WO2007004644A1 - 温度測定装置及びこれを利用した熱処理装置、温度測定方法 - Google Patents
温度測定装置及びこれを利用した熱処理装置、温度測定方法 Download PDFInfo
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- WO2007004644A1 WO2007004644A1 PCT/JP2006/313304 JP2006313304W WO2007004644A1 WO 2007004644 A1 WO2007004644 A1 WO 2007004644A1 JP 2006313304 W JP2006313304 W JP 2006313304W WO 2007004644 A1 WO2007004644 A1 WO 2007004644A1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
- G01K11/12—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in colour, translucency or reflectance
- G01K11/125—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in colour, translucency or reflectance using changes in reflectance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Definitions
- Temperature measuring apparatus heat treatment apparatus using the same, and temperature measuring method
- the present invention relates to a temperature measurement device that measures temperature using a laser, a heat treatment device using the temperature measurement method, and a temperature measurement method, and in particular, generates a high temperature gradient in a substrate and shortens the heat treatment.
- the present invention relates to a temperature measuring device suitably used for temperature measurement when heat treatment is performed in time, a heat treatment device using the same, and a temperature measuring method.
- thermometers have been used as non-contact type temperature measuring devices.
- radiation thermometers have difficulty in measuring the exact temperature of the substrate because the emissivity varies depending on the surface state of the substrate. Therefore, a method for measuring the temperature of the substrate by a laser has been proposed.
- Patent Document 1 discloses that a semiconductor laser power laser beam is irradiated on a temperature-measured body and also on a reference member, and reflected light from the temperature-measured body and reflected light from the reference member.
- the frequency of the light component that caused an intensity change specifically corresponding to the temperature of the temperature-measured body is obtained, and the frequency force of the temperature-measurement body is determined.
- a method to grasp the temperature has been proposed.
- Patent Document 2 describes a laser beam irradiation unit for irradiating a measurement point of a workpiece with a laser beam irradiation unit for measuring a surface temperature of a workpiece!
- a laser beam separating unit that separates the irradiated laser beam and irradiates the measurement point of the workpiece in parallel with the measurement point of the workpiece and a reference point at a position separated by a predetermined distance, and a pulse laser beam is applied to the measurement point.
- Patent Document 1 Japanese Patent Laid-Open No. 2000-162048
- Patent Document 2 Japanese Patent Laid-Open No. 11-190670
- these temperature measuring methods are methods for measuring the temperature of the substrate when the substrate is heated in a furnace and the heat treatment is performed while keeping the temperature of the entire substrate constant, so that a high power density heating source is used. Suitable for temperature measurement when heat treatment is performed in a short time due to a high temperature gradient in the substrate where heat treatment is performed by rapid heating from the surface of the substrate! Further, since the method according to Patent Document 1 utilizes modulation of laser light by lattice vibration, it is difficult to apply when the substrate is amorphous such as glass. Furthermore, there is a problem that it is difficult to measure the temperature of a substrate that undergoes a rapid temperature change with low time resolution because it requires spectral analysis of minute noise. For this reason, there is a need for a temperature measuring apparatus or method that can accurately measure the temperature of the substrate surface and the inside where the temperature changes rapidly in milliseconds, such as the heat treatment of the substrate.
- the present invention makes it easy to set the temperature at a predetermined position in a substrate at a predetermined time when performing heat treatment of the substrate by performing rapid surface heating of the substrate by a high power density heating source. It is an object of the present invention to provide a temperature measuring apparatus and a temperature measuring method that can measure the temperature efficiently and efficiently. It is another object of the present invention to provide a heat treatment apparatus capable of performing heat treatment under accurate temperature control using such a temperature measurement apparatus. Means for solving the problem
- the problem that the film thickness control becomes unstable when the film thickness is measured while measuring the film thickness with a highly coherent laser beam is that the film formation substrate is heated during film formation.
- the intensity of the reflected laser light is measured while irradiating the substrate with laser light while the substrate is being heat-treated with a plasma jet, the time-varying state of the reflectance of the laser light obtained at that time is The present invention was completed by obtaining the knowledge that the surface of the substrate is rapidly heated and corresponds to the refractive index change state based on the temperature distribution generated in the substrate.
- the temperature measurement method is a method for measuring the temperature of a subject to be measured having a unique correlation between temperature and refractive index.
- Light intensity that measures the light intensity characteristic X that indicates the relationship between time and the intensity of reflected or transmitted light resulting from the interference of laser light that is irradiated multiple times within the heated object and irradiated with laser light.
- a thermal load equivalent to the condition under which the heated object is heated is applied to the measurement unit and a virtual heated object having the same shape, thermal and optical characteristics as the heated object, and the laser light Reproduction of a virtual heated object having a light intensity characteristic z whose light intensity characteristic most closely matches the light intensity characteristic X is reproduced as a reproduced object.
- a temperature output unit for obtaining a temperature of a predetermined portion of the heated body at a predetermined time based on the reproduced heated body.
