Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
  • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
  • G03F9/7049—Technique, e.g. interferometric
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
  • G03F7/70605—Workpiece metrology
  • G03F7/70616—Monitoring the printed patterns
  • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
  • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
  • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Definitions

• the present invention relates generally to metrology and inspection techniques, which are used in a semiconductor manufacturing processes. More specifically, the present invention relates to techniques for acquisition of wafer targets and measuring an alignment error between different layers or different patterns on the same layer of a semiconductor wafer stack.
• Target acquisition is one of the most widespread processes during optical inspection and metrology of semiconductor. Every inspection or metrology recipe to test a semiconductor process requires accurate navigation to the target and identification and acquisition of the feature to be inspected.
• target acquisition is typically performed via special acquisition patterns that are printed together with layers of the wafer, next to the positions where the actual inspection or metrology operations are to be performed.
• the images of these acquisition patterns are captured via an imaging tool and an analysis algorithm is used to verify that the captured image contain the acquisition pattern, and calculate the target image coordinates on the true wafer.
• the measurement of overlay and alignment error on a wafer is one of the most critical process control techniques used in the manufacturing of integrated circuits and devices. Overlay accuracy generally pertains to the determination of how accurately a first patterned layer aligns with respect to a second patterned layer disposed above or below it. Alignment error relates to the determination of how accurately a first pattern aligns with respect to a second pattern disposed on the same layer.
• overlay and alignment are used herein interchangeably.
• overlay and alignment measurements are performed via test patterns that are printed together with layers of the wafer.
• the images of these test patterns are captured via an imaging tool and an analysis algorithm is used to calculate the relative displacement of the patterns from the captured images.
• an object is imaged by an optical tool having a light source for directing incident beams towards the object.
• the beams are reflected and scattered away from the object towards an image sensor, such as a CCD (charge coupled device) camera.
• an image sensor such as a CCD (charge coupled device) camera.
• CCD charge coupled device
• the CCD camera then must be placed at this specific image plane location to achieve a focused image of the target with the least amount of blurring or with the most clarity.
• optical aberrations of the imaging system cause a placement error of the image.
• these placement errors are different for the scattered light from the first and second layer.
• the difference in the aberrations induced placement error causes an error in the overlay measurement.
• accurate centering of the overlay target along the optical axis of the optical system is required.
• a target imaging mechanism that provides flexible placement of the imaging sensor (z) would be beneficial.
• an overlay metrology mechanism that provides flexible placement of the overlay target (x,y) would be beneficial.
• the illumination of the system is only directed at specific angles at a grating target and the imaging lens is set to capture corresponding pairs of diffracted
• ⁇ orders that interfere with each other to form a sinusoidal image That is, everything captured by the imaging lens is used for imaging information.
• embodiments of the present invention provide higher accuracy as well as less sensitivity to optical aberrations and thus less tool induced shift, than conventional overlay determination techniques and apparatus.
• Figure 1 illustrates the relationship between the resultant sinusoidal image formed from the interference between two monochromatic beams and the beams' angular separation and wavelength.
• Figure 2 illustrates the infinite depth of focus achieved with monochromatic two beam imaging.
• Figure 3 is a top plan view of an example periodic overlay target in accordance with one embodiment of the present invention.
• Figure 4 is a schematic of a generalized 1 st order diffraction imaging system along the x axis, where only two diffracted orders are captured by the imaging lens, in accordance with a specific implementation of the present invention.
• Figure 4 A is a schematic of a 1 st order diffraction imaging system along the x axis, where only the 0 th and the -1 st diffracted orders are captured by the imaging lens, in accordance with another embodiment of the present invention.
• Figure 4B is a schematic of a 1 st order diffraction imaging system along the x axis using dipole illumination, where only the 0 th and a 1 st diffracted order of both incident beams are captured by the imaging lens, in accordance with another embodiment of the present invention.
• Figure 5 A is a diagrammatic side view representation of a dipole illumination system in accordance with one implementation.
• Figure 5B is a top view of the aperture stop of Figure 5 A.
• Figure 5C is a diagrammatic representation of an alternative illumination system using a Diffractive Optical Element (DOE) to generate multiple sources at the aperture plane.
• Figure 5D is a top view of an aperture stop of a system for a cross quadrapole illumination configuration.
• DOE Diffractive Optical Element
• Figure 5E is a top view of an aperture stop of a system for a diagonal quadrapole illumination configuration.
