WO2007054859A2 - Composant optique miniature - Google Patents

Composant optique miniature Download PDF

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Publication number
WO2007054859A2
WO2007054859A2 PCT/IB2006/054065 IB2006054065W WO2007054859A2 WO 2007054859 A2 WO2007054859 A2 WO 2007054859A2 IB 2006054065 W IB2006054065 W IB 2006054065W WO 2007054859 A2 WO2007054859 A2 WO 2007054859A2
Authority
WO
WIPO (PCT)
Prior art keywords
optical component
miniature optical
miniature
carrier
soldering
Prior art date
Application number
PCT/IB2006/054065
Other languages
English (en)
Other versions
WO2007054859A3 (fr
Inventor
Gunnar Luettgens
Koen Van Os
Marc Andre De Samber
Original Assignee
Philips Intellectual Property & Standards Gmbh
Koninklijke Philips Electronics N. V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Intellectual Property & Standards Gmbh, Koninklijke Philips Electronics N. V. filed Critical Philips Intellectual Property & Standards Gmbh
Publication of WO2007054859A2 publication Critical patent/WO2007054859A2/fr
Publication of WO2007054859A3 publication Critical patent/WO2007054859A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the invention relates to a miniature optical component comprising at least one optically active surface and having at least one base surface on which at least one soldering surface is arranged via which the miniature optical component can be positioned in a defined manner by means of at least one corresponding soldering surface on a carrier using a solder, while in addition the miniature optical component is to be arranged at a defined distance from a solid-state light source.
  • Miniature optical components i.e. particularly components having a maximum base surface area of 30mm x 40mm, are used, for example, in the manufacture of a lighting application, particularly one that uses a solid-state light source.
  • Such miniature optical components are, for example, collimators, screens, or shields.
  • the solid-state light source is an electroluminescent light source (LED or laser diode or light emitting diode), these miniature optical components are often to be positioned in a very close and defined way, depending on their function, i.e. in particular in a spatially pre-determined location.
  • the solid-state light source may also comprise a plurality of electroluminescent light sources which are arranged, for example, in an array side by side.
  • the LED may also be arranged on a ceramic carrier sheet or the like.
  • the LED may be provided with a light-converting element comprising phosphor materials, which element absorbs the emitted light totally or partly and re-emits the energy as light having another wavelength. Such phosphor-converting LEDs are used, for example, for generating white light.
  • Light-converting elements may be arranged, for example, as phosphor layers, drop-shaped phosphor deposits, or phosphor-containing ceramics.
  • This phosphor layer which may comprise a phosphor material or a mixture of a plurality of phosphor materials, is applied in a known way.
  • a drop-shaped phosphor layer may be arranged above an LED in this regard.
  • the LED may be embedded into an electrophoretically deposited layer or embedded or coated by means of at least partly transparent phosphor-containing ceramic tiles or ceramic bodies.
  • the electroluminescent light source is often positioned here in the form of one or a plurality of LEDs on a carrier, which has at least one flat area, which area serves to arrange or position the LEDs and the other optical components of the lamp.
  • One possible basic method of positioning at least one optical component on a carrier uses the effect of what is referred to as a self-adjustment, which is caused by the surface tensions of the liquid solder carrying the optical component to be positioned. It is functionally necessary here that the solder be arranged between two soldering surfaces defined in terms of their respective dimensions. The quantity of the solder used is to be attuned to the dimensions of the respective soldering surfaces in order to be able to guarantee the self-adjustment effect.
  • the object of the invention is achieved by the characteristics of claim 1.
  • the dimensions of the corresponding soldering surfaces and the respective solder quantity are mutually adjusted such that the defined positioning of the miniature optical components on the carrier can be implemented by means of a liquid or liquefied and subsequently solidified solder, while at least one reference element is arranged for the defined distancing of the miniature optical component from the solid-state light source.
  • a technologically simple arrangement and simultaneously an accurate positioning of the miniature optical components very close to the solid-state light source are made possible in a surprisingly simple way by the combination of these two aforementioned characteristics, i.e. the selection and arrangement of the soldering surfaces and the provision of the reference element or elements.
  • the desired position is accurately determined by the reference element or elements, which position is also fixed upon the solidification of the solder.
  • the reference element may be arranged either at the solid-state light source or at the miniature optical component to be positioned and acts particularly as a spacer. Alternatively, the reference element may be arranged between the solid-state light source and the miniature optical component to be positioned.
  • a gage may be used which is fixed between the LED and the optical element for the duration of the soldering process so as to ensure a minimum distance between the LED and the optical element.
  • the gage can be removed after the soldering process. In this way, the LED and the optical element can be decoupled, and thus damages due to thermal stresses (for example due to different coefficients of expansion) can be prevented.
  • the horizontal measurement of the reference element would correspond to the desired distance, for example, given a horizontal arrangement of the solid-state light source and the miniature optical components to be positioned on a horizontally arranged, plate- shaped carrier.