- the calculation unit includes a data input unit that inputs predetermined input data, a heat conduction analysis unit that calculates a temperature distribution characteristic of the virtual heated object based on the input data, and a calculated temperature distribution characteristic
- a conversion unit that converts the refractive index distribution characteristic into a corresponding refractive index distribution characteristic
- an optical analysis unit that obtains a predetermined optical characteristic Y of the virtual heated object having the converted refractive index distribution characteristic, and a predetermined optical characteristic from the light intensity characteristic X X is extracted, the difference between the optical characteristics X and Y is discriminated, and the initial value corrected until the difference is minimized is re-entered in the data input section, and the optical that best matches the optical characteristic X is extracted.
- a determination unit that obtains the characteristic Z, and a reproduction target output unit that outputs a virtual target having the light intensity characteristic z and temperature distribution characteristic corresponding to the optical characteristic Z as a reproduction target. It can have.
- the optical characteristic is a characteristic relating to a frequency, a phase, a peak of a peak, and a lowest point of a valley regarding a light intensity characteristic obtained for a heated object and a virtual heated object, or
- the optical thickness characteristic obtained for the virtual heated body can be obtained.
- the determination unit may include a pattern recognition unit that determines a difference between the light intensity characteristic X and the light intensity characteristic Y by a pattern matching method, a feature point method, or a frequency analysis method.
- a mean square error calculation unit for discriminating a difference between the thickness characteristic X and the optical thickness characteristic Y by a mean square error method may be provided.
- the light intensity measuring unit may include a laser light source, an optical path branching element, a laser condensing lens, and a light intensity measuring machine, and the laser condensing lens has a focal length that is heated. It should have a relationship of f> 2d with respect to body thickness d.
- the invention described above can be suitably used for a temperature measuring device that obtains the temperature of a heated object that changes within a range of room temperature to 3000 liters in a range of 1 ⁇ s to 10 s,
- the semiconductor substrate can be heat-treated with high quality. And in the heat treatment equipment
- the temperature measurement method irradiates a laser-heated object having a unique correlation between temperature and refractive index with laser light, and results from interference of laser light that is multiply reflected inside the object to be heated.
- the temperature distribution characteristic when a heat load equivalent to the condition that the heated object is heated is obtained, and the refractive index distribution characteristic corresponding to the temperature distribution characteristic is obtained, and such a refractive index distribution characteristic is obtained.
- a light intensity characteristic Y obtained when a virtual heated object is irradiated with laser light having the same characteristics as the laser light is determined to determine the difference between the light intensity characteristic Y and the light intensity characteristic X.
- the corrected light intensity characteristic is obtained by correcting the predetermined conditions, and the corrected light intensity characteristic Z having the smallest difference from the light intensity characteristic X and a virtual temperature distribution characteristic corresponding to such a light intensity characteristic Z are obtained.
- the predetermined condition of the thermal load condition is preferably a power transfer efficiency or a size of a region that effectively receives Z and power to be supplied to the virtual heated body.
- the temperature measurement program provides a laser beam that is multiple-reflected in the heated body when the heated body is irradiated with laser light having a unique correlation between temperature and refractive index.
- a program for obtaining the light intensity characteristic X indicating the relationship between the light intensity of reflected or transmitted light resulting from interference and time, and the shape, thermal and optical characteristics equivalent to the heated object A heat conduction analysis program for obtaining a temperature distribution characteristic when a thermal load equivalent to the condition under which the heated object is heated is applied to a virtual heated object having a refractive index distribution characteristic corresponding to the temperature distribution characteristic.
- a program for obtaining an optical analysis program for obtaining a light intensity characteristic Y obtained when a virtual object to be heated having the refractive index distribution characteristic is irradiated with a laser light having a characteristic equivalent to the laser light, and the light intensity characteristic X Difference between the light intensity characteristic Y and the light intensity characteristic X with the smallest difference between the light intensity characteristic X and the predetermined condition of the thermal load conditions until the difference is minimized.
- the program for obtaining the virtual object to be heated having the light intensity characteristic z and the temperature distribution characteristic corresponding thereto as the reproduced object. It has a program for determining the temperature in a predetermined time of a predetermined site of Caro heat body.
- the computer-readable recording medium according to the present invention is subjected to multiple reflections within the heated body when the heated body having a unique correlation between temperature and refractive index is irradiated with laser light.
- An optical analysis program for obtaining a light intensity characteristic Y obtained when a virtual heated body having the refractive index distribution characteristic is irradiated with laser light having characteristics equivalent to the laser light, and the light intensity characteristic X A program that determines the difference between the light intensity characteristic Y and the light intensity characteristic z with the smallest difference from the light intensity characteristic X while correcting the predetermined condition of the thermal load condition until the difference is minimized.
- a program for obtaining a virtual heated object having a temperature distribution characteristic corresponding to the light intensity characteristic Z as a reproduced object and a temperature distribution characteristic of the reproduced object is recorded on which is recorded a program for obtaining a temperature of a predetermined part of a body at a predetermined time.
- the LSI for temperature measurement is a laser that is multiple-reflected inside the heated body when the heated body is irradiated with a laser beam having a unique correlation between temperature and refractive index. Indicates the relationship between the light intensity of reflected or transmitted light resulting from light interference and time
- a program for obtaining the light intensity characteristic X and a thermal load equivalent to the condition under which the heated body is heated are applied to a virtual heated body having the same shape, thermal and optical characteristics as the heated body.
