Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70058—Mask illumination systems
• • G—PHYSICS
  • G02—OPTICS
  • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
  • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
  • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
  • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
  • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
  • G02F1/1333—Constructional arrangements; Manufacturing methods
  • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
  • G02F1/133509—Filters, e.g. light shielding masks
  • G02F1/133514—Colour filters
  • G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
  • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70058—Mask illumination systems
  • G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70058—Mask illumination systems
  • G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70216—Mask projection systems
  • G03F7/7035—Proximity or contact printers
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70691—Handling of masks or workpieces
  • G03F7/70716—Stages

Definitions

• the present invention relates to a plurality of exposure areas set at predetermined intervals along the transport direction on the surface of the object to be exposed through a photomask while the object to be exposed is transported in a predetermined direction. More particularly, the present invention relates to an exposure apparatus that attempts to prevent a portion between exposure areas adjacent to each other outside the plurality of exposure areas from being exposed.
• a conventional exposure apparatus relatively moves a stage on which a substrate is placed and a photomask corresponding to a layer to be exposed to expose a single mask pattern in each of a plurality of exposure regions of the substrate.
• the position of the stage with respect to the photomask when exposed to the plurality of exposure areas is measured for each area, and the photo is positioned with respect to a predetermined position recognition mark on the substrate.
• Means for acquiring the relative position of the stage at the time of exposure with respect to the plurality of exposure areas with the mask as a reference, and detecting the position recognition mark to position the photomask, and using the photomask at that time as a reference The stage and the photomask are moved relative to each other while measuring the position of the stage with respect to the photomask so that the acquired relative position is reproduced.
• the relative position data of other exposure areas to be stored is stored, and when the second layer pattern is formed by exposure, the stage and the photomask are relatively moved and positioned based on the relative position data.
• exposure has been made (for example, see Patent Document 1).
• Patent Document 1 Japanese Unexamined Patent Application Publication No. 2004-246025
• the substrate is moved stepwise onto the substrate.
• a mask pattern of a photomask is exposed by switching a plurality of set exposure areas one by one, and a plurality of substrates formed in close proximity to the photomask are formed on the photomask.
• an exposure apparatus that exposes a plurality of exposure areas while transporting the substrate at a constant speed in a direction orthogonal to the arrangement direction of the plurality of mask patterns formed on the photomask.
• FIG. 11 for example, among a plurality of exposure areas 2 set in the transport direction (arrow A direction) of the color filter substrate 1, between the first exposure area 2a and the second exposure area 2b.
• the portion 3a and the portion 3b between the second exposure region 2b and the third exposure region 2c also form the exposure pattern row 4 with the plurality of mask patterns, which may reduce the appearance quality of the product. It was.
• the present invention addresses such problems and exposes a portion between exposure areas adjacent to each other outside a plurality of exposure areas set along the transport direction of the object to be exposed. It is an object of the present invention to provide an exposure apparatus that attempts to prevent the exposure.
• an exposure apparatus configured to place an object to be exposed, in which a plurality of exposure areas are set in a line at least, on an upper surface, and to A stage that conveys the object to be exposed in the set direction; a mask stage that is disposed above the stage and holds a photomask in close proximity to the object to be exposed; and a constant exposure period for the object to be exposed
• a light source that illuminates and irradiates the photomask held on the mask stage with exposure light, and is disposed between the mask stage and the light source, and condenses the exposure light that irradiates the photomask with parallel light.
• an imaging device disposed between the light source and the condensing lens, and forming an image of the light source on the front side of the condensing lens, and the imaging device.
• a lens A shotta that is disposed in the vicinity of the imaging position and that switches exposure light irradiation and blocking in synchronization with the plurality of exposure regions sequentially passing through the lower side of the photomask by conveying the object to be exposed.
• a plurality of exposure areas are arranged in at least one row on the upper surface of the stage. Place the exposed object set on the top surface, transport the exposed object in the setting direction of the plurality of exposure areas, and hold the photomask in close proximity to the exposed object on the mask stage. Then, the exposure light is irradiated onto the photomask held on the mask stage by a light source that is constantly lit during the exposure period for the object to be exposed. At that time, an image of the light source is formed on the front side of the condenser lens by the imaging lens, and the exposure light irradiated to the photomask by the condenser lens is converted into parallel light.
