, the property of maintaining a certain shape when the ratio of the second material to the whole of the first material and the second material is a predetermined value.
• the second material consists of acid. The acid satisfies at least one of the condition that it contains a substance having an ionic radius larger than ⁇ 3 + and the condition that it has stronger basicity than the first material.
• the resin mold according to the present invention is used in the case where a cavity is provided and the flowable resin filled with the cavity and having basicity is cured to form a cured resin.
• it is a resin mold having low adhesion to the surface between the mold surface and the cured resin, which also has a surface force with which the flowable resin contacts.
• a portion including at least a part of the mold surface is made of a low adhesion material. Also, the low adhesion material is
• the low adhesion material has shape retention when the ratio of each of the plurality of materials to the total of the first material and the plurality of materials is a predetermined value.
• Each of the plurality of materials also has an acidity.
• Each of the oxides satisfies at least one of the condition that it contains a substance having an ionic radius larger than ⁇ 3 + , and the condition that it has a stronger basicity than the first material.
• low adhesion material it is possible to include a Sani ⁇ containing a substance having an ionic radius larger than Upsilon 3+ raw materials. And, when such an oxide is included in the raw material, it is possible to obtain a low adhesion material whose adhesion to a substance is lower than that of a single substance. That
• the material produces a low adhesion material. This reduces the number of exposed ions per unit area on the surface of the low adhesion material than on the surface of ⁇ o alone
• the second material of matter has a predetermined ratio. Or, other than ⁇ and its ⁇
• a number of materials each have a predetermined ratio. And, under the predetermined ratio, the low adhesion material has shape retention.
• a low adhesion material is obtained.
• a low adhesion material can be obtained which has a shape retention property greater than that of the acid precipitate alone or each of the acid precipitates alone. Note that, throughout the present application, "a plurality of materials” means “a plurality of materials”.
• the low adhesion material contains at least one of a solid solution and a complex oxide.
• the solid solution and the complex oxide thereof are selected from ⁇ ⁇ ⁇ and La ⁇ or
• 3 2 3 2 3 is also an oxide having strong! ⁇ basicity.
• adhesion to a substance having basicity is lower than that of YO alone. It is possible to obtain a low adhesion material containing at least one of a solid solution and a composite oxide each having adhesion. Furthermore, La and Sr are both substances having a larger ion radius than Y 3 + . Therefore, the adhesion to each substance is higher than that of single substance
• a low adhesion material which contains at least either a low solid solution or a complex oxide.
• La O has a predetermined ratio to the total of ⁇ and La ⁇ .
• SrO has a predetermined ratio to the total of YO and SrO.
• Oxides ie, single oxides (LaO or SrO), which are inferior in formability to YO.
• the low adhesion material comprises a mixture. And there are two such mixtures specifically. One mixture was generated from Y O and La O respectively.
• the solid solution and the complex oxide have lower adhesion to substances (particularly, substances having basicity) than that of Y 2 O alone, and also have poorer shape retention than Y 2 O.
• the shape retention is better than a single oxide (LaO or SrO). Therefore, those
• the mold surface in contact with the flowable resin having basicity is made of a low adhesion material in the resin mold.
• the low adhesion material comprises a first material and a second material that also provide Y O force, or Y O and a plurality of other than Y O
• the second material and a plurality of materials other than Y O are each
• the low adhesion material has lower adhesion to the cured resin (particularly to the cured resin having basicity) than that of Y 2 O alone. Therefore, this low adhesion material is a high release material
• the adhesion on the mold surface is lower than that of Yo alone, in other words, it has high releasability.
• the resin mold is obtained.
• the second material made of an oxide having 2 3 2 3 3 strong or basicity has a predetermined ratio. Some moths have stronger basicity than Y 2 O over the whole of Y 2 O and its multiple materials other than Y 2 O.
• Each of the plurality of materials comprising oxides has a predetermined ratio. And, under the predetermined ratio of these, the low adhesion material has shape retention.
• a low adhesion material having shape retention can be obtained. Therefore, in the resin mold, at least a part of the mold surface is constituted by the low adhesion material having good shape retention.
• the low adhesion material of the present invention can also be used as an antifouling material having a function of preventing the adhesion of the organic matter contamination.
