WO2006126379A1 - 電池パック - Google Patents
電池パック Download PDFInfo
- Publication number
- WO2006126379A1 WO2006126379A1 PCT/JP2006/309154 JP2006309154W WO2006126379A1 WO 2006126379 A1 WO2006126379 A1 WO 2006126379A1 JP 2006309154 W JP2006309154 W JP 2006309154W WO 2006126379 A1 WO2006126379 A1 WO 2006126379A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- upper cover
- circuit board
- battery pack
- unit cell
- cover
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/271—Lids or covers for the racks or secondary casings
- H01M50/273—Lids or covers for the racks or secondary casings characterised by the material
- H01M50/278—Organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/202—Casings or frames around the primary casing of a single cell or a single battery
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/284—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with incorporated circuit boards, e.g. printed circuit boards [PCB]
- H01M50/287—Fixing of circuit boards to lids or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/296—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by terminals of battery packs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M6/00—Primary cells; Manufacture thereof
- H01M6/42—Grouping of primary cells into batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Definitions
- a circuit board is arranged on the upper side of the unit cell, an upper cover is arranged on the upper side of the circuit board, and the circuit board and the upper side are arranged on the upper surface of the unit cell by a resin mold.
- the present invention relates to a battery pack in which a cover is integrated.
- an external connection terminal is arranged on the upper surface of a circuit board, With the external connection terminal exposed on the upper surface of the battery pack, the circuit board and the like are integrated into the unit cell with a resin mold.
- the positioning member of the mounting portion contacts the upper surface of the battery pack.
- the technique of covering the upper side of the circuit board with a resin mold as disclosed in Japanese Patent Application Laid-Open No. 2003-17022 results in insufficient strength of the upper surface of the battery pack against contact with the positioning member or the like.
- a cover made of a synthetic resin having a high strength is provided with a window facing the external connection terminal of the circuit board.
- the cover covers the entire circuit board and covers the window. In this state, the cover and the circuit board may be integrated with the unit cell in a state where the external connection terminal is exposed.
- JP-A-2 In the publication No. 004-221026, since the entire circuit board is covered with a cover, the assembly work takes time and the productivity of the battery pack deteriorates.
- a cover is disposed only on the upper side of the circuit board, and the force bar, the circuit board, etc. are integrated with the unit cell by a resin mold. In this case, it is necessary to prevent the molten resin from covering the external connection terminals through the gap between the upper cover and the circuit board.
- an object of the present invention is to prevent the molten resin from covering the external connection terminal through the gap between the upper cover and the circuit board, and at an appropriate interval between the upper cover and the upper surface of the unit cell.
- An object of the present invention is to provide a battery pack in which the upper cover can be efficiently integrated with the upper surface of the unit cell by a resin mold in the set state.
- the battery pack of the present invention is formed between an upper cover disposed on the upper side of the unit cell and the upper cover and the upper surface of the unit cell, and the upper cover is integrated with the upper surface of the unit cell. Including a resin mold
- a positioning projection is provided on the lower surface of the upper cover so as to protrude downward.
- at least one positioning protrusion is provided on the lower surface of the upper cover.
- an electrical component is disposed on the upper side of the unit cell, the upper cover is disposed on the upper side of the electrical component, and the resin mold is an upper surface of the unit cell.
- the electrical component and the upper cover may be integrated.
- the electrical components correspond to circuit boards, PTC (positive temperature coefficient) elements, lead wires, and the like.
- an external connection terminal is disposed on the upper surface of the circuit board as the electrical component, and the upper cover has a window facing the external connection terminal in a penetrating manner.
- the circuit board is fitted into the lower surface of the upper cover.
- the board fitting portion to be formed may be recessed.
- the case where the entire thickness of the circuit board is fitted into the board fitting portion and the case where only a part of the thickness of the circuit board is fitted into the board fitting portion are included.
- the gap between the inner surface of the board fitting portion and the circuit board when the circuit board is fitted into the board fitting portion is as small as possible (including zero). ,.
- the battery pack of the present invention may be provided with anchor means for preventing the upper cover from coming off from the resin mold.
- the anchor means may be a recess formed in a recessed shape on the positioning protrusion.
- the anchor means may be an anchor portion that protrudes downward from the lower surface of the upper cover and has a through hole or a recess formed on the side surface thereof.
