WO2007010755A1

WO2007010755A1 - Pedestal for mounting electronic part and tire with pedestal

Info

Publication number: WO2007010755A1
Application number: PCT/JP2006/313492
Authority: WO
Inventors: Yoichi Watanabe; Yoshihiko Ichikawa; Yousuke Kondou
Original assignee: Bridgestone Corporation
Priority date: 2005-07-15
Filing date: 2006-07-06
Publication date: 2007-01-25
Also published as: JP2007024696A

Abstract

A pedestal (9) for mounting an electronic part, wherein a first pedestal part (25) having a first mounting face (25a) installable on the inner liner (7) of a tire (5) is formed on one side of the pedestal (9) for mounting the electronic part, and a second pedestal part (27) having a second mounting face (27a) allowing the electronic part (11) to be mounted thereon is formed on the other side of the pedestal (9) for mounting the electronic part. At least the first pedestal part (25) is formed of a semi-vulcanized rubber material.

Description

Specification

Base for mounting electronic components and tire with pedestal

Technical field

TECHNICAL FIELD [0001] The present invention relates to an electronic component mounting base for mounting electronic components such as a transbonder and a tire internal pressure monitoring device to a tire, and a tire with a base.

Background art

In recent years, electronic components such as transbonders are often attached to tires. Various studies have been made on the mounting of the electronic component. Normally, the electronic component is mounted on the tire as follows.

[0003] An electronic component mounting base having a rubber material strength is bonded to the inner liner of the tire with an adhesive. Alternatively, the electronic component is molded from the raw tire by molding the raw tire by vulcanizing the raw tire with the electronic component mounting base attached to the inner liner of the raw tire. The mounting base is bonded to the inner liner of the tire by a crosslinking reaction. In other words, the electronic component mounting base is attached to the inner liner by a crosslinking reaction during the molding of the tire. Then, the electronic component is bonded to the mounting surface of the electronic component mounting base with an adhesive. Thereby, the electronic component can be attached to the tire.

[0004] Prior arts related to the present invention include those shown in Patent Document 1 and Patent Document 2.

Patent Document 1: JP 2000-168321 A

Patent Document 2: JP-A-9-136517

Disclosure of the invention

[0005] When the electronic component mounting pedestal is bonded to the inner liner 1 with an adhesive while exerting force, sufficient adhesion between the electronic component mounting pedestal and the inner liner 1 is ensured. There was a problem that it could not be secured, and the electronic component mounting pedestal was likely to be peeled off during traveling of the tire with the pedestal.

[0006] During the molding of the tire, when the electronic component mounting base is bonded to the inner liner by a crosslinking reaction, compared to the case of bonding by an adhesive, Although the adhesiveness between the electronic component mounting base and the inner liner 1 can be improved, the fluidity of the electronic component mounting base during molding of the tire (specifically, the electronic component mounting base) The pedestal for mounting electronic components may be greatly deformed depending on the fluidity of the rubber material constituting the electronic component. For this reason, when the travel distance or travel time of the tire with the pedestal becomes longer, there is a problem that the electronic component mounting base and the electronic component are likely to be peeled off.

[0007] The present invention has been made to solve the problems of the related art described above, and even when the tire is bonded to the inner liner by a crosslinking reaction during the molding of the tire, the molding of the tire is performed. It is an object of the present invention to provide a pedestal for mounting an electronic component capable of reducing deformation inside and a tire with a pedestal equipped with the pedestal for mounting an electronic component.

[0008] In order to achieve the above object, a first aspect of the present invention includes a first pedestal portion having a first attachment surface that can be attached to an inner liner of the tire on one side, and the other side. Electronic component mounting for mounting an electronic component to a tire, comprising a second pedestal portion having a second mounting surface to which the electronic component can be mounted, wherein at least the first pedestal portion is made of a semi-vulcanized rubber material. The gist is that it is a pedestal.

Here, the semi-vulcanized rubber is a rubber that has undergone a sufficient crosslinking reaction,

!] Rubber material with a modulus of 30% to 80% (30% or more and 80% or less) when the modulus of the rubber material at the time of sulfur is 100%. Electronic components refer to, for example, transbonders, tire internal pressure monitoring devices, and the like.