- the heat conduction analysis program for obtaining the temperature distribution characteristic, the program for obtaining the refractive index distribution characteristic corresponding to the temperature distribution characteristic, and the virtual heated object having the refractive index distribution characteristic have the same characteristics as the laser beam.
- Reproduce the heating element A program for determining a heating element, said reproduction program to determine the temperature at a predetermined time in a predetermined portion of the object to be Caro heat body based on the temperature distribution characteristics of the object to be heated, and implement an LSI to a temperature measurement.
- the temperature measuring apparatus or method described above is very short in acquiring the temperature of the heated object from the acquisition of the light intensity characteristic X of the object to be heated, and further acquiring the temperature of the predetermined part of the object to be heated in a predetermined time. Because it is timed, there is no particular difference from the normal temperature measurement method.
- the speed of temperature measurement can be increased by providing a database that accumulates data on the light intensity characteristics X and the corresponding object to be reproduced.
- the temperature measuring device can be made compact and simplified.
- the database according to the present invention includes an input unit that inputs data for selecting a measurement target, a predetermined initial value related to an object that can be input to the input unit, and the power of the initial value.
- Light intensity characteristic Z most closely matched to the light intensity characteristic X acquired from the heated object from the data group related to the light intensity characteristic and the reproduced heated object, and the reproduction corresponding to the light intensity characteristic Z
- a temperature measuring device having a compact and simple structure can be configured.
- this temperature measurement device has a unique correlation between temperature and refractive index.
- a temperature measurement device having a light intensity measurement unit for measuring the intensity characteristic X, a database, and a temperature output unit for obtaining a temperature at a predetermined time of a predetermined part of the heated object based on the reproduced heated object.
- the database changes an input unit that inputs data for selecting a measurement target, a predetermined initial value related to a target that can be input to the input unit, and a specific initial value among the initial values.
- a recording unit storing a data group relating to light intensity characteristics calculated in advance based on the correction values, and a data group relating to a reproduction target to be heated having a temperature distribution characteristic corresponding to the data group, and the light intensity characteristics And the reappearance cover
- the temperature measuring device may be configured as follows. That is, the first shows the relationship between the light intensity of the interference wave and the time obtained by irradiating the object to be heated, which has a unique correlation between the temperature and refractive index of an arbitrary part, with a predetermined laser beam.
- the first virtual heated object having a light intensity characteristic acquisition unit for obtaining a light intensity characteristic of 1 and a shape, thermal characteristics, and optical characteristics equivalent to the heated object!
- a virtual heated body temperature characteristic acquisition unit for obtaining a temperature distribution characteristic when a thermal load equivalent to the condition under which the heated body is heated is applied to the virtual heated body, and the virtual heated body Irradiating the laser beam to a virtual heated object refractive index characteristic acquisition unit for obtaining a refractive index characteristic corresponding to the temperature distribution characteristic, and a second virtual heated object having a refractive index characteristic equivalent to the virtual heated object
- the virtual heating body light intensity characteristic acquisition unit for acquiring the second light intensity characteristic indicating the relationship between the light intensity of the interference wave and the time obtained, the first light intensity characteristic, and the second light intensity Characteristics of the reproduced object to be heated having the third light intensity characteristic that most closely matches the first light intensity characteristic, and the temperature distribution characteristic in the reproduced object to be heated identification unit and the reproduced object to be heated.
- Optical thickness characteristic of the second virtual heating body so as to minimize the difference between the frequency of the waveform obtained from the first light intensity characteristic and the frequency of the waveform obtained from the second light intensity characteristic. By adjusting, the third light intensity characteristic can be obtained.
- the temperature measuring method or apparatus makes it possible to easily and accurately determine the temperature at a predetermined position in the substrate when performing heat treatment by performing rapid heating from the surface of the substrate with a high power density heating source. Can be measured.
- the heat treatment apparatus according to the present invention has a simple structure and is compact, and measures high temperature by measuring the temperature of a minute part in a desired substrate and controlling the heat treatment condition based on the temperature.
- the substrate can be heat-treated with temperature stability.
- FIG. 1 is an explanatory diagram showing a configuration of a temperature measuring device according to the present invention.
- FIG. 2 is a layout diagram showing an outline of a heat treatment apparatus provided with the temperature measuring apparatus of FIG.
- FIG. 3 is an explanatory view showing a multiple reflection state of laser light irradiated to a heated object.
- FIG. 4 is a graph of the light intensity characteristic X showing the relationship between the light intensity of reflected light and the time produced as a result of interference of laser light that is irradiated with laser light and is multiply reflected inside the heated object. .
- FIG. 5 is a graph in which the light intensity characteristic X shown in FIG. 4 is superimposed on the light intensity characteristic Y obtained for the virtual heated object.
- FIG. 6 is a graph showing an optical thickness characteristic Y of a virtual heated body.
- FIG. 5 is a graph plotting optical thickness characteristics extracted from light intensity characteristics X shown in FIG.
- FIG. 8 is a graph in which the light intensity characteristic X shown in FIG. 4 and the light intensity characteristic Z obtained for the reproduced object to be heated are superimposed.
- FIG. 9 is a graph showing temperature distribution characteristics of a virtual heated body and a reproduced heated body.
- FIG. 10 is a graph showing temperature distribution characteristics at 5 ms after the start of heat treatment of the object to be reproduced.