- a locking portion is provided on the lower surface of the upper cover, and the upper side is moved by the locking portion in a state where the circuit board is fitted into the board fitting portion.
- a cover may be fixed to the circuit board.
- a tape fitting portion into which a double-sided tape is fitted is formed on the upper surface of the board fitting portion, and the upper cover is attached to the circuit board by the double-sided tape. It may be fixed to the upper surface.
- the case where the entire thickness of the double-sided tape is fitted into the tape fitting portion and the case where only a part of the thickness of the double-sided tape is fitted into the tape fitting portion are included.
- the battery pack of the present invention when the intermediate assembly of the battery pack is mounted in the mold for forming the resin mold, for example, the upper cover is pressed on the inner surface of the mold.
- the lower end of the positioning projection comes into contact with the upper surface of the unit cell, and the upper cover and the upper surface of the unit cell are regulated at a predetermined interval. Therefore, a gap for injecting molten resin between the upper cover and the upper surface of the unit cell is ensured, and a lead wire, a PTC element, or the like disposed between the upper cover and the upper surface of the unit cell is ensured. It is possible to prevent electrical components such as circuit boards from coming into close contact with each other.
- the distance between the upper cover and the upper surface of the unit cell is defined by the positioning protrusions, and variations in each battery knock are reduced. Therefore, the battery pack after molding the resin mold The accuracy of the vertical dimension of the battery can be maintained high, and the reliability for manufacturing the battery pack can be increased. Due to the restriction of the distance between the upper cover and the upper surface of the unit cell, it is not necessary to fix the upper cover to the upper surface of the unit cell with rivets, and the labor required for manufacturing the battery pack is reduced accordingly. it can.
- the anchor means is provided on the upper cover, the upper cover does not come off from the resin mold after the molding of the resin mold, and does not move to the upper side of the unit cell. In this respect as well, the accuracy of the vertical dimension of the battery pack can be maintained high, and the reliability for manufacturing the battery pack can be increased.
- the molten resin does not go around the upper surface of the circuit board when molding the resin mold.
- a certain external connection terminal can be prevented from being covered with a resin mold.
- the resin mold even when a small gap is formed between the inner surface of the board fitting portion and the circuit board when the circuit board is fitted into the board fitting portion, the resin mold During molding, the lower end force of the board mating part The molten resin that has entered the gap between the inner surface of the board mating part and the side surface of the circuit board flows upward through the gap, The direction is changed at the upper end to try to flow through the gap between the upper surface of the circuit board and the upper surface of the board fitting portion.
- the flow path of the molten resin from the lower end of the board fitting part to the external connection terminal of the circuit board is increased by the amount that the circuit board fits in the board fitting part, and the board fitting part
- the flow resistance increases, making it difficult for the molten resin to reach the external connection terminals. Therefore, when molding the resin mold, the molten resin is prevented from being covered on the external connection terminals, and the external connection terminals are securely connected to the contact terminals of the external device via, for example, the upper cover window. it can.
- the upper cover is fixed to the circuit board with the locking portion, or the upper cover is fixed to the circuit board with double-sided tape, the upper cover is surely prevented from separating from the circuit board before molding the resin mold. it can. Therefore, it is possible to reliably prevent the gap between the upper surface of the circuit board and the upper surface of the board fitting portion from being increased, and more reliably prevent the molten resin from covering the external connection terminals.
- FIG. 1 is a perspective view of an upper cover of a battery pack according to a first embodiment.
- FIG. 2 is an exploded perspective view of an intermediate assembly of the battery pack according to the first embodiment.
- FIG. 3 is a longitudinal front view of the battery pack according to the first embodiment.
- FIG. 4 is a partially enlarged view of FIG. 3 showing the main part of the battery pack of the first embodiment.
- FIG. 5A is a cross-sectional view taken along line BB in FIG.
- FIG. 5B A-A line cross section of Fig. 3
- FIG. 6 is a front view of the battery pack according to the first embodiment.
- FIG. 7 is a perspective view of an upper cover according to a second embodiment.
- FIG. 8 is a longitudinal side view showing the main part of the second embodiment.
- FIG. 9 is a perspective view of an upper cover of a battery pack according to a third embodiment.
- FIG. 10 is a vertical side view of the upper cover of the third embodiment.