  • the reference element can remain in its position after the positioning according to the invention, particularly if it is made of an elastic material that compensates the maximum temperature fluctuations or length changes caused by different coefficients of expansion, which length changes may occur in the manufacturing process and during functional operation.
  • the reference element may be removed wholly or partly after the positioning according to the invention. If the reference element is a plug-in part, for example a gage, it can be completely removed again. It is alternatively possible, however, to remove the reference element by cutting, for example by means of a laser, so that there is no physical connection between the solid-state light source and the miniature optical component to be positioned, and temperature fluctuations in this regard are negligible.
  • the miniature optical components can be positioned at a distance of less than 0.5 mm, preferably less than 0.25 mm to the LED. By using a gage, a minimum distance between the LED and the miniature optical component can also be guaranteed. In that case the miniature optical components can be positioned at a distance of less than 0.5 mm, preferably less than 0.25 mm, and more than 0.01 mm to the LED.
  • the precise positioning takes place with at least the following steps.
  • the LED is fixed on the carrier 1 by a conventional soldering process.
  • the miniature optical components are also fixed on the carrier, preferably by means of reflow soldering. The solder is liquefied during this and subsequently solidifies between the corresponding soldering surfaces of the miniature optical components and the carrier.
  • the miniature optical component moves towards the LED owing to the surface tension of the liquefied solder until the reference element rests against the LED and the desired position has been reached.
  • Miniature optical components in the sense of the invention have a base surface area which serves to fasten them on a carrier, which area is smaller than 30 mm x 40 mm, particularly preferably smaller than 20 mm x 10 mm.
  • These miniature optical components may be, for example: reflectors, LEDs, elements that affect a light/dark boundary, or collimators.
  • a soldering surface in the sense of the invention is a surface which enables a soldering with the usual soldering agent.
  • the soldering surface is capable of being wetted or has at least one metal surface.
  • a foil is arranged at the miniature optical component, which foil is preferably reflective and projects beyond the miniature optical component.
  • a further optical component can be arranged in a defined way at that portion of the foil that projects beyond the optical component.
  • the optical component is fixed on the carrier in a known way.
  • This interaction ensures that an optical component can also be positioned just as precisely as a miniature optical component in a technologically simple way.
  • the gap arising between the miniature optical component and the optical component is covered by the foil, so that in case of a reflecting foil, for example, no scattered light is caused thereby. This renders it possible to realize very efficient optics.
  • the miniature optical component comprises a screen or a cutting edge. It is also preferable that the miniature optical component comprising the cutting edge cuts into this light-converting element with an arrangement next to an LED provided with a light-converting element.
  • the cutting edge can thus be drawn into the light- converting element by using among other things the surface tension of the liquid solder and thus can cut into this.
  • the light-converting element may be designed, for example, as a phosphor powder layer, a drop-shaped phosphor deposit, or a phosphor-containing ceramic.
  • the miniature optical component comprising a screen partly covers this light-converting element in a defined manner.
  • solder is present between the two parallel surfaces of the carrier and the miniature optical components before the beginning of the soldering process.
  • the soldering surfaces may be arranged horizontally, for example. In case of a vertical positioning, the solder will adhere to at least one of the two soldering surfaces before being heated.
  • the solder is fluid after being heated, however, it may be pasty/gel- like/creamy or firm during the application.
  • an illumination unit comprising at least one miniature optical component which is positioned close to a solid-state light source, as defined in claims 1 to 9.
  • the object of the invention is also achieved by the characteristics of the method as defined in claim 11.
  • Fig. 1 is a schematic sectional view of a carrier having an LED and a multipart collimator
  • Fig. 2 is a schematic sectional view of a carrier comprising an LED as well as having an optical component with a cutting edge or a screen
  • Fig. 3.1 is a schematic sectional view of a carrier comprising an LED as well as having an optical component before soldering
  • Fig. 3. 2 is a schematic sectional view of a carrier comprising an LED as well as having an optical component after soldering.
  • Fig. 1 is a schematic sectional view of a carrier 1 having an LED 2 and a multipart collimator 3.
  • the LED 2 has a base surface area of approximately lmm x 1 mm up to 2 mm x 5 mm with which the LED 2 is arranged on the flat carrier 1, which is made of a thermally conducting material (metal, ceramic, or DBC).
  • the LED 2 and the carrier 1 are connected by solder spots 4 which are arranged between two respective soldering surfaces (not shown in Fig. 1).
  • a conventional solder here serves as the solder 5, for example a tin solder.
  • a plurality of miniature optical components 31 of the collimator 3 are arranged, of which, for example, two miniature optical components 31 are shown in Fig. 1.
  • the miniature optical components 31 have an area of approximately 20 mm x 10 mm with which each of the miniature optical components 31 is arranged on the flat carrier 1.