- FIG. 11 A graph showing the refractive index distribution characteristics at 5 ms after the start of heat treatment of the object to be reproduced. is there.
- the temperature measuring apparatus includes a light intensity measuring unit 100, a calculation unit 200, and a temperature output unit 300.
- the light intensity measurement unit 100 irradiates a laser beam to a heated object having a unique correlation between temperature and refractive index, and reflects or transmits light that is generated as a result of interference of laser light that is multiply reflected inside the heated object. It has a function of measuring the light intensity characteristic X indicating the relationship between the light intensity of light and time, that is, a function as an object to be heated light intensity characteristic acquisition unit.
- Arithmetic unit 200 is heated A virtual heated body having the same shape, thermal and optical characteristics as the body is subjected to a thermal load equivalent to the condition in which the heated body is heated and irradiated with laser light having characteristics equivalent to the laser light.
- a function for obtaining a reheated object that obtains a reheated virtual object having a light intensity characteristic z having a light intensity characteristic z that most closely matches the light intensity characteristic X.
- Have The temperature output unit 300 has a function of obtaining a temperature at a predetermined time of a predetermined part of the heated body based on the reproduced heated body.
- the symbols X, Y, and Z indicate characteristics relating to a heated object, a virtual heated object, and a reproduced heated object, respectively.
- the light intensity measuring unit 100 has a measuring device force shown in FIG.
- the object to be heated 10 is heated by the plasma jet 51 of the plasma generator 50 and heat treatment is performed, and the temperature measuring device 100 is used for the heat treatment device.
- a laser light source 105, an optical path branching element 106, a laser condensing lens 107, a filter 109, and a light intensity measuring device 108 are included.
- the object to be heated 10 is heat-treated by this heat treatment apparatus
- the laser light 20 is irradiated from the laser light source 105 to the back surface of the object to be heated 10 through the optical path branching element 106 and the laser condenser lens 107
- the irradiated laser beam 20 is multiple-reflected on the front and back surfaces of the object to be heated 10 as shown in FIG. 3, and the interfering laser beam 22 passes through the optical path branch element 106 and the filter 109 to measure the optical intensity.
- the light intensity measuring device 108 measures and records a light intensity characteristic X indicating the relationship between light intensity and time as shown in FIG.
- FIG. 4 shows that when a quartz substrate with a thickness of 525 ⁇ m is heat-treated with a plasma jet with an input power of 1.67 kW and a scanning speed of 700 m / s, the output from the back surface of the quartz substrate is 10 mW and the wavelength is 633 ⁇ .
- This is obtained by vertically irradiating m He-Ne laser light and measuring the amount of reflected laser light (laser light 22) reflected on the front and back surfaces of the quartz substrate.
- the horizontal axis in FIG. 4 indicates the time after the start of heat treatment, and the vertical axis indicates the reflectance (relative light intensity) obtained from the light quantity ratio between the reflected laser beam 22 and the incident laser beam 20.
- the transmittance obtained from the amount of transmitted light transmitted to the surface side of the quartz substrate can be used, but it is practically preferable to use the reflectance in consideration of the operability of the apparatus configuration.
- the reflectance repeatedly increases and decreases according to the elapsed time of heat treatment.
- Intensity characteristic X shows the vibration waveform.
- the temperature distribution and temperature change state of the object to be heated are measured using such light intensity characteristics X. Therefore, in the present invention, it is sufficient that the object to be heated 10 has a unique correlation between the temperature and the refractive index, but the incident light and the multiple reflection laser light interfere with each other, and the interference wave generates a vibration waveform. It must be able to interfere to a certain extent. Therefore, it is desirable that the heated object 10 has two or more reflecting surfaces that are substantially parallel, and the deviation in parallelism that is desired is within 5 °.
- the object to be heated preferably has a laser transmittance of 50% or more.
- the intensity ratio of the reflected laser beam reflected from the back surface of the heated object and the surface force to the incident light can be secured to 1/4 or more, it is possible to obtain time-varying curve data with a sufficiently large amplitude.
- the area of the object to be heated 10 should be sufficiently large compared to the thickness thereof. This has the advantage that the temperature can be measured with relatively high accuracy because the thermal diffusion length in the plane direction is longer than the thickness direction, and the influence of the heat storage effect during heating is reduced. For the same reason, the thickness of the object to be heated should be sufficiently larger than the thickness of the heat treatment layer.
- the laser beam 20 used for the light intensity measuring unit 100 is not particularly limited as long as it has coherence.
- a He-Ne laser beam with an output of 10 mW and a wavelength of 633 nm, a YAG harmonic laser beam with an output of 50 mW and a wavelength of 532 can be used.
- a lens or the like In order to reduce the measurement temperature error, it is necessary to make the irradiation laser spot sufficiently smaller than the temperature distribution in the plane direction of the object to be heated 10, so it is desirable to use a lens or the like.
- a lens with a focal length of 2d is used for the heated object thickness d, the reflected light intensity from the back surface of the heated object is extremely weak compared to the reflected light intensity from the surface. Therefore, there arises a problem that the interference amplitude of the reflected light becomes small. Therefore, it is desirable to use a lens with a focal length of 2d!