[0010] According to the first aspect of the present invention, at least the first pedestal portion also has a semi-vulcanized rubber material force. Therefore, even when the electronic component mounting base is bonded to the inner liner by a crosslinking reaction during the molding of the tire, the tire is being molded (specifically, during the vulcanization of the raw tire). ) In the first pedestal portion (specifically, the fluidity of the rubber material constituting the first pedestal portion) can be reduced, and deformation of the electronic component mounting pedestal can be reduced.

[0011] The modulus of the second pedestal may be higher than the modulus of the first pedestal after vulcanization.

[0012] According to the above configuration, the modulus of the second pedestal portion is the first pedestal after vulcanization. Therefore, it is possible to reduce the deformation of the mounting base for electronic parts during the molding of the tire.

[0013] The first pedestal portion and the second pedestal portion may be superposed.

[0014] Further, the second pedestal portion may have a rigid material force.

[0015] According to the above configuration, since the second pedestal portion has a rigid material force, the deformation of the electronic component mounting pedestal during molding of the tire can be further reduced.

[0016] Further, the second pedestal portion and the first pedestal portion may be a single layer having a rubber material force.

[0017] Further, a vulcanized adhesive is applied to at least one of the overlapping surface of the first pedestal portion and the overlapping surface of the second pedestal portion, and the first pedestal portion and the second pedestal portion are formed. The first pedestal portion and the second pedestal portion may be bonded together by polymerization.

[0018] In addition, when the raw tire is vulcanized to form a tire having a predetermined product shape, the first pedestal portion and the second pedestal portion are bonded by a crosslinking reaction. Good.

[0019] Further, when a tire having a predetermined product shape is formed by vulcanizing a raw tire, the first pedestal portion is bonded to the inner liner of the tire by a crosslinking reaction. Also good.

[0020] The electronic component may be attached to the second attachment surface of the second pedestal.

[0021] A second aspect of the present invention is a pedestal comprising: a tire that can be filled with a working gas; and a pedestal for mounting an electronic component having the first side surface that is attached to an inner liner of the tire. The main point is that it is a tire. Here, the working gas is mainly air, but also includes nitrogen gas and the like.

According to the first or second aspect, even when the electronic component mounting base is bonded to the inner liner by a crosslinking reaction during molding of the tire, the molding of the tire is performed. The fluidity of the first pedestal portion in the interior can be reduced, and the deformation of the pedestal for mounting the electronic component can be reduced, so that even if the travel distance or travel time of the tire with the pedestal becomes long, the electronic Adhesive peeling between the component mounting base and the electronic component is less likely to occur.

Brief Description of Drawings FIG. 1 (a) is a diagram showing an electronic component mounting base before being mounted to an inner liner according to a first embodiment of the present invention. FIG. 1 (b) is a view showing the electronic component mounting base after being mounted on the inner liner 1 according to the first embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of a tire with a pedestal according to the first embodiment of the present invention.

[Fig. 3] Fig. 3 (a) is a view showing an electronic component mounting base according to a second embodiment of the present invention before being mounted on an inner liner. FIG. 3 (b) is a view showing the electronic component mounting base after being mounted on the inner liner 1 according to the second embodiment of the present invention.

FIG. 4 is a partial cross-sectional view of a pedestal-equipped tire according to a second embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

[0024] Hereinafter, first and second embodiments of the present invention will be described in detail with reference to the drawings.

In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the planar dimensions, the ratio of the thickness of each layer, and the like are different from the actual ones.

[0025] (First embodiment)

A first embodiment of the present invention will be described with reference to FIG. 1 and FIG.

Here, FIG. 1 (a) is a view showing the electronic component mounting base according to the first embodiment before being mounted to the inner liner 1. FIG. FIG. 1 (b) is a diagram showing the electronic component mounting base according to the first embodiment after being mounted on the inner liner. FIG. 2 is a partial cross-sectional view of the pedestal-equipped tire according to the first embodiment.

As shown in FIG. 2, the pedestal-equipped tire 1 according to the first embodiment includes a tire 5 that can be assembled to the rim 3 and can be filled with air as a working gas, and an inner liner in the tire 5. The electronic component mounting base 9 attached to 7 and the transbonder 11 attached to the electronic component mounting base 9 are provided.

[0028] The specific configuration of the tire 5 in the pedestal tire 1 is as follows.