• FIG. 1 is a flow chart showing a method of producing a low adhesion material according to Example 1 of the present invention.
• the amount of LaO added to the 2 3 2 3 3 O 3 and the product formed from Y 2 O and La 2 O are basic.
• FIG. 6 is a relationship diagram showing the relationship between the adhesive force and the epoxy resin which is a substance to be mixed.
• FIG. 3 The whole of YO and SrO in the raw material of the low adhesion material according to Example 2 of the present invention
• FIG. 4 is a cross-sectional view showing a resin mold according to Example 3 of the present invention.
• FIG. 5 A sectional view showing a modification of the resin mold shown in FIG.
• the resin molds 1 and 10 according to the present invention are used in the case where a basic flowable resin is cured to form a basic hardenable resin, and the flowable resin contacts. It has low adhesion between the mold surface 6 and the cured resin.
• This resin mold 1, 1
• the mold surface 6 is made of the low adhesion material 3.
• the low adhesion material 3 is a solid solution formed from Y 2 O and other oxides. That
• Acid oxide is La O, which contains La, which is a substance having a larger ion radius than Y 3 +.
• La O has a predetermined ratio to the whole of O and La O, and the low adhesion material 3 has this ratio
• the low adhesion material according to the present invention is a low adhesion material having low adhesion to a substance having basicity (for example, epoxy resin etc.) and has the following two features. .
• the first feature is as follows.
• the first feature is a first material which is also Y O force and the first material
• the first feature is that the other material is an oxide, and the oxide or the oxide thereof contains a substance having an ionic radius larger than Y 3+ , and
• At least one of the conditions of having basicity stronger than 3 is satisfied.
• the second feature is that the other material has a predetermined ratio to the whole of the material and the other material,
• the low adhesion material is to have shape retention under the predetermined ratio.
• those materials consist of multiple types, those materials each have a predetermined ratio.
• Example 1 of the low adhesion material according to the present invention will be described with reference to FIGS. 1 and 2.
• Figure 1 is It is a flowchart which shows the manufacturing method of the low adhesion material which concerns on a present Example.
• Fig. 2 shows the addition of LaO to the whole of YO and LaO in the raw material of the low adhesion material according to this example.
• the amount of 2 3 2 3 2 3 added, Y O and La O forces, and the product produced are materials that have basicity, and so on.
• the "addition amount" of LaO refers to the sample used for obtaining the data of FIG.
• the amount of La O with respect to the total of Y O and La O is the amount of Y O and La O
• the first material is used as the low adhesion material based on experiments and analysis.
• a mixture of Y 2 O and the complex oxide LaYO and a complex oxide LaYO were employed.
• the first material YO has a larger ion radius than Y 3 +, which is an ion of Y contained in the first material YO.
• La was adopted as the target substance.
• the ion radius of Y 3+ is 1.02 ⁇ (102 pm)
• it contains a substance (La) having an ionic radius larger than Y 3+ and has a stronger basicity than YO.
• La O as a second material that also has an acidity that satisfies both conditions.
• Isoelectric Point of Surface is used as one of the indices indicating acidity and basicity of the oxide surface. It is basic if the IEPS is greater than 7 and acidic if it is less than 7.
• the value of IEPS can be ordered by the ratio of the charge of the cation (cation ion) constituting the acid salt to its ion radius (Reference: George A Parks, "The Isoelectric Points of Solid Oxides, Solid Hydroxides, and Aqueous Hydroxo complex systems ", 65, 177-198 (1965)).
• IEPS is expressed by the following equation.
• the method for producing the low adhesion material according to the present embodiment for example, the powder mixing method, will be described with reference to FIG.
• step S1 a necessary amount of powder of YO, which is the first material, is prepared. next,
• step S2 a predetermined amount of powder of LaO, which is the second material, is added, and the solution is further dissolved in step S3.
• step S4 ball mill mixing is performed in step S4.
• step S5 the ball mill mixed material is dried and sieved.
• step S6 the mixed material is molded at a predetermined pressure using a mold for forming a predetermined shape.
• step S7 the formed compact is pressurized and fired at a predetermined temperature for a predetermined time by a hot press.
• the processing conditions in this case are, for example, a temperature of 1350 ° C., a time of 1 hour, and a press pressure of 0 MPa.
• step S8 the sintered body under pressure and firing is heat-treated at a predetermined temperature for a predetermined time to promote a solid solution reaction or a complex oxide formation reaction.