• Figure 6 is a diagrammatic representation of a 1 st order diffraction optical imaging system for target acquisition or for determining overlay or alignment in accordance with one embodiment of the present invention.
• embodiments of the present invention provide mechanisms for target acquisition or for determining overlay (or alignment) by imaging with only two scattered beams from a periodic acquisition or overlay target such that the wavelength and the angle of separation between the two beams are substantially matched to the pitch of the target and cause a substantially pure sinusoidal image to be formed.
• the depth of focus of this sinusoidal image is very large. Accordingly, the position of the image sensor is flexible and does not have to be exactly placed at a single image focus plane location. That is, the sensor may be placed at a continuum of locations after the imaging lens and still reside in a well focused image plane.
• p — sm ⁇ j -sin ⁇ 2
• ⁇ i the angular separation between the first wave and the normal to the image plane
• ⁇ 2 is the angular separation between the second wave and the normal to the image plane
• ⁇ is the wavelength of the light.
• Equation 1 When the two interfering coherent plane waves are symmetric about the normal to the image plane with each having an angular separation ⁇ between the wave and the normal to the image plane, Equation 1 reduces to Equation 2: ⁇
• the incident beams have both an angular and spectral spread when striking the target.
• the periodic target is finite in size. Accordingly, although the depth of focus is not infinite, a very large depth of focus can be achieved by using two ray bundles with particular characteristics to image a target with specific characteristics.
• the large depth of focus defines a continuous range in which all planes can be used as image planes. This continuous range is termed the depth of focus of the system. It is a range (e.g. one micrometer) across which the image quality (focus) is good.
• any suitable mechanism may be utilized to create a sinusoidal image at a near infinite depth of focus.
• a periodic target in order to form a sinusoid image, a periodic target is provided that is imaged with an off-axis incident plane wave, such that only two scattered plane waves are captured by the imaging lens.
• the resulting sinusoidal image has the same period as the target's pitch.
• Any suitable periodic target may be utilized.
• Figure 3 is a top plan view of an example periodic overlay target 300 having a first set of periodic line structures 302 in a first layer and a second set of periodic line structures 304 in a second layer in accordance with one embodiment of the present invention.
• this particular arrangement is merely illustrative and is not to limit the scope of the invention.
• an array of other structures such as squares, segmented lines, etc. may be utilized with the apparatus embodiments described herein.
• the imaging optics are then arranged so that the target image is constructed by only two scattered plane waves so that the image will be sinusoidal and have the same pitch as the target.
• Two output beams are generated by any suitable mechanism so as to follow the requirements of Equations 1 or 2 described above. These two beams may be generated, by way of example, by two diffracted orders from a periodic target. Preferably, two output beams having a wavelength ⁇ are scattered with an angular separation of 2 ⁇ from a single target with pitch p.
• the relative displacement between an image of structures on a first layer and an image of structures on a second layer is important for overlay determination.
• the output beams scattered from the target are in the form of multiple angles, defined as 0 th order diffraction, -1 st order diffraction, +l st order diffraction, -2 nd order, +2 nd order, etc. These scattered output beams are called diffraction orders of the grating.
• the pitch of the target can be selected such that the -1 st or the +l st order diffraction is reflected on the same path as the illuminating light.
• an effective source function S(J x ,f ) ⁇ (J x -v,f y ) is used, where f x and f y are the spatial frequencies variables and v is the off-axis frequency. If v is chosen such that:
• the imaging optics are also configured so that only the -1 st or the +l st order (and the 0 th order) diffractions for each incident beam are captured by the imaging lens.
• the condition of "1 st order diffraction" imaging (only the 0 th and either the -1 st
• Ip is achieved for pitch gratings for which 1 I 3 NA
• Equation 3 y F r
• Equation 4 p >
• Equation 5 ⁇ p ⁇
• Equation 5 is relevant for dipole illumination and for diagonal quadrupole illumination schemes.
• FIG. 4 is a schematic of a generalized I s order diffraction imaging system, where only two diffracted orders are captured, in accordance with one implementation of the present invention. As shown, an incident beam 402 is directed towards the grating target 404. Multiple diffracted orders are then scattered from the target 404.
• the imaging system (shown here as lens 410) is configured to capture in this example only the +l st and +2" diffracted orders.
• the imaging lens is sized or the aperture stop is adjusted, and the lens is positioned so as to only capture these two diffracted orders. As shown, only a portion of lens 410 is shown, while the other portion that is not shown is blocked using an aperture stop.