The tire 5 includes a carcass 13 that is a skeleton member. The cross-sectional shape of the carcass 13 has a toroidal shape. A bead filler (bead portion) 15 that can be fitted to the rim 3 is integrally provided on both edges (one edge and the other edge) of the carcass 13. Each bead filler 15 has a bead core 17 incorporated therein. The outer surface of the carcass 13 can be grounded A functional tread 19 is provided on the body. Between the tread 19 and the carcass 13, a belt 21 for reinforcing the car force 13 is interposed.

[0030] On the inner side surface (including the inner peripheral surface) of the carcass 13, the inner liner 7 is provided on the body to prevent the air filled in the tire 5 from leaking. A side tread 23 protecting the carcass 13 is provided between one bead filler 15 and one end of the carcass 13 on the outer surface of the carcass 13 and between the other bead filler 15 and the other end of the carcass 13. Each one is provided! /

[0031] The specific configuration of the electronic component mounting base 9 in the tire with base 1 is as follows.

[0032] As shown in FIGS. 1 (a) and 1 (b), an electronic component mounting base 9 is for mounting a transbonder 11 as an electronic component to a tire 5 and is on one side (FIG. 1). The first pedestal 25 is also provided on the other side (upper side in Fig. 1), and is superposed on the first pedestal 25 and on the other side (upper side in Fig. 1) and from the aluminum material (one of the rigid materials). The second pedestal 27 is provided. The modulus (elastic modulus) of the second pedestal 27 is higher than the modulus of the first pedestal 25. The outer shape of the first pedestal portion 25 is larger than the outer shape of the second pedestal portion 27. As the constituent material of the second pedestal 27, another rigid material such as hard grease may be used instead of the aluminum material.

[0033] The first pedestal 25 has a first attachment surface 25a that can be attached to the inner liner 7 of the tire 5, and a superposed surface 25b. The second pedestal 27 has a second mounting surface 27a to which the transbonder 11 can be attached and a superposition surface 27b. The first pedestal 25 and the second pedestal 27 are formed by applying a vulcanized adhesive to at least one of the overlapping surfaces 25b of the first pedestal 25 and the overlapping surfaces 27b of the second pedestal 27. The portion 25 and the second pedestal portion 27 are bonded together by being polymerized. Alternatively, the first pedestal portion 25 and the second pedestal portion 27 are used when the raw tire is vulcanized to form a tire 5 having a predetermined product shape and the overlapping surface 25b of the first pedestal portion 25 and the second pedestal portion. 27 polymerized surfaces 27b are bonded together by a crosslinking reaction. Furthermore, the first pedestal 25 is bonded to the inner liner 7 of the tire 5 by a crosslinking reaction when the raw tire is vulcanized to form the tire 5 having a predetermined product shape. .

[0034] Before mounting the electronic component mounting base 9 to the inner liner 7, in other words, when the electronic component mounting base 9 itself is in an independent state, the first base 25 is semi-vulcanized. Rubber material It ’s power. Here, the semi-cured rubber is a rubber that has not undergone sufficient crosslinking reaction. When the modulus of the rubber material at the time of ^ 311 vulcanization is 100%, 30% to 80% (30% % Or more and 80% or less). Semi-vulcanized rubber can be produced by shortening the vulcanization time, lowering the vulcanization temperature, or changing the composition of rubber chemicals that contribute to the vulcanization speed.

[0035] The specific configuration of the transbonder 11 in the pedestal tire 1 is as follows.

[0036] The transbonder 11 is an electronic component used to monitor the internal pressure and internal temperature of the tire 5, and is, for example, a second mounting surface of the second pedestal portion 27 by bonding with an adhesive such as cyanoacrylate. Installed on 27a. If the second pedestal 27 is also made of aluminum, the transponder 11 may be attached to the second mounting surface 27a of the second pedestal 27 by mechanical attachment means such as screws! / ,.

[0037] Operations and effects of the first exemplary embodiment of the present invention will be described.

