WO2006103839A1 - Appareil et procede de montage d’un composant electronique - Google Patents

Appareil et procede de montage d’un composant electronique Download PDF

Info

Publication number
WO2006103839A1
WO2006103839A1 PCT/JP2006/302656 JP2006302656W WO2006103839A1 WO 2006103839 A1 WO2006103839 A1 WO 2006103839A1 JP 2006302656 W JP2006302656 W JP 2006302656W WO 2006103839 A1 WO2006103839 A1 WO 2006103839A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier tape
tape
spacer
reel
take
Prior art date
Application number
PCT/JP2006/302656
Other languages
English (en)
Japanese (ja)
Inventor
Tadashi Ito
Makoto Oota
Original Assignee
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corporation filed Critical Shibaura Mechatronics Corporation
Priority to JP2007510334A priority Critical patent/JP4700686B2/ja
Priority to KR1020077019827A priority patent/KR101095882B1/ko
Publication of WO2006103839A1 publication Critical patent/WO2006103839A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00—Winding webs
    • B65H18/08—Web-winding mechanisms
    • B65H18/10—Mechanisms in which power is applied to web-roll spindle
    • B65H18/103—Reel-to-reel type web winding and unwinding mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/195—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/02—Registering, tensioning, smoothing or guiding webs transversely
    • B65H23/032—Controlling transverse register of web
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/41—Winding, unwinding
    • B65H2301/412—Roll
    • B65H2301/4127—Roll with interleaf layer, e.g. liner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/19—Specific article or web
    • B65H2701/1942—Web supporting regularly spaced non-adhesive articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]