  • the miniature optical components 31 and the carrier 1 are connected by a plurality of drops of the solidified solder 5 which are arranged between two respective soldering surfaces (not shown in Fig. 1). Again, tin solder is used as the soldering agent.
  • the miniature optical component 31 On the side facing the LED 2, the miniature optical component 31 carries a foil 6 which is designed, for example, as a reflecting aluminum foil and which has a thickness of approximately 0.1 mm, as well as a needle-shaped reference element 12.
  • the reflecting foil 6 rests directly on the surface of the further optical components 32 of the collimator 3, i.e. with matching shapes, for example adhering thereto. Between the miniature optical components 31 and the optical components 32, there is a gap of approximately 0.3 mm, which is covered by the foil 6, preferably a reflecting one.
  • the miniature optical components 31 and optical components 32 may be reflecting and the foil 6 may be transparent.
  • the LED 2 is fixed on the carrier 1 using a conventional soldering process.
  • the miniature optical components 31, which carry the flexible foil 6, is fixed likewise on the carrier 1.
  • the miniature optical component 31 is moved towards the LED 2 by means of the surface tension of the liquefied solder 5 until the reference element 12 rests against the LED 2 and the desired position is reached.
  • an optical component 32 is made to approach the projecting portion of the foil 6 until it rests against the foil 6, for example made of a stiff material, and thus the desired position is reached.
  • Fig. 2 is a schematic sectional view of a carrier 1 comprising an LED 2 and miniature optical components having a cutting edge 7 and a screen 8, respectively.
  • the LED 2 has a base surface n area of approximately 1 mm x 1 mm by which the LED 2 is arranged on the flat carrier 1, which comprises a usual DBC material.
  • the LED 2 and the carrier 1 are connected by a plurality of solder spots 4, which are arranged between two respective soldering surfaces (not shown in Fig. T). Again, tin solder is used as the soldering agent.
  • one or a plurality of miniature optical components 31 are arranged, for example one having a cutting edge 7 or one with a screen 8.
  • the miniature optical components 31 comprising the cutting edge 7 and the screen 8 are connected with the carrier 1 (analogous to the LED T) by solder spots 4.
  • the miniature optical component 31 having the cutting edge 7 carries a reflecting foil 6, which has a thickness of approximately 0.01 to 0.1 mm and is of aluminum.
  • the reflecting foil 6 causes a reflection of the light towards the central portion of the light-converting element 9.
  • the miniature optical component 31 comprising a screen 8 has a shield that faces the LED 2 and is distant from the base. This shield helps generate the light/dark boundary in a vehicle headlight.
  • Figs. 3.1 and 3. 2 are diagrammatic sectional views of a carrier 1 having an LED array 2 (four LEDs arranged side by side, not represented in Figs. 3.1 and 3.2) as well as comprising an optical component before soldering, here a collimator 3.
  • the LED array 2 has a base surface area of approximately 4 mm x 1 mm with which the LED array 2 is arranged on the flat carrier 1, which comprises a DBC material.
  • the LED 2 and the carrier 1 are connected by solder spots (not shown in Figs. 3.1 and 3.2).
  • a light-converting element 9, constructed as a drop-shaped phosphor layer here, is arranged over the, for example blue, LED array 2, which is covered completely by this phosphor layer.
  • the solder 5 Before the start of the soldering process, the solder 5 is located between the two parallel surfaces 10 and 11 of the carrier 1 and the collimator 3, which are arranged vertically and parallel to each other, but spatially offset.
  • the solder 5 has a firm consistency and is shaped as a bar, the two ends of the bar being arranged between a defined soldering surface 11 on the collimator 3 and a defined soldering surface 10 on the carrier 1, respectively.
  • Fig. 3.2 is a schematic sectional view of a carrier 1 comprising an LED 2 as well as a collimator 3, analogous to 3.1, but after the soldering or positioning.
  • the collimator 3 has been positioned and fixed near the blue LED 2 in particular through the effect of gravity and the surface tension of the liquefied solder during the soldering process (including the solidifying of the liquefied solder).
  • the fixation between the two corresponding parallel surfaces of the carrier 1 and the collimator 3 takes place via the solder spots (not shown in Fig. 3.2).
  • the collimator 3 cuts into the phosphor layer 7 with sealing action and rests on the carrier with its edge 12 facing the carrier 1. This edge 12 functions as a reference element in the sense of the invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un composant optique miniature (31) comprenant au moins une surface optiquement active et ayant au moins une zone de surface de base sur laquelle au moins une surface de soudure est disposée au moyen de laquelle le composant optique miniature (31) peut être positionné d'une manière déterminée par au moins une surface de soudure correspondante sur un support (1) par l'utilisation d'une soudure. Dans cette invention, le composant optique miniature (31) peut être également disposé à une distance déterminée d'une source lumineuse à semi-conducteurs (2). Les dimensions des surfaces de soudure correspondantes de manière réciproque et la quantité de soudure concordent de manière à ce que le positionnement déterminé des composants optiques miniatures (31) sur le support (1) puisse être réalisé par la soudure liquide ou liquéfiée et successivement solidifiée, et au moins un élément de référence (12) est disposé pour la distanciation déterminée des composants optiques miniatures (31) de la source lumineuse à semi-conducteurs (2).
PCT/IB2006/054065 2005-11-09 2006-11-02 Composant optique miniature WO2007054859A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05110507.0 2005-11-09
EP05110507 2005-11-09

