WO2006090682A1 - 微細構造体の加工方法および微細構造体の加工装置 - Google Patents
微細構造体の加工方法および微細構造体の加工装置 Download PDFInfo
- Publication number
- WO2006090682A1 WO2006090682A1 PCT/JP2006/303016 JP2006303016W WO2006090682A1 WO 2006090682 A1 WO2006090682 A1 WO 2006090682A1 JP 2006303016 W JP2006303016 W JP 2006303016W WO 2006090682 A1 WO2006090682 A1 WO 2006090682A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- block
- heating
- surface plate
- processing
- cooling
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 69
- 238000003754 machining Methods 0.000 title abstract description 8
- 238000001816 cooling Methods 0.000 claims abstract description 109
- 238000012545 processing Methods 0.000 claims description 121
- 239000000463 material Substances 0.000 claims description 113
- 238000010438 heat treatment Methods 0.000 claims description 105
- 238000000465 moulding Methods 0.000 claims description 75
- 239000012778 molding material Substances 0.000 claims description 49
- 238000003672 processing method Methods 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 28
- 230000008569 process Effects 0.000 claims description 24
- 230000007246 mechanism Effects 0.000 claims description 18
- 239000000919 ceramic Substances 0.000 claims description 15
- 229910052582 BN Inorganic materials 0.000 claims description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 claims 2
- 238000009434 installation Methods 0.000 claims 1
- 238000007599 discharging Methods 0.000 abstract description 3
- 239000004417 polycarbonate Substances 0.000 description 68
- 229920005989 resin Polymers 0.000 description 24
- 239000011347 resin Substances 0.000 description 24
- 238000012546 transfer Methods 0.000 description 8
- -1 polyethylene Polymers 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 229920006289 polycarbonate film Polymers 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 238000000018 DNA microarray Methods 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001053 micromoulding Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/30—Mounting, exchanging or centering
- B29C33/306—Exchangeable mould parts, e.g. cassette moulds, mould inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/16—Cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/52—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
- B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
- B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
- B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
- B29C2043/046—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds travelling between different stations, e.g. feeding, moulding, curing stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
Definitions
- Fine structure processing method and fine structure processing apparatus Fine structure processing method and fine structure processing apparatus
- the present invention relates to a method for processing a fine structure used for pattern formation of various devices highly integrated in the electronics field and the bio field, and an apparatus for applying the fine structure.
- a stamper (mold) on which a fine pattern has been formed is embossed with a predetermined molding pressure into a heated wax (molded material). After transferring the pattern, it is essential to wait for the resin to cool and then demold the microstructure.
- a printing apparatus having a heat insulating structure has been proposed in which the sectional area of the pressing surface of the stamper is smaller than the sectional area of the holding portion that holds the pressing surface of the stamper.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2004-288784
- the pressure surface holding portion is heated and cooled together with the pressure surface.
- the molding pressure pressurization
- the holding part has a predetermined rigidity or more.
- the heat capacity is also a predetermined value or more.
- An object of the present invention is to provide a fine structure processing method and a fine structure processing apparatus used therefor, which can shorten the heat cycle of the temperature rise and cooling.
- the fine structure processing method of the present invention comprises at least two opposing surface plates facing a mold for processing a fine structure from a molding material, and during the processing of one fine structure, Use at least two opposing surface plates.
- the fine structure processing apparatus of the present invention includes a mold for processing a fine structure from a material to be molded, at least two opposing surface plates facing the mold, and during the processing of one fine structure. And a drive device for using at least two opposed surface plates.
- the microstructure processing apparatus is sandwiched between the mold and the surface side of the opposing surface plate, and the microstructure is added by heat molding the material to be molded.
- a fine structure processing apparatus for measuring the surface of the counter surface plate which is located on the front surface side, the first block including the heating device, and on the back surface side to change the heat capacity of the counter surface plate.
- the first block and the second block are provided so as to be relatively movable between a position where the first block and the second block abut and a position where the first block and the second block are separated from each other.
- the fine structure is sandwiched between the mold and the surface side of the opposed surface plate, and the material to be molded is pressed and heated and molded.
- a method for processing a microstructure which is sandwiched between a mold and the surface side of an opposing surface plate, and pressurizing and heating the material to be molded, and the microstructure is processed.
- an external member is brought into contact after separating a part of the opposed surface plate during heating of the molding material.
- the fine structure processing method or processing apparatus may be used in the case where the mold side is heated and cooled when finely processing the molding material, or the mold side and the molding material side. And the case where both are heated and cooled.
- the fine structure can be processed with excellent throughput and high yield.
- the quality of the fine structure can be improved.
- the drive device may be a device that moves the surface plate in any form as long as the drive device can use at least two opposed surface plates during processing of one microstructure.
- a device that moves the mold or a device that moves both the surface plate and the mold may be used.
- the volume of the facing platen is reduced to reduce the total heat capacity of the facing platen, and the amount of heat stored in the facing platen is physically discharged. This makes it possible to improve the cooling rate of the facing platen.
- the first block when the opposed surface plate is heated, the first block is heated, and during cooling, the second block, which is an external member, is brought into contact with the first block, thereby increasing the volume of the opposed surface plate during cooling.
- the amount of heat that the first block has moved to the second block makes it possible to improve the cooling rate of the facing platen.
- the heating efficiency of the facing platen is achieved by performing pressure heating molding of the material to be molded by changing the volume of the facing platen during heating and the volume of the facing platen during cooling.
- the cooling efficiency of the facing platen is improved, and the heat cycle between the temperature rise and the cooling can be shortened. As a result, it is possible to improve the throughput required for processing the fine structure.
- the first block is an external member.