- FIGS. 1 to 6 show a first embodiment of a battery pack according to the present invention.
- the battery pack 1 is a flat rectangular box.
- Cell unit 2 an electrical component disposed above the unit cell 2, a plastic upper cover 3 disposed above the electrical component, and an electrical component and the upper cover 3 disposed on the top surface of the unit cell 2 And a plastic lower cover 6 fixed to the lower surface of the unit cell 2.
- the unit cell 2 has, for example, a left-right width dimension of 33.8 mm, a vertical height dimension of 46 mm, and a front-rear thickness dimension of 44.5 mm.
- the resin mold 5 is formed of, for example, a polyamide-based resin or a polyester-based resin, and insulates and protects the electrical component from the outside. As shown in FIG. 2, the unit cell 2 has smaller front and rear thickness dimensions than the vertical height dimension and the horizontal width dimension.
- the unit cell 2 is a secondary battery in which an electrode body and an electrolyte solution are enclosed in an outer can 7 and can be charged and discharged. Specifically, the lithium ion battery power is also obtained.
- the upper surface of the outer can 7 is closed with the sealing plate 9, and the negative electrode terminal 10 is provided at the center of the sealing plate 9.
- the outer can 7 is formed, for example, by deep drawing a plate material made of aluminum or its alloy power.
- the sealing plate 9 is formed by press-curing a plate material such as an aluminum alloy.
- the electrode body include a positive electrode sheet using LiCoO as a positive electrode active material and graphite as a negative electrode active material.
- the whole negative electrode sheet is wound in a spiral shape with a separator made of resin, and the whole is crushed into a flat shape.
- the electrical component includes a PTC element 11 disposed on the upper side of the unit cell 2, a horizontally long circuit board 12 disposed on the upper side of the PTC element 11, and a lead wire and a lead plate described later.
- the PTC element 11 forcibly reduces the current.
- the PTC element 11 is connected to the negative electrode terminal 10 through a strip-shaped terminal side lead wire 13 and is connected to the circuit board 12 through a strip-shaped substrate side lead wire 15.
- the circuit board 12 is connected to the sealing plate 9 of the unit cell 2 through a pair of lead plates 16 and 17 bent in an L shape.
- the board-side lead wire 15 is bonded to the lower surface of the left end of the circuit board 12 in a U-shaped curved state.
- the circuit board 12 includes a protection circuit that limits the charge / discharge current of the unit cell 2, and external connection terminals 19, 20, and 21 are arranged side by side on the right side of the upper surface of the circuit board 12. ing.
- the external connection terminals 19, 20, 21 are connected to the contact terminals of external devices such as mobile phones and chargers to input / output charge / discharge current to / from the unit cell 2.
- a pair of inspection terminals 22 and 23 for inspecting the performance of the battery pack 1 are arranged side by side.
- the lead wires 13 and 15 and the lead plates 16 and 17 are formed by cutting a thin plate made of a conductive metal such as aluminum or nickel.
- the electrical component and the upper cover 3 are temporarily assembled on the upper side of the unit cell 2, and a resin mold 5 is formed on the intermediate assembly.
- notches 25, 25 are formed to engage with the positioning convex portions of the external device.
- the upper cover 3 has three windows 26, 27, 29 facing the external connection terminals 19, 20, 21, and two windows 30, 31 facing the inspection terminals 22, 23. There is a submergence determination seal 32 so as to block the upper surface of the window 30, 31. It is pasted.
- Positioning protrusions 33, 33 having predetermined dimensions project downward from the left and right ends of the upper cover 3 as shown in FIGS. 1 and 2, respectively, as shown in FIGS.
- the lower end of the positioning protrusion 33 abuts on the upper surface of the sealing plate 9 of the unit cell 2, so that the space between the upper cover 3 and the upper surface of the unit cell 2 is regulated at a predetermined interval.
- the vertical dimension of the positioning protrusion 33 is 2 mm, for example.
- each positioning projection 33 has a plate shape whose left and right widths are smaller than the front-rear width (the vertical width in FIG. 1).
- the resin mold 5 enters the recesses 35 and 35 as shown in FIG. 5A, so that the upper cover 3 can be prevented from coming off from the resin mold 5.
- a horizontally long board fitting portion 36 into which the circuit board 12 is fitted as shown in FIGS. 1, 3, and 4 is formed as a recess.