• exposure light is synchronized with the passage of the exposure object through the underside of the photomask by the transport of the exposure object with a shirt arranged near the image formation position of the image of the light source by the imaging lens. Switch between irradiation and blocking.
• the exposure apparatus places an object to be exposed, on which a plurality of exposure areas are arranged in at least one line, on the upper surface, and sets the exposure in the setting direction of the plurality of exposure areas.
• a light source that irradiates exposure light onto a photomask held on a stage;
• a photo integrator that is disposed between the mask stage and the light source and that uniformizes a luminance distribution of the exposure light that irradiates the photomask; and
• An exposure apparatus comprising: a light collecting lens disposed between a mask stage and a photo integrator and configured to collimate exposure light applied to the photo mask.
• An imaging lens disposed between the integrator and the condenser lens, and forms an end face image of the photo integrator on the front side of the condenser lens, and an image of the end face image of the photo integrator by the imaging lens A shotta that is arranged in the vicinity of the position and that switches between irradiation and blocking of exposure light in synchronization with the plurality of exposure areas sequentially passing under the photomask by conveying the object to be exposed. It is a thing.
• an object to be exposed in which a plurality of exposure areas are set on the upper surface of the stage in at least one row, is placed on the upper surface, and the above-described direction of setting the plurality of exposure areas is described above.
• Transport the object to be exposed hold the photomask in close proximity to the object to be exposed on the mask stage, and irradiate the photomask held on the mask stage with a light source that is always lit during the exposure period for the object to be exposed.
• the photointegrator uniformly distributes the brightness distribution of the exposure light that is incident on the photomask, and the imaging lens collects the end face image of the photointegrator.
• the exposure light that forms an image on the front side of the optical lens and then irradiates the photomask with the condenser lens is converted into parallel light.
• exposure is performed in synchronization with a plurality of exposure areas passing sequentially under the photomask by the transport of the object to be exposed by a shutter disposed in the vicinity of the imaging position of the image of the light source by the imaging lens. Switch between irradiation and blocking of light.
• the shirter is movable in a direction opposite to the conveyance direction of the object to be exposed, and has the same number of slits as the plurality of exposure regions of the object to be exposed along the movement direction. .
• the shirter in which the same number of slits as the plurality of exposure areas of the object to be exposed is moved in the moving direction in the direction opposite to the conveying direction of the object to be exposed.
• the exposure light is switched on and off in synchronism with the passage of the exposure area sequentially under the photomask.
• the portion between the adjacent exposure areas is exposed outside the plurality of exposure areas set in a line along the transport direction on the object to be exposed. Light can be prevented. Therefore, the appearance quality of the product can be improved.
• the shatter since the shatter is arranged in the vicinity of the imaging position of the image of the light source by the imaging lens, the shatter can be made smaller and interference with surrounding components can be avoided.
• FIG. 1 is a front view showing a schematic configuration of an embodiment of an exposure apparatus according to the present invention.
• FIG. 2 is a plan view showing an example of a plurality of exposure regions set on a color filter substrate used in the exposure apparatus.
• FIG. 3 is a plan view showing a configuration example of a photomask used in the exposure apparatus.
• FIG. 4 is a plan view showing one structural example of a color filter substrate used in the exposure apparatus.
• FIG. 5 is a plan view showing a configuration example of a shirt used in the exposure apparatus.
• FIG. 6 is an explanatory view showing alignment between the photomask and the color filter substrate.
• FIG. 7 is a flowchart illustrating an exposure procedure performed using the exposure apparatus.
• FIG. 8 is a timing chart for explaining the operation of the shirter synchronized with sequentially passing under the plurality of exposure area force photomasks of the color filter substrate.
• FIG. 9 is an explanatory view showing an exposure preventing operation for the first non-exposed region of the color filter substrate in the exposure operation by the exposure apparatus.
