WO2007038199A1 - Systeme d'alignement de vision trois points a une seule camera pour un manipulateur de dispositif - Google Patents

Systeme d'alignement de vision trois points a une seule camera pour un manipulateur de dispositif Download PDF

Info

Publication number
WO2007038199A1
WO2007038199A1 PCT/US2006/036814 US2006036814W WO2007038199A1 WO 2007038199 A1 WO2007038199 A1 WO 2007038199A1 US 2006036814 W US2006036814 W US 2006036814W WO 2007038199 A1 WO2007038199 A1 WO 2007038199A1
Authority
WO
WIPO (PCT)
Prior art keywords
testing
calibration target
alignment system
alignment
vision alignment
Prior art date
Application number
PCT/US2006/036814
Other languages
English (en)
Inventor
Kexiang Ken Ding
Steve Ade
Larry Stuckey
Original Assignee
Delta Design, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Design, Inc. filed Critical Delta Design, Inc.
Priority to DE112006002529T priority Critical patent/DE112006002529T5/de
Priority to JP2008532382A priority patent/JP2009509173A/ja
Publication of WO2007038199A1 publication Critical patent/WO2007038199A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

Definitions

  • the present invention relates generally to device handlers, and more particularly to a single camera vision alignment system for a device handler used in semiconductor testing.
  • an alignment system is needed that will align devices using simple cost-effective procedures. Further, an alignment system is needed that is capable of aligning several devices repeatedly without extensive delay.
  • a vision alignment system includes an alignment camera positioned above an alignment portion of the vision alignment system, a lighting system located in proximity to the alignment camera, a calibration target, three actuators, positioned in a testing portion of the vision alignment system, for correcting an offset between the calibration target and a testing device, and a pick and place handler for transporting the calibration target and the testing device between the testing portion and the alignment portion.
  • the calibration target is configured to represent a contactor location for a tester apparatus.
  • the camera has a resolution of at least one mega pixel.
  • a method for aligning a testing device in a handler system includes the steps of pre-aligning a calibration target with a contactor of a testing apparatus, recording three actuation
  • FIG. 1 is a perspective view of a vision alignment system.
  • FIG. 2 is a top view of a calibration target on a testing side of a vision alignment system.
  • FIG. 3 is a top view of a calibration target on an alignment side of a vision alignment system.
  • FIG. 4 is a top view illustrating offset between a calibration target and a testing device.
  • FIG. 5 is a block diagram of an implementation of the vision alignment system using a vision guide plate.
  • FIG. 1 An exemplary vision alignment system, according to the present invention, is now described in reference to the accompanying drawings. It will be appreciated that the alignment vision system may be used advantageously with a semiconductor device testing and handler machine. The handler uses the alignment vision system to align semiconductors for testing purposes. Of course, other applications may be apparent to those skilled in the art.
  • a vision alignment system 1 is shown in Fig. 1.
  • the vision alignment system 1 has two sides, an alignment side 2 (shown on the left in Fig. 1) and a testing side 3 (shown on the right in Fig. 1).
  • the testing side 3 the initial calibration of the system is carried out using a calibration target 10.
  • the testing side 3 also includes three actuators 30 and a tester 90.
  • the alignment side 2 the alignment of a device to be tested 60 is determined.
  • the alignment side 2 includes an alignment camera 50 and a lighting system 80.
  • a pick and place handler 100 positioned between the testing side 3 and the alignment side 2 is configured to transport calibration targets 10 and testing devices 60 from one side to another.
  • the pick and place handler 100 is a rigid part carrier having solid part locking mechanisms. As shown in Fig. 1, the pick and place handler 100 is configured to transport a calibration target 10 from the testing side 3 to the alignment side 2. Conversely, the pick and place handler 100 can transport a testing device 60 from the alignment side 2 to the testing side 3.
  • the calibration target 10 is used to represent the contactor location 95 (shown in one dimension for simplicity) of a tester 90.
  • the tester 90 carries out various operations on a testing device 60 to determine, for example, the testing device's 60 operational characteristics.
  • the contactor 95 of the tester 90 facilitates a connection between the tester 90 and a testing device 60.
  • aligning a testing device 60 with the contactor 95 of a tester 90 is essential for accurate and efficient testing.
  • the vision alignment system 1 employs the calibration target 10 to represent the contactor location for alignment purposes.