- a tape fitting portion 39 into which the double-sided tape 37 is fitted is formed in the middle between the left and right sides of the board fitting portion 36.
- the upper cover 3 is adhered to the circuit board 12 by the double-sided tape 37 and fixed.
- An insulating seal 40 is arranged on the upper surface of the sealing plate 9 of the unit cell 2 from the center of the left and right to the left end as shown in FIGS. 2, 3 and 5B. The insulating seal 40 allows the PTC element 11 and The terminal side lead wire 13 and the board side lead wire 15 are prevented from contacting the sealing plate 9 of the unit cell 2.
- a fitting recess 41 into which a fitting portion of an external device is fitted is formed as shown in FIG.
- adhesive portions 43 surrounded by ring-shaped grooves 42 are respectively provided at the left and right ends of the upper surface of the lower cover 6, and the left and right central portions of the upper surface of the lower cover 6 are provided.
- a tape fitting portion 46 into which the double-sided tape 45 is fitted is formed in a recess. An adhesive is applied to the adhesive portion 43, and the lower cover 6 is attached to the lower surface of the unit cell 2 with the adhesive and the double-sided tape 45.
- the front, rear, left and right peripheral surfaces of the unit cell 2 are covered with a label 47 having insulating properties as shown in FIG.
- the outer surface of the label 47 is printed with a predetermined logo type, etc.
- a procedure for assembling the battery pack 1 will be described.
- One end of the terminal side lead wire 13 is joined to one end of the PTC element 11, and the other end of the lead wire 13 is joined to the negative electrode terminal 10.
- one end of the board-side lead wire 15 is joined to the other end of the PTC element 11, and the other end of the lead wire 15 is joined to the left end portion of the circuit board 12.
- a lead plate 16 is joined to the right end portion of the circuit board 12, and a lead plate 17 is joined to the right side of the upper surface of the sealing plate 9 of the unit cell 2.
- the circuit board 12 is placed on the upper side of the unit cell 2 by bending the board-side lead wire 15 into a U shape, and the lead board 16 and the lead board 17 are joined.
- Double-sided tape 37 is affixed to the upper cover 3, the circuit board 12 is fitted into the board fitting portion 36 of the upper cover 3, and the upper cover 3 is fixed to the circuit board 12, thereby forming an intermediate assembly.
- molten resin that has entered the gap between the inner side surface of the board fitting portion 36 and the side surface of the circuit board 12 from the lower end of the board fitting portion 36 flows upward through the gap, and then the board fitting portion.
- the direction is changed at the upper end of 36 to try to flow through the gap between the upper surface of the circuit board 12 and the upper surface of the board fitting portion 36. That is, the flow path of the molten resin from the lower end of the board fitting portion 36 to the external connection terminals 19, 20, 21 of the circuit board 12 is increased by the amount that the circuit board 12 is fitted into the board fitting portion 36.
- the flow resistance is increased by the amount of change in the flow direction of the molten resin at the upper end of the board fitting portion 36, so that the molten resin does not easily reach the external connection terminals 19, 20, 21. Therefore, when the resin mold 5 is molded, the molten resin is prevented from being covered on the external connection terminals 19, 20, 21, and the external connection terminals 19, 20, 21 are connected to the upper force bar 3 window 26, 27. , 29 can be securely connected to the contact terminals of external devices. [0038] After the molding of the resin mold 5, an adhesive is applied to each adhesive portion 43 of the lower cover 6, and the lower cover 6 is attached to the lower surface of the unit cell 2 with the adhesive and the double-sided tape 45. Attached. A label 47 is affixed to the front, rear, left and right peripheral surfaces of the unit cell 2, and a submergence determination seal 32 is affixed to the upper surface of the upper cover 3. Thereby, the assembly of the battery pack 1 is completed.
- each anchor portion 49 On the side surface of each anchor portion 49, three through holes 50 through which the molten resin of the resin mold 5 passes are arranged side by side and provided in a penetrating manner.
- the vertical dimension of the anchor portion 49 is shorter than the vertical dimension of the positioning protrusion 33, so that the restriction of the distance by the positioning protrusion 33 is not obstructed. Since other points are the same as those of the first embodiment, description thereof is omitted.
- each anchor portion 49 when the resin mold 5 enters each through hole 50 of each anchor portion 49, the upper cover 3 can be prevented from coming off from the resin mold 5.