• FIG. 10 is a plan view showing a state in which exposure pattern rows are formed in a plurality of exposure regions of a color filter substrate by the exposure apparatus.
• FIG. 11 is a plan view showing a state in which an exposure pattern row is formed in a portion between adjacent exposure areas outside a plurality of exposure areas set in the conveyance direction of the color filter substrate.
• FIG. 1 is a front view showing a schematic configuration of an embodiment of an exposure apparatus according to the present invention.
• This exposure apparatus performs predetermined exposure via a photomask on a plurality of exposure areas set at predetermined intervals along the transfer direction on the surface of the exposure object while transferring the exposure object in a predetermined direction.
• a pattern row is formed, and includes a stage 5, a mask stage 6, a light source 7, a photo integrator 8, a condenser lens 9, an imaging lens 10, a shotta 11, and an imaging means 12. It becomes.
• the object to be exposed is the color filter substrate 1 coated with a color resist will be described.
• the stage 5 has a color filter substrate 1 (shown in two rows in the figure) in which a plurality of exposure regions 2 are set in at least one row at intervals G1. 5a and transports the color filter substrate 1 in the setting direction of the plurality of exposure areas 2, and is moved at a constant speed (V) in the direction indicated by the arrow A in FIG. It has become so.
• reference numeral 2a indicates the first exposure area
• reference numeral 2b indicates the second exposure area
• reference numeral 2c indicates the third exposure area.
• reference numeral 3a indicates a portion between the first and second exposure areas 2a and 2b (hereinafter referred to as “first non-exposure area”)
• reference numeral 3b indicates the second and third exposure areas. A portion between the exposure areas 2b and 2c (hereinafter referred to as “second non-exposure area”) is shown.
• a mask stage 6 is arranged above the stage 5. This mask stay The die 6 holds the photomask 14 in close proximity to the color filter substrate 1 through a predetermined gap, for example, a gap of 100 to 300 ⁇ m.
• the photomask 14 is for transferring the mask pattern formed thereon onto the color resist on the color filter substrate 1 by exposure light exposure. As shown in FIG. It consists of a material 15, a light shielding film 16, a mask pattern 17, a window 18, and a mask side alignment mark 19.
• the transparent substrate 15 is a transparent glass substrate that transmits ultraviolet light and visible light with high efficiency, and has, for example, quartz glass power.
• a light shielding film 16 is formed on one surface 15a of the transparent substrate 15.
• the light shielding film 16 shields exposure light and is formed of an opaque thin film such as chromium (Cr).
• the light shielding film 16 has a plurality of mask patterns 17 arranged in one direction.
• the plurality of mask patterns 17 are openings having a predetermined shape that allow exposure light to pass therethrough, and are capable of irradiating the color filter substrate 1 conveyed opposite to the exposure light, and are formed on the color filter substrate 1 shown in FIG. It is transferred onto the pick cell 21 of the black matrix 20.
• it has a width substantially equal to the width of the pick cells 21 and has a long rectangular shape in a direction orthogonal to the arrangement direction, and is formed at intervals corresponding to the three pitch intervals of the pick cells 21.
• the left edge portion of the mask pattern 17a located at the center is preset as the reference position R1.
• a piercing window 18 is formed in the side of the arrangement direction adjacent to the plurality of mask patterns 17.
• This window 18 is for observing the substrate-side alignment mark 22 and the pick matrix 21 of the black matrix 20 formed on the color filter substrate 1 shown in FIG.
• the imaging means 12 can detect the position of the substrate-side alignment mark 22 and the reference position R2 set in advance in the upper left corner of the pick cell 21a located at the center of the black matrix 20 as shown in FIG. It has become.
• it is formed in a rectangular shape extending from the center side toward one end portion 14a in parallel with the arrangement direction of the plurality of mask patterns 17 described above. As shown in FIG.
• the light shielding film 16 has a plurality of mask side alignment marks 19 arranged side by side from the center side to the other end portion 14b on one side of the side window 18. Is formed.
