WO2006114971A3 - 電子部品モジュール - Google Patents

電子部品モジュール Download PDF

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Publication number
WO2006114971A3
WO2006114971A3 PCT/JP2006/306437 JP2006306437W WO2006114971A3 WO 2006114971 A3 WO2006114971 A3 WO 2006114971A3 JP 2006306437 W JP2006306437 W JP 2006306437W WO 2006114971 A3 WO2006114971 A3 WO 2006114971A3
Authority
WO
WIPO (PCT)
Prior art keywords
lands
rear plane
electronic component
component module
corner
Prior art date
Application number
PCT/JP2006/306437
Other languages
English (en)
French (fr)
Other versions
WO2006114971A2 (ja
WO2006114971A1 (ja
WO2006114971A9 (ja
Inventor
Tsuyoshi Suesada
Kazuaki Higashibata
Toshihiro Hosokawa
Masaki Kawata
Original Assignee
Murata Manufacturing Co
Tsuyoshi Suesada
Kazuaki Higashibata
Toshihiro Hosokawa
Masaki Kawata
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co, Tsuyoshi Suesada, Kazuaki Higashibata, Toshihiro Hosokawa, Masaki Kawata filed Critical Murata Manufacturing Co
Priority to EP06730385.9A priority Critical patent/EP1873826B1/en
Priority to CN2006800013043A priority patent/CN101124674B/zh
Priority to JP2007514510A priority patent/JP4424420B2/ja
Publication of WO2006114971A2 publication Critical patent/WO2006114971A2/ja
Publication of WO2006114971A1 publication Critical patent/WO2006114971A1/ja
Priority to US11/743,216 priority patent/US7615874B2/en
Publication of WO2006114971A3 publication Critical patent/WO2006114971A3/ja
Publication of WO2006114971A9 publication Critical patent/WO2006114971A9/ja
Priority to US12/495,892 priority patent/US20090260856A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/81385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Abstract

　電子部品モジュール（２７ｉ）は、外形が矩形状となっている裏面（２７ａ）を有するセラミック基板と、裏面（２７ａ）に配列された複数の接合材付け用ランド（３）とを備える電子部品モジュールであって、複数の接合材付け用ランド（３）は、裏面（２７ａ）のうち角部（７）を除いた各辺に沿ってそれぞれ１列で配列された外周ランド列（４）を含み、前記複数の接合材付け用ランド（３）は、前記裏面（２７ａ）のうち角部（７）から略対角線方向に内側にずれた位置でなおかつ、前記角部（７）を挟む２辺に沿ってそれぞれ１列で配列されている前記外周ランド列（４）のうち前記角部（７）に最も近い端のものにそれぞれ隣接する位置に配置された角部内側ランド（５）を含む。
PCT/JP2006/306437 2005-04-18 2006-03-29 電子部品モジュール WO2006114971A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP06730385.9A EP1873826B1 (en) 2005-04-18 2006-03-29 Electronic component module
CN2006800013043A CN101124674B (zh) 2005-04-18 2006-03-29 电子元器件组件
JP2007514510A JP4424420B2 (ja) 2005-04-18 2006-03-29 電子部品モジュール
US11/743,216 US7615874B2 (en) 2005-04-18 2007-05-02 Electronic component module
US12/495,892 US20090260856A1 (en) 2005-04-18 2009-07-01 Electronic component module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005120144 2005-04-18
JP2005-120144 2005-04-18

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/743,216 Continuation US7615874B2 (en) 2005-04-18 2007-05-02 Electronic component module

Publications (4)

Publication Number Publication Date
WO2006114971A2 WO2006114971A2 (ja) 2006-11-02
WO2006114971A1 WO2006114971A1 (ja) 2006-11-02
WO2006114971A3 true WO2006114971A3 (ja) 2007-07-05
WO2006114971A9 WO2006114971A9 (ja) 2007-08-16

Family

ID=

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62123744A (ja) * 1985-11-22 1987-06-05 Nec Corp 半導体装置
JPH09148475A (ja) * 1995-11-28 1997-06-06 Hitachi Chem Co Ltd 半導体パッケ−ジ
JPH1079405A (ja) * 1996-09-04 1998-03-24 Hitachi Ltd 半導体装置およびそれが実装された電子部品
JP2003017530A (ja) * 2001-06-28 2003-01-17 Hitachi Ltd 半導体装置およびその実装方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62123744A (ja) * 1985-11-22 1987-06-05 Nec Corp 半導体装置
JPH09148475A (ja) * 1995-11-28 1997-06-06 Hitachi Chem Co Ltd 半導体パッケ−ジ
JPH1079405A (ja) * 1996-09-04 1998-03-24 Hitachi Ltd 半導体装置およびそれが実装された電子部品
JP2003017530A (ja) * 2001-06-28 2003-01-17 Hitachi Ltd 半導体装置およびその実装方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1873826A4 *

Also Published As

Publication number Publication date
JP4424420B2 (ja) 2010-03-03
WO2006114971A2 (ja) 2006-11-02
US20070200221A1 (en) 2007-08-30
KR20070068439A (ko) 2007-06-29
EP1873826A2 (en) 2008-01-02
EP1873826A4 (en) 2010-08-25
CN101124674B (zh) 2010-06-16
US7615874B2 (en) 2009-11-10
US20090260856A1 (en) 2009-10-22
CN101124674A (zh) 2008-02-13
WO2006114971A9 (ja) 2007-08-16
JPWO2006114971A1 (ja) 2008-12-18
EP1873826B1 (en) 2016-04-20
KR100880814B1 (ko) 2009-01-30

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