- the heating source for heating the article to be heated 10 is not particularly limited.
- This temperature measuring apparatus can be used when any heat source is used for heat treatment of a substrate or the like.
- this temperature measurement device can measure SiO substrates, Si substrates, etc. in milliseconds with a high power density heating source such as plasma jet, laser or Xe flash lamp or halogen lamp.
- the calculation unit 200 in the present temperature measurement device can be configured as follows as a configuration that realizes the above-described function for obtaining the object to be reproduced. That is, as shown in FIG. 1, the calculation unit 200 includes a data input unit 210, a heat conduction analysis unit 220, a conversion unit 230, an optical analysis unit 240, a determination unit 250, and a reproduction target object output unit 260. be able to.
- the data input unit 210 has a function for inputting predetermined input data such as initial values for calculation and correction values thereof.
- predetermined input data such as initial values for calculation and correction values thereof.
- shape and conditions such as thickness, area, and parallelism of the object to be heated, and thermal and optical characteristics such as temperature dependence of initial temperature, initial reflectance, thermal conductivity, density, specific heat, and refractive index.
- Conditions such as the type of heating source, type of input power, input power, time profile of input power, power transmission efficiency, and the size of the area that effectively receives the input power of the virtual heated object are input.
- the heat conduction analysis unit 220 has a function for obtaining the temperature distribution characteristic of the virtual heated body based on the input data, that is, a function as a virtual heated body temperature characteristic acquisition unit.
- the heat conduction analysis unit 220 can be mainly composed of a program or software applying a known heat conduction analysis method.
- the conversion unit 230 has a function of converting the temperature distribution characteristic obtained by the heat conduction analysis unit 220 into a corresponding refractive index distribution characteristic, that is, a function as a virtual heated object refractive index characteristic acquisition unit.
- the virtual object to be heated has a unique correlation between the temperature and the refractive index, and the temperature distribution generated in the virtual object to be heated and the temporal change in temperature are uniquely determined.
- the optical analysis unit 240 has a function for obtaining a predetermined optical characteristic of the virtual heated object having the converted refractive index distribution characteristic obtained by the conversion part 230, that is, the refractive index distribution characteristic described above.
- the optical structure has a function as a light intensity characteristic acquisition unit that acquires the light intensity characteristic Y.
- the optical characteristic ⁇ can also be an optical thickness characteristic Y related to the optical thickness (n X d) defined by the thickness d of the substrate irradiated with the laser light and the refractive index n of the substrate.
- a program or software applying a known optical analysis method can be used.
- the determination unit 250 has a function of extracting a predetermined optical characteristic X from the light intensity characteristic X and determining a difference between the optical characteristic X and the optical characteristic Y obtained by the optical analysis unit 240.
- the target optical characteristic is a light intensity characteristic
- the difference between the light intensity characteristic X obtained by the light intensity measurement unit 100 and the light intensity characteristic Y obtained by the optical analysis unit 240 is determined.
- the target optical characteristic is the optical thickness characteristic
- the optical thickness characteristic X obtained by extracting the optical thickness characteristic from the light intensity characteristic X obtained by the light intensity measurement unit 100 and the optical thickness obtained by the optical analysis unit 240 are used. Determine the difference from the thickness characteristic Y.
- the fact that the waveform indicating these characteristics is oscillating is used.
- the light intensity characteristic X shown by the solid line actually obtained by the light intensity measurement unit 100 and the light indicated by the broken line obtained by the optical analysis unit 240 using the initial value are used.
- the waveform of intensity characteristic Y usually has different frequency and phase. Focusing on these points, the difference between the light intensity characteristic X and the light intensity characteristic Y is discriminated.
- a pattern recognition unit using a pattern matching method, a feature point method, or a frequency analysis method is provided in the determination unit 250, and the difference in frequency and phase between the light intensity characteristic X and the light intensity characteristic Y is extracted.
- the difference can be easily determined by analysis by the pattern recognition unit.
- the higher the rising temperature of the object to be heated the lower the frequency.
- the horizontal axis indicates the time after the start of heat treatment, and the vertical axis indicates the reflectivity.
- the difference between the optical thickness characteristic X and the optical thickness characteristic Y is determined as follows. That is, the optical thickness characteristic Y as shown by the solid line in FIG. In Fig. 6, the horizontal axis shows the time after the start of heat treatment, and the vertical axis shows the optical thickness.
- the peak of the vibration waveform and the peak of the next valley, or the peak of the valley and the peak of the next peak The optical thickness is changed by (1/4) ⁇ (where ⁇ is the wavelength of the laser beam).
- the time for the optical thickness to change by ⁇ / 4 is extracted from the waveform showing the light intensity characteristic X shown in FIG. 4 and plotted in FIG. 6, as shown by the circle in FIG. In FIG. 6, a to g are when the waveform indicating the light intensity characteristic X in FIG. 4 indicates the peak of the peak or the lowest point of the valley.
- the difference between the optical thickness characteristic X and the optical thickness characteristic Y can be easily made by comparing the optical thicknesses of the two at the times a to g. For example, it can be determined by obtaining the difference of the mean square error of both optical thicknesses in a to g.