• the processing conditions in this case are, for example, a temperature of 1550 ° C. and a time of 5 hours.
• FIG. 2 shows the amount of La O added to the total of Y and La O in raw materials, YO
• the addition amount of LaO with respect to the total of YO and LaO in the raw materials is
• the adhesion was calculated based on the obtained data. As a result, as shown in FIG. 2, as the addition amount of LaO increases, the result is that the adhesion decreases.
• La O— Y which is a sample manufactured from the first material Y O and the second material La O.
• a sample having 30 mol% of La O added is a solid solution La-Y O and a complex acid.
• the substance was a mixture consisting of LaYO. And the amount of La O added is 50 mol%.
• Both the mixture and the complex oxide LaYO correspond to the low adhesion material according to the present invention.
• the adhesion shown in FIG. 2 was measured as follows. First, it has basicity As a material to be treated, an epoxy resin which is a thermosetting resin is prepared. Next, the epoxy resin is brought into contact with the LaO-YO pseudo binary material, and the epoxy resin is
• the cured resin and the pseudo-binary material are pulled along the direction perpendicular to the adhesion interface, and the load at the time of peeling is measured. Next, remove the load by the area of the adhesive interface. In this way, the adhesion between the pseudo binary material and the cured resin is calculated. This adhesion is equivalent to the force (releasing force) per unit area required for releasing the resin-molded-type caustic-cured resin, which also has the effect of the pseudo-binary material.
• a low adhesion material which has low adhesion within a range usable as a resin mold and good shape retention to such an extent that it can be used as a resin molding.
• the low adhesion material with low adhesion is considered to be due to the following two reasons for the ionic radius and the basicity.
• La which is a substance that That is, from YO to Y 3+
• the number of cation force per unit area exposed on the surface of the pseudo-binary material is smaller than that on the surface of YO alone.
• the adhesion to the substance is Y O alone
• a pseudo binary material having strong and basic properties can also be obtained, which is considered to be a force close to the basicity of epoxy resin. Therefore, the bonding force between the pseudo binary material and the substance having basicity is Y ⁇ simple substance
• the range of the adhesive force required varies depending on the application of the low adhesive material.
• the amount of LaO added is Omol%
• the amount of La O added in Figure 2 is Omol%
• the ratio of LaO referred to here is the ratio of the first material YO to the second in the generated pseudo binary material.
• the range of the ratio of the second material LaO to the total of 2 3 2 3 2 3 2 3 3 is determined in the following procedure. First, Y O
• the expected substance can be present as a predetermined substance, La O
• the "predetermined substance" referred to in the following is either one of a mixture of a solid solution La-YO, a solid solution La-YO and a complex oxide LaYO, and a complex oxide LaYO.
• the range of the ratio of LaO is 0%.
• the low adhesion material according to this example can be obtained when the ratio is more than about 75 mol%.
• the ratio of La O exceeds about 75 mol%, La O—Y O pseudo binary is
• the heat treatment temperature shown in the above-described phase diagram will be described by taking the case of 1860.degree. C. as an example. According to the phase diagram, the ratio of La O is greater than Omol% and solid
• the complex oxide LaYO is formed from around ol% to around 75 mol%.
• YO refers to the temperature (about 180 ° C) heated when used as a resin mold
• LaO-YO pseudo binary materials have the above-mentioned temperature (heat treatment temperature
• Y O pseudo binary material power and has shape retention in the range from room temperature to heat treatment temperature
• Example 2 of the low adhesion material according to the present invention will be described.
• the first material Y O and the second material SrO are used as a low adhesion material.
• the resulting SrO-YO pseudobinary material was adopted. More specifically, SrO-Y O pseudo
• solid solution Sr-YO solid solution Sr-YO
• complex oxide SrYO complex oxide
• the ion radius of Y 3+ is 1.02 ⁇ (102 pm), and the ion radius of Sr 3+ is 1. 18A (118 pm).
• SrO was adopted as a second material consisting of an oxide which also satisfies the condition of being in conflict with having 2 3 basicity.
• SrO is added to YO by a predetermined amount to contain YO and SrO.
• SrO-YO pseudo-binary material is generated.
• the method of producing this pseudo binary material is the same as that of Example 1.
• the low adhesion material according to this example will be described with reference to FIG. Fig. 3 shows the amount of SrO added to the total of YO and SrO in the raw materials for the low adhesion material according to this example.
• the amount of SrO added to the powder is two kinds, 10 mol% and 19 mol%.