• the plurality of mask side alignment marks 19 are used to align the reference position R1 preset in the mask pattern 17 with the reference position R2 preset in the pick cell 21 of the color filter substrate 1. And is formed corresponding to the mask pattern 17. Further, the formation position is such that the left side edge of the mask alignment mark 19 in FIG. 3 coincides with the left side edge of the corresponding mask pattern 17.
• a mask side alignment mark 19 formed on the center side of the light shielding film 16 is set in advance as a reference mark 19a.
• the reference mark 19a and the substrate-side alignment mark 22 of the color filter substrate 1 are adjusted so as to have a predetermined positional relationship, whereby the reference position R1 of the mask pattern 17 and the color filter substrate are aligned.
• the reference position R2 of 1 can be aligned.
• the photomask 14 is held on the mask stage 6 with the side on which the light shielding film 16 is formed facing down.
• a light source 7 is disposed above the mask stage 6. This light source 7 is always turned on during the exposure period for the color filter substrate 1 and irradiates the photomask 14 held on the mask stage 6 with exposure light, and emits exposure light including ultraviolet rays.
• a photo integrator 8 is disposed between the mask stage 6 and the light source 7.
• the photo integrator 8 makes the luminance distribution of the exposure light applied to the photo mask 14 uniform, and is a kaleidoscope or a fly-eye lens, for example.
• a kaleidoscope is used, and the shape of the end face 8a is formed in a rectangular shape so that the exposure light is irradiated only to a plurality of mask pattern 17 formation regions of the photomask 14.
• a filter that reflects or absorbs ultraviolet rays and transmits visible light is formed by covering the window 18 and the mask-side alignment mark 19 of the photomask 14, the exposure light irradiates the entire photomask 14.
• a filter that reflects or absorbs ultraviolet rays and transmits visible light is formed by covering the window 18 and the mask-side alignment mark 19 of the photomask 14.
• a condenser lens 9 is disposed between the mask stage 6 and the photo integrator 8.
• This condenser lens 9 has its front focal point formed by an imaging lens 10 described later.
• This is a condensing lens that is positioned in the vicinity of the image forming position of the image of the end face 8a of the photo integrator 8 to make the exposure light parallel light and irradiate the photo mask 14 perpendicularly.
• An imaging lens 10 is disposed between the photo integrator 8 and the condenser lens 9.
• the imaging lens 10 forms an end face image of the photo integrator 8 on the front side of the condenser lens 9, and is a convex lens.
• a shirter 11 is provided in the vicinity of the imaging position of the end face image of the photo integrator 8 by the imaging lens 10. This shirter 11 switches between irradiation and blocking of exposure light in synchronization with the movement of the color filter substrate 1 so that a plurality of exposure regions 2 sequentially pass under the mask pattern 17 of the photomask 14. Yes, the first and second non-exposed areas 3a of the adjacent color filter substrate 1 are moved and stopped in the opposite direction (arrow B direction) to the moving direction of the color filter substrate 1 indicated by the arrow A in FIG. , 3b can be prevented from being exposed to exposure light. Then, as shown in FIG.
• the same number of slits 23 as the first to third exposure regions 2a to 2c of the color filter substrate 1 are formed along the movement direction indicated by the arrow B.
• the slits 23 corresponding to the first to third exposure areas 2a to 2c of the color filter substrate 1 are the first slit 23a, the second slit 23b, and the third slit 23c, respectively. is there. Further, the portion between the first and second slits 23a, 23b corresponding to the first and second non-exposed areas is the first light shielding area 30a, and the second and third slits. A portion between the slits 23b and 23c is the second light shielding region 30b.
• the size (wX d) of the slit 23 of the shirter 11 shown in FIG. 5 is the magnification of the condenser lens 9 is M, and the total width of the plurality of mask patterns 17 of the photomask 14 shown in FIG.
• the hatched area is the exposure light irradiation area 31.
• An exposure optical system 24 is configured including the light source 7, the photo integrator 8, the imaging lens 10, the condenser lens 9, the mask stage 6, and the shirter 11.
• An imaging unit 12 is disposed above the stage 5.
• the imaging means 12 captures the substrate-side alignment mark 22 formed on the color filter substrate 1 and the mask-side alignment mark 19 formed on the photomask 14 through the mirror 25 in the same field of view.