- the determination of the difference in optical characteristics by the determination unit 250 is repeated until the difference is minimized. That is, the determination unit 250 discriminates the difference between the optical characteristics X and Y, re-enters the initial value corrected until the difference is minimized, and the difference between the optical characteristics X and Y is the largest.
- the optical characteristic Z that is small, that is, the optical characteristic X that best matches the optical characteristic X is obtained.
- the reproduced heated object output unit 260 obtains the virtual heated object having the light intensity characteristic Z and the temperature distribution characteristic corresponding to the optical structure having the optical characteristic Z thus obtained.
- a virtual heated object having various characteristics is output to the temperature output unit 300 as a reproduced heated object. This reproduced object to be heated reproduces the temperature distribution and the time change of the temperature most closely approximated to the temperature distribution and the temperature change of the object to be heated.
- the temperature output unit 300 obtains a temperature at a predetermined position and time (time after the start of heat treatment) of the object to be heated based on the reproduced object to be heated, and outputs the temperature as a measured temperature of the object to be heated. To do.
- the temperature measuring device has been described above.
- This temperature measuring apparatus can suitably carry out the following temperature measuring method.
- the temperature measurement method according to the present invention irradiates a heated object having a unique correlation between temperature and refractive index and irradiates the laser beam with the interference force between the incident light and the reflected light, and the obtained light intensity and A step of obtaining a light intensity characteristic X indicating a relationship with time, and first, conditions under which the heated body is heated to a virtual heated body having the same shape, thermal and optical characteristics as the heated body.
- a distribution characteristic is obtained, a refractive index distribution characteristic corresponding to the temperature distribution characteristic is obtained, and a virtual heated body having such a refractive index distribution characteristic is irradiated with laser light having characteristics equivalent to the laser light.
- the light intensity characteristic Y obtained is determined to determine the difference between the light intensity characteristic Y and the light intensity characteristic X, and then a predetermined condition of the thermal load conditions applied to the virtual heated body is corrected.
- the corrected light intensity characteristic is obtained, the corrected light intensity characteristic Z having the smallest difference from the light intensity characteristic X, and a virtual heated object having a temperature distribution characteristic corresponding to such light intensity characteristic Z And a step of obtaining a temperature of a predetermined portion of the heated body at a predetermined time based on a temperature distribution characteristic of the reproduced heated body.
- the light intensity characteristic X is the smallest difference and corrected to obtain the corrected light intensity characteristic Z, that is, the light intensity characteristic Z that most closely matches the light intensity characteristic X.
- the heat load condition to be set is preferably the power transmission efficiency or the size of the region (heat receiving region) that effectively receives the power supplied to Z and the virtual heated object among the initial values described above.
- the power transfer efficiency ⁇ is input as ⁇ + ⁇
- the width W of the plasma jet is input as the size of the heat receiving area as W + AW, and recalculation is performed. This effectively reduces the difference between the light intensity characteristics X and Y.
- Such a temperature measurement method can be preferably implemented by the following program.
- the temperature measurement program according to the present invention has a light intensity obtained from the interference between incident light and reflected light when a laser beam is irradiated onto a heated object having a unique correlation between temperature and refractive index.
- the program for obtaining the light intensity characteristic X indicating the relationship with time, and the condition under which the heated body is heated to a virtual heated body having the same shape, thermal and optical characteristics as the heated body.
- Heat load A program for obtaining the light intensity characteristic Z having the smallest difference from the light intensity characteristic X while correcting a predetermined condition, and the light intensity characteristic Z and a temperature distribution characteristic corresponding thereto.
- this program can be recorded on a computer-readable recording medium.
- the computer-readable recording medium according to the present invention can obtain the interference force between the incident light and the reflected light when the heated object having a unique correlation between temperature and refractive index is irradiated with the laser light.
- a heat conduction analysis program for obtaining a temperature distribution characteristic when an equivalent heat load is applied a program for obtaining a refractive index distribution characteristic corresponding to the temperature distribution characteristic, and a virtual heated object having the refractive index distribution characteristic, the laser
- a program for obtaining a virtual heated object having a temperature distribution characteristic to be reproduced as a heated object and a program for obtaining a temperature at a predetermined time of a predetermined portion of the heated object based on the temperature distribution characteristic of the reproduced heated object. Recorded.
- the LSI for measuring temperature is a light that can also obtain an interference force between the incident light and the reflected light when a laser beam is irradiated onto a heated object having a unique correlation between temperature and refractive index.
- the optical analysis program for obtaining the light intensity characteristic Y obtained when the laser light having the same characteristics as the laser light is irradiated, the difference between the light intensity characteristic X and the light intensity characteristic Y is determined, and the difference is minimized.
- the temperature measuring device and the temperature measuring method according to the present invention have been described above.
- the database changes an input unit for inputting data for selecting a measurement target, a predetermined initial value related to a target that can be input to the input unit, and a specific initial value among the initial values.
- a recording unit in which a data group related to light intensity characteristics calculated in advance based on the corrected values and a data group related to a reheated object having temperature distribution characteristics corresponding to the data group are stored; Light intensity characteristic that most closely matches the light intensity characteristic X acquired from the object to be heated from the data group regarding the intensity characteristic and the reproduced object to be heated.
- a search unit for searching for a reproduction object to be heated corresponding to Z and its light intensity characteristic Z.
