WO2007037364A1

WO2007037364A1 - Optical module

Info

Publication number: WO2007037364A1
Application number: PCT/JP2006/319449
Authority: WO
Inventors: Takaharu Ohyama; Ikuo Ogawa; Akimasa Kaneko; Katsutoshi Takatoi; Yoshiyuki Doi; Yuji Akahori
Original assignee: Nippon Telegraph And Telephone Corporation; Ntt Electronics Corporation
Priority date: 2005-09-29
Filing date: 2006-09-29
Publication date: 2007-04-05
Also published as: JP2007094145A; JP4699155B2

Abstract

Disclosed is an optical module which enables a connection without being affected by heat from a PLC while securing mechanical strength and electrical connection with a mounting board. Specifically disclosed is an optical module comprising a glass block (91) which holds an optical fiber (92) that is optically coupled with a light receiving/emitting surface (54) of an optical element (55), and is joined to a lid (53) at a surface including an end face of the optical fiber (92), a metal wiring (57) which is electrically connected with the optical element (55) and so formed as to penetrate a case (51) from the inside to the outside thereof, and a lead pin (58) which is joined with the metal wiring (57) outside the case (51). This optical module is fixed to a mounting board (81) so that the mounting surface of the mounting board (81) and the optical axis of the optical element (55) are parallel to each other.

Description

Specification

Light Mossyur

Technical field

The present invention relates to an optical module, and more particularly to an optical module that is mounted on a mounting board together with a PLC on which functional elements are formed, and constitutes an optical transceiver.

Background art

In recent years, with the widespread use of optical fiber transmission, a technique for integrating a large number of optical elements at high density is required. One of them is a planar lightwave circuit (hereinafter referred to as PLC: Planar Lightwave Circuit). A PLC is an optical circuit in which optical waveguides and optical elements with optical waveguide power are integrated on a silicon substrate or quartz substrate, and is excellent in terms of integration and high functionality with high productivity and reliability. The optical transceiver at the transmission terminal station is equipped with a light emitting element such as an LD, a light receiving element such as a PD, and a PLC on which functional elements such as a multiplexer / demultiplexer, branching coupler, and optical modulator are formed. And

[0003] In an optical transceiver, the light emitting / receiving element and the PLC are connected by optically connecting the light emitting element module and Z or the light receiving element module (hereinafter referred to as an optical module) and the PLC with an optical disc component. Bonding to or direct bonding. Figure 1 shows a method of directly joining a conventional optical module and a PLC.

FIG. 2 shows the configuration of a conventional optical module. As an example, the optical module 11 includes four light emitting elements or light receiving elements (hereinafter referred to as optical elements) 15 having a light emitting surface or a light receiving surface (hereinafter referred to as a light receiving / emitting surface) 14. The optical element 15 is sealed by a box-shaped housing 12 and a lid 13 having a sapphire glass force that enables input / output of an optical signal to / from the light emitting / receiving surface 14 (see, for example, Non-Patent Document 1). . Since the casing 12 and the lid 13 are joined by metal solder and have high airtightness, they are protected from the external environment and the reliability of the optical element 15 is ensured. The optical element 15 is fixed to the housing 12 with metal solder or the like with the light emitting / receiving surface 14 facing the lid 13, and connected to the metal wiring 17 of the housing 12 by bonding wires 16. The metal wiring 17 extends through the housing 12 to the back and side surfaces of the housing 12. On the other hand, the PLC 21 has an optical waveguide 24 formed on a silicon substrate 22. The optical waveguide 24 formed in the PLC 21 and the light receiving / emitting surface 14 of the optical element 15 are arranged so as to be optically coupled. A short plate 23 as a reinforcing plate is joined to the PLC 21 and joined to the lid 13 of the optical module 11 on the surface including the end face of the optical waveguide 24 of the PLC 21. A UV curable adhesive or the like is used for bonding between the optical module 11 and PLC21. The optical module 11 and the PLC 21 are fixed on the mounting board 31, and the metal wiring 17 of the optical module 11 and the electrode 32 connected to the metal wiring 34 formed on the mounting board 31 are connected by the bonding wire 33. The