[0038] When the electronic component mounting pedestal 9 itself is independent, the first pedestal portion 25 also has a semi-vulcanized rubber material force. Therefore, during molding of the tire 5, the electronic component mounting pedestal 9 is Even when the tire 7 is bonded by a crosslinking reaction, the fluidity of the first pedestal portion 25 during the molding of the tire 5 (specifically, during the vulcanization of the raw tire) (the first pedestal portion 25 is constituted) By reducing the fluidity of the rubber material, the deformation of the electronic component mounting base 9 during molding of the tire 5 can be reduced. In particular, the modulus of the second pedestal portion 27 is higher than the modulus of the first pedestal portion 25 after vulcanization, and the second pedestal portion 27 also has a rigid material force such as an aluminum material. The deformation of the mounting base 9 can be further reduced. Therefore, even if the travel distance or travel time of the tire with pedestal 1 becomes long, the adhesive peeling of the electronic component mounting base 9 and the transbonder 11 hardly occurs.

[0039] (Second Embodiment)

A second embodiment of the present invention will be described with reference to FIGS.

[0040] Fig. 3 (a) is a view showing an electronic component mounting base according to the second embodiment before being mounted on the inner liner. FIG. 3 (b) is a view showing the electronic component mounting base according to the second embodiment after being mounted on the inner liner. FIG. 4 is a partial cross-sectional view of a pedestal tire according to the second embodiment. [0041] As shown in FIG. 4, the tire with pedestal 29 according to the second embodiment has substantially the same configuration as the tire with pedestal 1 according to the first embodiment. Of the specific configuration of the tire with pedestal 29 according to the second embodiment, only the parts different from the specific configuration of the tire with pedestal 1 according to the first embodiment will be described. Of the plurality of constituent elements in the tire with pedestal 29 according to the second embodiment, those corresponding to the constituent elements in the tire with pedestal 1 according to the first embodiment are denoted by the same reference numerals in the figure and described. Is omitted.

[0042] As shown in FIGS. 3 (a) and 3 (b), the inner liner 7 in the tire 5 is provided with an electronic component mounting base 31, and the electronic component mounting according to the second embodiment is performed. The pedestal 31 is for attaching the transbonder 11 to the tire 5 in the same manner as the electronic component mounting pedestal 9 according to the first embodiment. The electronic component mounting base 31 includes, on one side (lower side in FIG. 3), a first base 33 having a first mounting surface 33a that can be attached to the inner liner 7 of the tire 5 and the other side. A second pedestal portion 35 having a second mounting surface 35a to which the transbonder 11 can be mounted is provided (on the upper side in FIG. 3). The first pedestal portion 33 and the second pedestal portion 35 are in one layer (single layer) that also has rubber material strength. The first pedestal portion 33 is bonded to the inner liner 17 of the tire 5 by a crosslinking reaction when calcining the raw tire to form the tire 5 having a predetermined product shape. Before attaching the electronic component mounting base 31 to the inner liner 7, in other words, when the electronic component mounting base 31 itself is in an independent state, the first base portion 33 and the second base portion 35 ( The base for mounting electronic components 3 (1) has a semi-vulcanized rubber material strength.

[0043] The operation and effects of the second embodiment of the present invention will be described.

[0044] When the electronic component mounting base 31 itself is independent, the entire electronic component mounting base 31 also has a semi-vulcanized rubber material force. Even when the seat 31 is bonded to the inner liner 7 by a crosslinking reaction, the fluidity of the entire electronic component mounting base 31 during the molding of the tire 5 is reduced, and the electronic component mounting during the molding of the tire 5 is performed. The deformation of the pedestal 31 can be reduced. Therefore, even if the travel distance or travel time of the tire 29 with pedestal becomes longer, adhesion peeling between the electronic component mounting base 31 and the transbonder 11 is less likely to occur.

[0045] Although the present invention has been described according to the embodiment, the present invention is not limited thereto. The present invention can be implemented in various modes, and the configuration of each part can be replaced with any configuration having a similar function. For example, in the first and second embodiments, the force using an electronic component as a transbonder is not limited to this, and may be an electronic component such as a tire internal pressure monitoring device. Further, the scope of rights encompassed by the present invention is not limited to these embodiments.

[0046] (Example)

A drum test according to an embodiment of the present invention will be briefly described.

[0047] An electronic component mounting base is attached to an inner liner of a size 205Z55R16 passenger car tire, and a transbonder is bonded to the electronic component mounting base with an adhesive. In other words, a tire with a pedestal provided with the passenger car tire, the electronic component mounting base, and the trans bonder is prepared. Next, the passenger car tire is assembled to a 6.5-inch wide rim, and the interior of the passenger car tire is filled with 290 KPa air. Further, a drum having a diameter of 1.7 m is used, and the drum is rotated at a speed of 240 kmZh for 60 minutes while pressing the passenger car tire against the outer peripheral surface of the drum. Then, when the number of adhesive peels of the electronic component mounting base per 10 tires with pedestal and the number of adhesive peels of the transbonder per 10 tires with the pedestal were examined, the results shown in Table 1 were obtained. become.

