WO2007010755A1 - Socle de montage de pièce électronique et pneu associé au socle - Google Patents

Socle de montage de pièce électronique et pneu associé au socle Download PDF

Info

Publication number
WO2007010755A1
WO2007010755A1 PCT/JP2006/313492 JP2006313492W WO2007010755A1 WO 2007010755 A1 WO2007010755 A1 WO 2007010755A1 JP 2006313492 W JP2006313492 W JP 2006313492W WO 2007010755 A1 WO2007010755 A1 WO 2007010755A1
Authority
WO
WIPO (PCT)
Prior art keywords
pedestal
electronic component
tire
mounting base
component mounting
Prior art date
Application number
PCT/JP2006/313492
Other languages
English (en)
Japanese (ja)
Inventor
Yoichi Watanabe
Yoshihiko Ichikawa
Yousuke Kondou
Original Assignee
Bridgestone Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bridgestone Corporation filed Critical Bridgestone Corporation
Publication of WO2007010755A1 publication Critical patent/WO2007010755A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
    • B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
    • B60C23/02—Signalling devices actuated by tyre pressure
    • B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
    • B60C23/0491—Constructional details of means for attaching the control device
    • B60C23/0493—Constructional details of means for attaching the control device for attachment on the tyre
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D30/00—Producing pneumatic or solid tyres or parts thereof
    • B29D30/0061—Accessories, details or auxiliary operations not otherwise provided for
    • B29D2030/0077—Directly attaching monitoring devices to tyres before or after vulcanization, e.g. microchips