- the number of through holes 50 arranged in each anchor portion 49 may be at least one.
- Each anchor portion 49 may be provided separately from the positioning protrusion 33 or may be provided so as to be connected to the positioning protrusion 33. Further, in place of the through hole 50, a recess may be formed on one side or both sides of the anchor portion 49.
- Each locking portion 51 is formed in a hook shape so as to cover the upper side of the board fitting portion 36 as shown in FIG. 10, and the upper cover 3 is fitted to the circuit board 12 by the locking portion 51. Fix it. In other words, by pressing the lower surface side of the upper cover 3 against the circuit board 12, the circuit board 12 is fitted into the board fitting part 36 so as to push the respective locking parts 51. Then, each locking portion 51 is restored to the state shown in FIG. 10 and is caught on the lower surface of the circuit board 12, thereby Secure 3 to the circuit board 12.
- each locking portion 51 on the board fitting portion 36 side is inclined in a tapered shape.
- the other points are the same as those in the first embodiment, and a description thereof will be omitted.
- the gap between the inner surface of the board fitting portion 36 and the circuit board 12 is preferably as small as possible (including zero), specifically O. lmm or less. It is preferable.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020077027276A KR101233261B1 (ko) | 2005-05-25 | 2006-05-02 | 배터리팩 |
CN2006800140091A CN101167198B (zh) | 2005-05-25 | 2006-05-02 | 电池部件 |
US11/884,355 US20100143793A1 (en) | 2005-05-25 | 2006-05-02 | Battery Pack |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-153132 | 2005-05-25 | ||
JP2005153134A JP4794908B2 (ja) | 2005-05-25 | 2005-05-25 | 電池パック |
JP2005-153134 | 2005-05-25 | ||
JP2005153132A JP4548663B2 (ja) | 2005-05-25 | 2005-05-25 | 電池パック |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006126379A1 true WO2006126379A1 (ja) | 2006-11-30 |
Family
ID=37451807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/309154 WO2006126379A1 (ja) | 2005-05-25 | 2006-05-02 | 電池パック |
Country Status (4)
Country | Link |
---|---|
US (1) | US20100143793A1 (ja) |
KR (1) | KR101233261B1 (ja) |
CN (1) | CN101167198B (ja) |
WO (1) | WO2006126379A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010062149A (ja) * | 2008-09-03 | 2010-03-18 | Samsung Sdi Co Ltd | 保護回路組立体、電池組立体及び保護回路組立体と電池組立体との結合方法 |
US20100136373A1 (en) * | 2008-12-02 | 2010-06-03 | Samsung Sdi Co., Ltd. | Secondary battery |
US8778518B2 (en) * | 2010-09-16 | 2014-07-15 | Samsung Sdi Co., Ltd. | Battery pack |
US8835025B2 (en) * | 2008-06-03 | 2014-09-16 | Samsung Sdi Co., Ltd. | Battery pack having a combined bare cell, protection circuit module and top case |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100839783B1 (ko) * | 2007-01-03 | 2008-06-19 | 삼성에스디아이 주식회사 | 이차전지 |
JP5291322B2 (ja) * | 2007-10-26 | 2013-09-18 | 日立マクセル株式会社 | 電池パック |
KR101023910B1 (ko) * | 2008-12-22 | 2011-03-22 | 삼성에스디아이 주식회사 | 배터리 팩 |
KR101023895B1 (ko) * | 2009-01-13 | 2011-03-22 | 삼성에스디아이 주식회사 | 배터리팩 |
US8691410B2 (en) * | 2011-11-02 | 2014-04-08 | Samsung Sdi Co., Ltd. | Battery pack |
US9142812B2 (en) * | 2012-01-31 | 2015-09-22 | Samsung Sdi Co., Ltd. | Battery pack |