- the third block By contacting the third block, the volume of the facing platen immediately after heating is reduced, the total heat capacity of the facing platen is reduced, the amount of heat stored in the facing platen is physically discharged, and during cooling
- the third block which is an external member, into contact with the first block, the amount of heat of the first block moves to the third block during cooling, thereby improving the cooling rate of the opposing surface plate. It is possible.
- FIG. 1 is a diagram showing an overview of a fine structure processing apparatus in Embodiment 1 of the present invention.
- FIG. 2 is a cross-sectional view showing a fine structure processing apparatus in Embodiment 2 of the present invention.
- FIG. 3 is a partial cross-sectional view of a fine structure processing apparatus in Embodiment 3 of the present invention.
- FIG. 4 is a sectional view showing a fine structure processing apparatus in a fifth embodiment of the present invention.
- FIG. 5 is a partial sectional view of a fine structure processing apparatus in a sixth embodiment of the present invention.
- FIG. 6 is a cross-sectional view showing an outline of a fine structure processing apparatus according to a seventh embodiment of the present invention.
- FIG. 7 is a first step cross-sectional view illustrating an outline of a method for processing a fine structure according to a seventh embodiment of the present invention.
- FIG. 8 is a second step cross-sectional view showing an outline of a fine structure processing method in Embodiment 7 of the present invention.
- FIG. 9 is a first step cross-sectional view illustrating an outline of a fine structure processing method according to an eighth embodiment of the present invention.
- FIG. 10 is a second cross-sectional view showing an outline of a processing method of a microstructure in an eighth embodiment of the present invention.
- FIG. 11 is a third cross-sectional view showing an outline of a fine structure processing method in Embodiment 8 of the present invention.
- FIG. 12 is a first cross-sectional view showing an outline of a fine structure processing method according to the ninth embodiment of the present invention.
- FIG. 13 is a second cross-sectional view showing an outline of a fine structure processing method according to the ninth embodiment of the present invention.
- FIG. 14 is a cross-sectional view showing another outline of the fine structure processing method according to the ninth embodiment of the present invention.
- FIG. 15 is a longitudinal sectional view showing a schematic configuration of a fine structure processing apparatus according to a tenth embodiment of the present invention.
- FIG. 16 is a first step cross-sectional view of the microstructure processing method in Embodiment 10 of the present invention.
- FIG. 17 is a second step cross-sectional view of the microstructure processing method in Embodiment 10 of the present invention.
- FIG. 18 is a first cross-sectional view showing an outline of a processing method of a fine structure according to an eleventh embodiment of the present invention.
- FIG. 19 is a second cross-sectional view showing an outline of a processing method of a fine structure according to an eleventh embodiment of the present invention.
- FIG. 20 is a third cross-sectional view showing an outline of a fine structure processing method according to the eleventh embodiment of the present invention.
- FIG. 21 is a first cross-sectional view showing an outline of a processing method of a fine structure according to a twelfth embodiment of the present invention.
- FIG. 22 is a second cross-sectional view showing an outline of a fine structure processing method in Embodiment 12 of the present invention.
- FIG. 23 is a process cross-sectional view illustrating another outline of the method for processing a fine structure according to the twelfth embodiment of the present invention.
- FIG. 1 is a top view showing an outline of a fine structure processing apparatus according to Embodiment 1 of the present invention.
- two opposed surface plates hereinafter referred to as “surface plates”) 1 1, 12 that can move below the mold 5 are arranged.
- the cooling surface plate 12 is located at the molding force punching position immediately below the mold 5, and the heating surface plate 11 is located at the retracted position.
- the surface plate 11 for heating is located at the molding position when the mold is pressed and molded, and moves to the retracted position when cooling after molding.
- the cooling surface plate 12 is positioned at a molding processing position when the molded resin is cooled before demolding, and the mold 5 is pressed against the molding 1 that is the resin.
- reference numeral 20 indicates the moving direction of the surface plates 11 and 12 by a driving device (not shown) that moves the surface plates 11 and 12.
- the driving device can be realized by using any mechanism that is commonly used for this type of driving device.
- the surface plates 11 and 12 are set to predetermined temperatures by the temperature setting devices 31 and 32, respectively.
- These temperature setting devices 31, 32 also have a temperature sensor, a heater, a power source and the like (not shown) to maintain the temperature of the surface plate at a constant temperature.
- the temperature setting device is not limited to the above-described configuration, and may be maintained at a predetermined temperature by charging it into a furnace maintained at a constant temperature.
- the resin 1 that is the material to be molded is loaded at the molding processing position where the heating platen 11 is located from the direction that does not overlap with the platen moving space so as to avoid the moving space of the platen 11 and 12.
- the mold 5 After being put in and heated to the molding temperature, the mold 5 is pressed and processed. After that, the surface plate 11 moves to the retracted position while maintaining the load at the time of the above molding process, and instead the surface plate 12 moves to the molding processing position and comes into contact with the resin la after molding. Cool the fat la. Then, the processed resin la, which is a fine structure, is demolded and carried on the extension of the charging direction of the resin 1 before molding.
- the resin 1 may be preheated by the preheating device 41 before being mounted at the molding position.
- the preheating device may be a furnace maintained at a constant temperature, or may be a heating device such as a heater.
- the surface plates 11 and 12 are reciprocating forces that are linear movements. The movement is not limited to such a moving form, and any moving form in which the surface plate circulates can be used. For example, two or more surface plates may circulate in a circular shape, or may move while changing the height position. Even if the charging line of the molding material 1 and the surface plate moving space may overlap, as long as the spatial trajectories of both do not overlap at the same time, there is no problem even if they overlap.