[0006] In an optical transceiver, if an optical module and a PLC are connected by an optical disc component, the mounting space becomes large. Therefore, as described above, the optical module and the PLC are directly joined. However, in the conventional method described above, when a functional element such as an optical switch that also uses the thermo-optic effect is mounted on the PLC 21, a large amount of heat is generated. In particular, since the silicon substrate 22 of the PLC 21 has a high thermal conductivity, the optical module 11 bonded to the PLC 21 is easily affected by the heat of the PLC 21. Therefore, when the characteristics of the optical element 15 mounted on the optical module 11 are deteriorated, there is a problem.

[0007] In addition, since the metal wiring 17 of the optical module 11 and the electrode 32 formed on the mounting board 31 are connected by the bonding wire 33, it is difficult to ensure mechanical strength and it is easy to break. There was a problem. In particular, there was a problem that the reliability against vibration was inferior o

Further, in the optical transceiver assembly process, the optical element 15 is fixed to the housing 12 in order to optically couple the light receiving / emitting surface 14 of the optical element 15 and the optical waveguide 24 of the PLC 21. In this process and in the process of joining the optical module 11 and the PLC 21, it is difficult to ensure the mounting position accuracy.

[0009] An object of the present invention is to provide an optical module that can connect a PLC force without being affected by heat, and can ensure mechanical strength while ensuring electrical connection with a mounting board. There is to do.

[0010] Non-patent literature 1: A. Kaneko, et al, Ultra small and low power consumption 8ch variabl e optical attenuator multiplexer (V- AWG) using multi-chip PLC integration technol ogy ", Proc. OFC'2005, OTuD3

Disclosure of the invention

[0011] In order to achieve the above-mentioned object, the present invention provides a housing having at least one opening, a lid that transmits light and closes and seals the opening of the housing, and a light receiving / emitting surface of the lid. An optical module including an optical element fixed to face the optical fiber holds an optical fiber optically coupled to the light receiving and emitting surface of the optical element, and is bonded to the lid on a surface including the end face of the optical fiber. And an optical fiber connecting means, which is fixed to the mounting board so that the mounting surface of the mounting board and the optical axis of the optical element are parallel to each other.

[0012] Further, the optical module holds an optical fiber that is optically coupled to the light receiving and emitting surface of the optical element, and an optical fiber connecting means that is bonded to the lid on the surface including the end surface of the optical fiber. And a metal wiring that is electrically connected to the optical element and penetrates from the inside of the housing to the outside of the housing, and a lead pin joined to the metal wiring outside the housing, The mounting board is fixed to the mounting board so that the mounting surface of the mounting board and the optical axis of the optical element are parallel to each other.

[0013] In the optical module, the lead pin and the electrode formed on the mounting board can be fixed by solder. Further, the lead pin may be fixed to the mounting board by fitting with a connector fixed on the mounting board.

[0014] The optical fiber connecting means has a glass blocking force, and one of a convex portion and a concave portion is formed on a surface including an end surface of the optical fiber, and the lid includes the optical element and the optical fiber. In order to optically couple, either one of the concave portion and the convex portion is formed so as to be fitted to either one of the convex portion and the concave portion. Alternatively, the optical fiber connecting means has a glass block force, and a surface where the lid and the glass block are joined is inclined with respect to the optical axis. Alternatively, the optical fiber connecting means may be a connector that fits with either one of the optical ferrule and the optical connector.

Further, a marker pattern may be formed on the metal wiring so as to determine a mounting position where the optical element is optically coupled to the optical fiber! /.

Brief Description of Drawings [FIG. 1] FIG. 1 is a cross-sectional view showing a method of directly joining a conventional optical module and a PLC.

FIG. 2 is a perspective view showing a configuration of a conventional optical module.