• the imaging lens may be arranged to capture any two diffraction orders. As illustrated in Figure 4, the +l st and +2 nd orders 403 and 406 pass through the imaging lens 410, while all other diffracted orders are prevented from passing through such imaging lens 410. In effect, two nearly plane waves 412a and 412b are output from the imaging lens 410. These output beams 412a and 412b form a sinusoidal image 414 across a very wide depth of focus. (Only the center plane of this focus range is illustrated for simplicity). A sensor (not shown) can then be placed at a larger range of positions to detect this sinusoidal image 414 with good focus being achieved across this sensor position range.
• Figure 4A is a schematic of a 1 st order diffraction imaging system, where the two diffracted orders captured by the lens are the 0 and -1 st diffracted orders, in accordance with another embodiment of the present invention.
• an incident beam 452 is directed towards the grating target 454. Multiple diffracted orders are then scattered from the target 454.
• 0 th diffracted order 453 is the specular reflection of incident beam 452.
• the -1 st diffracted order 456 follows the same path as the incident beam 452, but in the opposite direction.
• Other orders are also scattered from the target 454.
• the +l st diffracted order 458 is also scattered from the target.
• Other diffracted orders, such as -2 nd and +2 nd diffracted orders may also be scattered from the periodic target 454, but are not shown so as to simplify the illustration.
• the imaging system (shown here as lens 460) is configured (using the above
• Equations 2 ⁇ 5) to capture only the 0 and -1 st diffracted orders.
• the imaging lens is sized, or rather the numerical aperture (NA) is adjusted, so as to only capture two diffracted orders.
• the 0 th and -1 st orders 453 and 456 pass through the imaging lens 460, while other diffracted orders (e.g., the +l st diffracted order 458) are prevented from passing through such imaging lens 460.
• Li effect two nearly plane waves 462a and 462b are output from the imaging lens 460. These output beams 462a and 462b form a sinusoidal image 464 across a very wide depth of focus, (only the center plane of this focus range is illustrated for simplicity).
• a sensor (not shown) can then be placed at a larger range of positions to detect this sinusoidal image with good focus being achieved across this sensor position range.
• any suitable sensor may be used, such as a charge coupled detectors (CCD) or CMOS based digital camera, to detect the sinusoidal images from the imaged periodic targets.
• CCD charge coupled detectors
• CMOS complementary metal-oxide-semiconductor
• this imaging system described herein can be used for the purpose of overlay metrology to image two adjacent periodic targets, a first periodic target on a first layer and a second periodic target on a second layer.
• both the first and second periodic targets have a same pitch (e.g., the first and second targets 302 and 304 of Figure 3) and are illuminated with an incident beam such that the two diffracted orders captured by the lens have a well defined separation angle and wavelength such that the conditions of Equation2 are met, both the first and second targets will be imaged by only the 0 and - 1 st diffracted order beams, which will sample the imaging lens at the same locations.
• embodiments of the present invention cause the locations through which the diffracted 0 th and -1 st orders pass for both targets to be the same, defining the aberrations that the output beams see as they pass through the imaging system for both layers to be the same.
• the imaging lens will cause a same placement error for both the first layer target and the second layer target, bringing the tool induced shift (TIS) of an overlay measurement between the two layers to zero.
• TIS tool induced shift
• the aberrations of the imaging optics shift the location of the sinusoid formed by the 0 th and -1 st diffracted order output beams for the first layer by 2 nm to the right, these aberrations will likewise shift the sinusoid formed by the 0 th and -1 st diffracted order output beams for the second layer by 2nm to the right.
• placement error does not affect overlay determination since the relative displacement between the first and second layer targets is only important and not the absolute position of either of the two targets. Any misalignment between the two images from the first and second layer targets can be attributed to only the overlay error.
• the overlay error may be determined in any suitable manner by analyzing whether and how much the images from the first and second layer targets are misaligned.
• the center of symmetry (COS) of the first layer image is determined, and the COS of the second layer image is determined.
• the difference between the first COS and the second COS can then be defined as the overlay error. Since the phase of the sinusoid image corresponds to the phase of the target, the phase of the sinusoid of the first layer structures can be compared to the phase of the sinusoid of the second layer structures. The phase difference can then be translated to spatial misalignment and defined as the overlay error.
• a single incident beam may be used to produce two output beams, 0 th and 1 st diffraction order beams, that satisfy the conditions of the above Equations.