- the force shown in the case of two surface plates 11 and 12 may be arranged with three or more surface plates.
- the basic elements in the fine structure processing apparatus include a mold for cleaning the fine structure from the material to be molded, at least two facing surface plates facing the mold, and one fine structure. And a drive for using at least two opposing surface plates during body processing.
- the drive device for moving the surface plate can be configured using any known drive mechanism as described above.
- the apparatus for moving the surface plate is used in order to use two surface plates during processing of one fine structure.
- the two surface plates are devices that move the mold while stationary, or devices that move the surface plate and the mold together. May be.
- the drive device for moving the mold can be configured using any known device in the same manner as the device for moving the surface plate.
- the basic element in the method for processing a fine structure includes at least two opposing surface plates facing a mold for processing the fine structure from a material to be molded, and includes one fine structure. Constructed by using at least two opposing surface plates during body processing.
- the material to be molded (resin, resin with substrate, various films, various composite materials, etc.) can be heated efficiently, and the molded microstructure can be efficiently and smoothly. Mold force Can be released.
- high-accuracy temperature management is possible, which can contribute to yield improvement and quality improvement of fine structures.
- the surface plate driving device described above can move at least two opposed surface plates between a retracted position where the opposed surface plate is not used and a use position where the opposed surface plate is used. This With this configuration, it is possible to use at least two opposing surface plates depending on efficiency. For example, an opposing surface plate that was held at the molding temperature during molding was used, and the mold was held at the release temperature when the microstructure was removed after the pressurization maintenance period. It is possible to use an opposite surface plate.
- the material to be molded can be preheated before being heated between the mold and the opposing surface plate.
- the molding material may be in any form, such as a resin, a resin with a substrate, various films, and various composite materials.
- the resin or resin film include polyethylene, polypropylene, polybutyl alcohol, polyvinylidene chloride, polyethylene terephthalate, polyvinyl chloride, polystyrene, ABS resin, AS resin, acrylic resin, polyacetal, Polybutylene terephthalate, glass reinforced polyethylene terephthalate, polycarbonate, modified polyphenylene ether, polyphenylene sulfide, polyether ether ketone, liquid crystal polymer, fluorine resin, polysulfone, polyethersulfone, polyamideimide, polyetherimide, thermoplastic polyimide, etc.
- Various steel materials can be used for the mold and the surface plate.
- SS41 thick steel plates and forged products can be used.
- a heat-resistant resin can also be used for the mold. Any known machining such as a lathe, milling machine, electric discharge machining, laser machining, electron beam machining, or corrosion may be used for machining the mold.
- FIG. 2 is a cross-sectional view showing an outline of the fine structure processing apparatus in the second embodiment of the present invention.
- the high-temperature surface plate 11 is disposed immediately below the mold 5, that is, at the molding position, and the cooling surface plate 12 is retracted to the retreat position.
- the point in the present embodiment is that a base material 7 is arranged on the surface plate 11 and the material to be molded is formed on the base material 7. Rum 1 is in place.
- the film 1 is molded by the mold part 5 a of the mold 5, the mold part 5 a is pressed while being supported by the base material 7. In this molding process, the film 1 is heated together with the base material 7 by the surface plate 11.
- the base plate 7 is moved to the base support mechanism (not shown) so as to maintain the state where the film 7 is pressed against the mold 5 even when the surface plate 11 moves to the retracted position.
- Maintaining such a state is important in order to maintain the state in which the resin constituting the film flows and the recesses and corners of the mold part 5a are sufficiently filled.
- the substrate 7 may be any material as long as it has predetermined rigidity and thermal conductivity.
- a metal plate, a heat resistant resin plate, a composite layer of resin and ceramics, or a combination layer thereof can be used.
- the form may be a cut plate shape, a batch type single plate, a long plate, a continuously supplied type, a coil shape capable of winding and rewinding, and the like.
- a base material disposing device (not shown) for disposing the base material between the facing surface plate and the material to be molded also places the base material in the position according to the form of the base material as described above. Any device structure can be used as long as it is installed in the device!
- a basic element in the method for processing a fine structure in the present embodiment is to process the fine structure by inserting a base material between the material to be molded and the facing surface plate. This method can alleviate sudden temperature changes applied to the mold and the resulting load impact.
- the base material described above can have higher rigidity and higher thermal conductivity than the material to be molded. By this method, the temperature impact and load impact due to the substrate can be more reliably reduced.
- the elastic modulus of the base material can be set to lOOGPa or more. By using such a base material, it is possible to withstand a rapid change in temperature (load impact) caused by a molding pressure applied to the base material itself or a small heat capacity of a thin base material. If the elastic modulus of the base material is less than 100 GPa, it cannot withstand the molding pressure, which hinders the processing of microstructures.
- the thermal conductivity of the substrate may be 20 WZ (m- ° C) or more. By using such a base material, the temperature following time after contact with the opposite surface plate is shortened, and the throughput can be improved. If the thermal conductivity of the substrate is less than 20 WZ (m '° C), the temperature follow-up time is shortened because the heat exchange rate between the facing platen and the resin is not sufficient.
- the description has been made on the premise that the surface plate is moved in order to use two surface plates during processing of one fine structure. However, as long as two surface plates can be used during the processing of a single microstructure, the two surface plates are either stationary or move the mold together, or the surface plate and the mold move together. There may be.
- the substrate is moved together with the mold when the mold is moved.
- the base material is moved while keeping the state where the film is pressed against the mold.
- the driving device that moves the mold while pressing the resin film against the mold with a base material interposed therebetween can be constituted by any known device of this type.
- FIG. 3 is a partial cross-sectional view of the fine structure processing apparatus in the third embodiment of the present invention.
