WO2007054859A3 - Composant optique miniature - Google Patents

Composant optique miniature Download PDF

Info

Publication number
WO2007054859A3
WO2007054859A3 PCT/IB2006/054065 IB2006054065W WO2007054859A3 WO 2007054859 A3 WO2007054859 A3 WO 2007054859A3 IB 2006054065 W IB2006054065 W IB 2006054065W WO 2007054859 A3 WO2007054859 A3 WO 2007054859A3
Authority
WO
WIPO (PCT)
Prior art keywords
miniature optical
optical component
defined
solder
arranged
Prior art date
Application number
PCT/IB2006/054065
Other languages
English (en)
Other versions
WO2007054859A2 (fr
Inventor
Gunnar Luettgens
Os Koen Van
Samber Marc Andre De
Original Assignee
Philips Intellectual Property
Koninkl Philips Electronics Nv
Gunnar Luettgens
Os Koen Van
Samber Marc Andre De
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to EP05110507 priority Critical
Priority to EP05110507.0 priority
Application filed by Philips Intellectual Property, Koninkl Philips Electronics Nv, Gunnar Luettgens, Os Koen Van, Samber Marc Andre De filed Critical Philips Intellectual Property
Publication of WO2007054859A2 publication Critical patent/WO2007054859A2/fr
Publication of WO2007054859A3 publication Critical patent/WO2007054859A3/fr

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

L'invention concerne un composant optique miniature (31) comprenant au moins une surface optiquement active et ayant au moins une zone de surface de base sur laquelle au moins une surface de soudure est disposée au moyen de laquelle le composant optique miniature (31) peut être positionné d'une manière déterminée par au moins une surface de soudure correspondante sur un support (1) par l'utilisation d'une soudure. Dans cette invention, le composant optique miniature (31) peut être également disposé à une distance déterminée d'une source lumineuse à semi-conducteurs (2). Les dimensions des surfaces de soudure correspondantes de manière réciproque et la quantité de soudure concordent de manière à ce que le positionnement déterminé des composants optiques miniatures (31) sur le support (1) puisse être réalisé par la soudure liquide ou liquéfiée et successivement solidifiée, et au moins un élément de référence (12) est disposé pour la distanciation déterminée des composants optiques miniatures (31) de la source lumineuse à semi-conducteurs (2).
PCT/IB2006/054065 2005-11-09 2006-11-02 Composant optique miniature WO2007054859A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP05110507 2005-11-09
EP05110507.0 2005-11-09

Publications (2)

Publication Number Publication Date
WO2007054859A2 WO2007054859A2 (fr) 2007-05-18
WO2007054859A3 true WO2007054859A3 (fr) 2007-10-18

Family

ID=38023648

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2006/054065 WO2007054859A2 (fr) 2005-11-09 2006-11-02 Composant optique miniature

Country Status (2)

Country Link
TW (1) TW200724475A (fr)
WO (1) WO2007054859A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008021661A1 (de) * 2008-04-30 2009-11-05 Ledon Lighting Jennersdorf Gmbh LED-Modul mit Rahmen und Leiterplatte
WO2016066476A1 (fr) * 2014-10-27 2016-05-06 Koninklijke Philips N.V. Agencement électroluminescent directionnel et son procédé de production

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987001509A1 (fr) * 1985-09-10 1987-03-12 Plessey Overseas Limited Fabrication d'un dispositif optique ou electronique hybride
US6759687B1 (en) * 2000-10-13 2004-07-06 Agilent Technologies, Inc. Aligning an optical device system with an optical lens system
US20050041434A1 (en) * 2003-08-20 2005-02-24 Yasushi Yatsuda Light Source and vehicle lamp
US20050067628A1 (en) * 2003-09-30 2005-03-31 Citizen Electronics Co., Ltd. Light emitting diode
US20050133808A1 (en) * 2003-09-11 2005-06-23 Kyocera Corporation Package for housing light-emitting element, light-emitting apparatus and illumination apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987001509A1 (fr) * 1985-09-10 1987-03-12 Plessey Overseas Limited Fabrication d'un dispositif optique ou electronique hybride
US6759687B1 (en) * 2000-10-13 2004-07-06 Agilent Technologies, Inc. Aligning an optical device system with an optical lens system
US20050041434A1 (en) * 2003-08-20 2005-02-24 Yasushi Yatsuda Light Source and vehicle lamp
US20050133808A1 (en) * 2003-09-11 2005-06-23 Kyocera Corporation Package for housing light-emitting element, light-emitting apparatus and illumination apparatus
US20050067628A1 (en) * 2003-09-30 2005-03-31 Citizen Electronics Co., Ltd. Light emitting diode

Also Published As

Publication number Publication date
WO2007054859A2 (fr) 2007-05-18
TW200724475A (en) 2007-07-01

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