3) FIG. 3 is a side view showing a method of joining the optical module and the PLC, which is useful in the first embodiment of the present invention.

[4] FIG. 4 is a cross-sectional view showing a configuration of an optical module that works on one embodiment of the present invention.

FIG. 5 is a perspective view showing an optical module mounting method.

FIG. 6A is a front view showing another application example of the configuration of the optical module.

FIG. 6B is a side view showing another application example of the configuration of the optical module.

[7] FIG. 7 is a side view showing a method of joining the optical module and the PLC, which is useful in the second embodiment of the present invention.

FIG. 8 is a top view showing a method for joining an optical module and a glass block.

[9] FIG. 9 is a top view showing a configuration of an optical transceiver according to an embodiment of the present invention.

FIG. 10 is a side view showing the method for joining the optical module and the glass block according to Example 1.

[FIG. 11A] FIG. 11A is a perspective view showing a method of joining an optical module and a glass block according to a second embodiment and joining them using a ferrule.

FIG. 11B is a perspective view showing a method of joining the optical module and the glass block according to the second embodiment and joining them using an optical connector.

FIG. 12 is a side view showing a method for joining an optical module and a glass block according to Example 3.

FIG. 13 is a side view showing a method for joining an optical module and a glass block according to Example 4.

FIG. 14 is a top view showing a method for joining an optical module and a glass block according to Example 5.

FIG. 15 is a top view showing a method for joining an optical module and a glass block according to Example 6. FIG. 16 is a top view showing the arrangement of optical elements in the optical module.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0018] (Optical module and PLC bonding method 1)

FIG. 3 shows a method of joining the optical module and the PLC, which is useful in the first embodiment of the present invention. The optical module 51 has the same structure as the optical module 11 shown in FIG. 1, and has an optical element 55 sealed by a box-shaped housing 52 and a lid 53 having sapphire glass power. When a functional element that generates heat is mounted and a PLC and an optical module are joined, they can be joined directly as shown in FIG. However, when a PLC equipped with a functional element that generates heat and an optical module are joined, the following method is used.

The optical module 51 is fixed so that the mounting surface of the mounting board 81 and the optical axis of the optical element 55 of the optical module 51 are parallel to each other. Since the metal wiring 57 of the optical module 51 and the electrode 82 formed on the mounting board 81 are fixed by metal solder or the like, the optical module 51 can be firmly fixed on the mounting board 81.

The optical element 55 of the optical module 51 has its light emitting / receiving surface 54 optically coupled to an optical fiber 92 fixed to the glass block 91. The glass block 91 as the optical fiber connecting means is bonded to the lid 53 of the optical module 51 using an adhesive or the like on the surface including the end surface of the optical fiber 92.

On the other hand, the PLC 21 is bonded to the substrate 22, and the optical waveguide formed in the PLC 21 is optically coupled to the optical fiber 92 fixed to the glass block 93. The optical fiber 92 is bonded to the PLC 21 as a reinforcing plate. The optical fiber 92 is bonded to the glass block 93 on the surface including the optical waveguide end face of the PLC 21. In this way, since the optical module 51 and the PLC 21 are connected via the optical fiber 92, the optical module 51 is not affected by the heat of the PLC 21.

[0022] Further, since the mounting surface of the mounting board 81 and the optical axis of the optical element 55 of the optical module 51 are fixed in parallel, it is possible to suppress the component height on the mounting board 81. For example, a thin optical transceiver can be configured.

[0023] (Optical module) FIG. 4 shows the configuration of an optical module that is useful in one embodiment of the present invention. The optical module 51 includes an optical element 55 sealed by a box-shaped casing 52 and a lid 53 having a sapphire glass power that transmits light. As the material of the casing 52, for example, alumina ceramics are used. The outer periphery of the case 52 and the lid 53 is formed by metal power for bonding metal vapor deposition. As the bonding agent for bonding the casing 52 and the lid 53, metal solder is used. Since the casing 52 and the lid 53 have high airtightness, they are protected from the external environment, and the reliability of the optical element 55 can be ensured.