- the base material 7 keeps pressing the film 1 against the mold 5 until the surface plate 12 is placed at the forming position. It is supported by the substrate support mechanism 17 so as to maintain it.
- the base material support mechanism 17 is composed of a column or plank that can be advanced and retracted in the direction 25. Since the base material support mechanism 17 is in contact with the base material 7 together with the surface plates 11 and 12, the base material support mechanism 17 is provided so as not to overlap the surface plates 11 and 12 arranged at the molding car position.
- the basic element of the fine structure processing apparatus in the present embodiment includes a base material positioned between the opposing surface plate and the molding material, and the molding material is interposed via the base material.
- the two surface plates are either a device that moves the mold while still, or a method that moves the surface plate and the mold together. There may be.
- the base material is also moved together with the mold, and during the movement, the base material support mechanism keeps the resin film pressed against the mold with the base material interposed therebetween.
- the drive device and the substrate support mechanism can be configured using any known device of this type.
- the heating platen 11 was removed, and the 60 ° C cooling platen 12 was pressed against a molded fine structure (PC film) la and cooled. After 60 seconds from contact between the cooling surface plate 12 and the PC film la, the PC film la was removed from the mold 5. Attaching force of the above PC film to the mold forming position The time for one cycle until releasing was 5 minutes.
- the surface plate 11 was removed, and the surface plate 12 at 60 ° C. was pressed through the A1N substrate 7 while the A1N substrate 7 was pressed, and cooled. 180 seconds after pressing the surface plate 12, the PC film la, which is a molded fine structure, was removed from the mold 5. Attaching force of the above PC film to the molding position The period of one cycle until demolding was 7 minutes. Although the heat capacity varies greatly depending on the specifications of the device for the conventional cycle, it cannot be said unconditionally. However, if the heating and cooling steps of the surface plate are rate-limiting, 20 to 30 minutes were required.
- the fourth embodiment is a modification of the second embodiment described with reference to FIG. That is, in the second embodiment, the surface plate 11 is used for heating the base material 7 and the surface plate 12 is used for cooling. In the fourth embodiment, both of the surface plates 11 and 12 are used in FIG. Are equipped with heating and cooling systems, each used in both heating and cooling steps of the substrate 7.
- the cooling platen 12 was further pressed against the molded PC film la for cooling. After 60 seconds from contact between the cooling surface plate 12 and the PC film la, the PC film la was removed from the mold 5. Attaching force of the above PC film to the mold forming position The period of one cycle until releasing was 6 minutes. In this process, the surface plate 12 is heated to 180 ° C, and the surface plate 11 and the surface plate 12 are replaced when the PC film 1 is replaced.
- Table 1 shows the measurement results of the line widths of the microstructures (wiring patterns) processed in Examples 1 to 3 using a laser microscope together with the one period. According to Table 1, in Examples 1 to 3, the average value is finished to the intended line width, and the fluctuation range is within the allowable range ( ⁇ 1.0 m).
- the base 107 is brought into contact with the mold 5, and the mold 107 is heated by the surface plates 111 and 112 through the base 107! / Is cooled and the material to be molded is cooled.
- PC film 1 is molded.
- a member 131 serving as a temperature setting device and an opposing surface plate is disposed at a position where the PC film 1 is sandwiched together with the mold 5.
- one of the surface plates 111 and 112 may be used only for heating and the other may be used only for cooling.
- each of the surface plates 111 and 112 may be heated and It may be used for both cooling.
- the surface plate 111 was removed, and the surface plate 112 of 60 ° C. was pressed and cooled through the A1N substrate 107 while the A1N substrate 107 was pressed. 120 seconds after pressing the surface plate 112, the formed PC film la, which is a microstructure, was removed from the mold 5.
- the mounting force of the PC film 1 at the mold forming position was 6 minutes for one cycle until demolding.
- the base 107a is brought into contact with the mold 5 in the same manner as in the fifth embodiment, and the mold 5 is heated or cooled by the surface plates 111a and 112a through the base 107a. Then, the PC film 1 as a molding material is molded.
- the present embodiment is different from the fifth embodiment in that the base material 107b is also brought into contact with the surface of the PC film 1 opposite to the side facing the mold 5, and the base material 107b is interposed therebetween. PC plate 1 is heated and Z or cooled by the surface plate 11 lb, 112b.
- the mold 5 is heated through the base material 107a by the platen 11 la at 180 ° C.
- the PC film 1 is heated through the substrate 107b by the 180 ° C surface plate 111b in a state where the substrate 107b made of the A1N substrate is pressed against the back surface of the PC film 1.
- the base plates 107a and 107b are kept pressed against the mold 5 and the PC film 1, and the surface plates 11 la and 11 lb are removed.
- the C surface plates 111a and 11 lb were pressed against the base materials 107a and 107b for 90 seconds to cool the mold 5 and the PC film 1 through the base materials 107a and 107b, respectively.
- the mounting force of the PC film 1 at the molding position of the mold 1 period of time until demolding was 5.5 minutes.
- FIG. 6 is a longitudinal sectional view showing a schematic configuration of the fine structure processing apparatus in the present embodiment
- FIGS. 7 and 8 are first views showing the fine structure processing method in the present embodiment
- FIG. 7 is a sectional view of a second process.
- the microstructure processing apparatus in the present embodiment is provided with a mold 5, and is provided below the mold 5 so as to be movable between a molding processing position and a retracted position.
- Panel 2 11 is located on the opposite surface plate 211 side of the mold 5, a mold part 5a on which a predetermined pattern is formed is provided.
- a film 1 that is a material to be molded is disposed between the mold part 5a and the opposed surface plate 211.