  • the calibration target 10 may be a two-dimensional pattern that provides visual contrast.
  • the calibration target 10 is formed on a glass plate with chromium circles in a 5x5 matrix as shown in Fig. 1.
  • the calibration target 10 may be a model device similar to the devices undergoing testing 60.
  • the calibration target 10 is pre-aligned with the contactor 95 of the tester 90 on the testing side 3 as shown in Fig. 1.
  • the vision alignment system 1 records three actuating points 20 to define a calibration target 10 coordinate system.
  • Figs. 1 and 2 show three defined actuation points 20 of the target coordinate system.
  • Each actuation point 20 represents the zero point for a corresponding actuator 30.
  • the coordinate system of the calibration target 10 may now be used to accurately represent the contactor 95 position of the tester 90.
  • a testing device 60 initially located on the alignment side 2, must now be aligned with the calibration target 10 to insure that it will be aligned properly with the contactor 95.
  • target touching points 40 are used to define a camera coordinate system for a camera 50.
  • the target touching points 40 are closely located in the same position relative to the testing device 60 as the corresponding actuation points 20 relative to the calibration target 10.
  • Figs. 1 and 3 show three target touching points 40 corresponding to three actuation points 20.
  • the camera 50 is oriented such that it captures the orientation of a testing device 60 relative to the calibration target 10.
  • the camera 50 can have any number of resolutions suitable for use in the alignment system 1.
  • the camera 50 has a resolution of at least one mega pixel.
  • the camera 50 can detect a large offset as well as a small offset in the testing device 60.
  • the camera 50 determines a position offset 70 between each of the testing devices 60 and the calibration target 10. Since the calibration target 10 represents the location of the contactor 95, the alignment system 1 can then determine the offset between the testing device 60 and the contactor 95.
  • a lighting system 80 is also provided.
  • the lighting system 80 is comprised of a five-channel programmable LED array light.
  • the angle of light emitted onto the testing device 60 can be changed to provide light at an angle anywhere in the range of 0° to 90°.
  • the lighting system 80 contains a processor (not shown) adapted to execute software that will configure the lighting system 80 so that the images captured by the camera 50 are of sufficient quality to determine offset 70.
  • the lighting system 80 is capable of providing lighting so that the images captured by the camera 50 have enhanced contrast.
  • the lighting system 80 is configured to execute a trainable vision algorithm that enables the system to accurately locate parts including a testing device 60.
  • the testing device 60 is moved from the alignment side 2 to the testing side 3 via the pick and place handler 100.
  • the actuators 30 are used to correct the offset 70.
  • three actuators 30, as shown in Figs. 1 and 2 are located on the testing side 3.
  • a vision guide plate (VGP) 110 is used.
  • the VGP 110 is a modular component that can be mounted to the contactor 95.
  • an image of the testing device 60 is captured by the camera 50 after the testing device 60 has been thermally soaked.
  • the vision alignment system 1 stores the image and information obtained from the image. For example, information such as the "best fit" of the device 60 contact pattern and the position of the device 60 relative to a mechanical reference point are stored.
  • the testing device 60 is mounted onto the VGP 110 as shown in FIG. 5.
  • the VGP 110 completes any mechanical adjustments to the testing device 60 before insertion into the contactor 95.
  • calibration of the vision alignment system 1 can be achieved by focusing a camera 50 on the VGP 110 and contactor assembly.
  • the VGP 110 allows the vision alignment system 1 to adapt to various test site patterns and other handler systems.
  • the VGP 110 provides several benefits and has a variety of uses.
  • the VGP 110 is configured to include
  • the VGP 110 can be used to thermally condition the contactor 95. Further, the VGP 110 is capable of detecting whether a device 60 is stuck in the contactor 95 and is capable of ejecting a device 60 from the contactor 95. In addition, the VGP 110 may be used to clean a contactor 95, validate the cleaning of a contactor 95 and detect bent pins.
  • One advantage is that the present invention is compatible with multiple device handler systems.
  • the error frequency for alignment calculations of the present invention is less than that of mechanical alignment systems.
  • the present invention is simpler and costs less to produce than other conventional systems.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Eye Examination Apparatus (AREA)