• a sample was also prepared that also had two SrO-YO pseudobinary materials. And each sample, SrO
• the experiment was carried out using a material (Y 2 O alone) that is equivalent to the amount of addition of iron S 0 mol%.
• Adhesion was calculated based on the data. As a result, as shown in FIG. 3, it was found that the adhesion decreases as the amount of SrO added increases.
• the samples which are 10 mol% and 19 mol% are both solid solutions Sr-Y O and complex oxides SrY
• the mixture consisting of solid solution Sr-YO and complex oxide SrYO is a resin.
• the mixture consisting of the solid solution Sr-YO and the complex oxide SrYO has low adhesion according to the present invention.
• O is a SrO-YO pseudo binary material produced from YO and SrO.
• phase diagrams of yttrium sesquioxide-strontium oxide an d ytteroium sesquioxide-strontium oxide systems Phase diagrams of yttrium sesquioxide-strontium oxide an d ytteroium sesquioxide-strontium oxide systems "(S.. Fresvyatskn. Et al. Jzv. A kad. Nauk SSSR, Neorg. Mater., 7 [10] 1808-1811 (1971)) and in Translation "Inorg. Mater. (Engl. Transl.), 7 [10] 1614-1617 (1971),", about the same document. ing.
• the sample in which the amount of SrO additive added in the raw materials was 10 mol% and 19 mol% is the generated SrO-YO pseudo binary material, which is a solid solution Sr —
• FIG. 3 shows the raw materials of the SrO-YO pseudo binary material.
• the complex oxide SrY O consisting of 2 3 has completely different properties and crystal structure compared to single SrO
• the ratio of the complex oxide SrYO contained in the sample was determined by adding SrO
• SrO has the property of low chemical stability in air.
• the solid solution Sr-YO is Sr when the heat treatment temperature is 1970.degree.
• Mixture consisting of 2 3 body, solid solution Sr-YO, solid solution Sr-YO and complex oxide SrYO
• the second point is that the adhesion to a substance having basicity is such that the ratio of SrO is O mol% YO single force begins to decrease as the ratio of SrO increases (see Figure 3).
• the third point is that a simple mixture of Y O alone, a solid solution Sr—Y O and a complex oxide Sr Y 204
• adhesion to a substance having basicity is examined. This adhesion is preferably as low as possible.
• the ratio of SrO is better in solid solution Sr-YO than in YO alone.
• the low adhesion required for the low adhesion material is satisfied with the adhesion (the third point mentioned above).
• the solid solution Sr-YO which has lower adhesion than YO alone, has low adhesion.
• shape retention is examined. It is preferable that the shape retention be good.
• SrO-YO pseudo binary materials if the chemical stability in air is low
• the solid solution Sr-YO has high shape retention required for low adhesion materials.
• the solid solution Sr-YO is a low adhesion material according to the present invention
• phase diagram The heat treatment temperature shown in the above-described phase diagram will be described by way of example at a temperature of 1970.degree. According to the phase diagram, a solid solution Sr-YO is formed until the ratio of SrO exceeds O mol% and around 1.5 mol%. Similarly, from around 1.5 mol% to around 50 mol%, solid solution Sr
• a mixture of YO and the complex oxide SrY O is formed. Similarly, to 50 mol% In this case, the complex oxide SrY O alone is produced.
• Y O means the temperature (about 180 ° C) that is heated when used as a resin mold
• these SrO-YO pseudo binary materials have the above-mentioned temperatures (including the heat treatment temperature).
• SrO Y O is a quasi binary material force, and good retention can be achieved in the range up to room temperature force heat treatment temperature.
• a low adhesion material with shape is obtained.
• Example 2 As described above, in Example 2, the following six materials were mentioned as the low adhesion material according to the present invention. It is (1) solid solution La-Y O, (2) solid solution La-
• the low adhesion material according to the present invention may be formed by mixing two or more of the above-mentioned six low adhesion materials in an appropriate combination and an appropriate ratio. Good. In this case, it is a low adhesion material which also has three systems of Y O, La and Sr,
• LaO-SrO-YO pseudo ternary material may be formed. Furthermore, 3 of Y O, La and Sr
• low-adhesion materials in which one or more other substances are added to one system that is, higher-order multicomponent materials can be used as the low-adhesion material according to the present invention.
• the following mixture may be used as the low adhesion material. It is a solid solution LaYO, a mixture of a solid solution La-YO and a complex oxide LaYO, and a complex oxide It is a mixture of at least one of LaYO and Y alone as the first material. Furthermore,
• Solid solution Sr-YO mixture of solid solution Sr-YO and complex oxide SrYO, and
• the second material it is larger than Y 3 +, which is an ion of Y contained in the first material YO.
• the oxide which satisfies the deviation condition is also described.