Definitions

  • the present invention relates to an electronic component mounting base for mounting electronic components such as a transbonder and a tire internal pressure monitoring device to a tire, and a tire with a base.
  • An electronic component mounting base having a rubber material strength is bonded to the inner liner of the tire with an adhesive.
  • the electronic component is molded from the raw tire by molding the raw tire by vulcanizing the raw tire with the electronic component mounting base attached to the inner liner of the raw tire.
  • the mounting base is bonded to the inner liner of the tire by a crosslinking reaction.
  • the electronic component mounting base is attached to the inner liner by a crosslinking reaction during the molding of the tire.
  • the electronic component is bonded to the mounting surface of the electronic component mounting base with an adhesive. Thereby, the electronic component can be attached to the tire.
  • Patent Document 1 Prior arts related to the present invention include those shown in Patent Document 1 and Patent Document 2.
  • Patent Document 1 JP 2000-168321 A
  • Patent Document 2 JP-A-9-136517
  • the present invention has been made to solve the problems of the related art described above, and even when the tire is bonded to the inner liner by a crosslinking reaction during the molding of the tire, the molding of the tire is performed. It is an object of the present invention to provide a pedestal for mounting an electronic component capable of reducing deformation inside and a tire with a pedestal equipped with the pedestal for mounting an electronic component.
  • a first aspect of the present invention includes a first pedestal portion having a first attachment surface that can be attached to an inner liner of the tire on one side, and the other side.
  • Electronic component mounting for mounting an electronic component to a tire comprising a second pedestal portion having a second mounting surface to which the electronic component can be mounted, wherein at least the first pedestal portion is made of a semi-vulcanized rubber material.
  • the gist is that it is a pedestal.
  • the semi-vulcanized rubber is a rubber that has undergone a sufficient crosslinking reaction
  • Electronic components refer to, for example, transbonders, tire internal pressure monitoring devices, and the like.
  • At least the first pedestal portion also has a semi-vulcanized rubber material force. Therefore, even when the electronic component mounting base is bonded to the inner liner by a crosslinking reaction during the molding of the tire, the tire is being molded (specifically, during the vulcanization of the raw tire). ) In the first pedestal portion (specifically, the fluidity of the rubber material constituting the first pedestal portion) can be reduced, and deformation of the electronic component mounting pedestal can be reduced.
  • the modulus of the second pedestal may be higher than the modulus of the first pedestal after vulcanization.
  • the modulus of the second pedestal portion is the first pedestal after vulcanization. Therefore, it is possible to reduce the deformation of the mounting base for electronic parts during the molding of the tire.
  • the first pedestal portion and the second pedestal portion may be superposed.
  • the second pedestal portion may have a rigid material force.
  • the second pedestal portion has a rigid material force, the deformation of the electronic component mounting pedestal during molding of the tire can be further reduced.
  • the second pedestal portion and the first pedestal portion may be a single layer having a rubber material force.
  • a vulcanized adhesive is applied to at least one of the overlapping surface of the first pedestal portion and the overlapping surface of the second pedestal portion, and the first pedestal portion and the second pedestal portion are formed.
  • the first pedestal portion and the second pedestal portion may be bonded together by polymerization.
  • the first pedestal portion and the second pedestal portion are bonded by a crosslinking reaction. Good.
  • the first pedestal portion is bonded to the inner liner of the tire by a crosslinking reaction. Also good.
  • the electronic component may be attached to the second attachment surface of the second pedestal.
  • a second aspect of the present invention is a pedestal comprising: a tire that can be filled with a working gas; and a pedestal for mounting an electronic component having the first side surface that is attached to an inner liner of the tire.
  • the main point is that it is a tire.
  • the working gas is mainly air, but also includes nitrogen gas and the like.
  • the molding of the tire is performed.
  • the fluidity of the first pedestal portion in the interior can be reduced, and the deformation of the pedestal for mounting the electronic component can be reduced, so that even if the travel distance or travel time of the tire with the pedestal becomes long, the electronic Adhesive peeling between the component mounting base and the electronic component is less likely to occur.
  • FIG. 1 (a) is a diagram showing an electronic component mounting base before being mounted to an inner liner according to a first embodiment of the present invention.
  • FIG. 1 (b) is a view showing the electronic component mounting base after being mounted on the inner liner 1 according to the first embodiment of the present invention.
  • FIG. 2 is a partial cross-sectional view of a tire with a pedestal according to the first embodiment of the present invention.
  • FIG. 3 is a view showing an electronic component mounting base according to a second embodiment of the present invention before being mounted on an inner liner.