The optical element 55 is a light emitting element such as an LD or a light receiving element such as a PD. The optical element 55 is fixed to the casing 52 with metal solder or the like with the light emitting / receiving surface 54 facing the lid 53, and is connected to the metal wiring 57 of the casing 52 by a bonding wire 56. The metal wiring 57 extends through the housing 52 to the back and side surfaces of the housing 52. A lead pin 58 is fixed to the metal wiring 57 on the back surface of the casing 52 with metal solder or the like.

FIG. 5 shows an example of an optical module mounting method. Prepare an electrical connector that mates with the lead pin 58. The electrical connector may be the connector 60 fixed to the mounting board, or the connector 61 connected to the flexible cable 62 or the like. For example, if a measuring instrument or the like is connected to one of the flexible cables 62 using the connector 61, the characteristic evaluation or operation test of the optical module 51 can be easily performed. According to this method, the inspection process before shipment of the optical module 51 can be easily performed, which leads to cost reduction.

FIG. 6 shows another application example of the configuration of the optical module. The optical module 71 includes a box-shaped casing 72 that is open in two directions, and lids 73a and 73b that also have sapphire glass power to seal the openings in the two directions. The optical element 75 has light receiving / emitting surfaces 74a and 74b in two directions, facing the lids 73a and 73b, respectively, and fixed to the casing 72 with metal solder or the like, and the bonding wires 76a and 76b It is connected to 72 metal wires 77a and 77b. The metal wirings 77 a and 77 b extend through the casing 72 to the side surface of the casing 72. Lead pins 78a and 78b are fixed to metal wirings 77a and 77b on the side surface of the housing 72 by metal solder or the like.

[0027] (Method of joining optical module and PLC 2)

FIG. 7 shows a method of joining an optical module and a PLC, which is useful in the second embodiment of the present invention. The optical module 51 has the same structure as the optical module 51 shown in FIG. 3, and includes an optical element 55 sealed by a box-shaped housing 52 and a lid 53 having sapphire glass power. When a functional element that generates heat is mounted and the PLC and the optical module are bonded, the bonding can be performed directly as shown in FIG. However, when a PLC equipped with a functional element that generates heat and an optical module are joined, the following method is used.

The optical module 51 is fixed so that the mounting surface of the mounting board 81 and the optical axis of the optical element 55 of the optical module 51 are parallel to each other. Since the metal wiring 57 of the optical module 51 and the electrode 82 formed on the mounting board 81 are fixed by metal solder or the like via the lead pins 58, the optical module 51 can be firmly fixed on the mounting board 81. . The fixing agent for fixing the lead pin 58 to the mounting board 81 is not limited to metal solder but may be a conductive adhesive. It is preferable to use a solder that has a sufficient mechanical strength and can be repaired.

The light receiving / emitting surface 54 of the optical element 55 of the optical module 51 is optically coupled to the optical fiber 92 fixed to the glass block 91. The glass block 91 as the optical fiber connecting means is bonded to the lid 53 of the optical module 51 using an adhesive or the like on the surface including the end surface of the optical fiber 92.

On the other hand, the PLC 21 is bonded to the substrate 22, and the optical waveguide formed in the PLC 21 is optically coupled to the optical fiber 92 fixed to the glass block 93. A short plate 23 as a reinforcing plate is bonded onto the PLC 21 and bonded to the glass block 93 on the surface including the optical waveguide end face of the PLC 21. In this way, since the optical module 51 and the PLC 21 are connected via the optical fiber 92, the optical module 51 is not affected by the heat of the PLC 21.

[0031] Further, since the mounting surface of the mounting board 81 and the optical axis of the optical element 55 of the optical module 51 are fixed in parallel, the component height on the mounting board 81 can be suppressed. Become. Therefore, a thin optical transceiver can be configured.

