WO2007066643A1 - プローブピン、プローブカード及びプローブ装置 - Google Patents
プローブピン、プローブカード及びプローブ装置 Download PDFInfo
- Publication number
- WO2007066643A1 WO2007066643A1 PCT/JP2006/324232 JP2006324232W WO2007066643A1 WO 2007066643 A1 WO2007066643 A1 WO 2007066643A1 JP 2006324232 W JP2006324232 W JP 2006324232W WO 2007066643 A1 WO2007066643 A1 WO 2007066643A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe pin
- probe
- electrode
- contact portion
- contact
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims abstract description 179
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 32
- 238000012360 testing method Methods 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 27
- 239000012768 molten material Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 22
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 238000007689 inspection Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Definitions
- the characteristic of the child circuit such as c s formed on the semiconductor device is pressed against the electronic circuit on the side of the device.
- the quality of the conventional type is that a metal such as tungsten is used to withstand many inspections ().
- the part of the electrode on the side of the side may be separated when attached to the electrode on the side of the side when the electrode is separated from the electrode on the side of the side. For this reason, it was feared that deposits would build up on the probe and electrical damage would occur between the probe and the electrode, after a large number of inspections. For this reason, it was necessary to replace the pile in a short period of time and remove the accumulated deposits with a la, resulting in a short life.
- the characteristics of the contact surface to be inspected are to be inspected, and the surface to be contacted with is made of a material whose strength is weaker than that of And A material with low strength is a material that breaks under certain stress.
- the surface of the bur is weaker than the surface of the covered garment, so that the bur of the bur will break when the glued bur is separated.
- deposits will not be deposited on the puck and the puck surface will always be exposed, so even if the puck is used many times, a constant contact with and can be maintained.
- it is possible to prolong the life of the fish, for example, by eliminating the need for the job of the fish.
- No. 009 surface may be made of a weak material, and the side part of the surface may be made of a material stronger than the above material. Even though.
- the 001p may be used for conducting electricity and electricity by using a tinging object.
- a device equipped with a probe for inspecting the characteristics of in contact with, which is weaker in strength than the contact with the device, and a device for contacting with the device. So that it can be dipped into the And a moving mechanism for moving the container, and characterized in that the top surface of the plug is made of a material whose strength is weaker than that of the above.
- the bur of the bur is separated. Therefore, deposits do not accumulate on the pock and the plow surface is exposed, so that even if the puck is used many times, a constant contact with and can be maintained. As a result, for example, the power supply of the king is no longer necessary and the life of the horse can be extended.
- the plug can be dipped in the container, the contacted part can be replenished and recovered. This can extend the life of the fish. Also, since the shape of the pump is stable, and are more stable.
- FIG. 6 (a) is a cross-section showing the state where the probe is in contact with the electrode. (b) is a cross-section showing the state where the probe is separated from the electrode. This is a cross-section of the 7 side coated with tin.
- the pu is equipped with a pod 2, a W as 3, and a moving mechanism 4 for moving the W.
- the pod 2 is provided with a contactor that supports a plurality of contacts with which W is in contact, and a pump 2 that sends and receives an electric signal to and from the contact through the body of the contactor dish.
- a contactor that supports a plurality of contacts with which W is in contact
- a pump 2 that sends and receives an electric signal to and from the contact through the body of the contactor dish.
- Punt 2 is formed, for example, and Punt 2 is
- the contactor is arranged so that it can be energized.
- the 002b is joined, for example, to the 2 formed on the body of the contactor dish.
- the loop is formed by a linear 3 as shown in 2 and a 3 protruding at a right angle to the 3 and has a shape.
- the back of the 3 is joined to the connection 2 and the contact 3 projects at the end of the 3. This 3 contacts P as a share of W.
- 002P is, for example, integrally molded, and is entirely made of P having W, which is weaker than P, for example, tin, for example, tin.
- the one whose tensile strength is smaller than O Pa than P is selected.
- a flexible wire is formed to connect 2 and electricity.
- the test 4 sends and receives signals for electrical characteristics, and 2 sets of tests to generate the targeting phenomenon.
- Test 4 Ting 4 is switched over to Ting 4 for impressing voltage on, continued via ching 42.
- the tenting phenomenon is the phenomenon in which the film on the surface of the electrode P is destroyed when the potential marked on the surface of the electrode P reaches ⁇ O c, and a current flows through the film.
- Taing 4 is a set of 2 touching Ps on W.
- the towing function is realized by the towing 4.
- the moving mechanism 4 includes, for example, a horizontal 5 that supports 3 from below, a moving unit 5 such as a unit that raises and lowers the horizontal 5, and a raising and lowering unit 5 in two horizontal directions. It is made up of a moving X stage 52. This makes it possible to move W set to 3 in three dimensions and to touch W on W's desired P.
- W is on top of 3.
- the moving mechanism 4 moves the W to the third dimension, and as shown in 5, each of the W's P has two pushes. Are contacted.
- the electrode Pp is extremely lowered.
- a voltage is applied between the two pts of P using Ting 4.
- a tinging phenomenon is generated, and the film on the surface of the electrode P is broken down (tinging).