• a line CCD 26 having a large number of light receiving elements arranged in a straight line, and a substrate-side alignment mark 22 and a pick cell 21 and a photocell disposed on the front side and formed on the color filter substrate 1
• An image pickup lens 27 for forming an image of the mask side alignment mark 19 formed on the mask 14 on the line CCD 26 is provided.
• an optical distance correction unit 28 is disposed between the line CCD 26 and the imaging lens 27 on the optical path of the imaging unit 12.
• This optical distance correction means 28 is for substantially matching the optical distance between the line CCD 26 of the image pickup means 12 and the color filter substrate 1 and the optical distance between the line CCD 26 of the image pickup means 12 and the photomask 14.
• the optical distance correction means 28 is disposed on the optical path connecting the line CCD 26 of the image pickup means 12 and the color filter substrate 1 through the piercing window 18 formed in the photomask 14.
• the image of the substrate side alignment mark 22 of the color filter substrate 1 and the image of the mask side alignment mark 19 of the photomask 14 which are shifted in the optical axis direction of the imaging means 12 and the image of the mask side alignment mark 19 of the photomask 14 are Can be imaged simultaneously.
• the color filter substrate 1 to be used has an opaque film formed of chrome (Cr) isotropic on one surface of a transparent glass substrate, and the exposure region 2 as shown in FIG. A large number of pick cells 21 are formed in a matrix. Further, alignment is performed by correcting a positional deviation between a reference position R1 preset on the photomask 14 and a reference position R2 preset on the color filter substrate 1 at a substantially central portion on one end la side. For this purpose, an elongated substrate-side alignment mark 22 is formed.
• Cr chrome
• a plurality of alignment confirmation marks 29 are aligned from the center toward one side edge lb, and correspond to the pick cell 21, and coincide with the three pitch intervals of the pick cell 21 array. It is formed at intervals.
• the substrate side alignment mark 22 and the alignment confirmation mark 29 are formed so that the left side edge of each mark and the left side edge of the corresponding pick cell 21 in FIG.
• the color filter substrate 1 thus formed is coated with a predetermined color resist on the upper surface, and the end la side where the substrate-side alignment mark 22 is formed is transported as indicated by an arrow A in FIG. It is placed on the upper surface 5a of the stage 5 so as to be positioned at the top of the direction, and is transported in the direction of arrow A at a constant speed V by the transport means 13.
• the photomask 14 has the end portion 14c side on which the piercing window 18 is formed positioned on the near side in the transport direction indicated by an arrow A, as shown in FIG.
• the mask stage 6 is held with the surface on which the light shielding film 16 is formed facing down. Then, the color filter substrate 1 is conveyed so as to face the upper surface in the vicinity.
• the substrate-side alignment mark 22, the alignment confirmation mark 29, and the pick cell 21 on the color filter substrate 1 are imaged by the imaging means 12 through the window 18 formed in the photomask 14.
• the optical distance correction means 28 is disposed on the optical path connecting the line CCD 26 of the image pickup means 12 and the color filter substrate 1 through the window 18 formed in the photomask 14, and the optical distance is reduced. Since the optical distance between the line CCD 26 of the image pickup means 12 and the photomask 14 is substantially matched, the substrate side alignment mark on the color filter substrate 1 that is shifted in the optical axis direction of the image pickup means 12 The image of 22 etc.
• the image of the substrate-side alignment mark 22 and the like and the image of the mask-side alignment mark 19 that are simultaneously imaged by the imaging means 12 are simultaneously processed by an image processing unit (not shown).
• the substrate-side alignment mark 22 and the photomask 14 of the color filter substrate 1 are observed by the imaging means 12 through the window 18 of the photomask 14 as shown in FIG.
• the mask side alignment mark 19 is imaged simultaneously.
• the cell number of the light receiving element of the line CCD 26 where the substrate side alignment mark 22 is detected, and the above photomask 1 The cell number of the light receiving element of the line CCD 26 where the reference mark 19a of 4 is detected is read, and the distance L is calculated by a calculation unit (not shown). Then, it is compared with a predetermined distance L that has been preset and stored.