FIG. 8 shows a method for joining the optical module and the glass block. The optical module 51 integrates four optical elements 55, and the optical fiber 92 that optically couples them is a four-core tape-type optical fiber array. The arrangement pitch of the cores of the optical fiber 92 and the arrangement pitch of the light receiving / emitting surface 54 of the optical element 55 are the same. The connection between the metal wiring 57 of the optical module 51 and the electrode 82 formed on the mounting board 81 is fixed with metal solder or the like via the lead pin 58. Here, not only the driving electrodes 82a to 82d of the optical element 55 but also the ground pins 82e and 82f are used to fix the lead pins 58a to 58f, for example. Thereby, the optical module 51 can be more firmly fixed. If more strength is required, the number of lead pins may be increased. Further, the lead pins may be arranged in four directions, which are only three directions in FIG.

[0034] (Optical transceiver)

FIG. 9 shows a configuration of an optical transmitter / receiver according to an embodiment of the present invention. The optical transceiver 100 includes an optical module 112 containing a plurality of light emitting elements, a mounting board 111 on which an optical module 113 containing a plurality of light receiving elements is fixed, and an AWG type optical multiplexer / demultiplexer 131. . The optical module 112 and the optical module 113 are optically coupled to the tape type optical fibers 121 and 122 by the glass blocks 114a and 114b, and are connected to the AWG type optical multiplexer / demultiplexer 1131. The AWG type optical multiplexer / demultiplexer 131 is temperature controlled by a Peltier element 132. Since the AWG type optical multiplexer / demultiplexer 131 and the optical modules 112 and 113 are connected via the optical fibers 112 and 122, the optical modules 112 and 113 are not affected by heat.

In addition, the optical modules 112 and 113 are fixed so that the mounting surface of the mounting board 111 and the optical axes of the light emitting elements and the light receiving elements of the optical modules 112 and 113 are parallel to each other. The height of the vessel 100 can be reduced. Optical module 112, 丄! ^ And eight ^^. Since the connection with the optical multiplexer / demultiplexer 131 is performed via the fiber extra length processing unit 141 provided in the optical transceiver 100 in advance, the mounting space can be used efficiently.

Hereinafter, the method for joining the optical module and the glass block will be described with reference to specific examples.

Example 1

FIG. 10 shows a method of joining the optical module and the glass block according to the first example. The optical module 51 has the same structure as the optical module 51 shown in FIG. 4, and includes an optical element 55 sealed by a box-shaped casing 52 and a lid 53 having sapphire glass power. 7 differs from the joining method shown in FIG. 7 in that the optical module 51 is mounted and fixed to the mounting board 81 by fitting the connector 60 fixed to the mounting surface of the mounting board 81 and the lead pin 58. . According to this method, it is possible to easily mount the optical module 51 in the assembly process of the optical transceiver. The bonding method shown in Fig. 7 requires a process of reflowing the solder and fixing the optical module after aligning with the electrodes on the mounting board. In the solder reflow process, the optical module directly receives heat during reflow, which may deteriorate the characteristics of the optical element. Therefore, by attaching to the connector 60 arranged on the mounting board 81, the problem of heat during solder reflow can be avoided.

Furthermore, even if the optical module 51 fails after the optical transceiver is assembled, the optical module 51 can be easily removed and attached. In the first embodiment, the optical module 92 is attached to the optical module 51. The power optical module 51 can be applied even when the PLC is directly attached.

Example 2

[0040] FIGS. 11A and 11B show a method of joining an optical module and a glass block according to Example 2. FIG. In Example 2, a ferrule or an optical connector is used instead of the glass block. Since the optical module 51 is provided with the lead pin 58, it is firmly fixed to the mounting board, so that it has a mechanical strength that can withstand repeated insertion and removal of the ferrule or optical connector. Therefore, when fixing the optical module to the mounting board, it becomes possible to attach an optical cord such as an optical fiber, which has been complicated to handle, in a later process. As a result, the number of steps in the assembly process of the optical transceiver can be greatly reduced, and the manufacturing cost can be reduced.