- the electrical resistance between the P-electrode P and the P-electrode P becomes small, and the P-electrode P and the P-electrode P are electrically conducted.
- the switch 4 is switched to the test 4 by the switch 42. Then, using Test 4, an electric signal is sent from the electrode P to the electrode P, and the characteristics of the W W element are examined.
- Knob is separated from electrode P.
- the force of adhesion with the pre-electrode P is large. This is considered to be because a high current temporarily flows in a narrow area between the tip electrode P and the tip electrode P is welded.
- a tensile force acts on the probe electrode P. Since the electrode P is formed more frequently than the electrode P, if the electrode P is in contact with the electrode P as shown in 6 (a) and the electrode P is separated as shown in 6 (b), The part of the surface of the is separated and adheres to the electrode P.
- the container 62 having the container since the container 62 having the container is provided in the container, the container can be replenished with the container in the container 62. As a result, the shape of the pu is maintained, and the life of the pu can be further extended.
- the 003 62 is placed on the 6 so that it can keep the melt in the container 62.
- the body of the p is made of tin, but only the 3rd face of the p is made of tin, which is weaker than the electrode P, and the side of the 3rd face is formed.
- the part is made of a material stronger than the electrode P, for example,
- tungsten it may be made of tungsten or the like.
- a of the p is formed by Kakke (), and tin is coated on the b of the p.
- the tin of b is coated, for example, only to.
- the a of the body is made of a strong material, the degree of the body of the body is secured and the body is not deformed by, for example, touching P.
- only the surface of contact 3 is coated with tin, it is performed only on the surface of contact 3 that is missing at the time of separation, so that a large mass of tin does not adhere to the electrode P side.
- the contact a (3 contact 3) may be made of a strong material to the above degree, but only contact 3 It may be made of a strong material.
- tin is used as the material having a higher strength than the electrode P, but an alloy containing tin or another material such as solder may be used.
- the description is applied to the process used when the tinting process is performed, but it can also be applied to the process used when the tinting process is not performed. , P outside of W (ratney display), disk for otosk, etc.
- the P in this case is Aum.
- the horizontal axis indicates the number and the contact resistance. If the resistance is large, it will not be possible to use it, and it will be a life. As shown in Fig. 8, the (S)
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005352566A JP5048942B2 (ja) | 2005-12-06 | 2005-12-06 | プローブピン,プローブカード及びプローブ装置 |
JP2005-352566 | 2005-12-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007066643A1 true WO2007066643A1 (ja) | 2007-06-14 |
Family
ID=38122789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/324232 WO2007066643A1 (ja) | 2005-12-06 | 2006-12-05 | プローブピン、プローブカード及びプローブ装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5048942B2 (de) |
TW (1) | TW200736617A (de) |
WO (1) | WO2007066643A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018162343A3 (en) * | 2017-03-07 | 2018-10-25 | Capres A/S | A probe for testing an electrical property of a test sample |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5691193B2 (ja) * | 2010-02-26 | 2015-04-01 | 富士通セミコンダクター株式会社 | コンタクタ、半導体装置の試験装置、及び半導体装置の製造方法 |
CN108279368A (zh) * | 2018-01-23 | 2018-07-13 | 德淮半导体有限公司 | 测试机台及测试方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01291167A (ja) * | 1988-05-18 | 1989-11-22 | Canon Inc | プローブカードおよびそれを用いた被測定部品の測定法 |
JP2000260516A (ja) * | 1999-03-10 | 2000-09-22 | Canon Inc | 接触子機構 |
JP2002139542A (ja) * | 2000-08-21 | 2002-05-17 | Tokyo Electron Ltd | 検査方法及び検査装置 |
JP2005069711A (ja) * | 2003-08-27 | 2005-03-17 | Japan Electronic Materials Corp | プローブカード及びそれに使用する接触子 |
-
2005
- 2005-12-06 JP JP2005352566A patent/JP5048942B2/ja not_active Expired - Fee Related
-
2006
- 2006-12-05 WO PCT/JP2006/324232 patent/WO2007066643A1/ja active Application Filing
- 2006-12-06 TW TW095145415A patent/TW200736617A/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01291167A (ja) * | 1988-05-18 | 1989-11-22 | Canon Inc | プローブカードおよびそれを用いた被測定部品の測定法 |
JP2000260516A (ja) * | 1999-03-10 | 2000-09-22 | Canon Inc | 接触子機構 |
JP2002139542A (ja) * | 2000-08-21 | 2002-05-17 | Tokyo Electron Ltd | 検査方法及び検査装置 |
JP2005069711A (ja) * | 2003-08-27 | 2005-03-17 | Japan Electronic Materials Corp | プローブカード及びそれに使用する接触子 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018162343A3 (en) * | 2017-03-07 | 2018-10-25 | Capres A/S | A probe for testing an electrical property of a test sample |
US11215638B2 (en) | 2017-03-07 | 2022-01-04 | Capres A/S | Probe for testing an electrical property of a test sample |
Also Published As
Publication number | Publication date |
---|---|
JP5048942B2 (ja) | 2012-10-17 |
TW200736617A (en) | 2007-10-01 |
TWI314213B (de) | 2009-09-01 |
JP2007155553A (ja) | 2007-06-21 |
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