• the photomask 14 has arrows X, Y so that the distance L between the substrate side alignment mark 22 and the reference mark 19a is L or x ⁇ x (x is an allowable value). Is moved in the direction
• the reference position R1 of the photomask 14 and the reference position R2 of the color filter substrate 1 match within a predetermined allowable range.
• the alignment confirmation mark 29 of the color filter substrate 1 is imaged by the imaging means 12 through the window 18 of the photomask 14. Then, the cell number of the light receiving element of the line CCD 26 where each alignment confirmation mark 29 is detected and the cell number of the light receiving element of the line CCD 26 where each mask side alignment mark 19 of the photomask 14 is detected are read. An average value of each cell number is calculated in the calculation unit. The average value is compared with the cell number of the light receiving element of the line CCD 26 where the substrate side alignment mark 22 of the color filter substrate 1 is detected immediately after the alignment adjustment, and when both coincide with each other within a predetermined allowable range. In this case, it is determined that the alignment has been performed reliably, and exposure light is irradiated onto the photomask 14.
• the image of the mask pattern 17 of the photomask 14 is transferred onto the pick cell 21 of the color filter substrate 1. If the average value does not match the cell number, for example, it is determined that the color filter substrate 1 is of a different type or a defective product of the black matrix 20, and in this case, the exposure is stopped and an alarm is issued. To do.
• the image data picked up by the image pickup means 13 and the lookup table (LUT) of the reference position R2 of the color filter substrate 1 stored in the storage unit (not shown) are compared, and the reference position R2 is detected. Is done. Then, the cell number of the light receiving element of the line CCD 26 that detects the reference position R2 is compared with the cell number of the light receiving element of the line CCD 26 that detects the reference mark 19a of the photomask 14, and the distance L between them is L or L Photo to be L ⁇ x
• the mask 14 is finely moved in the directions of arrows X and Y. If necessary, the photomask 14 is rotated with the center of the surface as the central axis. As a result, even if the color filter substrate 1 is conveyed in the direction indicated by the arrow A while being shown, the photomask 14 moves following it. In this way, the mask pattern 17 of the photomask 14 is transferred to the color filter substrate 1 being conveyed. As a result, the stripe-shaped exposure pattern row 4 is accurately formed on the predetermined pick cell 21 of the color filter substrate 1.
• the shirter 11 shown in FIG. 5 is stopped with the center of the first slit 23a aligned with the optical axis center of the exposure light.
• the light source 7 is turned off.
• the color filter substrate 1 is placed on the upper surface 5a of the stage 5 and conveyed at a predetermined speed V in the direction of arrow A shown in FIG.
• the substrate-side alignment mark 22 of the color filter substrate 1 reaches the lower side of the opening window 18 of the photomask 14, the substrate-side alignment mark 22 is detected by the imaging means 12 in step S1.
• step S 2 when the substrate side alignment mark 22 is detected, a timer (not shown) is started as a trigger, and the tl time is counted.
• step S3 as shown in FIG. 8 (b), the light source 7 is turned on when the substrate alignment mark 22 is detected and the force tl time elapses.
• the exposure light is irradiated to the photomask 14 through the first slit 23a of the shirt 11 and exposure is started.
• the leading end of the first exposure area 2a of the color filter substrate 1 (direction of arrow A) is the photomask 14 mask pattern 17
• the transport speed V is set so that it substantially coincides with the leading edge of the transport direction (arrow A direction)
• the exposure can be started at the same time as the light passes under the mask pattern 17 of the photomask 14.
• step S4 the elapse of time t2 after the start of exposure is counted by a timer.
• the time t2 is set appropriately, the first time is reached by the movement of the color filter substrate 1 in the direction of arrow A as shown in FIG.
• the rear end in the transport direction of the exposure area 2a and the rear end in the transport direction of the mask pattern 17 of the photomask 14 substantially coincide with each other.
• the shirt 11 starts moving in the direction of arrow B at a speed V. To do.