Definitions

  • the present invention relates to an electronic component mounting apparatus and mounting method for mounting an electronic component on a carrier tape fed out of a carrier tape supply reel force and winding the carrier tape together with a spacer tape on a carrier tape take-up reel.
  • FIG. 6 shows a conventional mounting apparatus for mounting electronic components on the carrier tape.
  • This mounting apparatus has a carrier tape supply reel 2 around which a carrier tape 1 is wound.
  • the carrier tape 1 is formed with a terminal 3 having a device hole 3a and a lead 3b provided with one end protruding from the device hole 3a. Therefore, the carrier tape 1 is wound around the carrier tape supply reel 2 so as to overlap the spacer tape 4a protecting the lead 3b of the terminal portion 3.
  • the carrier tape 1 fed out from the carrier tape supply reel 2 engages with the carrier tape guide roller 5a and is guided to the transport rail 6, and is taken up from the transport rail 6 onto the carrier tape winding reel 7. It is done.
  • a mounting portion 8 is provided in the middle of the transport rail 6.
  • the carrier tape 1 is fed out from the carrier tape supply reel 2 so that a slack is generated between the carrier tape guide roller 5a and one end of the transport rail 6.
  • the amount of sag of the carrier tape 1 is detected and controlled by the first lower sensor 11a and the first upper sensor l ib. That is, when the first lower sensor 11a detects the sagging carrier tape 1, the feeding of the carrier tape 1 by the carrier tape supply reel 2 is stopped. When the carrier tape 1 is no longer slack and no carrier tape 1 is detected by the first upper sensor l ib, the carrier tape 1 is fed by the carrier tape supply reel 2. Is issued. Thereby, the amount of sag of the carrier tape 1 is controlled within a predetermined range.
  • an electronic component 12 such as a semiconductor chip is mounted on the carrier tape 1 as shown in FIG.
  • the mounting unit 8 has a mounting stage 13 driven in the X and Y directions and a mounting tool 14 driven in the X, Y and Z directions.
  • the spacer tape 4a fed out together with the carrier tape 1 from the carrier tape supply reel 2 is guided by a pair of spacer tape guide rollers 15a and 15b and wound around the spacer tape scraping reel 16. Taken.
  • the mounting stage 13 When the electronic component 12 is supplied onto the mounting stage 13, the mounting stage 13 is positioned below the terminal portion 3 of the carrier tape 1. Next, the mounting tool 14 is driven in the downward direction. Accordingly, the lead 3b of the terminal portion 3 is bent and connected to the bump 12a of the electronic component 12.
  • the carrier tape 1 on which the electronic component 12 is mounted is intermittently fed at a predetermined pitch by a feed mechanism such as a sprocket (not shown) provided to face the transport rail 6.
  • a feed mechanism such as a sprocket (not shown) provided to face the transport rail 6.
  • the carrier tape 1 on which the electronic component 12 is mounted and fed by the feeding mechanism is overlapped with the spacer tape 4b supplied from the spacer tape supply reel 18, and is wound around the carrier tape take-up reel 7. Accordingly, the electronic component 12 mounted on the carrier tape 1 is protected by the spacer tape 4b.
  • the carrier tape 1 is guided by the carrier tape guide roller 5b and wound around the carrier tape winding reel 7.
  • the spacer tape 4b is guided by the lower spacer tape guide roller 15c and the upper spacer tape guide roller 15d and is wound around the carrier tape take-up reel 7.
  • the carrier tape 1 is intermittently fed at a predetermined length by a feed mechanism (not shown). On the winding side, the amount of sag of the carrier tape 1 intermittently fed is detected by the second lower sensor 17a and the second upper sensor 17b.
  • the carrier tape 1 and the spacer tape 4b are guided by the carrier tape guide roller 5b and the spacer tape guide roller 15d, respectively, so that the carrier tape 1 and the spacer tape 4b are wound around the carrier tape take-up reel 7.
  • Position that is, the outer peripheral surface of the winding core 7a of the carrier tape winding reel 7 or the winding surface when the tapes 1, 4b are wound around the carrier tape winding reel 7.
  • the circumferential position in contact with the outer peripheral surface of the tapes 1 and 4b already wound around the core 7a is determined.
  • the above winding position is the position where the carrier tape 1 is in contact with the already wound spacer tape 4b. In the case of the spacer tape 4b, the position is in contact with the already wound carrier tape 1.
  • Patent Document 1 shows a mounting apparatus having the above-described configuration!
  • Patent Document 1 Japanese Patent Laid-Open No. 6-244246
  • the conventional mounting apparatus is configured so that the carrier tape 1 and the spacer tape 4b have the same winding position Z at which the carrier tape 1 and the spacer tape 4b are wound around the carrier tape take-up reel 7.
  • the roller 5b and the upper spacer tape guide roller 15d were positioned and provided. That is, the carrier tape guide roller 5b and the upper spacer tape guide roller 15d are arranged close to the lower side in the radial direction of the carrier tape take-up reel 7, thereby making the take-up position Z the same.
  • the carrier tape 1 may swing in the width direction during winding. If the carrier tape 1 is wound around the carrier tape take-up reel 7 while swinging in the width direction, the take-up may be shifted in the width direction of the carrier tape take-up reel 7.
  • the carrier tape 1 taken up on the carrier tape take-up reel 7 may be shaken in the width direction. Before the carrier tape 1 is fitted, that is, with the carrier tape 1 being displaced in the width direction, the carrier tape 1 is The reel is pressed and held on the outer peripheral surface of the take-up reel 7 and taken up.
  • the present invention even when the carrier tape is swung in the width direction, the swing is reduced and the spacer tape is wound together with the carrier tape. It is an object of the present invention to provide a mounting apparatus and a mounting method that can be wound on a tape take-up reel.
  • the present invention is a mounting device for mounting an electronic component on a carrier tape, and the carrier tape supply reel in which the carrier tape and the spacer tape are overlapped and wound,
  • a spacer tape take-up reel that winds up the spacer tape fed together with the carrier tape from the carrier tape supply reel;
  • a carrier tape take-up reel that winds up the carrier tape on which electronic components are mounted in this mounting part
  • a spacer tape supply reel that supplies a spacer tape that is wound over the carrier tape when the carrier tape on which the electronic component is mounted is scraped off by the carrier tape take-up reel, and the carrier tape take-up reel.
  • a spacer tape guide roller for guiding the spacer tape wound around
  • the spacer tape guide is wound on the downstream side of the winding direction of the carrier tape with respect to the winding position of the spacer tape that is wound around the carrier tape take-up reel and presses and holds the carrier tape.
  • An electronic component mounting apparatus comprising:
  • the present invention is a mounting method for mounting an electronic component on a carrier tape, A step of feeding out the carrier tape wound around the carrier tape supply reel, a step of mounting the electronic component on the carrier tape fed out of the carrier tape supply reel,