- the mold 5 and the facing surface plate 211 are provided so as to be relatively movable between a molding position and a retracted position by a driving device (not shown).
- This drive device can be realized using any mechanism that is commonly used in this type of drive device.
- the facing surface plate 211 is located on the front side, and has a first block 21 la including the heating device 21 lh, and a second block 21 lb located on the back side.
- the first block 21 la and the second block 21 lb are defined by the position where the first block 211a and the second block 211b come into contact with each other, the first block 21 la and the second block by a surface plate driving device (not shown). It is provided so that it can move relative to the position where 21 lb is separated.
- This surface plate drive device can be realized by using any mechanism that is commonly used for this type of drive device, but from the viewpoint of increasing the heat transfer efficiency by reducing the thermal resistance at the contact portion between the blocks.
- the surface roughness (Ra) of the contact surface of one of the blocks in the contact between the blocks is preferably 0.5 m or less.
- the heating device 21 lh included in the first block 21 la can embed a known heating device, but from the standpoint of heat uniformity of the opposed surface plate 211, a heating element is formed in the ceramic.
- a ceramic heater that generates heat when energized is preferable.
- the ceramic it is preferable to use a material selected from the group consisting of aluminum oxide, aluminum nitride, silicon nitride, silicon carbide, and boron nitride.
- the first block 21 la and the second block 21 lb have high thermal conductivity, aluminum, magnesium, copper, iron, stainless steel, aluminum oxide, aluminum nitride, for efficient heat transfer. It is preferable to use a material selected from the group consisting of silicon nitride, silicon carbide, and boron nitride. In order to further increase the heat transfer efficiency, the heat capacity of the second block 21 lb is preferably 30% or more of the total heat capacity of the first block 21 la and the second block 21 lb.
- the opposed surface plate 211 is heated to the molding temperature by the heating device 21 lh, and then the opposed surface plate 211 is moved to the retracted position as shown in FIG. Placement Move to the molding position and press the film 1 against the mold 5 and press and heat mold it. Thereafter, the load during the molding process is maintained for a certain time. During cooling, as shown in FIG. 8, the second block 21 lb force is separated from the first block 21 la.
- the film 1 may be preheated with a preheating device (not shown) before being mounted at the molding position.
- the preheating device may be a furnace maintained at a constant temperature, or may be a heating device such as a heater.
- FIGS. 9 to 11 are first to third process cross-sectional views illustrating a method for processing a microstructure in the present embodiment. Note that the same or corresponding parts as those of the fine structure processing apparatus in the above embodiment are denoted by the same reference numerals, and redundant description will not be repeated.
- the cooling efficiency of the facing surface plate 211 is improved by separating the second block 21 lb from the first block 21 la during cooling.
- the cooling efficiency of the facing surface plate 211 is further improved, and at the same time, the heating efficiency during heating in the next process is improved.
- the fine structure processing apparatus according to the present embodiment includes a third block 21 lc having substantially the same configuration force as the second block 21 lb.
- the second block 21 lb is heated in the heating process, the second block 21 lb and the third block 211c are moved in the cooling process as shown in FIG. As shown in FIG. 1, the third block 211c is brought into contact with the first block 21la.
- the volume of the facing platen 211 immediately after heating is reduced to reduce the total heat capacity of the facing platen 211, and the amount of heat stored in the facing platen 211 is physically discharged, and at the time of cooling
- the third block 211c which is an external member, is brought into contact with the first block 21la, it moves to the third block 211c where the amount of heat of the first block 21la is cooled during cooling. It is possible to improve the cooling rate of the surface plate.
- the second block 21 lb since the second block 21 lb has already been heated to some extent, the second block 21 lb is brought into contact with the first block 21 la instead of the third block 211c when heating in the next process. By doing so, it becomes possible to improve the heating efficiency of the opposing surface plate 11.
- FIG. 12 and FIG. 13 are first and second process cross-sectional views showing a method for processing a microstructure in the present embodiment. Note that the same or corresponding parts as those of the fine structure processing apparatus in each of the above embodiments are given the same reference numerals, and redundant description will not be repeated.
- the cooling efficiency of the facing surface plate 211 is improved by separating the second block 21 lb from the first block 21 la during cooling. In the present embodiment, only the first block 21 la is used in the heating process, and the second block 211b is first brought into contact with the first block 211a in the cooling process. First, as shown in FIG.
- the opposing surface plate 21 1 is also moved to the molding position by moving the opposing surface plate 211 to the mold 5 position. Press. Thereafter, the load during the molding process is maintained for a certain time.
- the second block 21 lb in a cooled state is brought into contact with the first block 21 la.
- the volume of the opposing surface plate 211 during cooling increases, and the amount of heat of the first block 21 la moves to the second block 21 lb, thereby improving the cooling rate of the facing surface plate 211. It is possible.
- the second block 21 lb and the third block 211c are basically reciprocating forces that are linear movements with respect to the first block 21 la.
- the second block 21 lb and the third block 211c may be of any moving configuration in which the second block 21 lb and the third block 211c are circularly moved.
- the block 21 lc may circulate in a circle or move while changing its height position.
- the second block 21 lb was separated from the first block 21 la, and the third block 21 lc for cooling was brought into contact with the first block 21 la.
- PC film 1 was removed from the mold 5. The mounting force of the PC film 1 at the mold molding position was 5 minutes for one cycle until the mold was removed.
- FIG. 15 is a longitudinal sectional view showing a schematic configuration of the fine structure processing apparatus in the present embodiment
- FIGS. 16 and 17 show a fine structure processing method in the present embodiment
- FIG. 3 is a sectional view of steps 1 and 2.