• step S5 whether or not the exposure for the last exposure area 2, for example, the third exposure area 2c in FIG. 2 has been completed, has elapsed since the substrate-side alignment mark 22 was detected.
• a determination unit determines the time based on the time.
• “NO” determination is made, and the process proceeds to step S6.
• step S6 the first non-exposed area 3a between the first exposed area 2a and the second exposed area 2b is a photomask.
• the shirt 11 moves at a speed V in the direction of arrow B shown in FIG.
• the first light-shielding region 30a between the first slit 23a and the second slit 23b of the shirter 11 is replaced with the first non-exposed region 3a of the color filter substrate 1. It moves in synchronism with the movement in the direction of arrow A, and exposure light is blocked by the first light shielding region 30a, thereby preventing exposure to the first non-exposure region 3a.
• step S7 the elapse of t3 hours from the start of movement of the shirt 11 is counted by a timer.
• the shirt 11 further moves in the direction of arrow B, and the center of the second slit 23b is positioned at the optical axis center of the exposure light.
• the color filter substrate 1 is transported in the direction of arrow A, the first non-exposure area 3a passes under the mask pattern 17 of the photomask 14, and the leading end of the second exposure area 2b in the transport direction This part matches the leading end of the mask pattern 17 in the carrying direction.
• step S8 as shown in FIG. 8 (d), the movement of the shirt 11 is stopped, and the process returns to step S4 to execute the exposure for the second exposure region 2b. Then, Steps S4 to S8 are repeatedly executed, and exposure is performed on all exposure regions 2 set in the conveyance direction of the color filter substrate 1.
• step S5 the determination is "YES" in step S5, and the process proceeds to step S9.
• step S9 as shown in FIG. 8 (b), the exposure of the last exposure area 2, for example, the third exposure area 2c is completed (see (c) in the figure).
• Light source 7 It is lit.
• the exposure of the exposure region 2 for one row set in the conveyance direction of the color filter substrate 1 is completed.
• the first to the third are arranged.
• the exposure areas 2 adjacent to the exposure areas 2a to 2c are also exposed simultaneously, and the exposure pattern row 4 can be formed for all the exposure areas 2 as shown in FIG.
• the photo integrator 8 is arranged between the light source 7 and the imaging lens 10 .
• the present invention is not limited to this, and the photo integrator 8 may not be provided.
• the imaging lens 10 should be arranged so as to form an image of the light source 7 at a position in front of the condenser lens 9.
• the shirt 11 stops with the center of the first slit 23a aligned with the optical axis center of the exposure light, and the light source 7 is turned off.
• the light source 7 is turned on and the exposure is started.
• the present invention is not limited to this, and the light source 7 is kept on before the start of exposure, and the shirt 11 is set before the start of exposure. Is stopped in a state where the optical path of the exposure light is blocked in the light shielding area on the leading side in the moving direction of the first slit 23a, and then the substrate side alignment mark 22 of the color filter substrate 1 is detected by the imaging means 11. Then, the movement may be started, and the exposure may be started when the center of the first slit 23a is positioned at the optical axis center of the exposure light.
• the shirter 11 has the same number of slits 23 as the plurality of exposure regions 2 of the color filter substrate 1 along the moving direction has been described. Is not limited to this, and the shirt 11 may have one light shielding plate force. In this case, the shirter 11 may be opened and closed in synchronization with the plurality of exposure regions 2 repeatedly passing under the photomask 14.
• the object to be exposed is the color filter substrate 1
• the present invention is not limited to this, and a plurality of exposure regions 2 have stripe-shaped exposure patterns. Any substrate can be used as long as it forms the row 4.

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
• Nonlinear Science (AREA)
• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
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• Liquid Crystal (AREA)
• Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

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• 2005
  • 2005-10-25 JP JP2005309205A patent/JP5382899B2/ja active Active
• 2006
  • 2006-10-04 KR KR1020087001979A patent/KR101306917B1/ko active IP Right Grant
  • 2006-10-04 CN CN2006800349340A patent/CN101268420B/zh not_active Expired - Fee Related
  • 2006-10-04 WO PCT/JP2006/319853 patent/WO2007049436A1/ja active Application Filing
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