  • FIG. 3 (b) is a view showing the electronic component mounting base after being mounted on the inner liner 1 according to the second embodiment of the present invention.
  • FIG. 4 is a partial cross-sectional view of a pedestal-equipped tire according to a second embodiment of the present invention.
  • FIG. 1 A first embodiment of the present invention will be described with reference to FIG. 1 and FIG.
  • FIG. 1 (a) is a view showing the electronic component mounting base according to the first embodiment before being mounted to the inner liner 1.
  • FIG. 1 (b) is a diagram showing the electronic component mounting base according to the first embodiment after being mounted on the inner liner.
  • FIG. 2 is a partial cross-sectional view of the pedestal-equipped tire according to the first embodiment.
  • the pedestal-equipped tire 1 includes a tire 5 that can be assembled to the rim 3 and can be filled with air as a working gas, and an inner liner in the tire 5.
  • the electronic component mounting base 9 attached to 7 and the transbonder 11 attached to the electronic component mounting base 9 are provided.
  • the tire 5 includes a carcass 13 that is a skeleton member.
  • the cross-sectional shape of the carcass 13 has a toroidal shape.
  • a bead filler (bead portion) 15 that can be fitted to the rim 3 is integrally provided on both edges (one edge and the other edge) of the carcass 13.
  • Each bead filler 15 has a bead core 17 incorporated therein.
  • the outer surface of the carcass 13 can be grounded
  • a functional tread 19 is provided on the body. Between the tread 19 and the carcass 13, a belt 21 for reinforcing the car force 13 is interposed.
  • the inner liner 7 is provided on the body to prevent the air filled in the tire 5 from leaking.
  • a side tread 23 protecting the carcass 13 is provided between one bead filler 15 and one end of the carcass 13 on the outer surface of the carcass 13 and between the other bead filler 15 and the other end of the carcass 13. Each one is provided! /
  • an electronic component mounting base 9 is for mounting a transbonder 11 as an electronic component to a tire 5 and is on one side (FIG. 1).
  • the first pedestal 25 is also provided on the other side (upper side in Fig. 1), and is superposed on the first pedestal 25 and on the other side (upper side in Fig. 1) and from the aluminum material (one of the rigid materials).
  • the second pedestal 27 is provided.
  • the modulus (elastic modulus) of the second pedestal 27 is higher than the modulus of the first pedestal 25.
  • the outer shape of the first pedestal portion 25 is larger than the outer shape of the second pedestal portion 27.
  • another rigid material such as hard grease may be used instead of the aluminum material.
  • the first pedestal 25 has a first attachment surface 25a that can be attached to the inner liner 7 of the tire 5, and a superposed surface 25b.
  • the second pedestal 27 has a second mounting surface 27a to which the transbonder 11 can be attached and a superposition surface 27b.
  • the first pedestal 25 and the second pedestal 27 are formed by applying a vulcanized adhesive to at least one of the overlapping surfaces 25b of the first pedestal 25 and the overlapping surfaces 27b of the second pedestal 27.
  • the portion 25 and the second pedestal portion 27 are bonded together by being polymerized.
  • first pedestal portion 25 and the second pedestal portion 27 are used when the raw tire is vulcanized to form a tire 5 having a predetermined product shape and the overlapping surface 25b of the first pedestal portion 25 and the second pedestal portion. 27 polymerized surfaces 27b are bonded together by a crosslinking reaction. Furthermore, the first pedestal 25 is bonded to the inner liner 7 of the tire 5 by a crosslinking reaction when the raw tire is vulcanized to form the tire 5 having a predetermined product shape. .
  • the first base 25 Before mounting the electronic component mounting base 9 to the inner liner 7, in other words, when the electronic component mounting base 9 itself is in an independent state, the first base 25 is semi-vulcanized. Rubber material It ’s power.
  • the semi-cured rubber is a rubber that has not undergone sufficient crosslinking reaction.
  • the modulus of the rubber material at the time of ⁇ 311 vulcanization is 100%, 30% to 80% (30% % Or more and 80% or less).
  • Semi-vulcanized rubber can be produced by shortening the vulcanization time, lowering the vulcanization temperature, or changing the composition of rubber chemicals that contribute to the vulcanization speed.
  • the transbonder 11 is an electronic component used to monitor the internal pressure and internal temperature of the tire 5, and is, for example, a second mounting surface of the second pedestal portion 27 by bonding with an adhesive such as cyanoacrylate. Installed on 27a. If the second pedestal 27 is also made of aluminum, the transponder 11 may be attached to the second mounting surface 27a of the second pedestal 27 by mechanical attachment means such as screws! / ,.
  • the first pedestal portion 25 also has a semi-vulcanized rubber material force. Therefore, during molding of the tire 5, the electronic component mounting pedestal 9 is Even when the tire 7 is bonded by a crosslinking reaction, the fluidity of the first pedestal portion 25 during the molding of the tire 5 (specifically, during the vulcanization of the raw tire) (the first pedestal portion 25 is constituted)
  • the modulus of the second pedestal portion 27 is higher than the modulus of the first pedestal portion 25 after vulcanization, and the second pedestal portion 27 also has a rigid material force such as an aluminum material. The deformation of the mounting base 9 can be further reduced. Therefore, even if the travel distance or travel time of the tire with pedestal 1 becomes long, the adhesive peeling of the electronic component mounting base 9 and the transbonder 11 hardly occurs.
