TW200724475A - Miniature optical component - Google Patents
Miniature optical componentInfo
- Publication number
- TW200724475A TW200724475A TW095140998A TW95140998A TW200724475A TW 200724475 A TW200724475 A TW 200724475A TW 095140998 A TW095140998 A TW 095140998A TW 95140998 A TW95140998 A TW 95140998A TW 200724475 A TW200724475 A TW 200724475A
- Authority
- TW
- Taiwan
- Prior art keywords
- miniature optical
- optical component
- solder
- carrier
- light source
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title abstract 6
- 229910000679 solder Inorganic materials 0.000 abstract 3
- 238000005476 soldering Methods 0.000 abstract 3
- 239000007788 liquid Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05110507 | 2005-11-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200724475A true TW200724475A (en) | 2007-07-01 |
Family
ID=38023648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095140998A TW200724475A (en) | 2005-11-09 | 2006-11-06 | Miniature optical component |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW200724475A (zh) |
WO (1) | WO2007054859A2 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008021661A1 (de) * | 2008-04-30 | 2009-11-05 | Ledon Lighting Jennersdorf Gmbh | LED-Modul mit Rahmen und Leiterplatte |
CN107078193B (zh) * | 2014-10-27 | 2019-11-22 | 亮锐控股有限公司 | 定向发光装置及其制造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8522429D0 (en) * | 1985-09-10 | 1985-10-16 | Plessey Co Plc | Alignment for hybrid device |
US6759687B1 (en) * | 2000-10-13 | 2004-07-06 | Agilent Technologies, Inc. | Aligning an optical device system with an optical lens system |
JP4314911B2 (ja) * | 2003-08-20 | 2009-08-19 | スタンレー電気株式会社 | 車両前照灯 |
US20050133808A1 (en) * | 2003-09-11 | 2005-06-23 | Kyocera Corporation | Package for housing light-emitting element, light-emitting apparatus and illumination apparatus |
JP4773048B2 (ja) * | 2003-09-30 | 2011-09-14 | シチズン電子株式会社 | 発光ダイオード |
-
2006
- 2006-11-02 WO PCT/IB2006/054065 patent/WO2007054859A2/en active Application Filing
- 2006-11-06 TW TW095140998A patent/TW200724475A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2007054859A2 (en) | 2007-05-18 |
WO2007054859A3 (en) | 2007-10-18 |
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