In FIG. 11A, the MT ferrule 302 is used to optically couple the optical element of the optical module 51 and the optical fiber. A connector 301 having connection pins 31 la and 31 lb is joined to the optical module 51. Connection pin 311a, 31 lb force Connect so that it fits with the connection pin hole 321a, 32 lb of MT ferrule 302, and crimp with metal leaf spring 303.

FIG. 11B optically couples the optical element of the optical module 51 and the optical fiber using an optical connector 304 such as an MPO connector or an MPX connector. The optical module 51 is joined by a connector 305 having connection pins 351a and 351b. Connection pin 351a, 351b 1S Connect so that it fits into the connection pin hole 341a, 341b of the optical connector 304.

[0043] The number of optical fiber cores of the ferrule or optical connector is the number of optical elements built in the optical module. There are no restrictions on the number of core wires. In addition, when attachment / detachment with a ferrule or optical connector is not necessary, the end face of the ferrule may be directly joined to the lid of the optical module using an adhesive.

Example 3

FIG. 12 shows a method for joining an optical module and a glass block according to the third embodiment. The optical element 155 of the optical module 151 is optically coupled to the optical fiber 162 fixed to the glass block 161. The glass block 161 is bonded to the lid 153 of the optical module 151 on the surface including the end surface of the optical fiber 162.

A convex portion 163 is provided on the end face of the glass block 161, and a concave portion 155 is provided on the lid 153. The convex portion 163 and the concave portion 155 are fitted so as to be optically coupled to the light emitting / receiving surface 154 of the optical element 155 and the core of the optical fiber 162. In this way, alignment between the optical element 155 and the optical fiber 162 can be facilitated. Of course, a concave portion may be provided on the end surface of the glass block 161, and a convex portion may be provided on the end surface of the lid 153.

[0046] When the optical module and the PLC are directly connected, a convex portion (or on the end face of the PLC is connected so that the light emitting / receiving surface of the optical element and the optical waveguide of the PLC are optically coupled. If the concave portion is formed, alignment between the light emitting / receiving surface and the optical waveguide can be facilitated.

Example 4

FIG. 13 shows a method for joining an optical module and a glass block according to Example 4. The optical element 175 of the optical module 171 is optically coupled to an optical fiber 182 fixed to the glass block 181. The glass block 181 is bonded to the lid 173 of the optical module 171 on the surface including the end surface of the optical fiber 182.

[0048] Since light is input / output from the optical fiber 182 and reflection occurs at the end surface, an inclined surface of, for example, 8 degrees is provided on the end surface of the glass block 181 and the lid 173. This inclined surface can prevent return light to the optical element 175 and return light to the optical fiber 182. A thin film filter may be bonded to the surface of the lid 173.

[0049] When the optical module and the PLC are directly connected, in order to prevent the return light generated on the end face, inclined faces are provided on the end face of the PLC and the lid of the optical module. A thin film filter may be adhered to the surface of the lid 173 which may be provided. Example 5

FIG. 14 shows a method of joining the optical module and the glass block according to the fifth example. The glass block 212 fixes three four-core tape type optical fibers 213a to 213c, and is bonded to the three optical modules 201a to 201c on the surface including the end face of the optical fiber 213. The three optical modules 201a to 201c are fixed to the mounting board 212 as shown in FIGS.

[0051] The optical modules 201a to 201c are optical modules in which a plurality of optical elements are integrated, and are connected to the plurality of optical modules in one block, so that the mounting space on the mounting board can be reduced. it can. Since the optical modules 201a to 201c are fixed to the mounting board 212 via lead pins, they can be firmly fixed.

[0052] Even when a plurality of optical modules and a PLC are directly connected, the plurality of optical modules are connected to the end face of the PLC so that the light receiving and emitting surfaces of the optical element and the optical waveguide are optically coupled. Hey.