  • FIG. 1 is a front view showing a schematic configuration of a mounting apparatus showing a first embodiment of the present invention.
  • FIG. 2 is a view showing a carrier tape take-up reel for explaining a take-up position of the carrier tape and the spacer tape with respect to the carrier tape take-up reel.
  • FIG. 3 is a side view, partly in section, showing the mounting structure of the upper spacer tape guide roller.
  • FIG. 4 is a front view of an attachment member to which an upper spacer tape guide roller according to a second embodiment of the present invention is attached.
  • FIG. 5 is a side view showing a mounting hole image of an upper spacer tape guide roller showing a third embodiment of the present invention.
  • FIG. 6 is a front view showing a schematic configuration of a conventional mounting apparatus.
  • FIG. 7 is an enlarged plan view showing a part of the carrier tape.
  • FIG. 8 is a diagram for explaining mounting in the mounting unit.
  • FIGS. 1 to 3 The same parts as those of the conventional configuration shown in FIG.
  • the mounting apparatus of the present invention has an upper spacer tape guide roller 15d for setting the winding position of the spacer tape 4b wound around the carrier tape winding reel 7.
  • This upper spacer tape guide roller 15d It is arranged above the carrier tape guide roller 5b for guiding the carrier tape 1 wound around the take-up reel 7, and is provided so that the vertical positioning can be adjusted by the mounting member 21 as positioning means.
  • the attachment member 21 is in the form of a strip plate, and is arranged on the side of the carrier tape take-up reel 7 with the longitudinal direction along the vertical direction. As shown in FIG. 3, the attachment member 21 has a plurality of attachment holes 22 formed at predetermined intervals in the vertical direction. Then, the upper spacer tape guide roller 15d is attached and fixed to the attachment hole 22 at a predetermined position by the screw 23 via the washer 23a.
  • the upper spacer tape guide roller 15d is attached to the attachment member 21 and arranged above the carrier tape guide roller 5b, so that it is an outer peripheral surface of winding as shown in FIG.
  • the winding position X of the spacer tape 4b with respect to the winding core 7a of the carrier tape winding reel 7 can be set downstream of the winding position Y of the carrier tape 1 in the winding direction.
  • the winding position X of the spacer tape 4b was shifted to the downstream side in the winding direction from the winding position Y of the carrier tape 1. Therefore, when the carrier tape take-up reel 7 is rotationally driven and the take-up starts, the carrier tape 1 comes into contact with the outer peripheral surface of the take-up, and when the carrier tape take-up reel 7 rotates by a predetermined angle, The spacer tape 4b is wound around the carrier tape 1 on the outer peripheral surface of the winding. That is, the spacer tape 4 b is wound around the carrier tape take-up reel 7 with a predetermined time delay from the carrier tape 1.
  • the spacer tape 4b presses and holds the carrier tape 1 after the carrier tape 1 swings out. It will be wound up. As a result, even if the carrier tape 1 swings during winding, it is possible to prevent the carrier tape 1 from being pressed and held in a state where the carrier tape 1 is displaced by the spacer tape 4b.
  • the amount of deflection of the carrier tape 1 when it is taken up by the carrier tape take-up reel 7 varies depending on the type of carrier tape 1 such as thickness, width dimension, material (particularly flexibility) or weight. come. [0030] If the amount of deflection of the carrier tape 1 varies depending on the type of product, the carrier tape 1 takes up from the carrier tape take-up reel 7 until the run-out stops and the carrier tape take-up reel 7 rotates. The angle is different.
  • the mounting position of the upper spacer tape guide roller 15d with respect to the mounting member 21 is changed.
  • the position where the spacer tape 4b is held by the carrier tape take-up reel 7 by pressing the spacer tape 4b is set to the carrier. It can be changed downstream of the winding position Y of tape 1 in the winding direction.
  • the winding position of the spacer tape 4b is set to the first position shown in FIG. Change to position XI downstream of winding position X.
  • the spacer tape 4b can press and hold the carrier tape 1 when the swing of the carrier tape 1 taken up by the carrier tape take-up reel 7 is settled.
  • the winding position of the spacer tape 4b is set to the position X2 upstream from the initial winding position X.
  • the spacer tape 4b can press and hold the carrier tape 1 when the swing of the carrier tape 1 taken up by the carrier tape take-up reel 7 is settled.
  • the winding position of the spacer tape 4b is not set to X2, but remains XI on the downstream side of X2.
  • the carrier tape 1 is not pressed and held by the spacer tape 4b when the deflection is settled at the winding position Y, but is pressed and held by the spacer tape 4b after being wound from X2 to XI. That's it.
  • the rotation angle from when the carrier tape 1 is wound around the carrier tape take-up reel 7 until it is pressed and held by the spacer tape 4b increases.
  • the carrier tape 1 may be displaced on the outer peripheral surface of the take-up core 7a of the take-up reel 7. Therefore, it is preferable that the carrier tape 1 is held by the spacer tape 4b when the run-out is stopped.
  • the upper spacer tape guide is used so that the spacer tape 4b presses and holds the carrier tape 1 when the runout has subsided.
  • the mounting position of the roller l 5d with respect to the mounting member 21 is set.
  • FIG. 4 is a second embodiment showing a modified example of the attachment member 21 which is a positioning means.
  • the attachment member 21 includes a plurality of members shown in the first embodiment.
  • a long hole 25 is formed in place of the mounting hole 22, and the mounting position of the upper spacer tape guide roller 15 d can be changed along the long hole 25.
  • FIG. 5 is a third embodiment showing still another modified example of the positioning means.
  • an upper spacer tape guide roller 15d is provided on the movable member 26.
  • the movable member 26 is provided so as to be movable along the linear guide 27.
  • a screw shaft 28 is screwed onto the movable member 26, and the screw shaft 28 is rotationally driven by a motor 29.
  • the movable member 26 can be moved along the linear guide 27. Therefore, the upper spacer tape guide roller 15d provided on the movable member 26. Can be set. That is, the winding position of the spacer tape 4b can be set.
  • the spacer tape wound around the carrier tape take-up reel Since the winding position is set to the downstream side in the winding direction from the winding position of the carrier tape, the carrier tape is wound around the carrier tape winding reel, and the force is delayed to wind the spacer tape. For this reason, the spacer tape is wound after the carrier tape has settled, so that the carrier tape can be wound without any positional displacement.
  • the winding position of the spacer tape can be set. For this reason, even if the amount of runout varies depending on the quality of the carrier tape, the carrier tape can be reliably wound without slipping.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Winding Of Webs (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)