• the second material is not limited to this, and depending on the characteristics of the substance having basicity and the required degree of low adhesion, the following acid compounds may be used as the second material: Can also be adopted.
• the acid substance is a condition that it contains a substance having an ionic radius larger than ⁇ 3+ and basicity stronger than ⁇
• the acid oxide satisfies at least one of the conditions of having
• the low adhesion material according to the present invention has a very low oxide content.
• the acidity to be added to the salmon is the salmon contained in the salmon.
• the low-adhesion material of the present invention is not limited to this, and an oxide containing a substance different from both La and Sr as a substance having a larger ion radius than Y 3 +
• Materials produced using such acids may also be low adhesion materials according to the present invention.
• additives are added to Y 2 O.
• the adhesion to a substance having basicity is reduced. Therefore, the addition of the second material (additive) to the first material Y O has the effect of the present invention that the adhesion is reduced.
• exceeding 0 mol% of the specific force of the second material (additive) can be the lower limit of the ratio of the second material.
• FIG. 4 is a cross-sectional view showing a resin mold according to the present embodiment
• FIG. 5 is a cross-sectional view showing a modification of the resin mold of FIG. In order to make it easier to work with any of the figures shown below It is drawn in tension.
• transfer molding is used as an example of the resin molding method, and a case where a chip mounted on a substrate is sealed with epoxy resin is described.
• a chip wired by a wire is housed in a cavity, filled with a flowable resin in a clamped state, and the flowable resin is hardened to form a hardened resin, A molded body (package) having a substrate and a cured resin is completed.
• the upper mold 1 corresponds to the resin mold according to the present invention.
• Upper mold 1 is a low releasability material according to, for example, Example 1 of the present invention, that is, a high releasability material consisting of a solid solution La-YO.
• a resin flow channel 4 through which fluid resin (not shown) flows and a cavity 5 into which the fluid resin is filled are provided in a recessed form. Therefore, the high releasability material 3 is exposed on the mold surface 6 in the resin flow path 4 and the cavity 5, that is, on the mold surface 6 of the resin mold to which the flowable resin contacts. It will be.
• the lower mold 2 is made of tool steel or the like, and a substrate 7 which also has a lead frame, a printed substrate, and the like is placed thereon.
• a chip 8 is mounted on the substrate 7, and electrodes (not shown) of the substrate 7 and the chip 8 (both not shown) are electrically connected by wires 9.
• the substrate 7 is positioned on the lower mold 2 and placed, and the substrate 7 is fixed by a method such as suction.
• a plunger (not shown) is used to press the flowable resin which is made of thermosetting resin and has a certain viscosity so that the flowable resin 5 can flow to the cavity 5 via the resin flow path 4. Fill.
• a flowable resin is heated and cured to form a cured resin.
• the upper mold 1 is lifted to open the mold, and the molded product in which the substrate 7, the chip 8 and the wire 9 are integrally sealed by the cured resin is taken out.
• the features of the resin mold according to the present embodiment are the same as those of the resin mold among the flowable resin.
• Highly releasable material in which the upper mold 1 to be brought into contact with the solid solution La-YO kao described in Example 1 is highly releasable material in which the upper mold 1 to be brought into contact with the solid solution La-YO kao described in Example 1
• the mold surface 6 of the upper mold 1 in contact with the flowable resin is constituted by the highly releasable material 3.
• the high releasability material 3 is a chemically stable substance having excellent low adhesion to the cured resin formed by curing the flowable resin. Due to this low adhesion, excellent releasability with respect to the cured resin, characteristics in which dirt made of the cured resin does not easily adhere to the mold surface, and characteristics in which the dirt adhered to the mold surface is easily removed are generated. . Therefore, according to this embodiment, a resin mold capable of maintaining excellent releasability for a long time without requiring an ejector mechanism and reducing the frequency of cleaning can be realized. Furthermore, a resin mold having excellent releasability can be realized as compared to the case of forming a metal-based material such as Cr, TiC, CrN or the like on the mold surface.
• Ceramic materials have excellent wear resistance. Therefore, there is no problem with the abrasion of the organic material that occurs when the organic material is coated on the mold surface.
• the resin mold according to the present example is the low adhesion material (solid solution La— YO) having a predetermined shape such as the resin flow path 4 and the cavity 5 manufactured in Example 1. , Mounting holes