[0048] In Example 1 and Example 2, the vulcanized state of the first pedestal is semi-vulcanized. On the other hand, in Comparative Examples 1 and 2, the vulcanization state of the first pedestal is full vulcanization. For the first constellation material, Example 1 and Comparative Example 1 are rigid materials, and Example 2 and Comparative Example 2 are rubber materials.

[0049] As shown in Example 1 and Example 2, when the electronic component mounting base itself is in an independent state, the first base portion of the electronic component mounting base is a semi-vulcanized rubber material. In Comparative Examples 1 and 2, the number of adhesive peeling of the electronic component mounting pedestal per 10 pedestal tires and the number of adhesive peeling of the transbonder per 10 pedestal tires are Compared to less.

[table 1] Example 1 Example 2 Comparative example 1 Comparative example 2 Curing state of the first base part Semi-curing Semi-curing Full curing Full-curing Component material of the second base part Rigid material Rubber material Rigid material Rubber material

10 seats per pedestal

0 pieces zio pieces 0 pieces / 10 pieces 5 pieces Z10 pieces 5 pieces Z10 pieces

10 pedestals ^ "per tire

0/10 pcs 2/10 pcs 0 value / 10 pcs 3 pcs 10 pcs: Transbon evening 'Possibility of industrial use

An electronic component mounting base that can reduce deformation during the molding of the tire and a mounting base for the electronic component are provided even when the inner liner is bonded to the inner liner by a crosslinking reaction during the molding of the tire. A tire with a pedestal can be provided.

Claims

The scope of the claims

[1] In the electronic component mounting base for mounting the electronic component on the tire,

A second pedestal having a first mounting portion having a first mounting surface that can be mounted on one side of the inner liner of the tire on one side and a second mounting surface on which the electronic component can be mounted on the other side. Part

At least the first pedestal is made of semi-vulcanized rubber material

An electronic component mounting base characterized by the above.

[2] The modulus of the second pedestal is higher than the modulus of the first pedestal after vulcanization

2. The electronic component mounting base according to claim 1, wherein the electronic component mounting base is provided.

[3] The first pedestal and the second pedestal are superposed

[4] The second pedestal has a rigid material force

The electronic component mounting base according to claim 3, wherein the electronic component mounting base is provided.

5. The electronic component mounting pedestal according to claim 1, wherein the first pedestal portion and the second pedestal portion are formed in one layer having a rubber material force.

[6] A vulcanized adhesive is applied to at least one of the overlapping surface of the first pedestal portion and the overlapping surface of the second pedestal portion to polymerize the first pedestal portion and the second pedestal portion. By

The first pedestal portion and the second pedestal portion are bonded together.

[7] When a tire having a predetermined product shape is molded by vulcanizing a raw tire, the first pedestal portion and the second pedestal portion are bonded by a crosslinking reaction.

[8] When a raw tire is vulcanized to form a tire having a predetermined product shape, the first pedestal is bonded to the inner liner of the tire by a crosslinking reaction.

[9] The electronic component is attached to the second attachment surface of the second pedestal portion. 9. The electronic component mounting base according to claim 8, wherein the electronic component mounting base is provided.

[10] a tire capable of being filled with working gas;

An electronic component mounting base mounted on the inner liner of the tire for mounting the electronic component on the tire,

The pedestal for mounting electronic parts includes a first pedestal portion having a first mounting surface that can be mounted on the inner liner of the tire on one side and a second mounting surface on which the electronic component can be mounted. Provide the second pedestal on the other side,

At least the first pedestal is made of semi-vulcanized rubber material,

The first pedestal portion and the second pedestal portion are superposed,

When a raw tire is vulcanized to form a tire having a predetermined product shape, the first pedestal is bonded to the inner liner of the tire by a crosslinking reaction.

A tire with a pedestal characterized by that.

[11] The electronic component is attached to the second attachment surface of the second pedestal portion.

A tire with a pedestal characterized by that.