• the single incident beam 452 results in 0 th diffraction order output beam 453 and -1 st diffraction order output beam 456.
• These two output beams would then pass through imaging lens 460 and result in two output beams 462a and 462b that interfere to form sinusoidal image 464.
• two incident beams are used to generate more light onto the target and a brighter image.
• Figure 4B is a schematic of a 1 st order diffraction imaging system, where two incident beams are used. This configuration is called dipole illumination.
• two incident beams 472a and 472b are directed towards the target 474.
• Multiple diffracted orders are then scattered from the target 474.
• 0 th diffracted order 473a and 473b are specular reflections of incident beams 472a and 472b, respectively.
• the -1 st diffracted order 476a and the +l st diffracted order 476b follow the same paths as the 0 diffracted order beams 474b and 474a respectively.
• Other diffracted orders are also scattered from the periodic target 474, but are not shown so as to simplify the illustration.
• the sinusoidal image 484 resulting from the 0 th and -1 st diffracted orders from 473a and 476a adds up to reinforce the sinusoidal image 484 resulting from the 0 th and +l st diffracted orders 473b and 476b.
• the result is a brighter sinusoidal image 484.
• Embodiments of the present invention will also result in better process robustness.
• the image has been found to vary across the wafer, while measuring the same target at multiple sites across the wafer.
• the image variation is due to process variations across the wafer.
• Each site has slightly different characteristics, e.g., reflect at different spectral and angular intensity patterns.
• Periodic targets will maintain diffractive orders at well defined angles for each wavelength and by allowing only two beam imaging a sinusoidal image will be formed with a pitch depending only on the pitch of the target, rather than the process.
• TIS variation is also due to process variations across the wafer.
• TIS due to optical aberrations is eliminated and thus TIS variability will be reduced.
• TIS and overlay measurement will be less sensitive to process variations.
• Embodiments of the present invention will also result in higher contrast images, m the case of an isolated line that is imaged with a brightfield source, multiple diffraction orders are generated at multiple angles because the illumination is generated at multiple angles as well. In fact, multiple diffraction orders are generated for each of the different illumination angles. Some of the output rays will only have one strongly diffracted order captured by the imaging optics and this single order ray will not have a corresponding coherent peer with which to interfere to then contribute to image formation. Thus, this single order ray will only contribute to the general DC background. This effect reduces the contrast quality.
• the illumination is only directed at specific angles resulting in exactly corresponding pairs of diffracted orders that are captured by the imaging lens and interfere with each other to form a sinusoidal image. That is, everything captured by the imaging lens is used for imaging information.
• the 0 th diffraction order beam 473 a and the -1 st diffracted order beam 476a will form a first sinusoidal image
• the 0 th diffracted order beam 473b and the +l st diffracted order 476b will form a second sinusoidal image that overlaps with and reinforces the first sinusoidal image. Since all of the output beams that are imaged in embodiments of the present invention contribute to the image, there is less DC background noise. Accordingly, contrast is improved over other types of conventional imaging systems.
• a quadrapole illumination system may be implemented for imaging a target having periodic structures in both the y and x direction.
• a dipole system may be used for both x and y targets, where the x or y targets are imaged in a first direction using two beams and then the wafer is rotated with respect to the dipole illumination such that the other x or y targets are imaged in a second direction
• crossed quadrapole illumination may be used to contribute two beams in the x direction and two beams in the y direction.
• diagonal quadrapole illumination may be used to contribute four beams each contributing in both the x and y directions, as opposed to contributing two incident beams to the x direction and two incident beams to the y direction.
• FIG. 5A is a diagrammatic side view representation of a kohler illumination system employing dipole illumination system 500 in accordance with one implementation.
• the illumination system 500 includes a light source 512 that radiates light 513 at all angles. Any suitable number of light sources may be used.
• the light 513 from the light source is directed to aperture plane (aperture stop) 508.
• the aperture plane 508 includes one or more apertures to thereby form one or more point like sources radiating at all angles forming ray bundles, such as the two ray bundles 509a and 509b.
• two actual point like sources radiating at all angles such as Light Emitting Diodes (LEDs) could be located at the aperture plane 508 to form the two ray bundles 509a and 509b.
• LEDs Light Emitting Diodes
• condenser lens 510 which is configured to focus the two ray bundles 509a and 509b in the form of a first beam 504a and a second beam 504b that are directed towards periodic target 502 at specific angles.