  • FIG. 3 (a) is a view showing an electronic component mounting base according to the second embodiment before being mounted on the inner liner.
  • FIG. 3 (b) is a view showing the electronic component mounting base according to the second embodiment after being mounted on the inner liner.
  • FIG. 4 is a partial cross-sectional view of a pedestal tire according to the second embodiment.
  • the tire with pedestal 29 according to the second embodiment has substantially the same configuration as the tire with pedestal 1 according to the first embodiment.
  • the specific configuration of the tire with pedestal 29 according to the second embodiment only the parts different from the specific configuration of the tire with pedestal 1 according to the first embodiment will be described.
  • those corresponding to the constituent elements in the tire with pedestal 1 according to the first embodiment are denoted by the same reference numerals in the figure and described. Is omitted.
  • the inner liner 7 in the tire 5 is provided with an electronic component mounting base 31, and the electronic component mounting according to the second embodiment is performed.
  • the pedestal 31 is for attaching the transbonder 11 to the tire 5 in the same manner as the electronic component mounting pedestal 9 according to the first embodiment.
  • the electronic component mounting base 31 includes, on one side (lower side in FIG. 3), a first base 33 having a first mounting surface 33a that can be attached to the inner liner 7 of the tire 5 and the other side.
  • a second pedestal portion 35 having a second mounting surface 35a to which the transbonder 11 can be mounted is provided (on the upper side in FIG. 3).
  • the first pedestal portion 33 and the second pedestal portion 35 are in one layer (single layer) that also has rubber material strength.
  • the first pedestal portion 33 is bonded to the inner liner 17 of the tire 5 by a crosslinking reaction when calcining the raw tire to form the tire 5 having a predetermined product shape.
  • the first base portion 33 and the second base portion 35 Before attaching the electronic component mounting base 31 to the inner liner 7, in other words, when the electronic component mounting base 31 itself is in an independent state, the first base portion 33 and the second base portion 35 ( The base for mounting electronic components 3 (1) has a semi-vulcanized rubber material strength.
  • the entire electronic component mounting base 31 also has a semi-vulcanized rubber material force. Even when the seat 31 is bonded to the inner liner 7 by a crosslinking reaction, the fluidity of the entire electronic component mounting base 31 during the molding of the tire 5 is reduced, and the electronic component mounting during the molding of the tire 5 is performed. The deformation of the pedestal 31 can be reduced. Therefore, even if the travel distance or travel time of the tire 29 with pedestal becomes longer, adhesion peeling between the electronic component mounting base 31 and the transbonder 11 is less likely to occur.
  • the present invention has been described according to the embodiment, the present invention is not limited thereto.
  • the present invention can be implemented in various modes, and the configuration of each part can be replaced with any configuration having a similar function.
  • the force using an electronic component as a transbonder is not limited to this, and may be an electronic component such as a tire internal pressure monitoring device.
  • the scope of rights encompassed by the present invention is not limited to these embodiments.
  • An electronic component mounting base is attached to an inner liner of a size 205Z55R16 passenger car tire, and a transbonder is bonded to the electronic component mounting base with an adhesive.
  • a tire with a pedestal provided with the passenger car tire, the electronic component mounting base, and the trans bonder is prepared.
  • the passenger car tire is assembled to a 6.5-inch wide rim, and the interior of the passenger car tire is filled with 290 KPa air.
  • a drum having a diameter of 1.7 m is used, and the drum is rotated at a speed of 240 kmZh for 60 minutes while pressing the passenger car tire against the outer peripheral surface of the drum.
  • the results shown in Table 1 were obtained. become.
  • Example 1 and Example 2 the vulcanized state of the first pedestal is semi-vulcanized.
  • Comparative Examples 1 and 2 the vulcanization state of the first pedestal is full vulcanization.
  • Example 1 and Comparative Example 1 are rigid materials
  • Example 2 and Comparative Example 2 are rubber materials.
  • Example 1 and Example 2 when the electronic component mounting base itself is in an independent state, the first base portion of the electronic component mounting base is a semi-vulcanized rubber material.
  • the number of adhesive peeling of the electronic component mounting pedestal per 10 pedestal tires and the number of adhesive peeling of the transbonder per 10 pedestal tires are Compared to less.
  • Example 1 Example 2 Comparative example 1 Comparative example 2 Curing state of the first base part Semi-curing Semi-curing Full curing Full-curing Component material of the second base part Rigid material Rubber material Rigid material Rubber material
  • An electronic component mounting base that can reduce deformation during the molding of the tire and a mounting base for the electronic component are provided even when the inner liner is bonded to the inner liner by a crosslinking reaction during the molding of the tire.
  • a tire with a pedestal can be provided.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Tires In General (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