Abstract

Selon l’invention, une bande support (1) est enroulée sur une bobine enrouleuse (7) de bande support sans aucun décalage de position. Lorsque la bande support sur laquelle est monté un composant électronique (12) par une partie de montage (8) est décalée dans le sens de la largeur, l’enroulement d’une bande d’espacement (4b) simultanément à la bande support permet de supprimer ce décalage. Un rouleau de guidage (15d) de bande d’espacement capable de réaliser un changement de position permet d’établir la position d’enroulement de la bande d’espacement, enroulée par la bobine enrouleuse de bande support et maintenant par compression la bande support, en aval d’une position d’enroulement de bande support dans le sens d’enroulement.
PCT/JP2006/302656 2005-03-28 2006-02-15 Appareil et procede de montage d’un composant electronique WO2006103839A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007510334A JP4700686B2 (ja) 2005-03-28 2006-02-15 電子部品の実装装置及び実装方法
KR1020077019827A KR101095882B1 (ko) 2005-03-28 2006-02-15 전자 부품의 실장 장치 및 실장 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005091976 2005-03-28
JP2005-091976 2005-03-28

Publications (1)

Publication Number Publication Date
WO2006103839A1 true WO2006103839A1 (fr) 2006-10-05

Family

ID=37053108

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/302656 WO2006103839A1 (fr) 2005-03-28 2006-02-15 Appareil et procede de montage d’un composant electronique

Country Status (5)

Country Link
JP (1) JP4700686B2 (fr)
KR (1) KR101095882B1 (fr)
CN (1) CN100533700C (fr)
TW (1) TWI385737B (fr)
WO (1) WO2006103839A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2855313A4 (fr) * 2012-05-31 2016-04-27 Hewlett Packard Development Co Bobinage de films de traitement

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5059693B2 (ja) * 2008-06-06 2012-10-24 Ｊｕｋｉ株式会社 部品供給装置
CN104770077A (zh) * 2012-08-31 2015-07-08 黄永洙 具有元件自动暴露装置的载带的自动供给设备
JP6239362B2 (ja) * 2013-12-05 2017-11-29 Juki株式会社 電子部品供給装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01187161A (ja) * 1988-01-19 1989-07-26 Toshiba Corp キャリアテープの定量搬送装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244246A (ja) * 1993-02-13 1994-09-02 Shibuya Kogyo Co Ltd ボンディング装置
JP3223780B2 (ja) * 1996-01-19 2001-10-29 松下電器産業株式会社 チップの実装装置
JP2001127086A (ja) * 1999-10-26 2001-05-11 Hitachi Cable Ltd 半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01187161A (ja) * 1988-01-19 1989-07-26 Toshiba Corp キャリアテープの定量搬送装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2855313A4 (fr) * 2012-05-31 2016-04-27 Hewlett Packard Development Co Bobinage de films de traitement

Also Published As

Publication number Publication date
JPWO2006103839A1 (ja) 2008-09-04
CN101133485A (zh) 2008-02-27
KR20070100824A (ko) 2007-10-11
KR101095882B1 (ko) 2011-12-21
TWI385737B (zh) 2013-02-11
TW200711011A (en) 2007-03-16
JP4700686B2 (ja) 2011-06-15
CN100533700C (zh) 2009-08-26

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