• the upper mold 10 is a resin mold according to the present modification.
• a mold body 11 made of a conventional resin mold material (tool steel etc.) is used, and Example 1 is applied to the surface of the mold body 11.
• Low adhesion material Solid solution La-YO
• the release layer 12 is formed by a known method, for example, PVD (Physical Vapor Deposition) such as vacuum evaporation, electron beam evaporation, sputtering, plasma spraying, ion plating, C VD (Chemical Vapor Deposition), Or baking of the sheet-like material It is formed by the clever method.
• PVD Physical Vapor Deposition
• C VD Chemical Vapor Deposition
• the presence of the release layer 12 at the mold surface 6 provides the same effect as the effect obtained by the resin mold shown in FIG.
• the low adhesion material according to Example 1 is formed on at least the mold surface 6 !,! Thereby, in the mold surface 6, excellent low adhesion to the cured resin, that is, low releasability is realized.
• the thickness of the release layer 12 which also has low adhesion material strength can be appropriately determined. If only the low adhesion is taken into consideration, the release layer 12 may have a thickness (about several nm) such that a unit grid made of a low adhesion material is formed. However, considering the durability etc., it is possible that the mold release layer 12 which actually constitutes the mold surface 6 of the resin mold has a predetermined thickness (for example, about several hundred ⁇ m). Preferred.
• the mold body 11 can be made of a material other than tool steel or the like.
• the mold body 11 may be made of a cemented carbide alloy containing WC (tungsten carbide), or a ceramic material which also has the same strength as 3YSZ (3 mol% yttria stable water zirconia).
• the low adhesion material according to Example 1 described above that is, the solid solution La— YO, is used as the low adhesion material constituting the mold surface of the resin mold.
• the low adhesion material of the present invention is not limited to this, and the low adhesion material described in Examples 1 and 2 may be adopted.
• a material obtained by adding another substance as an additive to the low adhesion material described in Examples 1 and 2 may be adopted as the low adhesion material constituting the mold surface.
• a material formed by mixing two or more of the low adhesion materials described in Examples 1 and 2 in an appropriate combination and an appropriate ratio is configured as a mold surface. It may be adopted as a low adhesion material.
• YO has a larger ion radius than Y 3+
• a material to which an oxide containing a material different from La and Sr is added may be adopted as the low adhesion material constituting the mold surface. Also in these cases, the same effects as the effects obtained by the present embodiment and the modification can be obtained.
• a block-like (rectangular parallelepiped) low adhesion material is used as a cavity for forming the bottom or top face of the cavity. It may be used as a lock.
• the resin mold used for sealing the tip 8 mounted on the substrate 7 has been described as an example.
• the resin mold of the present invention is not limited to this, and it is possible to flow the flowable resin in a state in which the cavity 5 is filled with the flowable resin, such as general transfer molding, compression molding, injection molding, etc.
• the present invention can be applied to a resin mold used for curing to produce a molded article.
• all of the mold surface 6 with which the fluid resin contacts are made of the high releasability material.
• the resin mold of the present invention is not limited to this, and part of the mold surface 6 with which the fluid resin contacts, for example, the inner bottom surface (upper surface in FIGS. 4 and 5) of cavity 5 has high releasability. You may be made up of materials.
• the low adhesion material of the present invention is not limited to this, and the low adhesion material is required to be low in wettability to a substance having basicity other than the resin mold, that is, other than the resin molding type. It can be used for Specifically, such a low adhesion material can be used for coating or the like of a portion of the member or the like to which the flowable resin contacts.
• the low adhesion material according to the present invention can be used for applications which require a low adhesion to a substance having a basicity other than a resin.
• a low adhesion material can be used as a material having a function of preventing the adhesion of organic matter-causing dirt.
• it can be considered to be used as a material for building materials, baths, sanitary ware, and similar devices used for the outer wall of buildings and the like.
• the low adhesion material according to the present invention may be used as a material for coating the surface of a member used for these applications.
• the low-adhesion material 3 described above can also be used as an anti-soiling material having a function of preventing the adhesion of dirt made of an organic substance.