- the fine structure processing apparatus includes a mold 5, and is disposed above the mold 5 so as to be movable between a molding processing position and a retracted position. Panel 3 11 is placed. On the opposite surface plate 311 side of the mold 5, a mold part 5a on which a predetermined pattern is formed is provided. A film 1 which is a material to be molded is disposed between the mold part 5a and the opposing surface plate 311.
- the mold 5 and the facing surface plate 311 are formed into a molding position and a retracted position by a driving device (not shown). It is provided so that relative movement is possible.
- This drive device can be realized using any mechanism that is commonly used in this type of drive device.
- the first block 305a located on the upper side and including the heating device 305h on the surface opposite to the side facing the PC film 1 of the mold 5 (the lower surface in the figure), and the second block 305b located on the lower side Have.
- the first block 305a and the second block 305b are separated from the position where the first block 305a and the second block 305b come into contact with each other and the first block 305a and the second block 305b by a driving device (not shown). It is provided so as to be relatively movable between positions.
- This surface plate driving device can be realized by using any mechanism commonly used for this type of driving device, but from the viewpoint of reducing the thermal resistance at the contact portion between the blocks and increasing the heat transfer efficiency, It is preferable to vacuum-suck the first block 305a and the second block 305b by using a vacuum suction device.
- the surface roughness (Ra) of the contact surface of one of the blocks in the contact between the blocks is preferably 0.5 m or less.
- the heating device 305h included in the first block 305a can embed a known heating device, but from the viewpoint of heat uniformity, a ceramic heater that forms a heating element in ceramics and generates heat by energization. It is preferable that For the ceramic, it is preferable to use a material selected from the group strength of aluminum oxide, aluminum nitride, silicon nitride, silicon carbide, and boron nitride.
- the first block 305a and the second block 305b are provided with aluminum, magnesium, copper, iron, stainless steel, aluminum oxide, aluminum nitride, nitriding having high thermal conductivity in order to efficiently realize heat transfer. It is preferable to use a material selected from the group force consisting of silicon, silicon carbide, and boron nitride.
- the heat capacity of the second block 305b is preferably 30% or more of the total heat capacity of the first block 305a and the second block 305b.
- the fine structure processing apparatus having the above constituent force, first, after the heating / cooling block 305 having the first block 305a and the second block 305b force is heated to the molding temperature by the heating apparatus 305h, As shown in Fig. 16, move the mold 5 and the opposite surface plate 311 to the retracted position. Then, the film 1 is moved to the molding processing position, the film 1 is pressed against the mold 5, and is subjected to pressure heating molding processing. Thereafter, the load during the molding process is maintained for a certain time. During cooling, the second block 305b is separated from the first block 305a as shown in FIG.
- the second block 305b is separated from the first block 305a during cooling, thereby reducing the volume of the block 305 during cooling to reduce the total heat capacity and reducing the amount of heat stored in the block 305.
- the cooling rate of the block 305 can be improved.
- the cooling efficiency of the block 305 is improved, and the heat cycle of the block 305 can be shortened.
- the film 1 may be preheated by a preheating device (not shown) before being mounted at the molding position.
- the preheating device may be a furnace maintained at a constant temperature, or may be a heating device such as a heater.
- FIG. 18 to FIG. 20 are first to third process cross-sectional views illustrating a method for processing a microstructure in the present embodiment. Note that the same or corresponding parts as those of the fine structure processing apparatus in the above embodiment are denoted by the same reference numerals, and redundant description will not be repeated.
- the second block 305b is separated from the first block 305a during cooling, so that the cooling efficiency of the block 305 is improved.
- the cooling efficiency of the block 305 is further improved, and at the same time, the heating efficiency at the time of heating in the next step is improved.
- the fine structure processing apparatus according to the present embodiment includes a third block 305c having substantially the same configuration as the second block 305b.
- the second block 305b is heated during the heating process, the second block 305b and the third block 305c are moved during the cooling process as shown in FIG. Then, as shown in FIG. 20, the third block 305c is brought into contact with the first block 305a.
- the volume of the block 305 immediately after heating is reduced to reduce the total heat capacity of the block 305, and the amount of heat stored in the block 305 is physically discharged, and at the time of cooling, the outside
- the third block 305c which is a member
- the amount of heat of the first block 305a during cooling is moved to the third block 305c, which cools the opposing surface plate. It is possible to improve the speed.
- the second block 305b Since the second block 305b has already been heated to some extent, the second block 305b can be brought into contact with the first block 305a instead of the third block 305c during the heating in the next step. In addition, the heating efficiency of the block 305 can be improved.
- FIG. 21 and FIG. 22 are first and second process cross-sectional views showing a method for processing a fine structure in the present embodiment. Note that the same or corresponding parts as those of the fine structure processing apparatus in each of the above embodiments are given the same reference numerals, and redundant description will not be repeated.
- the cooling efficiency of block 305 is improved by separating second block 305b from first block 305a during cooling.
- first block 305a is used in the heating process, and the second block 305b is brought into contact with the first block 305a for the first time in the cooling process.
- the block 305 is moved from the retracted position to the molding position, and the film 1 is pressed against the mold 5. Thereafter, the load during the molding process is maintained for a certain time.
- the second block 305b in a cooled state is brought into contact with the first block 305a.
- the volume of the block 305 during cooling increases, and the amount of heat of the first block 305a moves to the second block 305b, so that the cooling rate of the block 305 can be improved.
- the second block 305b and the third block 305c are Basically, the reciprocating force that is a linear movement with respect to the first block 305a is not limited to such a moving form, and may be a moving form in which the second block 305b and the third block 305c circulate.
- the plurality of second blocks 305b and third blocks 305c may each circulate in a circular shape, or may move while changing the height position.