Example 6

FIG. 15 shows a method for joining an optical module and a glass block according to Example 6. The glass block 232 has the same structure as in Example 5. The optical module 221 has 12 optical elements integrated in one housing. All the optical elements can be hermetically sealed, and as shown in the second embodiment, it is possible to reduce the size of the optical elements as compared to arranging the optical elements individually hermetically sealed.

[0054] (Arrangement of optical element)

In order to ensure the alignment accuracy between the optical module and the glass block, the optical elements must be accurately arranged inside the optical module. Figure 16 shows the arrangement of the optical elements in the optical module. As described above, the optical module 401 is formed with metal wiring for connecting the optical element 400 and the electrode pattern on the mounting board. Using this metal wiring, the position of the optical element is determined. When the metal wirings 41 la and 41 lb electrically connected to the optical element 405 are formed, for example, marker patterns 412a4 to 12f are formed. With the marker patterns 412a4 to 12f, the center of the light receiving / emitting surface 404 of the optical element 405 can always be aligned with a constant accuracy and fixed to the housing 402. In this embodiment, other ceramics such as silicon carbide, silicon nitride, aluminum nitride, and zirconium may be used as a material for the casing. Further, glass such as quartz or sapphire may be used. Further, the bonding agent for bonding the housing and the lid is not limited to metal solder such as gold tin, gold germanium, and tin lead, and for example, a low melting point glass wax agent or the like can be used. The material of the lid is not limited to sapphire described above, and for example, quartz glass, borate glass, or the like can be used. If the airtightness can be ensured such that the characteristics of the optical element disposed inside the optical module are not deteriorated by the housing and the lid, the material's member is not limited.

Claims

The scope of the claims

[1] A light including a housing having at least one opening, a lid that transmits light and closes and seals the opening of the housing, and an optical element fixed with a light emitting / receiving surface facing the lid In the module,

An optical fiber optically coupled to the light receiving / emitting surface of the optical element is held, and an optical fiber connecting means joined to the lid is provided on a surface including the end surface of the optical fiber, and the mounting surface of the mounting board and the light An optical module, wherein the optical module is fixed to the mounting board so that the optical axis of the element is parallel.

[2] A light including a housing having at least one opening, a lid that transmits light and closes and seals the opening of the housing, and an optical element that is fixed with a light emitting / receiving surface facing the lid In the module,

An optical fiber connecting means that holds an optical fiber that is optically coupled to the light receiving and emitting surface of the optical element, and that is joined to the lid on the surface including the end face of the optical fiber;

A metal wiring electrically connected to the optical element and formed from the inside of the casing to the outside of the casing;

A lead pin joined to the metal wiring outside the housing;

An optical module, which is fixed to the mounting board so that a mounting surface of the mounting board and an optical axis of the optical element are parallel to each other.

[3] The optical module according to [2], wherein the lead pin and the electrode formed on the mounting board are fixed by solder.

4. The optical module according to claim 2, wherein the lead pin is fixed to the mounting board by fitting with a connector fixed on the mounting board.

[5] The optical fiber connecting means has a glass blocking force, and one of a convex portion and a concave portion is formed on a surface including an end surface of the optical fiber,

Since the optical element and the optical fiber are optically coupled to each other, the lid is formed with either a concave portion or a convex portion! / ヽ misalignment so as to be fitted to the convex portion or the concave portion. 5. The optical module according to claim 1, wherein the optical module is misaligned.

[6] The optical fiber connecting means has a glass block force, and the lid and the glass block The surface force to be bonded is inclined with respect to the optical axis. The optical module according to any one of the above.

7. The optical module according to any one of claims 1 and 4, wherein the optical fiber connecting means is a connector that engages with one of an optical ferrule and an optical connector.

[8] The metal wiring according to claim 1, wherein a marker pattern is formed so as to determine a mounting position where the optical element is optically coupled to the optical fiber.光 The optical module described in any one.