KR101606143B1 (ko) | 2013-03-11 | 2016-04-01 | 삼성전자주식회사 | 착탈식 배터리 팩을 갖는 전자 장치 |
KR101450221B1 (ko) * | 2013-04-17 | 2014-10-15 | 주식회사 아이티엠반도체 | 배터리 보호회로 모듈 패키지 |
KR101520391B1 (ko) * | 2014-02-11 | 2015-05-14 | 삼성에스디아이 주식회사 | 전지 팩 |
KR102289963B1 (ko) | 2018-06-29 | 2021-08-12 | 주식회사 엘지에너지솔루션 | 홀더를 구비한 이차전지 팩 |
CN208955087U (zh) * | 2018-10-30 | 2019-06-07 | 宁德时代新能源科技股份有限公司 | 二次电池 |
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JP2003086159A (ja) * | 2001-06-28 | 2003-03-20 | Matsushita Electric Ind Co Ltd | 電池及び電池パック |
JP2003197165A (ja) * | 2001-12-25 | 2003-07-11 | Rohm Co Ltd | 保護回路モジュールおよびこれを備える電池パック |
JP2003303580A (ja) * | 2002-02-06 | 2003-10-24 | Sony Corp | バッテリパック及びその製造方法 |
JP2004303625A (ja) * | 2003-03-31 | 2004-10-28 | Hitachi Maxell Ltd | パック電池とその製造方法 |
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JP3737389B2 (ja) * | 2001-06-19 | 2006-01-18 | 京セラ株式会社 | バッテリー |
US7563535B2 (en) * | 2002-02-06 | 2009-07-21 | Sony Corporation | Battery pack with insulating film sheath material and method of producing the same |
US7429432B2 (en) * | 2002-02-13 | 2008-09-30 | Matsushita Electric Industrial Co. Ltd. | Battery pack having circuit substrate resin molded to battery |
KR100974996B1 (ko) * | 2002-10-31 | 2010-08-09 | 산요덴키가부시키가이샤 | 팩 전지 |
JP5013666B2 (ja) * | 2003-10-17 | 2012-08-29 | ソニー株式会社 | 外装フィルムを使用した電池パック及び電池パックの製造方法 |
JP3922281B2 (ja) * | 2003-11-14 | 2007-05-30 | ソニー株式会社 | 電池パックおよび電池パックの製造方法 |
KR100645263B1 (ko) * | 2004-02-18 | 2006-11-14 | 주식회사 엘지화학 | 보호회로부가 구비된 일체형 캠 어셈블리 및 그것이구비되어 있는 이차전지 |
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2006
- 2006-05-02 CN CN2006800140091A patent/CN101167198B/zh not_active Expired - Fee Related
- 2006-05-02 US US11/884,355 patent/US20100143793A1/en not_active Abandoned
- 2006-05-02 KR KR1020077027276A patent/KR101233261B1/ko not_active IP Right Cessation
- 2006-05-02 WO PCT/JP2006/309154 patent/WO2006126379A1/ja active Application Filing
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JP2003086159A (ja) * | 2001-06-28 | 2003-03-20 | Matsushita Electric Ind Co Ltd | 電池及び電池パック |
JP2003197165A (ja) * | 2001-12-25 | 2003-07-11 | Rohm Co Ltd | 保護回路モジュールおよびこれを備える電池パック |
JP2003303580A (ja) * | 2002-02-06 | 2003-10-24 | Sony Corp | バッテリパック及びその製造方法 |
JP2004303625A (ja) * | 2003-03-31 | 2004-10-28 | Hitachi Maxell Ltd | パック電池とその製造方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US8835025B2 (en) * | 2008-06-03 | 2014-09-16 | Samsung Sdi Co., Ltd. | Battery pack having a combined bare cell, protection circuit module and top case |
JP2010062149A (ja) * | 2008-09-03 | 2010-03-18 | Samsung Sdi Co Ltd | 保護回路組立体、電池組立体及び保護回路組立体と電池組立体との結合方法 |
US20100136373A1 (en) * | 2008-12-02 | 2010-06-03 | Samsung Sdi Co., Ltd. | Secondary battery |
US8945734B2 (en) * | 2008-12-02 | 2015-02-03 | Samsung Sdi Co., Ltd. | Secondary battery including protection circuit module |
US8778518B2 (en) * | 2010-09-16 | 2014-07-15 | Samsung Sdi Co., Ltd. | Battery pack |
Also Published As
Publication number | Publication date |
---|---|
KR101233261B1 (ko) | 2013-02-14 |
US20100143793A1 (en) | 2010-06-10 |
CN101167198B (zh) | 2010-05-19 |
KR20080017321A (ko) | 2008-02-26 |
CN101167198A (zh) | 2008-04-23 |
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