- Example 8 in which a microstructure for a wiring pattern having a predetermined line width is processed will be described.
- the second block 305b is separated from the first block 305a, and the cooling third block 305c is brought into contact with the first block 305a as shown in FIGS. I let you.
- the PC film 1 was removed from the mold 5. Attaching force of the above PC film 1 to the mold forming position One cycle time until demolding was 7 minutes.
- Table 3 shows the measurement results of the line widths of the microstructures (wiring patterns) processed in Examples 6 to 8 with a laser microscope, together with the above-mentioned one period. According to Table 3, in Examples 4 and 5, the average value is finished to the intended line width, and the variation range is within the allowable range ( ⁇ 1.0 m).
- the present invention can process a high-quality microstructure with high efficiency and high yield by its unique method and apparatus, and is expected to make a great contribution in this field in the future.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Health & Medical Sciences (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Micromachines (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006800125068A CN101160203B (zh) | 2005-02-25 | 2006-02-21 | 精细结构的加工方法和精细结构的加工装置 |
US11/885,079 US7713052B2 (en) | 2005-02-25 | 2006-02-21 | Processing method of fine structure and processing equipment for fine structure |
EP06714156A EP1854617A4 (en) | 2005-02-25 | 2006-02-21 | METHOD FOR MACHINING A MICROSTRUCTURE AND SYSTEM FOR MACHINING A MICROSTRUCTURE |
JP2007504711A JP4784601B2 (ja) | 2005-02-25 | 2006-02-21 | 微細構造体の加工方法および微細構造体の加工装置 |
HK08105897.5A HK1111127A1 (en) | 2005-02-25 | 2008-05-27 | Processing method of fine structure and processing equipment for fine structure |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005050829 | 2005-02-25 | ||
JP2005-050829 | 2005-02-25 | ||
JP2005132561 | 2005-04-28 | ||
JP2005-132561 | 2005-04-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006090682A1 true WO2006090682A1 (ja) | 2006-08-31 |
Family
ID=36927322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/303016 WO2006090682A1 (ja) | 2005-02-25 | 2006-02-21 | 微細構造体の加工方法および微細構造体の加工装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7713052B2 (ja) |
EP (1) | EP1854617A4 (ja) |
JP (1) | JP4784601B2 (ja) |
KR (1) | KR100892801B1 (ja) |
CN (1) | CN101160203B (ja) |
HK (1) | HK1111127A1 (ja) |
WO (1) | WO2006090682A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009072690A1 (en) * | 2007-12-07 | 2009-06-11 | Top Engineering Co., Ltd. | Apparatus for heating pattern frame |
JP5263440B1 (ja) * | 2012-11-05 | 2013-08-14 | オムロン株式会社 | 転写成形方法、及び、転写成形装置 |
JP2020049716A (ja) * | 2018-09-26 | 2020-04-02 | 福井県 | 複合シート材料の製造方法および製造装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5376930B2 (ja) | 2008-12-19 | 2013-12-25 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
CA2803283C (en) * | 2010-07-29 | 2015-09-22 | Husky Injection Molding Systems Ltd. | Mold-tool assembly including heater having resistive element encased in aluminum nitride |
CN114919107B (zh) * | 2022-05-17 | 2024-02-27 | 深圳技术大学 | 硅模具的高温模压成型装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01109400U (ja) * | 1988-01-13 | 1989-07-24 | ||
JPH02102009A (ja) * | 1988-10-12 | 1990-04-13 | Canon Inc | 加圧成型用金型および加圧成型方法 |
JPH09323200A (ja) * | 1996-06-06 | 1997-12-16 | Meiki Co Ltd | プレス成形方法およびプレス成形装置 |
JP2004074775A (ja) * | 2002-06-17 | 2004-03-11 | Nagase Integrex Co Ltd | 転写装置 |
JP2004136333A (ja) * | 2002-10-18 | 2004-05-13 | Dainippon Printing Co Ltd | 急速冷却機能を有する熱プレス装置 |
JP2004148398A (ja) * | 2002-11-01 | 2004-05-27 | Dainippon Printing Co Ltd | 二度プレス機構を有する熱プレス装置 |
JP2004288784A (ja) * | 2003-03-20 | 2004-10-14 | Hitachi Ltd | ナノプリント装置、及び微細構造転写方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2532501A (en) * | 1944-01-27 | 1950-12-05 | Combined Optical Ind Ltd | Molding of plastics |
JPS58171918A (ja) * | 1982-04-01 | 1983-10-08 | Asahi Chem Ind Co Ltd | 強靭なるアクリルシ−ト |
JPH01109400A (ja) | 1987-10-23 | 1989-04-26 | Seiko Epson Corp | 音声録音再生装置 |
US5945137A (en) * | 1995-06-28 | 1999-08-31 | Fuji Photo Film Co., Ltd. | Disk producing apparatus for manufacturing a photo film cassette |
US5893994A (en) * | 1996-04-17 | 1999-04-13 | Irwin Research & Development, Inc. | Adjustable length heat tunnel for varying shot lengths |
US6099771A (en) * | 1998-07-08 | 2000-08-08 | Lear Corporation | Vacuum compression method for forming molded thermoplastic floor mat having a "Class A" finish |