- the predetermined initial value is the temperature dependence of the shape, initial temperature, initial reflectance, thermal conductivity, density, specific heat, and refractive index of the heated object with respect to the heated object.
- the specific initial value is data relating to power transmission efficiency or Z and plasma jet width.
- the data for selecting a measurement target is specifically “quartz substrate” or “Si substrate” or “quartz substrate and plasma jet scanning speed”. The contents of the data for selecting the measurement target are determined according to the needs of the production site, and the size of the database is determined according to the size of the data for selecting the measurement target.
- the temperature measuring device provided with such a beta base is the same as the operation of the temperature measuring device described above. Part 200 can be replaced with this beta base.
- the temperature is measured as follows. In other words, when the object to be heated is rapidly heated and data about the light intensity characteristic X starts to be acquired from the light intensity measuring unit 100, the search unit obtains the light that most closely matches the light intensity characteristic X acquired by the data unit cover. Search for strength characteristic Z. Then, a reproduced object to be heated having a temperature distribution characteristic corresponding to the light intensity characteristic Z is searched. Since the output related to the object to be heated is output with almost no time lag, the temperature measurement device can measure the temperature at the moment immediately after heating the object to be heated. The state of temperature change at an arbitrary position can be measured. Also, by providing such a beta base, a compact and simple temperature measuring device can be configured.
- the present temperature measurement apparatus accurately measures the temperature of the substrate surface and the inside that rapidly changes in milliseconds, such as when a semiconductor substrate or the like is heat-treated with a high power density heating source. be able to. For this reason, high-quality heat treatment can be performed by attaching the temperature measuring device to the heat treatment device.
- the heat treatment apparatus provided with a control device that controls the output of the plasma jet generation device based on a signal from the temperature measurement device, it is possible to perform a further high-quality heat treatment.
- a heat treatment apparatus can be provided with a driving apparatus that relatively moves the plasma jet of the plasma jet generator and the semiconductor substrate or the like.
- a quartz substrate temperature measurement test was performed when a quartz substrate having a thickness of 525 ⁇ m was thermally treated with a plasma jet.
- the input power of the plasma jet was 1.67kW, and the scanning speed was 700m / s.
- a He-Ne laser beam with an output of 10 mW and a wavelength of 633 nm is vertically irradiated from the back surface of this quartz substrate, and the reflection caused as a result of the interference of the laser beam that is multiply reflected inside the heated object
- the light intensity characteristic indicating the relationship between light intensity and time was measured.
- the method of utilizing the optical thickness characteristic described above was used to obtain the reproducible object to be heated.
- FIG. 7 is a graph showing the optical thickness characteristic, and shows an example in the case where a reproduction target object is obtained by using the optical thickness characteristic described above.
- the horizontal axis in Figure 7 is The time after the start of heat treatment is shown, and the vertical axis shows the optical thickness.
- Figure 8 is a graph showing the light intensity characteristics. The horizontal axis shows the time after the start of heat treatment, and the vertical axis shows the reflectance.
- Figure 9 is a graph showing the surface temperature of the quartz substrate. The horizontal axis shows the time after the start of heat treatment, and the vertical axis shows the surface temperature. Fig.
- FIG. 10 is a graph showing the temperature distribution characteristics at 5 ms after the start of heat treatment of the reproduced object, the horizontal axis shows the position of the reproduced object, and the vertical axis shows the depth position of the surface force of the reproduced object. Show.
- the numbers in the figure indicate the temperature, and the arrows indicate the plasma jet irradiation position. The plasma jet is also scanned in the left direction in the figure.
- the horizontal axis indicates the position of the reproduced object
- the vertical axis indicates the depth position of the surface force of the reproduced object.
- the numerical value in the figure indicates the refractive index
- the arrow indicates the irradiation position of the plasma jet.
- the symbol X indicates the characteristics of the heated object, that is, the quartz substrate.
- the symbol ⁇ ( ⁇ , ⁇ ) indicates the characteristics related to the virtual heated object, and the symbol ⁇ ⁇ relates to the reproduced heated object.
- the circles shown in Fig. 7 indicate the optical thickness characteristics extracted from the light intensity characteristics X for the heated object in Fig. 8 (the time indicating the peak and valley bottom points of the waveform and the optical thickness at that time) ) Are plotted.
- the optical thickness characteristic curve shows the power transmission efficiency as 45% of the rated value.
- ⁇ -Force obtained by re-inputting and recalculating the transmission efficiency at 64.5% of the rated value.
- Optical thickness characteristic ⁇ obtained by re-inputting and recalculating the transmission efficiency at 64.5% of the rated value.
- the second to sixth circles have the same optical thickness difference between adjacent circles (E / 4). This is related to the fact that the light intensity characteristic X shows a clear peak or valley waveform in FIG.
- the circles extracted from the light intensity characteristics in Fig. 8 are in good agreement with the optical thickness characteristics curve for the object to be reproduced.
- the waveform (frequency and phase) of the light intensity characteristic X relating to the heated object and the light intensity characteristic Z relating to the reproduced heated object agree well. According to the temperature distribution characteristics shown in Fig.
- the temperature of the surface of the reproduced object reached 1300 ° K after 5 ms.
- the temperature distribution has an annual ring shape centered on the plasma jet irradiation area.