Abstract

Cette invention concerne un système d'alignement de vision de machine (1) servant à aligner un dispositif à tester (60) et comprenant une caméra d'alignement (50) positionnée au-dessus d'une partie d'alignement (2) du système d'alignement (1). Un système d'éclairage (80) servant à émettre de la lumière sur le dispositif à tester (60) est placé à proximité de la caméra d'alignement (50). Une cible d'alignement (10) est utilisée pour définir un système de coordonnées de cible d'alignement (10). Trois actionneurs (30) sont positionnés dans une partie d'essais (3) du système d'alignement de vision (1) afin de corriger un décalage (70) entre la cible d'alignement (10) et le dispositif à tester (60). Un manipulateur preneur-placeur (100) transporte la cible d'alignement (10) et le dispositif à tester (60) entre la partie d'essais (3) et la partie d'alignement (2).
PCT/US2006/036814 2005-09-23 2006-09-21 Systeme d'alignement de vision trois points a une seule camera pour un manipulateur de dispositif WO2007038199A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE112006002529T DE112006002529T5 (de) 2005-09-23 2006-09-21 Dreipunkt-Sicht-Ausrichtsystem mit einer einzigen Kamera für ein Vorrichtungs-Handhabungsgerät
JP2008532382A JP2009509173A (ja) 2005-09-23 2006-09-21 デバイスハンドラ用の単一カメラ三ポイントビジョンアライメントシステム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US71961405P 2005-09-23 2005-09-23
US60/719,614 2005-09-23

Publications (1)

Publication Number Publication Date
WO2007038199A1 true WO2007038199A1 (fr) 2007-04-05

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Family Applications (1)

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PCT/US2006/036814 WO2007038199A1 (fr) 2005-09-23 2006-09-21 Systeme d'alignement de vision trois points a une seule camera pour un manipulateur de dispositif

Country Status (7)

Country Link
US (1) US20070185676A1 (fr)
JP (1) JP2009509173A (fr)
KR (1) KR20080053508A (fr)
CR (1) CR9892A (fr)
DE (1) DE112006002529T5 (fr)
TW (1) TW200739779A (fr)
WO (1) WO2007038199A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
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US9268979B2 (en) 2013-09-09 2016-02-23 Datalogic ADC, Inc. System and method for aiming and calibrating a data reader
US9519810B2 (en) 2012-07-31 2016-12-13 Datalogic ADC, Inc. Calibration and self-test in automated data reading systems
CN106959410A (zh) * 2013-11-11 2017-07-18 伊斯梅卡半导体控股公司 用于处理构件的组件和方法
CN109799780A (zh) * 2018-11-20 2019-05-24 武汉华中数控股份有限公司 一种基于数控机床批量加工的工件尺寸补偿方法

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US7842912B2 (en) * 2008-05-23 2010-11-30 Delta Design, Inc. Camera based vision alignment with device group guiding for semiconductor device testing handlers
US7506451B1 (en) * 2008-05-23 2009-03-24 Delta Design, Inc. Camera based two-point vision alignment for semiconductor device testing handlers
US8106349B2 (en) * 2008-07-16 2012-01-31 Delta Design, Inc. Vision alignment with multiple cameras and common coordinate at contactor for IC device testing handlers
US20110010122A1 (en) * 2009-07-07 2011-01-13 Delta Design, Inc. Calibrating separately located cameras with a double sided visible calibration target for ic device testing handlers
CN102062578B (zh) * 2010-12-13 2012-11-28 西安交通大学 一种用于视觉坐标测量的手持式光学靶标及其测量方法
CN102543740A (zh) * 2010-12-22 2012-07-04 中芯国际集成电路制造(上海)有限公司 提高多晶硅栅极与接触孔之间叠对均匀性的方法
TWI593968B (zh) * 2016-08-08 2017-08-01 由田新技股份有限公司 用於同時檢測複數個待測料片之移載設備及其單側式／雙側式檢測系統
US11226390B2 (en) * 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
CN112433428B (zh) * 2020-08-18 2022-01-04 深圳市安华光电技术有限公司 Dlp投影仪、光机和led光源装置校准方法
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9519810B2 (en) 2012-07-31 2016-12-13 Datalogic ADC, Inc. Calibration and self-test in automated data reading systems
US9268979B2 (en) 2013-09-09 2016-02-23 Datalogic ADC, Inc. System and method for aiming and calibrating a data reader
CN106959410A (zh) * 2013-11-11 2017-07-18 伊斯梅卡半导体控股公司 用于处理构件的组件和方法
CN106959410B (zh) * 2013-11-11 2019-10-18 伊斯梅卡半导体控股公司 用于处理构件的组件和方法
CN109799780A (zh) * 2018-11-20 2019-05-24 武汉华中数控股份有限公司 一种基于数控机床批量加工的工件尺寸补偿方法
CN109799780B (zh) * 2018-11-20 2020-09-18 武汉华中数控股份有限公司 一种基于数控机床批量加工的工件尺寸补偿方法

Also Published As

Publication number Publication date
CR9892A (es) 2008-07-31
DE112006002529T5 (de) 2008-08-14
US20070185676A1 (en) 2007-08-09
JP2009509173A (ja) 2009-03-05
KR20080053508A (ko) 2008-06-13
TW200739779A (en) 2007-10-16

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