Landscapes

• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Ceramic Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Materials Engineering (AREA)
• Structural Engineering (AREA)
• Organic Chemistry (AREA)
• Mechanical Engineering (AREA)
• Inorganic Chemistry (AREA)
• Moulds For Moulding Plastics Or The Like (AREA)
• Laminated Bodies (AREA)
• Compositions Of Macromolecular Compounds (AREA)

Priority Applications (2)

Applications Claiming Priority (2)

Publications (1)

Family

ID=38309029

Family Applications (1)

Country Status (7)

Families Citing this family (5)

Citations (3)

Family Cites Families (12)

• 2006
  • 2006-01-26 JP JP2006017335A patent/JP3974152B2/ja not_active Expired - Fee Related
  • 2006-12-27 CN CNA2006800290224A patent/CN101238081A/zh active Pending
  • 2006-12-27 KR KR1020097013884A patent/KR20090082293A/ko not_active Withdrawn
  • 2006-12-27 WO PCT/JP2006/326025 patent/WO2007086228A1/ja not_active Ceased
  • 2006-12-27 US US11/920,421 patent/US20080296532A1/en not_active Abandoned
  • 2006-12-27 EP EP06843407A patent/EP1978005A4/en not_active Withdrawn
  • 2006-12-27 KR KR1020077027278A patent/KR100961798B1/ko not_active Expired - Fee Related
  • 2006-12-29 TW TW095150108A patent/TW200730467A/zh not_active IP Right Cessation

Patent Citations (3)

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events