TWI314213B - - Google Patents

Download PDF

Info

Publication number
TWI314213B
TWI314213B TW95145415A TW95145415A TWI314213B TW I314213 B TWI314213 B TW I314213B TW 95145415 A TW95145415 A TW 95145415A TW 95145415 A TW95145415 A TW 95145415A TW I314213 B TWI314213 B TW I314213B
Authority
TW
Taiwan
Prior art keywords
probe
contact
inspected
contact portion
electrode
Prior art date
Application number
TW95145415A
Other languages
English (en)
Chinese (zh)
Other versions
TW200736617A (en
Inventor
Kenichi Kataoka
Ka Toh
Toshihiro Itoh
Original Assignee
Tokyo Electron Ltd
Univ Tokyo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Univ Tokyo filed Critical Tokyo Electron Ltd
Publication of TW200736617A publication Critical patent/TW200736617A/zh
Application granted granted Critical
Publication of TWI314213B publication Critical patent/TWI314213B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW095145415A 2005-12-06 2006-12-06 Probe pin, probe card, and probe device TW200736617A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005352566A JP5048942B2 (ja) 2005-12-06 2005-12-06 プローブピン，プローブカード及びプローブ装置

Publications (2)

Publication Number Publication Date
TW200736617A TW200736617A (en) 2007-10-01
TWI314213B true TWI314213B (de) 2009-09-01

Family

ID=38122789

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095145415A TW200736617A (en) 2005-12-06 2006-12-06 Probe pin, probe card, and probe device

Country Status (3)

Country Link
JP (1) JP5048942B2 (de)
TW (1) TW200736617A (de)
WO (1) WO2007066643A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5691193B2 (ja) * 2010-02-26 2015-04-01 富士通セミコンダクター株式会社 コンタクタ、半導体装置の試験装置、及び半導体装置の製造方法
EP3593151B1 (de) 2017-03-07 2023-07-05 Capres A/S Sonde zum testen einer elektrischen eigenschaft einer testprobe
CN108279368A (zh) * 2018-01-23 2018-07-13 德淮半导体有限公司 测试机台及测试方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01291167A (ja) * 1988-05-18 1989-11-22 Canon Inc プローブカードおよびそれを用いた被測定部品の測定法
JP3486569B2 (ja) * 1999-03-10 2004-01-13 キヤノン株式会社 接触子機構
JP4841737B2 (ja) * 2000-08-21 2011-12-21 東京エレクトロン株式会社 検査方法及び検査装置
JP2005069711A (ja) * 2003-08-27 2005-03-17 Japan Electronic Materials Corp プローブカード及びそれに使用する接触子

Also Published As

Publication number Publication date
JP5048942B2 (ja) 2012-10-17
TW200736617A (en) 2007-10-01
WO2007066643A1 (ja) 2007-06-14
JP2007155553A (ja) 2007-06-21

Similar Documents

Publication Publication Date Title
US7633309B2 (en) Inspection method, inspection apparatus and computer-readable storage medium storing program for inspecting an electrical property of an object
EP2690447A2 (de) Prüfkopf und Kontakt
KR101427506B1 (ko) 콘택트 프로브
TWI314213B (de)
JPH02116194A (ja) 導線の修理方法
JPH0732302B2 (ja) 電子回路におけるオープンの修復方法
US7276924B2 (en) Electrical connecting method
JP6155725B2 (ja) 半導体装置の検査方法及びその方法を用いた半導体装置の製造方法
TW200819755A (en) Electronic component inspection probe
JP2007086013A (ja) プローブカードの製造方法
JP2003185676A (ja) プローブユニット
JP5691193B2 (ja) コンタクタ、半導体装置の試験装置、及び半導体装置の製造方法
JP3196176B2 (ja) 異種金属接合プローブの製造方法
JP5020261B2 (ja) 検査方法、検査装置及びプログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP4074297B2 (ja) プローブユニットの製造方法
US20130162280A1 (en) Probe card and method of manufacturing the same
CN108364878B (zh) 微组装方法及芯片装置
JP6451206B2 (ja) プローブ針、プローブカード、プローブ針の製造方法及びプローブ針の再生方法
US7679387B2 (en) Inspection method, inspection apparatus, and control program for performing electrical inspection by using probe
TWI231370B (en) Method of soldering contact pins and the contact pins
JP2010060310A (ja) 基板検査治具及びその電極部
JP2005106690A (ja) 電気特性測定用接合型プローブとその製造方法
JP2010133786A (ja) 検査装置、及び検査方法
JP2007232740A (ja) プローブカードの製造方法
JP2006105682A (ja) プローブカード、その製造方法およびコンタクトプローブ

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees