WO2007037364A1 - Module optique - Google Patents

Module optique Download PDF

Info

Publication number
WO2007037364A1
WO2007037364A1 PCT/JP2006/319449 JP2006319449W WO2007037364A1 WO 2007037364 A1 WO2007037364 A1 WO 2007037364A1 JP 2006319449 W JP2006319449 W JP 2006319449W WO 2007037364 A1 WO2007037364 A1 WO 2007037364A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical
optical module
optical fiber
lid
mounting board
Prior art date
Application number
PCT/JP2006/319449
Other languages
English (en)
Japanese (ja)
Inventor
Takaharu Ohyama
Ikuo Ogawa
Akimasa Kaneko
Katsutoshi Takatoi
Yoshiyuki Doi
Yuji Akahori
Original Assignee
Nippon Telegraph And Telephone Corporation
Ntt Electronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph And Telephone Corporation, Ntt Electronics Corporation filed Critical Nippon Telegraph And Telephone Corporation
Publication of WO2007037364A1 publication Critical patent/WO2007037364A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar

Definitions

  • the present invention relates to an optical module, and more particularly to an optical module that is mounted on a mounting board together with a PLC on which functional elements are formed, and constitutes an optical transceiver.
  • PLC Planar Lightwave Circuit
  • a PLC is an optical circuit in which optical waveguides and optical elements with optical waveguide power are integrated on a silicon substrate or quartz substrate, and is excellent in terms of integration and high functionality with high productivity and reliability.
  • the optical transceiver at the transmission terminal station is equipped with a light emitting element such as an LD, a light receiving element such as a PD, and a PLC on which functional elements such as a multiplexer / demultiplexer, branching coupler, and optical modulator are formed.
  • the light emitting / receiving element and the PLC are connected by optically connecting the light emitting element module and Z or the light receiving element module (hereinafter referred to as an optical module) and the PLC with an optical disc component. Bonding to or direct bonding.
  • Figure 1 shows a method of directly joining a conventional optical module and a PLC.
  • FIG. 2 shows the configuration of a conventional optical module.
  • the optical module 11 includes four light emitting elements or light receiving elements (hereinafter referred to as optical elements) 15 having a light emitting surface or a light receiving surface (hereinafter referred to as a light receiving / emitting surface) 14.
  • the optical element 15 is sealed by a box-shaped housing 12 and a lid 13 having a sapphire glass force that enables input / output of an optical signal to / from the light emitting / receiving surface 14 (see, for example, Non-Patent Document 1). . Since the casing 12 and the lid 13 are joined by metal solder and have high airtightness, they are protected from the external environment and the reliability of the optical element 15 is ensured.
  • the optical element 15 is fixed to the housing 12 with metal solder or the like with the light emitting / receiving surface 14 facing the lid 13, and connected to the metal wiring 17 of the housing 12 by bonding wires 16.
  • the metal wiring 17 extends through the housing 12 to the back and side surfaces of the housing 12.
  • the PLC 21 has an optical waveguide 24 formed on a silicon substrate 22.
  • the optical waveguide 24 formed in the PLC 21 and the light receiving / emitting surface 14 of the optical element 15 are arranged so as to be optically coupled.
  • a short plate 23 as a reinforcing plate is joined to the PLC 21 and joined to the lid 13 of the optical module 11 on the surface including the end face of the optical waveguide 24 of the PLC 21.
  • a UV curable adhesive or the like is used for bonding between the optical module 11 and PLC21.
  • the optical module 11 and the PLC 21 are fixed on the mounting board 31, and the metal wiring 17 of the optical module 11 and the electrode 32 connected to the metal wiring 34 formed on the mounting board 31 are connected by the bonding wire 33.
  • the optical element 15 is fixed to the housing 12 in order to optically couple the light receiving / emitting surface 14 of the optical element 15 and the optical waveguide 24 of the PLC 21.
  • the optical element 15 is fixed to the housing 12 in order to optically couple the light receiving / emitting surface 14 of the optical element 15 and the optical waveguide 24 of the PLC 21.
  • An object of the present invention is to provide an optical module that can connect a PLC force without being affected by heat, and can ensure mechanical strength while ensuring electrical connection with a mounting board. There is to do.
  • Non-patent literature 1 A. Kaneko, et al, Ultra small and low power consumption 8ch variabl e optical attenuator multiplexer (V- AWG) using multi-chip PLC integration technol ogy ", Proc. OFC'2005, OTuD3
  • the present invention provides a housing having at least one opening, a lid that transmits light and closes and seals the opening of the housing, and a light receiving / emitting surface of the lid.
  • An optical module including an optical element fixed to face the optical fiber holds an optical fiber optically coupled to the light receiving and emitting surface of the optical element, and is bonded to the lid on a surface including the end face of the optical fiber.
  • an optical fiber connecting means which is fixed to the mounting board so that the mounting surface of the mounting board and the optical axis of the optical element are parallel to each other.
  • the optical module holds an optical fiber that is optically coupled to the light receiving and emitting surface of the optical element, and an optical fiber connecting means that is bonded to the lid on the surface including the end surface of the optical fiber. And a metal wiring that is electrically connected to the optical element and penetrates from the inside of the housing to the outside of the housing, and a lead pin joined to the metal wiring outside the housing,
  • the mounting board is fixed to the mounting board so that the mounting surface of the mounting board and the optical axis of the optical element are parallel to each other.
  • the lead pin and the electrode formed on the mounting board can be fixed by solder. Further, the lead pin may be fixed to the mounting board by fitting with a connector fixed on the mounting board.
  • the optical fiber connecting means has a glass blocking force, and one of a convex portion and a concave portion is formed on a surface including an end surface of the optical fiber, and the lid includes the optical element and the optical fiber.
  • either one of the concave portion and the convex portion is formed so as to be fitted to either one of the convex portion and the concave portion.
  • the optical fiber connecting means has a glass block force, and a surface where the lid and the glass block are joined is inclined with respect to the optical axis.
  • the optical fiber connecting means may be a connector that fits with either one of the optical ferrule and the optical connector.
  • a marker pattern may be formed on the metal wiring so as to determine a mounting position where the optical element is optically coupled to the optical fiber! /.
  • FIG. 1 is a cross-sectional view showing a method of directly joining a conventional optical module and a PLC.
  • FIG. 2 is a perspective view showing a configuration of a conventional optical module.
  • FIG. 3 is a side view showing a method of joining the optical module and the PLC, which is useful in the first embodiment of the present invention.
  • FIG. 4 is a cross-sectional view showing a configuration of an optical module that works on one embodiment of the present invention.
  • FIG. 5 is a perspective view showing an optical module mounting method.
  • FIG. 6A is a front view showing another application example of the configuration of the optical module.
  • FIG. 6B is a side view showing another application example of the configuration of the optical module.
  • FIG. 7 is a side view showing a method of joining the optical module and the PLC, which is useful in the second embodiment of the present invention.
  • FIG. 8 is a top view showing a method for joining an optical module and a glass block.
  • FIG. 9 is a top view showing a configuration of an optical transceiver according to an embodiment of the present invention.
  • FIG. 10 is a side view showing the method for joining the optical module and the glass block according to Example 1.
  • FIG. 11A is a perspective view showing a method of joining an optical module and a glass block according to a second embodiment and joining them using a ferrule.
  • FIG. 11B is a perspective view showing a method of joining the optical module and the glass block according to the second embodiment and joining them using an optical connector.
  • FIG. 12 is a side view showing a method for joining an optical module and a glass block according to Example 3.
  • FIG. 13 is a side view showing a method for joining an optical module and a glass block according to Example 4.
  • FIG. 14 is a top view showing a method for joining an optical module and a glass block according to Example 5.
  • FIG. 15 is a top view showing a method for joining an optical module and a glass block according to Example 6.
  • FIG. 16 is a top view showing the arrangement of optical elements in the optical module.
  • FIG. 3 shows a method of joining the optical module and the PLC, which is useful in the first embodiment of the present invention.
  • the optical module 51 has the same structure as the optical module 11 shown in FIG. 1, and has an optical element 55 sealed by a box-shaped housing 52 and a lid 53 having sapphire glass power.
  • a functional element that generates heat is mounted and a PLC and an optical module are joined, they can be joined directly as shown in FIG.
  • a PLC equipped with a functional element that generates heat and an optical module are joined, the following method is used.
  • the optical module 51 is fixed so that the mounting surface of the mounting board 81 and the optical axis of the optical element 55 of the optical module 51 are parallel to each other. Since the metal wiring 57 of the optical module 51 and the electrode 82 formed on the mounting board 81 are fixed by metal solder or the like, the optical module 51 can be firmly fixed on the mounting board 81.
  • the optical element 55 of the optical module 51 has its light emitting / receiving surface 54 optically coupled to an optical fiber 92 fixed to the glass block 91.
  • the glass block 91 as the optical fiber connecting means is bonded to the lid 53 of the optical module 51 using an adhesive or the like on the surface including the end surface of the optical fiber 92.
  • the PLC 21 is bonded to the substrate 22, and the optical waveguide formed in the PLC 21 is optically coupled to the optical fiber 92 fixed to the glass block 93.
  • the optical fiber 92 is bonded to the PLC 21 as a reinforcing plate.
  • the optical fiber 92 is bonded to the glass block 93 on the surface including the optical waveguide end face of the PLC 21. In this way, since the optical module 51 and the PLC 21 are connected via the optical fiber 92, the optical module 51 is not affected by the heat of the PLC 21.
  • the mounting surface of the mounting board 81 and the optical axis of the optical element 55 of the optical module 51 are fixed in parallel, it is possible to suppress the component height on the mounting board 81.
  • a thin optical transceiver can be configured.
  • FIG. 4 shows the configuration of an optical module that is useful in one embodiment of the present invention.
  • the optical module 51 includes an optical element 55 sealed by a box-shaped casing 52 and a lid 53 having a sapphire glass power that transmits light.
  • alumina ceramics are used as the material of the casing 52.
  • the outer periphery of the case 52 and the lid 53 is formed by metal power for bonding metal vapor deposition.
  • metal solder is used as the bonding agent for bonding the casing 52 and the lid 53. Since the casing 52 and the lid 53 have high airtightness, they are protected from the external environment, and the reliability of the optical element 55 can be ensured.
  • the optical element 55 is a light emitting element such as an LD or a light receiving element such as a PD.
  • the optical element 55 is fixed to the casing 52 with metal solder or the like with the light emitting / receiving surface 54 facing the lid 53, and is connected to the metal wiring 57 of the casing 52 by a bonding wire 56.
  • the metal wiring 57 extends through the housing 52 to the back and side surfaces of the housing 52.
  • a lead pin 58 is fixed to the metal wiring 57 on the back surface of the casing 52 with metal solder or the like.
  • FIG. 5 shows an example of an optical module mounting method.
  • the electrical connector may be the connector 60 fixed to the mounting board, or the connector 61 connected to the flexible cable 62 or the like.
  • the characteristic evaluation or operation test of the optical module 51 can be easily performed. According to this method, the inspection process before shipment of the optical module 51 can be easily performed, which leads to cost reduction.
  • FIG. 6 shows another application example of the configuration of the optical module.
  • the optical module 71 includes a box-shaped casing 72 that is open in two directions, and lids 73a and 73b that also have sapphire glass power to seal the openings in the two directions.
  • the optical element 75 has light receiving / emitting surfaces 74a and 74b in two directions, facing the lids 73a and 73b, respectively, and fixed to the casing 72 with metal solder or the like, and the bonding wires 76a and 76b It is connected to 72 metal wires 77a and 77b.
  • the metal wirings 77 a and 77 b extend through the casing 72 to the side surface of the casing 72.
  • Lead pins 78a and 78b are fixed to metal wirings 77a and 77b on the side surface of the housing 72 by metal solder or the like.
  • FIG. 7 shows a method of joining an optical module and a PLC, which is useful in the second embodiment of the present invention.
  • the optical module 51 has the same structure as the optical module 51 shown in FIG. 3, and includes an optical element 55 sealed by a box-shaped housing 52 and a lid 53 having sapphire glass power.
  • a functional element that generates heat is mounted and the PLC and the optical module are bonded, the bonding can be performed directly as shown in FIG.
  • the following method is used.
  • the optical module 51 is fixed so that the mounting surface of the mounting board 81 and the optical axis of the optical element 55 of the optical module 51 are parallel to each other. Since the metal wiring 57 of the optical module 51 and the electrode 82 formed on the mounting board 81 are fixed by metal solder or the like via the lead pins 58, the optical module 51 can be firmly fixed on the mounting board 81. .
  • the fixing agent for fixing the lead pin 58 to the mounting board 81 is not limited to metal solder but may be a conductive adhesive. It is preferable to use a solder that has a sufficient mechanical strength and can be repaired.
  • the light receiving / emitting surface 54 of the optical element 55 of the optical module 51 is optically coupled to the optical fiber 92 fixed to the glass block 91.
  • the glass block 91 as the optical fiber connecting means is bonded to the lid 53 of the optical module 51 using an adhesive or the like on the surface including the end surface of the optical fiber 92.
  • the PLC 21 is bonded to the substrate 22, and the optical waveguide formed in the PLC 21 is optically coupled to the optical fiber 92 fixed to the glass block 93.
  • a short plate 23 as a reinforcing plate is bonded onto the PLC 21 and bonded to the glass block 93 on the surface including the optical waveguide end face of the PLC 21. In this way, since the optical module 51 and the PLC 21 are connected via the optical fiber 92, the optical module 51 is not affected by the heat of the PLC 21.
  • the mounting surface of the mounting board 81 and the optical axis of the optical element 55 of the optical module 51 are fixed in parallel, the component height on the mounting board 81 can be suppressed. Become. Therefore, a thin optical transceiver can be configured.
  • FIG. 8 shows a method for joining the optical module and the glass block.
  • the optical module 51 integrates four optical elements 55, and the optical fiber 92 that optically couples them is a four-core tape-type optical fiber array.
  • the arrangement pitch of the cores of the optical fiber 92 and the arrangement pitch of the light receiving / emitting surface 54 of the optical element 55 are the same.
  • the connection between the metal wiring 57 of the optical module 51 and the electrode 82 formed on the mounting board 81 is fixed with metal solder or the like via the lead pin 58.
  • the driving electrodes 82a to 82d of the optical element 55 but also the ground pins 82e and 82f are used to fix the lead pins 58a to 58f, for example.
  • the optical module 51 can be more firmly fixed. If more strength is required, the number of lead pins may be increased. Further, the lead pins may be arranged in four directions, which are only three directions in FIG.
  • FIG. 9 shows a configuration of an optical transmitter / receiver according to an embodiment of the present invention.
  • the optical transceiver 100 includes an optical module 112 containing a plurality of light emitting elements, a mounting board 111 on which an optical module 113 containing a plurality of light receiving elements is fixed, and an AWG type optical multiplexer / demultiplexer 131. .
  • the optical module 112 and the optical module 113 are optically coupled to the tape type optical fibers 121 and 122 by the glass blocks 114a and 114b, and are connected to the AWG type optical multiplexer / demultiplexer 1131.
  • the AWG type optical multiplexer / demultiplexer 131 is temperature controlled by a Peltier element 132. Since the AWG type optical multiplexer / demultiplexer 131 and the optical modules 112 and 113 are connected via the optical fibers 112 and 122, the optical modules 112 and 113 are not affected by heat.
  • the optical modules 112 and 113 are fixed so that the mounting surface of the mounting board 111 and the optical axes of the light emitting elements and the light receiving elements of the optical modules 112 and 113 are parallel to each other.
  • the height of the vessel 100 can be reduced.
  • FIG. 10 shows a method of joining the optical module and the glass block according to the first example.
  • the optical module 51 has the same structure as the optical module 51 shown in FIG. 4, and includes an optical element 55 sealed by a box-shaped casing 52 and a lid 53 having sapphire glass power. 7 differs from the joining method shown in FIG. 7 in that the optical module 51 is mounted and fixed to the mounting board 81 by fitting the connector 60 fixed to the mounting surface of the mounting board 81 and the lead pin 58. . According to this method, it is possible to easily mount the optical module 51 in the assembly process of the optical transceiver.
  • the bonding method shown in Fig. 7 requires a process of reflowing the solder and fixing the optical module after aligning with the electrodes on the mounting board.
  • the optical module In the solder reflow process, the optical module directly receives heat during reflow, which may deteriorate the characteristics of the optical element. Therefore, by attaching to the connector 60 arranged on the mounting board 81, the problem of heat during solder reflow can be avoided.
  • the optical module 51 can be easily removed and attached.
  • the optical module 92 is attached to the optical module 51.
  • the power optical module 51 can be applied even when the PLC is directly attached.
  • FIGS. 11A and 11B show a method of joining an optical module and a glass block according to Example 2.
  • the MT ferrule 302 is used to optically couple the optical element of the optical module 51 and the optical fiber.
  • a connector 301 having connection pins 31 la and 31 lb is joined to the optical module 51.
  • Connection pin 311a, 31 lb force Connect so that it fits with the connection pin hole 321a, 32 lb of MT ferrule 302, and crimp with metal leaf spring 303.
  • FIG. 11B optically couples the optical element of the optical module 51 and the optical fiber using an optical connector 304 such as an MPO connector or an MPX connector.
  • the optical module 51 is joined by a connector 305 having connection pins 351a and 351b.
  • Connection pin 351a, 351b 1S Connect so that it fits into the connection pin hole 341a, 341b of the optical connector 304.
  • the number of optical fiber cores of the ferrule or optical connector is the number of optical elements built in the optical module. There are no restrictions on the number of core wires.
  • the end face of the ferrule may be directly joined to the lid of the optical module using an adhesive.
  • FIG. 12 shows a method for joining an optical module and a glass block according to the third embodiment.
  • the optical element 155 of the optical module 151 is optically coupled to the optical fiber 162 fixed to the glass block 161.
  • the glass block 161 is bonded to the lid 153 of the optical module 151 on the surface including the end surface of the optical fiber 162.
  • a convex portion 163 is provided on the end face of the glass block 161, and a concave portion 155 is provided on the lid 153.
  • the convex portion 163 and the concave portion 155 are fitted so as to be optically coupled to the light emitting / receiving surface 154 of the optical element 155 and the core of the optical fiber 162. In this way, alignment between the optical element 155 and the optical fiber 162 can be facilitated.
  • a concave portion may be provided on the end surface of the glass block 161, and a convex portion may be provided on the end surface of the lid 153.
  • a convex portion (or on the end face of the PLC is connected so that the light emitting / receiving surface of the optical element and the optical waveguide of the PLC are optically coupled. If the concave portion is formed, alignment between the light emitting / receiving surface and the optical waveguide can be facilitated.
  • FIG. 13 shows a method for joining an optical module and a glass block according to Example 4.
  • the optical element 175 of the optical module 171 is optically coupled to an optical fiber 182 fixed to the glass block 181.
  • the glass block 181 is bonded to the lid 173 of the optical module 171 on the surface including the end surface of the optical fiber 182.
  • an inclined surface of, for example, 8 degrees is provided on the end surface of the glass block 181 and the lid 173. This inclined surface can prevent return light to the optical element 175 and return light to the optical fiber 182.
  • a thin film filter may be bonded to the surface of the lid 173.
  • FIG. 14 shows a method of joining the optical module and the glass block according to the fifth example.
  • the glass block 212 fixes three four-core tape type optical fibers 213a to 213c, and is bonded to the three optical modules 201a to 201c on the surface including the end face of the optical fiber 213.
  • the three optical modules 201a to 201c are fixed to the mounting board 212 as shown in FIGS.
  • the optical modules 201a to 201c are optical modules in which a plurality of optical elements are integrated, and are connected to the plurality of optical modules in one block, so that the mounting space on the mounting board can be reduced. it can. Since the optical modules 201a to 201c are fixed to the mounting board 212 via lead pins, they can be firmly fixed.
  • the plurality of optical modules are connected to the end face of the PLC so that the light receiving and emitting surfaces of the optical element and the optical waveguide are optically coupled.
  • FIG. 15 shows a method for joining an optical module and a glass block according to Example 6.
  • the glass block 232 has the same structure as in Example 5.
  • the optical module 221 has 12 optical elements integrated in one housing. All the optical elements can be hermetically sealed, and as shown in the second embodiment, it is possible to reduce the size of the optical elements as compared to arranging the optical elements individually hermetically sealed.
  • Figure 16 shows the arrangement of the optical elements in the optical module.
  • the optical module 401 is formed with metal wiring for connecting the optical element 400 and the electrode pattern on the mounting board. Using this metal wiring, the position of the optical element is determined.
  • the metal wirings 41 la and 41 lb electrically connected to the optical element 405 are formed, for example, marker patterns 412a4 to 12f are formed. With the marker patterns 412a4 to 12f, the center of the light receiving / emitting surface 404 of the optical element 405 can always be aligned with a constant accuracy and fixed to the housing 402.
  • other ceramics such as silicon carbide, silicon nitride, aluminum nitride, and zirconium may be used as a material for the casing.
  • glass such as quartz or sapphire may be used.
  • the bonding agent for bonding the housing and the lid is not limited to metal solder such as gold tin, gold germanium, and tin lead, and for example, a low melting point glass wax agent or the like can be used.
  • the material of the lid is not limited to sapphire described above, and for example, quartz glass, borate glass, or the like can be used. If the airtightness can be ensured such that the characteristics of the optical element disposed inside the optical module are not deteriorated by the housing and the lid, the material's member is not limited.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Receiving Elements (AREA)

Abstract

La présente invention concerne un module optique permettant une liaison sans incidence de la chaleur d’un PLC et assurant une résistance mécanique et une connexion électrique à l’aide d’une plaque de montage. Plus précisément, cette invention concerne un module optique comprenant un bloc de verre (91) qui maintient une fibre optique (92) optiquement couplée à une surface réceptrice/émettrice de lumière (54) d’un élément optique (55), et joint à un couvercle (53) sur une surface comprenant une face terminale de la fibre optique (92), un câblage métallique (57) électriquement relié à l’élément optique (55) et formé afin de pouvoir pénétrer dans un boîtier (51) de l’intérieur vers l’extérieur de ce dernier, et une broche conductrice (58) jointe au câblage métallique (57) à l’extérieur du boîtier (51). Ce module optique est fixé à une plaque de montage (81) de sorte que la surface de montage de ladite plaque (81) et l’axe optique de l’élément optique (55) soient parallèles.
PCT/JP2006/319449 2005-09-29 2006-09-29 Module optique WO2007037364A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005285064A JP4699155B2 (ja) 2005-09-29 2005-09-29 光モジュール
JP2005-285064 2005-09-29

Publications (1)

Publication Number Publication Date
WO2007037364A1 true WO2007037364A1 (fr) 2007-04-05

Family

ID=37899785

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/319449 WO2007037364A1 (fr) 2005-09-29 2006-09-29 Module optique

Country Status (2)

Country Link
JP (1) JP4699155B2 (fr)
WO (1) WO2007037364A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009001958A1 (fr) * 2007-06-28 2008-12-31 Nippon Telegraph And Telephone Corporation Module optique
WO2012141333A1 (fr) * 2011-04-12 2012-10-18 Sumitomo Electric Industries, Ltd. Émetteur-récepteur optique mettant en œuvre un sous-ensemble optique de connexion de circuit imprimé flexible sur une carte de circuit

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009008952A (ja) * 2007-06-28 2009-01-15 Nippon Telegr & Teleph Corp <Ntt> 光モジュール
JP4599569B2 (ja) * 2008-01-16 2010-12-15 日本電信電話株式会社 アレイ型光学素子の接続方法
CN103885141A (zh) * 2012-12-19 2014-06-25 深圳新飞通光电子技术有限公司 平面光波导型并行光组件与光模块
CN106483609A (zh) * 2015-08-25 2017-03-08 青岛海信宽带多媒体技术有限公司 一种光模块

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359426A (ja) * 2001-06-01 2002-12-13 Hitachi Ltd 光モジュール及び光通信システム
JP2003227968A (ja) * 2002-02-01 2003-08-15 Sony Corp 光リンク装置
JP2004294905A (ja) * 2003-03-27 2004-10-21 Fdk Corp ファイバコリメータアレイ及びその製造方法
WO2005010580A1 (fr) * 2003-07-24 2005-02-03 Reflex Photonique Inc./Reflex Photonics Inc. Boitier optique encapsule

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3380733B2 (ja) * 1998-01-08 2003-02-24 日本電信電話株式会社 光モジュールおよびその製造方法
KR100677065B1 (ko) * 1999-04-29 2007-02-01 삼성전자주식회사 광커넥터 모듈
JP2002202440A (ja) * 2000-12-28 2002-07-19 Japan Aviation Electronics Industry Ltd 光モジュールの実装構造及び実装方法
JP2002313973A (ja) * 2001-04-11 2002-10-25 Sumitomo Metal Electronics Devices Inc 光通信用パッケージ
JP4028270B2 (ja) * 2002-03-19 2007-12-26 古河電気工業株式会社 光モジュール
JP2004253783A (ja) * 2003-01-31 2004-09-09 Fuji Photo Film Co Ltd レーザモジュール

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359426A (ja) * 2001-06-01 2002-12-13 Hitachi Ltd 光モジュール及び光通信システム
JP2003227968A (ja) * 2002-02-01 2003-08-15 Sony Corp 光リンク装置
JP2004294905A (ja) * 2003-03-27 2004-10-21 Fdk Corp ファイバコリメータアレイ及びその製造方法
WO2005010580A1 (fr) * 2003-07-24 2005-02-03 Reflex Photonique Inc./Reflex Photonics Inc. Boitier optique encapsule

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009001958A1 (fr) * 2007-06-28 2008-12-31 Nippon Telegraph And Telephone Corporation Module optique
JP5094860B2 (ja) * 2007-06-28 2012-12-12 日本電信電話株式会社 光モジュール
US8545111B2 (en) 2007-06-28 2013-10-01 Nippon Telegraph And Telephone Corporation Optical module
WO2012141333A1 (fr) * 2011-04-12 2012-10-18 Sumitomo Electric Industries, Ltd. Émetteur-récepteur optique mettant en œuvre un sous-ensemble optique de connexion de circuit imprimé flexible sur une carte de circuit
US9063310B2 (en) 2011-04-12 2015-06-23 Sumitomo Electric Industries, Ltd. Optical transceiver implementing with flexible printed circuit connecting optical subassembly to circuit board

Also Published As

Publication number Publication date
JP2007094145A (ja) 2007-04-12
JP4699155B2 (ja) 2011-06-08

Similar Documents

Publication Publication Date Title
US11803020B2 (en) Optical bench subassembly having integrated photonic device
AU668031B2 (en) Optical fiber array
US8168939B2 (en) Method and system for a light source assembly supporting direct coupling to an integrated circuit
US20030091301A1 (en) Miniaturized parallel optical transmitter and receiver module
US9151916B2 (en) Compact optical package made with planar structures
KR20140146648A (ko) 밀폐식 광섬유 정렬 조립체
JPH08254635A (ja) 光学相互接続装置
US5029968A (en) Optoelectronic hybrid package assembly including integral, self-aligned fiber optic connector
US6685363B2 (en) Passive self-alignment technique for array laser transmitters and receivers for fiber optic applications
WO2009107671A1 (fr) Dispositif de conversion photoélectrique
JP4699155B2 (ja) 光モジュール
US7366367B2 (en) Optical data link and method of manufacturing optical data link
JP5404564B2 (ja) 光モジュール及びその接続構造体
CN113495332A (zh) 激光器模块、硅光模块及光传输器件
US6491446B1 (en) Passive self-alignment technique for array laser transmitters and receivers for fiber optic applications
JP4203837B2 (ja) 光伝送モジュール
EP1306703A1 (fr) Dispositfs optiques pour la communication
JPH11287930A (ja) レセプタクル型光モジュールの構造
RU2717374C2 (ru) Субблок оптической скамьи с интегрированным фотонным устройством
JP2009253176A (ja) 光電変換モジュール及び光サブアセンブリ
WO2020218171A1 (fr) Module optique
JP4779919B2 (ja) 光電気変換装置
JP2008046367A (ja) 光送受信器および光モジュール
JP4779920B2 (ja) 光電気変換装置
JP2001077455A (ja) 光モジュール及びその接続構造

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 06810855

Country of ref document: EP

Kind code of ref document: A1