Publications (2)

Publication Number Publication Date
WO2007054859A2 true WO2007054859A2 (fr) 2007-05-18
WO2007054859A3 WO2007054859A3 (fr) 2007-10-18

Family

ID=38023648

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2006/054065 WO2007054859A2 (fr) 2005-11-09 2006-11-02 Composant optique miniature

Country Status (2)

Country Link
TW (1) TW200724475A (fr)
WO (1) WO2007054859A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2113942A3 (fr) * 2008-04-30 2014-03-26 Tridonic Jennersdorf GmbH Module DEL doté d'un cadre et d'une plaquette
US20170317251A1 (en) * 2014-10-27 2017-11-02 Koninklijke Philips N.V. Directional light emitting arrangement and a method of producing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987001509A1 (fr) * 1985-09-10 1987-03-12 Plessey Overseas Limited Fabrication d'un dispositif optique ou electronique hybride
US6759687B1 (en) * 2000-10-13 2004-07-06 Agilent Technologies, Inc. Aligning an optical device system with an optical lens system
US20050041434A1 (en) * 2003-08-20 2005-02-24 Yasushi Yatsuda Light Source and vehicle lamp
US20050067628A1 (en) * 2003-09-30 2005-03-31 Citizen Electronics Co., Ltd. Light emitting diode
US20050133808A1 (en) * 2003-09-11 2005-06-23 Kyocera Corporation Package for housing light-emitting element, light-emitting apparatus and illumination apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987001509A1 (fr) * 1985-09-10 1987-03-12 Plessey Overseas Limited Fabrication d'un dispositif optique ou electronique hybride
US6759687B1 (en) * 2000-10-13 2004-07-06 Agilent Technologies, Inc. Aligning an optical device system with an optical lens system
US20050041434A1 (en) * 2003-08-20 2005-02-24 Yasushi Yatsuda Light Source and vehicle lamp
US20050133808A1 (en) * 2003-09-11 2005-06-23 Kyocera Corporation Package for housing light-emitting element, light-emitting apparatus and illumination apparatus
US20050067628A1 (en) * 2003-09-30 2005-03-31 Citizen Electronics Co., Ltd. Light emitting diode

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2113942A3 (fr) * 2008-04-30 2014-03-26 Tridonic Jennersdorf GmbH Module DEL doté d'un cadre et d'une plaquette
US20170317251A1 (en) * 2014-10-27 2017-11-02 Koninklijke Philips N.V. Directional light emitting arrangement and a method of producing the same
US10164161B2 (en) * 2014-10-27 2018-12-25 Koninklijke Philips N.V. Directional light emitting arrangement and a method of producing the same

Also Published As

Publication number Publication date
TW200724475A (en) 2007-07-01
WO2007054859A3 (fr) 2007-10-18

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