• the first and second beams 504a and 504b have a 2 ⁇ X separation that is substantially matched to the pitch of target along the x axis p x and to the specific wavelength used.
• the two incident beams 504a and 504b are used to image a target in a single direction.
• incident beams 504 are used to image x direction structures although they may alternatively be used to image y direction structures.
• Figure 5B is a top view of the aperture stop 508 of system 500 with respect to the two incident beams 504a and 504b of Figure 5A. As shown, the beams 504a and 504b emanate with respect to aperture stop 508 towards the target 502 in two directions.
• Figure 5C is a diagrammatic representation of an alternative illumination system implementation.
• an incoming beam 520 is split into multiple beams 522 using a DOE (Diffractive Optical Element) 521, such that multiple beams hit the aperture plane 524 at the desired locations.
• DOE diffractive Optical Element
• Each beam 522 is than spread angularly using a diffuser 526 so that each beam radiates a ray bundle in all directions.
• condenser lens 510 which is configured to focus the two ray bundles to hit the target at a specific angle (not shown).
• a system may be configured to generate two beams for the x direction structures and two beams for the y direction structures.
• Figure 5D is a top view of an aperture stop of a system for this crossed quadrapole configuration. As shown, a first beam originating from aperture 556a and a second beam originating from aperture 556b are directed towards a periodic target for imaging the target structures in a y direction. These y direction beams 556 have a 2 ⁇ y separation along the y axis matched to the pitch of target along the y axis, p y , and to the specific wavelength used.
• a first beam originating from aperture 554a and a second beam originating from aperture 554b are directed towards the same target for imaging target structures in the x direction.
• These beams 554 have a 2 ⁇ X separation along the x axis matched to the pitch of target along the x axis, p x , and to the specific wavelength used.
• Figure 5E is a top view of an aperture stop of a system for a diagonal quadrapole configuration. In this configuration all the beams originating from apertures 574a-574d contribute to image formation of both the x and y direction structures.
• Figure 6 is a diagrammatic representation of an optical imaging system for 1 st order diffraction imaging for target acquisition or for determining overlay or alignment in accordance with one embodiment of the present invention. For clarity, the illumination path is shown as if the system is a transmitted light system. In most embodiments the system is a reflected light system and the illumination path also passes through the objective lens from top to bottom. As shown, the system 600 includes a beam generator 602 for directing at least one beam towards a periodic target having structures with a specific pitch /?
• the at least one incident beam has a wavelength value of ⁇ and an angle ⁇ from an axis that is perpendicular to a plane of the target towards a periodic target.
• Angle ⁇ and wavelength value ⁇ of the at least one incident beam and the pitch p of the periodic target are selected to substantially meet the requirement of Equation 2.
• the system further includes a sensor 612 for receiving the first and second output beams and generating an image based on the first and second output beams, wherein the image is sinusoidal.
• the system also includes a controller for (i) causing the beam generator to direct the at least one incident beam towards a periodic target or set of targets having a specific pitchy so that the sensor generates an image of the target or targets and (ii) analyzing the image.
• the image analysis includes determining whether the image is indeed the acquisition target.
• the image analysis includes determining whether the first and second targets from a first and second layers have an overlay or alignment error.
• the beam generator is realized using a light source 604 and a condenser lens 606.
• the light source may be implemented by any suitable device, such as a Diffractive Optical Element (DOE) for the generation of the at least one off axis illumination ray bundle directed at the condenser lens, or the generation of the at least one off axis illumination beam directed at the periodic target with pitch p.
• DOE Diffractive Optical Element
• the advantage of realizing the illumination beam with a DOE is that a DOE can be designed to be spectrally "Self aligned" to the requirement of Equation 1 or 2. That is, a single DOE can be used to direct a spectrally broad incident beam onto the target having each wavelength being directed at a different incident angle ⁇ such that Equations 1 or 2 is being met simultaneously for all wavelengths of the incident beam.
• a DOE can also be used to generate multiple illumination beams.
• a Diffractive beam-multiplication element may be used to split a beam into several beams, each with the characteristics of the original beam except for power and angle of propagation.

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• 2006
  • 2006-02-27 US US11/363,755 patent/US7528953B2/en active Active
  • 2006-02-28 JP JP2007558164A patent/JP4994248B2/ja not_active Expired - Lifetime
  • 2006-02-28 WO PCT/US2006/007195 patent/WO2006094021A2/en not_active Ceased

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