La présente invention concerne un socle (9) pour le montage d'une pièce électronique. Une première partie de socle (25) comprenant une première face de montage (25a) destinée à l'installation sur la gomme intérieure (7) d'un pneu (5) est formée sur un côté du socle (9) pour le montage de la pièce électronique. Une seconde partie de socle (27) comprenant une seconde face de montage (27a) destinée à recevoir la pièce électronique (11) est formée sur l'autre côté du socle (9) pour le montage de la pièce électronique. La première partie de socle (25) au moins est composée d'un matériau de caoutchouc semi-vulcanisé.
PCT/JP2006/313492 2005-07-15 2006-07-06 Socle de montage de pièce électronique et pneu associé au socle WO2007010755A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005207847A JP2007024696A (ja) 2005-07-15 2005-07-15 電子部品取付用台座及び台座付タイヤ
JP2005-207847 2005-07-15

Publications (1)

Publication Number Publication Date
WO2007010755A1 true WO2007010755A1 (fr) 2007-01-25

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PCT/JP2006/313492 WO2007010755A1 (fr) 2005-07-15 2006-07-06 Socle de montage de pièce électronique et pneu associé au socle

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JP (1) JP2007024696A (fr)
WO (1) WO2007010755A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10639948B2 (en) 2014-12-30 2020-05-05 Bridgestone Americas Tire Operations, Llc Assembly for attaching an electronics package to a tire
WO2022181269A1 (fr) * 2021-02-25 2022-09-01 住友ゴム工業株式会社 Pneumatique

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2919225B1 (fr) * 2007-07-24 2011-04-29 Michelin Soc Tech Pneumatique equipe pour la fixation d'un objet a sa paroi et attache a cet effet
JP7058179B2 (ja) * 2018-05-31 2022-04-21 株式会社ブリヂストン タイヤの製造方法
KR102091931B1 (ko) * 2018-08-13 2020-03-20 한국타이어앤테크놀로지 주식회사 나사 방식으로 고정되는 타이어용 센서 및 이를 적용한 타이어
CN116583411A (zh) * 2020-12-07 2023-08-11 住友橡胶工业株式会社 轮胎
JP2022129740A (ja) * 2021-02-25 2022-09-06 住友ゴム工業株式会社 タイヤ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000108619A (ja) * 1998-10-01 2000-04-18 Yokohama Rubber Co Ltd:The タイヤ用トランスポンダの補助部品
JP2002541003A (ja) * 1999-11-24 2002-12-03 ミシュラン ルシェルシェ エ テクニク ソシエテ アノニム モニター付き自動車タイヤと、モニターの保持組立体
WO2004048132A1 (fr) * 2002-11-26 2004-06-10 Iq-Mobil Gmbh Dispositif de maintien pour fixer un element electronique

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000108619A (ja) * 1998-10-01 2000-04-18 Yokohama Rubber Co Ltd:The タイヤ用トランスポンダの補助部品
JP2002541003A (ja) * 1999-11-24 2002-12-03 ミシュラン ルシェルシェ エ テクニク ソシエテ アノニム モニター付き自動車タイヤと、モニターの保持組立体
WO2004048132A1 (fr) * 2002-11-26 2004-06-10 Iq-Mobil Gmbh Dispositif de maintien pour fixer un element electronique

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10639948B2 (en) 2014-12-30 2020-05-05 Bridgestone Americas Tire Operations, Llc Assembly for attaching an electronics package to a tire
US11358422B2 (en) 2014-12-30 2022-06-14 Bridgestone Americas Tire Operations, Llc Assembly for attaching an electronics package to a tire
WO2022181269A1 (fr) * 2021-02-25 2022-09-01 住友ゴム工業株式会社 Pneumatique

Also Published As

Publication number Publication date
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