- the surface force is also over 1000K up to a depth exceeding 20 m, and it can be seen that the quartz substrate is sufficiently heat-treated under the conditions of this example. In fact, when the structure of the quartz substrate was observed with an optical microscope, it was found that heat treatment was sufficient. Comparing Fig. 10 and Fig. 11, the temperature distribution shape and the refractive index distribution shape are similar (equivalent) so that the quartz substrate temperature and refractive index have a linear proportional relationship. I understand that.
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- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
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Abstract
Description
Claims
Priority Applications (4)
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JP2007524074A JP4742279B2 (ja) | 2005-07-05 | 2006-07-04 | 温度測定装置及びこれを利用した熱処理装置、温度測定方法 |
US11/917,969 US8419272B2 (en) | 2005-07-05 | 2006-07-04 | Temperature measuring device, thermal treatment device using the same, temperature measuring method |
CN2006800245093A CN101218492B (zh) | 2005-07-05 | 2006-07-04 | 温度测量装置以及利用它的热处理装置、温度测量方法 |
EP06780758A EP1909083A4 (en) | 2005-07-05 | 2006-07-04 | TEMPERATURE MEASURING DEVICE, THERMAL PROCESSING DEVICE USING SAME, AND TEMPERATURE MEASURING METHOD |
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JP2005195691 | 2005-07-05 | ||
JP2005-195691 | 2005-07-05 |
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WO2007004644A1 true WO2007004644A1 (ja) | 2007-01-11 |
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PCT/JP2006/313304 WO2007004644A1 (ja) | 2005-07-05 | 2006-07-04 | 温度測定装置及びこれを利用した熱処理装置、温度測定方法 |
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US (1) | US8419272B2 (ja) |
EP (1) | EP1909083A4 (ja) |
JP (1) | JP4742279B2 (ja) |
KR (1) | KR100951305B1 (ja) |
CN (1) | CN101218492B (ja) |
WO (1) | WO2007004644A1 (ja) |
Cited By (5)
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JP2011060810A (ja) * | 2009-09-07 | 2011-03-24 | Hiroshima Univ | 半導体製造装置および半導体の製造方法 |
CN102445284A (zh) * | 2010-09-30 | 2012-05-09 | 东京毅力科创株式会社 | 温度测量方法 |
JP2013200267A (ja) * | 2012-03-26 | 2013-10-03 | Toyota Central R&D Labs Inc | 赤外線検出装置 |
US8900953B2 (en) | 2008-09-01 | 2014-12-02 | Hiroshima University | Crystal manufacturing apparatus, semiconductor device manufactured using the same, and method of manufacturing semiconductor device using the same |
US10041842B2 (en) | 2014-11-06 | 2018-08-07 | Applied Materials, Inc. | Method for measuring temperature by refraction and change in velocity of waves with magnetic susceptibility |
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WO2007005489A2 (en) * | 2005-07-05 | 2007-01-11 | Mattson Technology, Inc. | Method and system for determining optical properties of semiconductor wafers |
CN102135455B (zh) * | 2010-11-18 | 2012-12-19 | 杭州自动化技术研究院有限公司 | 非接触式测温方法、点温仪及其应用 |
DE102016015502A1 (de) * | 2016-12-23 | 2018-06-28 | Singulus Technologies Ag | Verfahren und Vorrichtung zur thermischen Behandlung beschichteter Substrate, insbesondere von Dünnschicht-Solarsubstraten |
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CN112053341A (zh) * | 2020-09-01 | 2020-12-08 | 广东电网有限责任公司 | 一种基于光反射率和人工智能的合金材料的表面温度测量方法 |
CN112089562B (zh) * | 2020-09-23 | 2021-06-29 | 郑州迪生仪器仪表有限公司 | 婴儿培养箱温度标定及测量方法 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US8900953B2 (en) | 2008-09-01 | 2014-12-02 | Hiroshima University | Crystal manufacturing apparatus, semiconductor device manufactured using the same, and method of manufacturing semiconductor device using the same |
JP2011060810A (ja) * | 2009-09-07 | 2011-03-24 | Hiroshima Univ | 半導体製造装置および半導体の製造方法 |
CN102445284A (zh) * | 2010-09-30 | 2012-05-09 | 东京毅力科创株式会社 | 温度测量方法 |
JP2013200267A (ja) * | 2012-03-26 | 2013-10-03 | Toyota Central R&D Labs Inc | 赤外線検出装置 |
US10041842B2 (en) | 2014-11-06 | 2018-08-07 | Applied Materials, Inc. | Method for measuring temperature by refraction and change in velocity of waves with magnetic susceptibility |
Also Published As
Publication number | Publication date |
---|---|
CN101218492B (zh) | 2010-08-18 |
EP1909083A4 (en) | 2011-12-14 |
EP1909083A1 (en) | 2008-04-09 |
US8419272B2 (en) | 2013-04-16 |
US20100086006A1 (en) | 2010-04-08 |
KR20080031046A (ko) | 2008-04-07 |
JPWO2007004644A1 (ja) | 2009-01-29 |
KR100951305B1 (ko) | 2010-04-05 |
CN101218492A (zh) | 2008-07-09 |
JP4742279B2 (ja) | 2011-08-10 |
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