SE515607C2 (sv) * | 1999-12-10 | 2001-09-10 | Obducat Ab | Anordning och metod vid tillverkning av strukturer |
DE10246942A1 (de) * | 2002-10-08 | 2004-04-22 | Battenfeld Gmbh | Vorrichtung zum Erzeugen von Mikrostrukturen |
WO2004089546A2 (en) * | 2003-04-04 | 2004-10-21 | Tecan Trading Ag | Elastomeric tools for fabricating of polymeric devices and uses thereof |
WO2004093171A1 (ja) * | 2003-04-11 | 2004-10-28 | Scivax Corporation | パターン形成装置、パターン形成方法 |
EP1594001B1 (en) * | 2004-05-07 | 2015-12-30 | Obducat AB | Device and method for imprint lithography |
-
2006
- 2006-02-21 JP JP2007504711A patent/JP4784601B2/ja not_active Expired - Fee Related
- 2006-02-21 US US11/885,079 patent/US7713052B2/en not_active Expired - Fee Related
- 2006-02-21 KR KR1020077020865A patent/KR100892801B1/ko not_active IP Right Cessation
- 2006-02-21 EP EP06714156A patent/EP1854617A4/en not_active Withdrawn
- 2006-02-21 WO PCT/JP2006/303016 patent/WO2006090682A1/ja active Application Filing
- 2006-02-21 CN CN2006800125068A patent/CN101160203B/zh not_active Expired - Fee Related
-
2008
- 2008-05-27 HK HK08105897.5A patent/HK1111127A1/xx not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01109400U (ja) * | 1988-01-13 | 1989-07-24 | ||
JPH02102009A (ja) * | 1988-10-12 | 1990-04-13 | Canon Inc | 加圧成型用金型および加圧成型方法 |
JPH09323200A (ja) * | 1996-06-06 | 1997-12-16 | Meiki Co Ltd | プレス成形方法およびプレス成形装置 |
JP2004074775A (ja) * | 2002-06-17 | 2004-03-11 | Nagase Integrex Co Ltd | 転写装置 |
JP2004136333A (ja) * | 2002-10-18 | 2004-05-13 | Dainippon Printing Co Ltd | 急速冷却機能を有する熱プレス装置 |
JP2004148398A (ja) * | 2002-11-01 | 2004-05-27 | Dainippon Printing Co Ltd | 二度プレス機構を有する熱プレス装置 |
JP2004288784A (ja) * | 2003-03-20 | 2004-10-14 | Hitachi Ltd | ナノプリント装置、及び微細構造転写方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1854617A4 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009072690A1 (en) * | 2007-12-07 | 2009-06-11 | Top Engineering Co., Ltd. | Apparatus for heating pattern frame |
CN101889241B (zh) * | 2007-12-07 | 2012-03-21 | 塔工程有限公司 | 用于加热图案框架的设备 |
JP5263440B1 (ja) * | 2012-11-05 | 2013-08-14 | オムロン株式会社 | 転写成形方法、及び、転写成形装置 |
JP2020049716A (ja) * | 2018-09-26 | 2020-04-02 | 福井県 | 複合シート材料の製造方法および製造装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20070102752A (ko) | 2007-10-19 |
KR100892801B1 (ko) | 2009-04-10 |
JP4784601B2 (ja) | 2011-10-05 |
EP1854617A1 (en) | 2007-11-14 |
CN101160203A (zh) | 2008-04-09 |
EP1854617A4 (en) | 2011-07-06 |
JPWO2006090682A1 (ja) | 2008-07-24 |
US7713052B2 (en) | 2010-05-11 |
HK1111127A1 (en) | 2008-08-01 |
CN101160203B (zh) | 2012-09-19 |
US20080169583A1 (en) | 2008-07-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4024714B2 (ja) | プレス成形装置の制御方法およびプレス成形方法 | |
WO2006090682A1 (ja) | 微細構造体の加工方法および微細構造体の加工装置 | |
US7678319B2 (en) | Mold and molding apparatus using the same | |
KR101421910B1 (ko) | 전사 시스템 및 전사 방법 | |
KR20070026245A (ko) | 프레스 성형장치 | |
KR20100059917A (ko) | 미세 형상 전사시트의 제조방법 및 제조장치 | |
WO2012133406A1 (ja) | 樹脂成形用金型、該樹脂成形用金型の製造方法及び樹脂成形品の製造方法 | |
JP4679546B2 (ja) | プレス成形方法 | |
KR20060128886A (ko) | 나노임프린트를 이용하는 패턴 형성 방법 및 상기 방법을실행하는 장치 | |
JP2008254230A (ja) | 成形体の成形用金型およびこれを用いる成形体の製造方法 | |
US20110076451A1 (en) | Imprinting method and device utilizing ultrasonic vibrations | |
He et al. | Optimization of control parameters in micro hot embossing | |
JP4409985B2 (ja) | プレス成形装置、プレス成形方法及び成形品 | |
TWI222925B (en) | Hot-embossing forming method featuring fast heating/cooling and uniform pressurization | |
CN117923767A (zh) | 堆叠式热压方法及堆叠式热压装置 | |
US20040046281A1 (en) | Localized compression molding process for fabricating microstructures on thermoplastic substrates | |
JP2019093562A (ja) | 成形装置 | |
JP2009028996A (ja) | スタンパ及びスタンパ取り付け方法 | |
JP7274002B1 (ja) | 積層成形品の製造方法および積層成形品製造システム | |
JP2006231588A (ja) | 樹脂シートの製造方法 | |
JP2005246722A (ja) | プレス成形装置およびプレス成形方法 | |
JP2006088522A (ja) | 成形体の製造方法 | |
JP2008294009A (ja) | 圧力を制御した微細加工方法および微細加工装置 | |
KR101068844B1 (ko) | 이중 고폭비를 갖는 마이크로 구조물의 제조장치 | |
JP2007112010A (ja) | 熱可塑性素材の成形方法及び装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200680012506.8 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2007504711 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2006714156 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2006714156 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020077020865 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 2006714156 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 11885079 Country of ref document: US |